JPS6092697A - Composite laminated ceramic part - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

[Detailed Description of the Invention] (1) Description of the field to which the invention pertains The present invention relates to a composite ceramic component having a capacitor, a resistor, and a conductor wiring, particularly a composite ceramic component having a dielectric, a metal oxide resistor, an insulator, and a conductor simultaneously fired. Concerning composite laminated ceramic parts.

(2) Description of conventional technology Conventionally, passive components such as resistors, capacitors, and inductances, and active components such as transistors and diodes in electronic circuits are constructed by forming printed wiring layers on ceramic substrates and soldering them. , it was used as a unit. In this case, disc-shaped or chip-shaped capacitors, chip resistors, etc. had to be installed one by one.

On the other hand, in multilayer ceramic substrates with capacitors and resistors using alumina green sheets as shown in Figure 1, the capacitor part is formed at the same time as the base material is fired, and then the resistor is baked. be.

However, in this case, since the alumina green sheet 1 is used as the base material, the firing temperature must be as high as 1500°C or higher, and the conductor materials are Mo, W,
It had to be carried out in a reducing atmosphere using a conductor layer 2 of low electrical conductivity such as Mn. Furthermore, since alumina is used as the dielectric layer of the capacitor forming portion 3, the dielectric constant C is very low, about 9, and it is possible to obtain a capacitance cap having a capacitance of about 3 pF7 at most. Furthermore, in the process of forming the resistor part, the resistor element 4 is printed on the fired base by screen printing or the like and then baked, which increases the number of manufacturing steps and increases the number of resistor parts. There are drawbacks such as the fact that the base area is large, making it difficult to downsize and increase the density of the product.

Further, RC composite parts having the configurations shown in FIGS. 2 to 4 have also been considered. Each figure shows a schematic perspective view (a) and an equivalent circuit diagram (b) of the composite component.

In FIGS. 2 and 3, the structure is formed by connecting the resistor 4 between the external electrodes 11 and 11 of the multilayer chip capacitor 12, but multiple capacitor and resistor elements are included in one component. However, it is difficult to configure this method, requires many steps, and adds heat cycles, which poses problems in terms of cost and reliability. Fourth
The structure shown in the figure has a capacitor forming portion 3 and a resistor 4 in the laminated structure, but the capacitor forming portion 3,
Since the ceramic and the insulator 13 are made of the same material, such as steatite, follisterite, barium titanate, etc., the mechanical strength of the ceramic after sintering is low.

Therefore, although K used as a chip component has sufficient mechanical strength, it has an insufficient mechanical strength and cannot be applied to board components used for mounting various chip components and mounting.

Furthermore, after firing, the external electrodes 11 are baked to form a completed part, which requires many manufacturing steps, and it is difficult to construct a large number of resistor and capacitor elements with large parts. There are also problems with densification.

(3) Purpose of the Invention The purpose of the present invention is to eliminate such conventional drawbacks, to construct a plurality of resistors and capacitors by simultaneous firing at low temperatures in an oxidizing atmosphere, and to produce a dielectric material with a high dielectric constant. An object of the present invention is to provide a composite laminated ceramic component in which a large capacitance capacitor is formed by using the above.

According to the present invention, a dielectric constant of
A high emissivity dielectric layer having the same composition as the above-mentioned high emissivity dielectric layer, which has one or more high emissivity dielectric layers, an electrode pattern on the surface, and a via hole connected to the electrode nozzle. A composite laminated ceramic component is obtained, which includes a structure in which a dielectric material, a mixed layer of alumina, and glass are laminated in contact with each other.

(4) Explanation of the structure and operation of the invention Hereinafter, the present invention will be explained in detail with reference to Examples.

〔Example〕

First, the low permittivity dielectric green sheet (hereinafter referred to as glass/ceramic or raw sheet) made of glass/ceramic used in the present invention is aluminum oxide 40-6011:
Total amount of crystallized glass is 100% in the composition range of 60 to 40% by weight.
% of the mixed powder is made into a slurry with a binder, an organic solvent, and a plasticizer, and then formed into a film by slip casting using a doctor blade to a thickness of 20 μm to 300 μm.
A green sheet of m is formed on a polyester film, peeled off, and then punched into desired external dimensions to obtain a sheet. ζThe composition of the crystallized glass powder used here is based on oxide conversion notation: lead oxide, boron oxide, silicon dioxide, group Il elements hexoxide, group II elements (however, carbon, silicon,
(excluding lead) oxides with a weight ratio of 3 to 66 and 2 to 5, respectively.
0%, 4-65% l011-5 (1,0,0,2-20
% composition range and a total amount of ioo%.

The starting raw material powder for the raw sheet of a commercial electrically conductive material (hereinafter referred to as a high dielectric material) having a relative permittivity of 50 or more is F, O.
A predetermined amount of PbO, Nb2O, and WO3 powders are weighed, mixed in a ball mill, filtered, dried, and prefired at 700 to soo'a. Next, it is ball-milled and then mixed with a binder, an organic solvent, and a plasticizer to form a slurry. This slurry was subjected to pickpocketing and casting film formation using a doctor blade to obtain a high corrosion electric material raw sheet having a thickness of 105 m to 200 μm.

As the starting raw material powder for the mixed raw sheet of high dielectric material and crystallized glass, the crystallized glass used for the glass/seven ramic raw sheet was used. Further, the high dielectric powder used was the one made when producing the high dielectric green sheet.

A crystallized glass powder and a high dielectric constant powder were weighed at a weight ratio of 5=95, and a binder, an organic solvent, and a plasticizer were mixed into the ball milled mixed powder to form a slurry. The film was formed using the pickpocketing and casting method, and the thickness was 10 μm or more.
A mixed green sheet of 50 μm was obtained.

In addition, the resistor paste consists of ruthenium dioxide powder and crystallized glass powder using insulator green sheet (K) in a weight ratio of 1 to 1.
They were mixed in a range of 0:90 to 50:50 to obtain the desired resistance value. The mixture was kneaded with an organic vehicle containing ethyl cellulose, α-terpineol, kerosene, and an aromatic hydrocarbon solvent using a triple roll to prepare a paste.

The conductors used for the electrode layer and signal line are Au and Ag.

An alloy powder containing one or more metals such as Pd and Pi was kneaded with an organic vehicle such as ethyl cellulose, α-terpineol, kerosene, and an aromatic hydrocarbon solvent to form a paste.

5 to 11 show a composite laminated ceramic component according to an embodiment of the present invention. In these figures (a)
is a plan view, and (b) is a cross-sectional view. The formed glass/ceramic raw sheet was punched to desired external dimensions to form via holes 21 for providing electrical conduction between the upper and lower surfaces of the glass/ceramic raw sheet 20 shown in FIG. 5. The diameter of the via hole 21 formed here could be up to a minimum of 100 μm.

Next, as shown in FIG. 6, a conductor layer 2 for use as a signal line and a shield line was formed by screen printing or the like on the glass/ceramic green wire 20 provided with a via hole 21. At the same time, a conductor was embedded in the bi-7 hole 21. As a conductor, Au, Ag, Pd
A paste consisting of a single metal such as , P or an alloy containing one or more of these metals was used. glass/ceramic,
A raw sheet 2o in which the conductor layer 2 was formed only in the pie 7 hole 210 portion and its vicinity was also produced.

Next, a seventh layer was applied to the glass-ceramic raw sheet 2° with the conductor layer 2 formed only in the via hole 21 portion and its vicinity.
The through resistor paste 23 shown in the figure was printed. Further, although not shown, in some cases, a resistor paste is similarly printed on glass/ceramic or raw material sheets in which no via holes are formed.

Next, the structure on the capacitor side will be explained.

High dielectric Pb (Fs xizNbx
/x) 0, -Pb(F'e 2J'+ Wl/8) 0
The three-component composite peropskite compound (hereinafter referred to as PNW) has a large dielectric constant of about 15,000, but when laminated with glass/ceramic or raw sheet and fired, there is a gap between the high dielectric material and the glass/ceramic. A large stress resulting from the difference in shrinkage rate is applied, and in the worst case, peeling occurs.

When the PNW and the glass/ceramic are fired separately, the shrinkage ratios are the same, but the shrinkage ratio at the laminated boundary becomes smaller.

The inventor's research revealed that the liquid phase component that promotes sintering of jUPNW diffuses into the glass/ceramic layer, so the surface layer of PNW cannot be sintered and the shrinkage rate is small. Therefore, it has been found that j) diffusion of PNW into the glass-ceramic layer can be prevented by mixing a part of the PNW components into the glass-ceramic layer.

In order to form a capacitor, the PNW raw sheet 24 is first punched as shown in FIG. Next, this P
A conductor layer 2 similar to that shown in FIG. 6 is also formed on the NW raw sheet 24 in which the conductor layer 2 is formed only in the via hole 21 portion and its vicinity.

Next, a ninth conductor layer 2, which will become an electrode layer, is placed on the mixed raw sheet 25.
Form as shown.

Next, as shown in FIG. 11, each of the sheets shown in FIGS. 6 to 9, the glass/ceramic raw sheet 20 shown in FIG. 10 for adjusting the thickness of the laminate, and only the via hole 21 and its vicinity The glass/ceramic material on which the conductor layer 2 is formed and the green sheet 20 are heated at a temperature of 100 to 130°C and a pressure of 200 to 200°C.
Lamination was carried out using a press machine at 300#/d. In FIG. 11, the electric conductor sheet and the conductor layer 2 formed on its upper and lower surfaces become the capacitor forming part 3 after sintering, and the conductor layer 26 for external terminals is passed through the via hole 21 and the conductor layer 2.
is connected to.

Moreover, the resistor 4 can be formed by laminating and baking the U01-based resistor paste 23, and is led to the outside through the via hole 21 and the conductor layer 2 for wiring.

The laminated body laminated and thermocompressed in this manner was cut into predetermined external dimensions, and a fired body was manufactured through a binder removal process for decomposing and vaporizing the binder, and a firing process.

The capacitor built into the composite laminated ceramic component manufactured in this manner had a capacitance of about 605 J compared to a capacitor manufactured using only a dielectric material. The built-in capacitor according to the present invention has a capacitance 15 times that of the conventional method.

(5) Explanation of effects As described above, the present invention has the following effects.

By preventing or preventing the liquid phase component of the dielectric incorporated into the composite multilayer ceramic component from diffusing into the glass ceramic, a dielectric with a predetermined dielectric constant is obtained, resulting in a capacitor with a large capacity. A ceramic wiring board is integrally formed.

[Brief explanation of the drawing]

Figures 1 to 4 show conventional parts, and Figures 1 and 4 (a
) is a sectional view, FIG. 2(a) and FIG. 4(a) are perspective views, FIG. 2(b), FIG. 3(b), and FIG. Figures to Figure 10 show each manufacturing process of the composite laminated ceramic component of this example, and (a) of each figure is a plan view, (
b) shows a cross-sectional view. Figure ii is a schematic internal cross-sectional view of 4 of the completed parts of this example. L... Alumina sheet, 2... Conductor layer, Total... Capacitor formation. Part, 4...Resistor, 11...External electrode, 12...Multilayer chip capacitor, 13...Insulator, 20...
...Glass/ceramic raw sheet, 21...
... Via hole, 23 ... Resistance paste, 2
4... PNW raw sheet, 25... Mixed raw sheet, 26... Conductor layer for external terminals. Figure 4 (W) (b) Figure 5 Figure 8

Claims (1)

[Claims] A high dielectric constant dielectric layer with a relative dielectric constant of 11 or more, which has an electrode pattern on its surface and a via hole connected to the electrode pattern, and a via hole that has an electrode pattern on its surface and is connected to the electrode pattern. A composite laminated ceramic comprising a structure in which a high-permittivity electric shield having the same composition as the high-permittivity dielectric layer and a mixed layer of alumina and glass are laminated in contact with each other. parts.