JPS6447099A - Ceramic composite substrate - Google Patents

Ceramic composite substrate

Info

Publication number
JPS6447099A
JPS6447099A JP62205478A JP20547887A JPS6447099A JP S6447099 A JPS6447099 A JP S6447099A JP 62205478 A JP62205478 A JP 62205478A JP 20547887 A JP20547887 A JP 20547887A JP S6447099 A JPS6447099 A JP S6447099A
Authority
JP
Japan
Prior art keywords
sheet
dielectric constant
viahole
land
conductive paste
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP62205478A
Other languages
Japanese (ja)
Other versions
JPH0525399B2 (en
Inventor
Yoshiki Inoue
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp filed Critical NEC Corp
Priority to JP62205478A priority Critical patent/JPS6447099A/en
Publication of JPS6447099A publication Critical patent/JPS6447099A/en
Publication of JPH0525399B2 publication Critical patent/JPH0525399B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • H05K1/162—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed capacitors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4626—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials
    • H05K3/4629—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials laminating inorganic sheets comprising printed circuits, e.g. green ceramic sheets

Abstract

PURPOSE:To enable small-sized mounting of a medium capacitance capacitor together with a large capacitance capacitor, by constituting a ceramic dielectric layer comprising a conductive wiring, a capacitor and a viahole with a plurality of conductive layers having different dielectric constants. CONSTITUTION:A viahole 2 for conducting an upper sheet into a lower sheet is provided at a desired position on a ceramic green sheet 1 with a high dielectric constant. An internal electrode 4 formed with a conductive paste attached to a sheet 1 with a high dielectric constant is connected to a land 3 by an internal wiring 5 formed with the conductive paste attached. An insulating ceramic green sheet 6 forms the viahole 2, the land 3 and the internal electrode 4. An external electrode 8 is formed with the above-described conductive paste attached to a most outside layer. The viahole 2, the land 3, the internal electrode 4 and the internal wiring 5 are provided in a sheet 9 with a medium dielectric constant. The sheet 1 with a high dielectric constant, the insulating sheet 6 and the sheet 9 with a medium dielectric constant are laminated and then baked to obtain a ceramic composite substrate having two dielectric layers.
JP62205478A 1987-08-18 1987-08-18 Ceramic composite substrate Granted JPS6447099A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP62205478A JPS6447099A (en) 1987-08-18 1987-08-18 Ceramic composite substrate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62205478A JPS6447099A (en) 1987-08-18 1987-08-18 Ceramic composite substrate

Publications (2)

Publication Number Publication Date
JPS6447099A true JPS6447099A (en) 1989-02-21
JPH0525399B2 JPH0525399B2 (en) 1993-04-12

Family

ID=16507519

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62205478A Granted JPS6447099A (en) 1987-08-18 1987-08-18 Ceramic composite substrate

Country Status (1)

Country Link
JP (1) JPS6447099A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008258619A (en) * 2007-03-30 2008-10-23 Ind Technol Res Inst Wiring structure of laminated capacitor

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS50119815A (en) * 1974-03-08 1975-09-19
JPS5817651A (en) * 1981-07-24 1983-02-01 Hitachi Ltd Multilayer circuit board and its manufacture
JPS5917232A (en) * 1982-07-20 1984-01-28 日本電気株式会社 Composite laminated ceramic part and method of producing same
JPS59132114A (en) * 1983-01-18 1984-07-30 松下電器産業株式会社 Laminated ceramic capacitor
JPS6088420A (en) * 1983-10-21 1985-05-18 日本電気株式会社 Composite laminated ceramic part

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS50119815A (en) * 1974-03-08 1975-09-19
JPS5817651A (en) * 1981-07-24 1983-02-01 Hitachi Ltd Multilayer circuit board and its manufacture
JPS5917232A (en) * 1982-07-20 1984-01-28 日本電気株式会社 Composite laminated ceramic part and method of producing same
JPS59132114A (en) * 1983-01-18 1984-07-30 松下電器産業株式会社 Laminated ceramic capacitor
JPS6088420A (en) * 1983-10-21 1985-05-18 日本電気株式会社 Composite laminated ceramic part

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008258619A (en) * 2007-03-30 2008-10-23 Ind Technol Res Inst Wiring structure of laminated capacitor
JP2011211210A (en) * 2007-03-30 2011-10-20 Ind Technol Res Inst Laminated capacitor and integrated circuit substrate

Also Published As

Publication number Publication date
JPH0525399B2 (en) 1993-04-12

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