JPS6489385A - Thick film hybrid integrated circuit board - Google Patents

Thick film hybrid integrated circuit board

Info

Publication number
JPS6489385A
JPS6489385A JP24540887A JP24540887A JPS6489385A JP S6489385 A JPS6489385 A JP S6489385A JP 24540887 A JP24540887 A JP 24540887A JP 24540887 A JP24540887 A JP 24540887A JP S6489385 A JPS6489385 A JP S6489385A
Authority
JP
Japan
Prior art keywords
conductor
substrate
throughholes
dielectric
capacitor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP24540887A
Other languages
Japanese (ja)
Inventor
Shiro Ezaki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp filed Critical Toshiba Corp
Priority to JP24540887A priority Critical patent/JPS6489385A/en
Publication of JPS6489385A publication Critical patent/JPS6489385A/en
Pending legal-status Critical Current

Links

Abstract

PURPOSE:To reduce space factor of capacitors and to improve component mounting density by forming the capacitors taking advantage of throughholes formed on an insulating substrate. CONSTITUTION:Tiny throughholes are formed on an alumina substrate 11, which is baked in an oxide atmosphere after filling a lead titanate paste into the throughholes. A palladium silver paste is printed and baked to form conductors 14a, 14b on the surface of the substrate 11, the conductor 14a extending by covering the surface of a dielectric 13. A resistor 15 is formed with a rubidium oxide paste wherein a part thereof overlaps the conductors 14a, 14b. A capacitor 19 is formed by forming conductors 16a-16c on the back side of the substrate, the conductor 16b covering the bottom surface of the dielectric 13. An upper layer conductor 18 is formed on the conductor 16a with an insulator 17 interposed therebetween. Another possible constitution is that a dielectric 21 is formed by covering the conductor 14a inside the throughhole 12 and the top thereof, which then is covered with the conductor 16b to form a capacitor 16. According to the constitution, the space factor of the capacitor is reduced, whereby the mounting density is improved.
JP24540887A 1987-09-29 1987-09-29 Thick film hybrid integrated circuit board Pending JPS6489385A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP24540887A JPS6489385A (en) 1987-09-29 1987-09-29 Thick film hybrid integrated circuit board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP24540887A JPS6489385A (en) 1987-09-29 1987-09-29 Thick film hybrid integrated circuit board

Publications (1)

Publication Number Publication Date
JPS6489385A true JPS6489385A (en) 1989-04-03

Family

ID=17133209

Family Applications (1)

Application Number Title Priority Date Filing Date
JP24540887A Pending JPS6489385A (en) 1987-09-29 1987-09-29 Thick film hybrid integrated circuit board

Country Status (1)

Country Link
JP (1) JPS6489385A (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2714217A1 (en) * 1993-12-17 1995-06-23 Thomson Csf High frequency resonator assembly using stripline or three-plate structure
FR2714216A1 (en) * 1993-12-17 1995-06-23 Thomson Csf High frequency resonator using three-plate or stripline structure with tuned filters
JP2007005431A (en) * 2005-06-22 2007-01-11 Shinko Electric Ind Co Ltd Capacitor-embedded substrate and its manufacturing method
JP2019057703A (en) * 2017-09-21 2019-04-11 サムソン エレクトロ−メカニックス カンパニーリミテッド． Capacitor component
CN110767632A (en) * 2019-09-26 2020-02-07 福建省福联集成电路有限公司 Capacitor structure and manufacturing method

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2714217A1 (en) * 1993-12-17 1995-06-23 Thomson Csf High frequency resonator assembly using stripline or three-plate structure
FR2714216A1 (en) * 1993-12-17 1995-06-23 Thomson Csf High frequency resonator using three-plate or stripline structure with tuned filters
JP2007005431A (en) * 2005-06-22 2007-01-11 Shinko Electric Ind Co Ltd Capacitor-embedded substrate and its manufacturing method
JP2019057703A (en) * 2017-09-21 2019-04-11 サムソン エレクトロ−メカニックス カンパニーリミテッド． Capacitor component
CN110767632A (en) * 2019-09-26 2020-02-07 福建省福联集成电路有限公司 Capacitor structure and manufacturing method

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