JPS6477990A - Hybrid integrated circuit - Google Patents
Hybrid integrated circuitInfo
- Publication number
- JPS6477990A JPS6477990A JP23514087A JP23514087A JPS6477990A JP S6477990 A JPS6477990 A JP S6477990A JP 23514087 A JP23514087 A JP 23514087A JP 23514087 A JP23514087 A JP 23514087A JP S6477990 A JPS6477990 A JP S6477990A
- Authority
- JP
- Japan
- Prior art keywords
- printed
- resistors
- insulating layer
- resistor
- baked
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Abstract
PURPOSE:To enhance integration density, to form printed resistors accurately and to reduce man-hours, by forming the RuO2 based printed resistors on a ceramic board, and forming inorgainc-glass or organic material based insulating layer on parts of said printed resistors. CONSTITUTION:A printed resistor 1, whose main component is ruthenium oxide, is printed and dried on a board 5 and baked in the air at the temperature of about 850 deg.C after the drying. An inorganic-glass based insulating layer 2 is printed and dried on the printed resistor 1. Thereafter, the device is baked in the air at the temperature of about 850 deg.C. Then a RuO2 based printed resistor 3, which is electrically insulated from the printed resistor 1 with the insulating layer 2 and has the crossover pattern together with the printed resistor 1, is printed and dried. The device is baked and formed in the air at the temperature of about 850 deg.C. The trimming of the resistors is performed all together. Conductors 4 comprising AgPd and the like are formed before the formation of the lower printed resistor 1. In this way, the printed resistors 1 and 3, which are electrically insulated with the insulating layer 2 and overlapped, are formed. Therefore, the integrating density is enhanced, the resistors can be trimmed accurately and the trimming man-hours can be decreased.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP23514087A JPS6477990A (en) | 1987-09-18 | 1987-09-18 | Hybrid integrated circuit |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP23514087A JPS6477990A (en) | 1987-09-18 | 1987-09-18 | Hybrid integrated circuit |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6477990A true JPS6477990A (en) | 1989-03-23 |
Family
ID=16981646
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP23514087A Pending JPS6477990A (en) | 1987-09-18 | 1987-09-18 | Hybrid integrated circuit |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6477990A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6399230B1 (en) | 1997-03-06 | 2002-06-04 | Sarnoff Corporation | Multilayer ceramic circuit boards with embedded resistors |
| US10337517B2 (en) | 2012-01-27 | 2019-07-02 | Edwards Limited | Gas transfer vacuum pump |
-
1987
- 1987-09-18 JP JP23514087A patent/JPS6477990A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6399230B1 (en) | 1997-03-06 | 2002-06-04 | Sarnoff Corporation | Multilayer ceramic circuit boards with embedded resistors |
| US10337517B2 (en) | 2012-01-27 | 2019-07-02 | Edwards Limited | Gas transfer vacuum pump |
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