JPS57166716A - Lamination delay line - Google Patents

Lamination delay line

Info

Publication number
JPS57166716A
JPS57166716A JP5165781A JP5165781A JPS57166716A JP S57166716 A JPS57166716 A JP S57166716A JP 5165781 A JP5165781 A JP 5165781A JP 5165781 A JP5165781 A JP 5165781A JP S57166716 A JPS57166716 A JP S57166716A
Authority
JP
Japan
Prior art keywords
lead
electrodes
out parts
elements
terminals
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP5165781A
Other languages
Japanese (ja)
Inventor
Minoru Takatani
Seiji Sasaki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
TDK Corp
Original Assignee
TDK Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by TDK Corp filed Critical TDK Corp
Priority to JP5165781A priority Critical patent/JPS57166716A/en
Publication of JPS57166716A publication Critical patent/JPS57166716A/en
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H03ELECTRONIC CIRCUITRY
    • H03HIMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H7/00Multiple-port networks comprising only passive electrical elements as network components
    • H03H7/30Time-delay networks
    • H03H7/32Time-delay networks with lumped inductance and capacitance

Abstract

PURPOSE:To form a small-sized, thin delay line by mounting chip type inductance elements on a composite capacitor substrate obtained by laminating electrodes and dielectric layers mutually, and connecting the external electrodes of the elements to formed electrodes on the external surface of the substrate. CONSTITUTION:On a dielectric layer 1, an electrode 2 is formed while its lead- out parts 3 and 4 are exposed to the upper and lower sides of the layer 1. Then, a dielectric layer 5 is printed, four small electrodes 6-9 are printed being superposed upon the lower electrode, and lead-out parts (a)-(d) are provided alternately at the upper and lower parts. A dielectric layer 10 is formed covering the electrodes 6-9 with the lead-out parts (a)-(d) exposed. They are baked at prescribed temperature to form a composite capacitor substrate. On the substrate, linear conductors 11-14 connected to the lead-out parts (a)-(d), linear conductors 15 and 16 extending from terminals A and B on a left and a right flank, and terminals C and D connecting with the lead-out parts 3 and 4 are provided. Lastly, known chip type inductance elements L1-L5 are mounted, and the conductors 11-16 and the external terminals 22 and 23 of the elements are soldered.
JP5165781A 1981-04-08 1981-04-08 Lamination delay line Pending JPS57166716A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP5165781A JPS57166716A (en) 1981-04-08 1981-04-08 Lamination delay line

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP5165781A JPS57166716A (en) 1981-04-08 1981-04-08 Lamination delay line

Publications (1)

Publication Number Publication Date
JPS57166716A true JPS57166716A (en) 1982-10-14

Family

ID=12892942

Family Applications (1)

Application Number Title Priority Date Filing Date
JP5165781A Pending JPS57166716A (en) 1981-04-08 1981-04-08 Lamination delay line

Country Status (1)

Country Link
JP (1) JPS57166716A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5974723U (en) * 1982-11-10 1984-05-21 ティーディーケイ株式会社 LC composite parts
JPH0436327U (en) * 1990-07-25 1992-03-26

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5974723U (en) * 1982-11-10 1984-05-21 ティーディーケイ株式会社 LC composite parts
JPH0115159Y2 (en) * 1982-11-10 1989-05-08
JPH0436327U (en) * 1990-07-25 1992-03-26

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