JPS5710960A - Semiconductor package - Google Patents

Semiconductor package

Info

Publication number
JPS5710960A
JPS5710960A JP8533480A JP8533480A JPS5710960A JP S5710960 A JPS5710960 A JP S5710960A JP 8533480 A JP8533480 A JP 8533480A JP 8533480 A JP8533480 A JP 8533480A JP S5710960 A JPS5710960 A JP S5710960A
Authority
JP
Japan
Prior art keywords
aluminum
ceramic
semiconductor package
laminated
baked
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP8533480A
Other languages
Japanese (ja)
Inventor
Osamu Sakuma
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP8533480A priority Critical patent/JPS5710960A/en
Publication of JPS5710960A publication Critical patent/JPS5710960A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
    • H01L23/64—Impedance arrangements
    • H01L23/642—Capacitive arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

PURPOSE:To make a semiconductor package incorporate a capaictor in built-in manner, by forming a ceramic capacitor in the ceramic part of a laminated baked ceramic type semiconductor package. CONSTITUTION:Shown in the figure is a dual inline type laminated baked ceramic package of frit-sealed structure, wherein laminated and baked in order from the lower layer are a substrate 1, made of aluminum or the like, on whose upper surface a capacitor electrode 2b made from a metal layer has been formed; a ferroelectric plate 3, made of titanic acid barium or the like, on whose upper surface a capacitor electrode 2a has been formed; an insulating plate 4 of aluminum or the like; a chip- mounting substrate 6 on which both a chip-bonding region 5 and an internal wiring have been formed; a wiring frame 8, made of aluminum or the like, on which an internal wiring 7 has been formed; and a sealing frame of aluminum or the like. Formed on the end surfaces are external terminals 11 to electrically connect with the desired internal wirings or the capaictor electroedes 2a and 2b respectively.
JP8533480A 1980-06-24 1980-06-24 Semiconductor package Pending JPS5710960A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8533480A JPS5710960A (en) 1980-06-24 1980-06-24 Semiconductor package

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8533480A JPS5710960A (en) 1980-06-24 1980-06-24 Semiconductor package

Publications (1)

Publication Number Publication Date
JPS5710960A true JPS5710960A (en) 1982-01-20

Family

ID=13855735

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8533480A Pending JPS5710960A (en) 1980-06-24 1980-06-24 Semiconductor package

Country Status (1)

Country Link
JP (1) JPS5710960A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6464240A (en) * 1987-09-03 1989-03-10 Tdk Corp Ic package
JPH0478275U (en) * 1990-11-20 1992-07-08

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS495392A (en) * 1972-04-28 1974-01-18

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS495392A (en) * 1972-04-28 1974-01-18

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6464240A (en) * 1987-09-03 1989-03-10 Tdk Corp Ic package
JPH0478275U (en) * 1990-11-20 1992-07-08

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