JPH0478275U - - Google Patents
Info
- Publication number
- JPH0478275U JPH0478275U JP12140090U JP12140090U JPH0478275U JP H0478275 U JPH0478275 U JP H0478275U JP 12140090 U JP12140090 U JP 12140090U JP 12140090 U JP12140090 U JP 12140090U JP H0478275 U JPH0478275 U JP H0478275U
- Authority
- JP
- Japan
- Prior art keywords
- surface treated
- transport frame
- clamp
- racking device
- surface treatment
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004381 surface treatment Methods 0.000 claims 2
Landscapes
- Coating Apparatus (AREA)
Description
第1図は本考案の実施例に係るラツキング装置
の概要を示す要部斜視図、第2図は処理型材を搬
送枠に吊り下げた状態を示す断面図、第3図は処
理型材の挟持状態例を示す断面図、第4図は他の
実施例を処理型材の吊り下げ状態をもつて示す断
面図、第5図は縦溝の設け方の他例を示す要部斜
視図、第6図は押圧手段の他例を示す要部斜視図
である。
1……挾持具、3……支持体、5,5′……押
圧手段、7……操作ハンドル、11……処理型材
(被表面処理材料)、12……掴み代、13……
縦溝、14……切欠、15……搬送枠、L……掴
み代の巾寸法。
Fig. 1 is a perspective view of the essential parts showing an outline of a racking device according to an embodiment of the present invention, Fig. 2 is a cross-sectional view showing a state in which a processed form is suspended on a conveyance frame, and Fig. 3 is a state in which the processed form is clamped. FIG. 4 is a cross-sectional view showing another example with the treated profile in a suspended state; FIG. 5 is a perspective view of the main part showing another example of how to provide vertical grooves; FIG. 6 FIG. 7 is a perspective view of a main part showing another example of the pressing means. DESCRIPTION OF SYMBOLS 1... Clamping tool, 3... Support body, 5, 5'... Pressing means, 7... Operating handle, 11... Treated mold material (material to be surface treated), 12... Grasping allowance, 13...
Vertical groove, 14... Notch, 15... Conveyance frame, L... Width dimension of gripping allowance.
Claims (1)
処理材料を搬送枠に吊り下げる表面処理用ラツキ
ング装置において、 上記挾持具は、操作ハンドルの操作で開閉方向
に移動できる押圧手段と、該押圧手段と対向する
状態に設けられた支持体とを備え、被表面処理材
料の端部には、所定の巾寸法が付与された掴み代
を形成して、該被表面処理材料の掴み代を上記挾
持具の押圧手段と支持体とで挾持するように構成
したことを特徴とする表面処理用ラツキング装置
。[Scope of Claim for Utility Model Registration] In a racking device for surface treatment that suspends a material to be surface treated from a transport frame via a clamp provided on the transport frame side, the clamp can be opened and closed in the opening and closing direction by operating an operating handle. A gripping member having a predetermined width is formed at the end of the material to be surface treated, and a support member is provided to face the pressing member. 1. A racking device for surface treatment, characterized in that the material to be surface treated is gripped by a pressing means of the clamping tool and a support.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP12140090U JPH0478275U (en) | 1990-11-20 | 1990-11-20 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP12140090U JPH0478275U (en) | 1990-11-20 | 1990-11-20 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH0478275U true JPH0478275U (en) | 1992-07-08 |
Family
ID=31869257
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP12140090U Pending JPH0478275U (en) | 1990-11-20 | 1990-11-20 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0478275U (en) |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS534706A (en) * | 1976-07-02 | 1978-01-17 | Nippon Steel Corp | Exhaust gas circuration sintering method |
JPS5318412U (en) * | 1976-07-26 | 1978-02-16 | ||
JPS5710960A (en) * | 1980-06-24 | 1982-01-20 | Fujitsu Ltd | Semiconductor package |
-
1990
- 1990-11-20 JP JP12140090U patent/JPH0478275U/ja active Pending
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS534706A (en) * | 1976-07-02 | 1978-01-17 | Nippon Steel Corp | Exhaust gas circuration sintering method |
JPS5318412U (en) * | 1976-07-26 | 1978-02-16 | ||
JPS5710960A (en) * | 1980-06-24 | 1982-01-20 | Fujitsu Ltd | Semiconductor package |