JPS578175A - Multilayer interconnection structure for crossover and manufacture thereof - Google Patents

Multilayer interconnection structure for crossover and manufacture thereof

Info

Publication number
JPS578175A
JPS578175A JP8319580A JP8319580A JPS578175A JP S578175 A JPS578175 A JP S578175A JP 8319580 A JP8319580 A JP 8319580A JP 8319580 A JP8319580 A JP 8319580A JP S578175 A JPS578175 A JP S578175A
Authority
JP
Japan
Prior art keywords
layer
thin film
conductive
several
multilayer interconnection
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP8319580A
Other languages
Japanese (ja)
Other versions
JPH0147036B2 (en
Inventor
Mikio Sakamoto
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Priority to JP8319580A priority Critical patent/JPS578175A/en
Publication of JPS578175A publication Critical patent/JPS578175A/en
Publication of JPH0147036B2 publication Critical patent/JPH0147036B2/ja
Granted legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/315—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material
    • B41J2/32—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material using thermal heads
    • B41J2/335—Structure of thermal heads

Abstract

PURPOSE:To provide a multilayer interconnection structure free from poor connector by arranging several first conductor layers, an insulating layer partially provided with several openings, an oxidized metal thin film layer, a conductive thick film electrode and several second conductive layers. CONSTITUTION:A paste (Au or the like) is printed on a dielectric substrate 101 such as alumina ceramics directly or through a dielectric glazed layer 102 (crystalized glass or the like) and baked to form several first conductive layers 106, which is covered with a glass material better in the insulation to form an insulating layer 107 for multilayer interconnection. Openings equal in the number to heating resistors 103 are provided on the layer 107 to connecting the first conductive layer 106 and the second conductive layer 104. Then, a metal thin film 108 made of Ta or the like is formed thereon. A thick film semiconductor electrode 109 is printed on the thin film 108 on the opening and dried. The metal thin film 108 is oxidized while an electrode 109 is baked. A second conductive layer 104 is provided thereon.
JP8319580A 1980-06-19 1980-06-19 Multilayer interconnection structure for crossover and manufacture thereof Granted JPS578175A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8319580A JPS578175A (en) 1980-06-19 1980-06-19 Multilayer interconnection structure for crossover and manufacture thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8319580A JPS578175A (en) 1980-06-19 1980-06-19 Multilayer interconnection structure for crossover and manufacture thereof

Publications (2)

Publication Number Publication Date
JPS578175A true JPS578175A (en) 1982-01-16
JPH0147036B2 JPH0147036B2 (en) 1989-10-12

Family

ID=13795542

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8319580A Granted JPS578175A (en) 1980-06-19 1980-06-19 Multilayer interconnection structure for crossover and manufacture thereof

Country Status (1)

Country Link
JP (1) JPS578175A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4854936A (en) * 1986-07-29 1989-08-08 Tdk Corporation Semiconductive ceramic composition and semiconductive ceramic capacitor

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5053863A (en) * 1973-09-12 1975-05-13
JPS5422576A (en) * 1977-07-21 1979-02-20 Nippon Electric Co Method of manufacturing substrate for integrated circuit
JPS5456163A (en) * 1977-10-11 1979-05-04 Fujitsu Ltd Preparation of ceramic multilayer circuit substrate

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5053863A (en) * 1973-09-12 1975-05-13
JPS5422576A (en) * 1977-07-21 1979-02-20 Nippon Electric Co Method of manufacturing substrate for integrated circuit
JPS5456163A (en) * 1977-10-11 1979-05-04 Fujitsu Ltd Preparation of ceramic multilayer circuit substrate

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4854936A (en) * 1986-07-29 1989-08-08 Tdk Corporation Semiconductive ceramic composition and semiconductive ceramic capacitor

Also Published As

Publication number Publication date
JPH0147036B2 (en) 1989-10-12

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