JPS57129764A - Preparation of multilayer wiring for crossover - Google Patents

Preparation of multilayer wiring for crossover

Info

Publication number
JPS57129764A
JPS57129764A JP1608881A JP1608881A JPS57129764A JP S57129764 A JPS57129764 A JP S57129764A JP 1608881 A JP1608881 A JP 1608881A JP 1608881 A JP1608881 A JP 1608881A JP S57129764 A JPS57129764 A JP S57129764A
Authority
JP
Japan
Prior art keywords
layer
conductor
metal layer
multilayer wiring
insulator
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1608881A
Other languages
Japanese (ja)
Inventor
Mikio Sakamoto
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Priority to JP1608881A priority Critical patent/JPS57129764A/en
Publication of JPS57129764A publication Critical patent/JPS57129764A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electronic Switches (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)

Abstract

PURPOSE:To prepare the titled multilayer wiring being excellent in adhesiveness of a connection part by providing a heating resistor and a multilayer wiring part monolithically on a substrate provided with a dielectric glazed layer. CONSTITUTION:A plurality of the first conductor layers 103 are formed on the substrate 101 provided with the dielectric glazed layer 102, an insulator layer 104 for multiwiring having the same number of openings with that of the heating resistor 109 is provided so as to cover the layer 102, and throughout the whole surfaces of the insulator layer 104, the part of the glazed layer 102 not covered with the former and the conductor layer 103 exposed in the opening of the insulator layer 104, the first thin metal layer 106 is provided. Next, after the second thin metal layer 107 is formed on the insulator layer 104, a conductor electrode 107 for connection is formed by subjecting the metal layer 107 to photoetching so as for the layer 107 to remain on the metal layer 106 in the opening part provided in the insulator layer 104, an etching resistant layer 105 is formed by oxidizing the metal layer 106, the multiwiring part is formed by connecting the conductor layer 103 with the electrode 107, and thereafter a plurality of heating resistors 109 are provided.
JP1608881A 1981-02-05 1981-02-05 Preparation of multilayer wiring for crossover Pending JPS57129764A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1608881A JPS57129764A (en) 1981-02-05 1981-02-05 Preparation of multilayer wiring for crossover

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1608881A JPS57129764A (en) 1981-02-05 1981-02-05 Preparation of multilayer wiring for crossover

Publications (1)

Publication Number Publication Date
JPS57129764A true JPS57129764A (en) 1982-08-11

Family

ID=11906771

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1608881A Pending JPS57129764A (en) 1981-02-05 1981-02-05 Preparation of multilayer wiring for crossover

Country Status (1)

Country Link
JP (1) JPS57129764A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59106978A (en) * 1982-12-10 1984-06-20 Hitachi Ltd Thin film thermal recording head

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59106978A (en) * 1982-12-10 1984-06-20 Hitachi Ltd Thin film thermal recording head

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