JPH0115150Y2 - - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a composite component, and particularly to a composite component with a built-in capacitor useful as a hybrid integrated circuit board.

When the substrate of a composite component is used as a substrate of a hybrid integrated circuit, for example, the capacitor is formed as a built-in type. Composite parts with built-in capacitors are generally composed of a multilayer capacitor in which dielectric layers and conductive patterns for capacitor electrodes are alternately laminated and fired to integrate them. The ends of the electrodes of each built-in capacitor are exposed on the end face of the laminate, and a suitable conductive paint is applied to these exposed electrode ends to form electrode lead terminals. These electrode lead terminals are usually formed on opposite end surfaces of the laminate.
Therefore, the lead-out terminals of a relatively large-capacity capacitor and a small-capacity capacitor are drawn out to the same end face of the laminate, resulting in a drawback that the design of the position of the lead-out terminals becomes complicated.

This invention has been made to eliminate the above-mentioned drawbacks of the present invention, and provides a composite component in which the lead-out terminals of a small-capacity capacitor and the lead-out terminals of a relatively large-capacity capacitor are formed at different positions at 90° angles. be.

Hereinafter, one embodiment of the present invention will be described in detail with reference to the accompanying drawings.

Figure 1 shows three low capacitance capacitors C 1 ~ manufactured using a dielectric material with a low dielectric constant by any manufacturing method, such as a method of alternately laminating dielectric layers and conductive patterns for _capacitor electrodes. A first capacitor substrate 1 incorporating C ₃ is shown. In manufacturing this capacitor board 1, each built-in capacitor
As shown in the figure, the electrode end portions C _E of C ₁ to _{C 3} are exposed to opposing end surfaces of the capacitor substrate 1, for example, in the vertical direction in the figure. Further, as shown in the figure, a direction indicator mark 2 is attached to the lower right corner of the capacitor board 1. Of course, the position of the direction indicator mark 2 is not limited to the lower right corner.

FIG. 2 shows a second capacitor board containing three relatively high capacitance capacitors C ₄ to _{C 6} manufactured by any manufacturing method, such as the above-described lamination method, using a dielectric with a high permittivity. 3 is shown. In manufacturing this second capacitor board 3, the electrode ends C _E of each of the built-in capacitors C ₄ to _{C 6} are placed on the left and right sides in a view at a 90 degree angle from the first capacitor board 1, as shown in the figure. Expose on opposite end faces. Further, a direction indicating mark 2 is attached at the same position as the first capacitor board 1. It goes without saying that the first and second capacitor substrates 1 and 3 have the same shape and dimensions.

Next, as shown in FIG. 3, an intermediate material 4 made of a dielectric material having an appropriate dielectric constant and having the same shape and dimensions as the first and second capacitor substrates 1 and 3 is prepared.
The direction indicating marks 2 of each substrate are aligned, and the intermediate material 4 is sandwiched between the first capacitor substrate 1 and the second capacitor substrate 3 as shown in FIG. In some cases, the intermediate material 4 may not be used and the first and second capacitor substrates 1 and 3 may be directly stacked. The laminate thus obtained enters a firing furnace and is treated at the required dielectric temperature and time to form an integrated composite part.

The composite component thus obtained has a 90° angle difference between the electrode ends of the built-in low-capacity capacitors C ₁ to _{C 3} and the electrode ends of the relatively high-capacity capacitors C ₄ to _{C 6} . Because it is led out to the edge of the board,
Work efficiency is further improved because the positions of the output terminals of the low-capacity capacitor and the high-capacity capacitor can be designed independently without having to consider the positions of the output terminals of the other capacitor. Furthermore, since the low capacitance capacitor and the high capacitance capacitor are manufactured separately, there are also advantages such as good manufacturing efficiency.

When the substrate of the above composite component is used as a substrate of a hybrid integrated circuit, for example, as shown in FIG. 5, a glass coating 6 is applied to the surface of the substrate 5 after firing,
A conductive paint such as Ag-Pd paste is applied from the electrode end of each capacitor C ₁ to _{C 6} to the flat surface of the substrate to form a lead terminal 7 . In addition,
Even if it is not used as a substrate for a hybrid integrated circuit,
At least the lead terminal 7 needs to be formed. In the illustrated example, lead terminals are also formed in areas where the electrode ends are not exposed, but this is done to simplify the work and may not be provided in unnecessary areas. Although the glass coating 6 may not be provided, since a parasitic capacitance is generated between the circuit pattern and the internal electrodes when a circuit pattern is formed, it is preferable to include the glass coating 6 in order to reduce this parasitic capacitance.

Next, as shown in FIG. 6, a predetermined circuit pattern 8 is formed on the glass covering 6, and further, as shown in FIG. 7, predetermined electronic components such as a resistor R and a transistor T are mounted. In this way, a hybrid integrated circuit is formed in which the resistor R and the transistor T are mounted on the composite component substrate 5.

With this configuration, even if the circuit configuration is complex, by forming the electrode lead terminal of the built-in capacitor at a predetermined position, there are very few places that need to be insulated and crossed over the printed circuit pattern. It is sufficient to use a jumper, which has advantages such as easy circuit design and miniaturization.

Note that when applying the glass coating 6, it is preferable that the direction indicator mark 2 is not hidden. Further, the circuit pattern 8 shown in FIG. 6 is merely an example and does not represent a circuit pattern of an actual circuit. Of course, the mounting positions and connection relationships of the resistor R and transistor T in FIG. 7 are merely examples, and do not represent an actual circuit. The type and number of electronic components mounted vary depending on the actual circuit, and components other than resistors and transistors may be mounted. In addition, the shape and dimensions of the capacitor board or the number of built-in capacitors,
Capacity etc. can also be changed in various ways as necessary.

[Brief explanation of the drawing]

FIG. 1 is a plan view showing the first capacitor substrate of the composite component according to the present invention, FIG. 2 is a plan view showing the second capacitor substrate of the composite component according to the present invention, and FIG. 3 is a plan view showing the second capacitor substrate of the composite component according to the present invention. Plan view of intermediate material, 4th
The figure is a side view showing the state of the composite component according to the present invention before firing, and Figures 5 to 7 show an example of the manufacturing process when manufacturing a hybrid integrated circuit using the substrate of the composite component according to the present invention. Each is a schematic plan view. 1: first capacitor board, 2: direction indicator mark, 3: second capacitor board, 4: intermediate material,
5: Composite component board, 6: Glass coating, 7: Output terminal, 8: Circuit pattern, _C1 to _C3 : Low capacity capacitor, _C4 to _C6 : High capacity capacitor.

Claims (1)

[Claims for Utility Model Registration] (1) A first capacitor substrate containing at least one low-capacitance capacitor formed by a low-permittivity dielectric and a conductive pattern for capacitor electrodes, and a high-permittivity dielectric at least one conductive pattern formed by the body and the conductive pattern for the capacitor electrode.
A second capacitor containing two relatively high capacitance capacitors
In a composite component formed by laminating and baking a capacitor substrate, the electrode lead terminals of the low capacitance capacitor and the electrode lead terminals of the high capacitor capacitor are separated by 90° from each other.
A composite part characterized by being formed at different angles. (2) The composite component according to claim 1, which is a utility model registration, characterized in that a transistor or a resistor is mounted on the composite component. (3) The composite component according to claim 1, wherein a direction indicating mark is attached to one corner of the first and second capacitor substrates.