JPH0517905Y2 - - Google Patents

Description

[Detailed Description of the Invention] [Industrial Application Field] The present invention relates to a hybrid integrated circuit having a multilayer structure.

[Summary of the idea]

This idea was developed to create a multilayer hybrid integrated circuit device by stacking at least three or more substrates, in order to make electrical connections between each substrate using external connection terminals. It is characterized in that it is larger than the outermost substrate and that a connection electrode is provided so as to surround the external connection terminal.

[Conventional technology]

Conventionally, methods for stacking and connecting three or more boards include connecting them using external connection terminals with complicated shapes, as shown in FIGS. 2 and 3, and using external connection terminals as shown in There was a method of connecting only two alternate boards using external connection terminals of a general shape.

[Problem that the invention attempts to solve]

In the conventional technology mentioned above, the former requires external connection terminals with a special shape, distances between each board are required, and connections are complicated and difficult to check, resulting in high costs and equipment complexity. The latter had the disadvantage of being larger, and the latter had the disadvantage that only three sheets could be stacked on top of each other with the Di1 structure.

In order to eliminate these drawbacks, the present invention uses conventional general-shaped external connection terminals, stacks four or more boards in a Di1 structure, and makes it possible to electrically connect each board to each other using the external connection terminals. The object of the present invention is to provide a hybrid integrated circuit device.

[Means for solving problems]

In order to achieve the above object, the present invention makes the dimensions of the inner board larger than the outermost board, and provides connection electrodes on the end surface of the board so as to surround two or more sides of the external connection terminal or a part thereof. .

[Effect]

As a result, it is now possible to easily connect four or more boards using standard external connection terminals.
This results in a low-cost, thin, multi-layered hybrid integrated circuit device.

〔Example〕

An embodiment of this invention will be described below with reference to FIG. 1 is an alumina ceramic substrate on which circuit wiring is applied using the thick film method, 1-1 is the outermost substrate, 1-
2 is an internal board. The internal board 1-2 is made larger on the side 3 that connects with the external connection terminal 2 compared to the outermost board 1-2, and the external connection terminal 2 is
A groove 4 is cut so as to surround the side surface 2-1, and a connection electrode pattern 5 is provided on the end surface around the groove 4.
These substrates 1-1 and 1-2 are stacked one on top of the other, and after the external connection terminals 2 are inserted, they are electrically connected by solder.

The shape of the groove of this invention may be a curved shape in addition to a rectangular shape.

[Effect of idea]

According to the present invention, it is possible to connect the external connection terminals of the internal boards to be overlapped without devising a special external connection terminal shape, and it is thin and has low manufacturing cost, and it is possible to connect a large number of boards. A hybrid integrated circuit device that can be easily stacked can be realized. Furthermore, the relative positioning of the internal board and the external connection terminals is easily determined by the grooves provided in the internal board, resulting in a hybrid integrated circuit device with low manufacturing costs and high dimensional accuracy.

[Brief explanation of drawings]

FIG. 1 is a partial perspective view showing one embodiment of the present invention.
FIG. 2 is a sectional view showing a conventional example, FIG. 3 is a perspective view showing an example of the shape of the external connection terminal shown in FIG. 2, and FIG. 4 is a sectional view showing another example of the prior art. 1... Wiring board, 1-1... Outermost wiring board,
1-2...Inner layer wiring board, 2...External connection terminal,
4... Groove, 5... Connection terminal electrode, 6... Mounted component, 7... Conductor pattern.

Claims (1)

[Scope of utility model registration request] In a hybrid integrated circuit in which a wiring circuit is formed using a thick film or the like on an insulating or dielectric substrate and electrical/electronic components are mounted, at least three or more of the substrates are stacked and connected by external connection terminals. In a structure in which boards are connected to each other, in order to connect the board and external connection terminal at the center excluding the outermost part, the connection part of the board is larger than the outermost board so as to surround at least two sides of the external connection terminal. A hybrid integrated circuit with a multilayer structure characterized by the provision of grooves.