JPS5750460A - Manufacture of hybrid integrated circuit - Google Patents

Manufacture of hybrid integrated circuit

Info

Publication number
JPS5750460A
JPS5750460A JP12629580A JP12629580A JPS5750460A JP S5750460 A JPS5750460 A JP S5750460A JP 12629580 A JP12629580 A JP 12629580A JP 12629580 A JP12629580 A JP 12629580A JP S5750460 A JPS5750460 A JP S5750460A
Authority
JP
Japan
Prior art keywords
capacitors
electrodes
insulating substrate
unit capacitors
hybrid
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP12629580A
Other languages
Japanese (ja)
Inventor
Tetsushi Wakabayashi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP12629580A priority Critical patent/JPS5750460A/en
Publication of JPS5750460A publication Critical patent/JPS5750460A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/01—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate comprising only passive thin-film or thick-film elements formed on a common insulating substrate

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)

Abstract

PURPOSE:To form highly accurate capacitors and to contrive the integration of a hybrid IC by a method wherein a plurality of electrodes are formed facing each other while sandwiching dielectrics in an insulating substrate, and wiring terminals led out frm the electrodes are freely connected on the surface of the substrate to adjust the capacity of the capacitors. CONSTITUTION:Aluminium interposed between electrodes 11 and 11' facing each other in the longitudinal direction of a ceramic insulating substrate 10 becomes unit capacitors C11 and aluminum interposed between electrodes 11' and 11'' formed in series under the unit capacitors C11 becomes unit capacitors C11'' and 16 pieces of two series-connected unit capacitors are connected in parallel and 32 unit capacitors in total exist. The wiring terminals of these electrodes are led out to the surface of the insulating substrate 10 as 11L, 11'L, 11''L and capacitors having required capacitance are formed by properly connecting the 11L, 11'L, 11''L. In this method, highly accurate capacitors are formed in the insulating substrate for miniaturization and the integration of a hybrid IC will be improved.
JP12629580A 1980-09-11 1980-09-11 Manufacture of hybrid integrated circuit Pending JPS5750460A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP12629580A JPS5750460A (en) 1980-09-11 1980-09-11 Manufacture of hybrid integrated circuit

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP12629580A JPS5750460A (en) 1980-09-11 1980-09-11 Manufacture of hybrid integrated circuit

Publications (1)

Publication Number Publication Date
JPS5750460A true JPS5750460A (en) 1982-03-24

Family

ID=14931664

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12629580A Pending JPS5750460A (en) 1980-09-11 1980-09-11 Manufacture of hybrid integrated circuit

Country Status (1)

Country Link
JP (1) JPS5750460A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5521332A (en) * 1992-08-31 1996-05-28 Kyocera Corporation High dielectric layer-containing alumina-based wiring substrate and package for semiconductor device
US5868884A (en) * 1994-03-25 1999-02-09 Sumitomo Metal Industries, Ltd. Method for producing ceramic dielectrics

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5521332A (en) * 1992-08-31 1996-05-28 Kyocera Corporation High dielectric layer-containing alumina-based wiring substrate and package for semiconductor device
US5868884A (en) * 1994-03-25 1999-02-09 Sumitomo Metal Industries, Ltd. Method for producing ceramic dielectrics

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