JPS5750460A - Manufacture of hybrid integrated circuit - Google Patents
Manufacture of hybrid integrated circuitInfo
- Publication number
- JPS5750460A JPS5750460A JP55126295A JP12629580A JPS5750460A JP S5750460 A JPS5750460 A JP S5750460A JP 55126295 A JP55126295 A JP 55126295A JP 12629580 A JP12629580 A JP 12629580A JP S5750460 A JPS5750460 A JP S5750460A
- Authority
- JP
- Japan
- Prior art keywords
- capacitors
- electrodes
- insulating substrate
- unit capacitors
- hybrid
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
- H10D86/80—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple passive components, e.g. resistors, capacitors or inductors
- H10D86/85—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple passive components, e.g. resistors, capacitors or inductors characterised by only passive components
Landscapes
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Abstract
PURPOSE:To form highly accurate capacitors and to contrive the integration of a hybrid IC by a method wherein a plurality of electrodes are formed facing each other while sandwiching dielectrics in an insulating substrate, and wiring terminals led out frm the electrodes are freely connected on the surface of the substrate to adjust the capacity of the capacitors. CONSTITUTION:Aluminium interposed between electrodes 11 and 11' facing each other in the longitudinal direction of a ceramic insulating substrate 10 becomes unit capacitors C11 and aluminum interposed between electrodes 11' and 11'' formed in series under the unit capacitors C11 becomes unit capacitors C11'' and 16 pieces of two series-connected unit capacitors are connected in parallel and 32 unit capacitors in total exist. The wiring terminals of these electrodes are led out to the surface of the insulating substrate 10 as 11L, 11'L, 11''L and capacitors having required capacitance are formed by properly connecting the 11L, 11'L, 11''L. In this method, highly accurate capacitors are formed in the insulating substrate for miniaturization and the integration of a hybrid IC will be improved.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP55126295A JPS5750460A (en) | 1980-09-11 | 1980-09-11 | Manufacture of hybrid integrated circuit |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP55126295A JPS5750460A (en) | 1980-09-11 | 1980-09-11 | Manufacture of hybrid integrated circuit |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5750460A true JPS5750460A (en) | 1982-03-24 |
Family
ID=14931664
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP55126295A Pending JPS5750460A (en) | 1980-09-11 | 1980-09-11 | Manufacture of hybrid integrated circuit |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5750460A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5521332A (en) * | 1992-08-31 | 1996-05-28 | Kyocera Corporation | High dielectric layer-containing alumina-based wiring substrate and package for semiconductor device |
| US5868884A (en) * | 1994-03-25 | 1999-02-09 | Sumitomo Metal Industries, Ltd. | Method for producing ceramic dielectrics |
-
1980
- 1980-09-11 JP JP55126295A patent/JPS5750460A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5521332A (en) * | 1992-08-31 | 1996-05-28 | Kyocera Corporation | High dielectric layer-containing alumina-based wiring substrate and package for semiconductor device |
| US5868884A (en) * | 1994-03-25 | 1999-02-09 | Sumitomo Metal Industries, Ltd. | Method for producing ceramic dielectrics |
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