JPS5917227A - Method of producing composite laminated ceramic part - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

[Detailed description of the invention] The present invention is a composite ceramic that constitutes a capacitor.

This invention relates to a method for manufacturing parts.

Conventionally, capacitors are placed on a substrate made of ceramic or the like with a wiring layer between wiring conductors, and an electronic circuit is formed using four solder wires. However, in this method, one chip type or disk type capacitor d must be installed. On the other hand, in recent years, attempts have been made to form electronic circuits including capacitors and the like inside substrates using high-7-lid technology. That is, a dielectric layer and an internal electric tree for a capacitor are alternately formed on a ceramic substrate made of alumina or the like by a screen printing method, and then an insulating layer that becomes the surface of the substrate is formed and fired to form a capacitor. However, in this case, there is a drawback that the number of steps for printing each pattern increases, resulting in poor workability. In addition, the dielectric constant of the g-electric material is small, and the flatness of the printed area deteriorates as the pressure printing layering is repeated, making it difficult to increase the number of layers, and forming a capacitor with a larger capacity than a trap. It was impossible to do so. On the other hand, there is also a method of forming a capacitor inside a substrate using an alumina clean sheet. FIG. 1 is a schematic cross-sectional view of a substrate containing a capacitor formed by this method. On the alumina green sheet; slurry 7 mark 11i11 L to form the internal electrode layer for the capacitor, the alumina clean sheet 3 on which the electrode layer is provided, and the alumina green sheet 1 on which C1 thickness can be applied if necessary. A ceramic composite component, which constituted the capacitor 4, was obtained by laminating a plurality of layers and firing at both temperatures of 1,500 to 1,600 DEG C. and in a reducing atmosphere. In this method, a high temperature of 1,500 to 1,600°C is required to sinter the alumina material, so it is necessary to use commercial melting point metals such as W and Mo as conductor materials. Because firing is carried out in a reducing atmosphere to prevent oxidation, costs such as fuel and atmosphere creation are high, and the equipment is also expensive.Also, since the dielectric constant of alumina is approximately 9, However, there was a drawback that the capacitance of this mount was also small.Furthermore, in order to improve the bonding property of the external lead terminal part of the composite ceramic component, the responsibility of A, Ag, etc. was required. Needs to be gold-plated,
There was a risk that the reliability of the parts would be impaired due to corrosion caused by the plating solution and migration pressure.

The object of the present invention is to eliminate such drawbacks of the prior art and to
Au by using a dielectric material and an insulator material that have a local dielectric constant that allows firing at a lower temperature (130'0° C. or lower) than in the past and in an oxidizing atmosphere.

Ag, Ps, Pd, etc. and alloys containing one or more of these can be used, and the method of producing a multilayer ceramic substrate using ordinary clean sea) 1 has good workability.
An object of the present invention is to provide a method for producing a new large-capacity capacitor composite laminated ceramic component that has good flatness, can be fired simultaneously, and has good soldering and other soldering properties through the firing process. .

The present invention is a process of producing a dielectric green sheet and an insulator green sheet, a process of forming through poles on a dielectric clean sheet and an insulator green sheet, and a process of forming conductors on the surface of the dielectric green sheet and through holes. , a step of forming a conductor on the surface of the insulator green sheet and/or through holes, a step of integrally molding the insulator clean sheet on which no conductor is formed, the insulator clean sheet and the dielectric green sheet on which the conductor is formed, and firing. This is a method for manufacturing a composite laminated ceramic component, comprising the steps of:

The present invention will be described in detail below based on examples.

Figures 2 to 9 are diagrams showing the manufacturing method of the present invention.
The θ diagram is a schematic cross-sectional view of a composite laminated ceramic component of the present invention produced in an example.

Insulator Green Sea) 11 shown in Figure 2 contains 40 to 60 wt% aluminum oxide, 1 to 40 wt% lead oxide, 2 to 40 wt% silicon oxide, and 1 to 30 wt% boron oxide.
w*%, 0.05 to 25 wt% of oxides of group ■ elements, and 0.05 to 25 wt% of oxides of group ■ elements (excluding carbon, silicon, and lead).
01-10 wt%, and a total of 100 wt%, inorganic powder that can be sintered at about 900°C is mixed with PVB as an organic solvent such as ethyl seltzer 7, a plasticizer, and a binder to form a slurry, and then cast. It was produced by punching a sheet of 60 sheets x 40 sheets and a thickness of 1100 sheets. On the other hand, the dielectric green-7-) 12 shown in FIG. 3 is Pb(Fe%.W5A)6. ss
(6% Nb excluded) 9 with a composition of 0.11701
The composite perovskite-based high dielectric material, which can be sintered at about 00°C, is pre-fired and ball-milled, and then made into a slurry with the same organic solvent, plasticizer, and binder used to make the insulating green sheet. After forming a film by casting, it was punched out into a size of 60 gi x 40 mm.

The insulator and dielectric materials used here can be sintered at the same very low temperature (900° C.), so they can be fired simultaneously. Furthermore, by using these abrasive materials, it is possible to use gold, silver, platinum, palladium, etc., which have low melting points, and alloys containing one or more of these as conductors, so that firing can be performed in an oxidizing atmosphere.

Next, in order to provide the outermost end of the internal electrode for the capacitor, a silver-balanum conductor is printed 1 on the insulator clean sheet 11 by screen printing, as shown in FIG.
．． internal! A pole layer 13 was formed.

In the step shown in FIG. 5, a through hole 14 was formed in the dielectric green sheet 12 to connect the internal capacitor ◆. In the process shown in Fig. 6, a silver-balanram conductor layer is printed on the dielectric green sheet in which the through holes shown in Fig. 5 are formed so that the internal electrodes for the capacitor are symmetrical with respect to the conductor pattern shown in Fig. 4. At the same time, a strand-like conductor layer 16 was printed in order to connect with the counter electrode conductor from the first layer. At this time, the conductor is completely buried in the through holes provided in the dielectric clean sheet.

In step VC of FIG. 7, an electrode N4 similar to that shown in FIG.
After printing 13, a land-like conductor layer 17 was printed on the h1 hole in order to establish conduction with the pole layer J5 at '' in FIG.

In the process shown in Fig. 8, conductor patterns are printed to route the opposing electrodes of the capacitors inside the board to the top layer of the board, respectively, and the null-hole pattern similar to that shown in Fig. 5 is printed. Insulator Green Sea that formed 14) on top of 11, inside the capacitor! An additional electrode layer pattern I8 that provides electrical continuity with one electrode layer 13 of the poles, and an additional electrode layer pattern 19 that provides electrical continuity with the other electrode layer 15 were printed. 'Figure 9 shows the final step of forming the board with the external lead terminal part (), and the insulator green sheet 4ii is formed with a through hole 14 corresponding to the position of the child part. The entire conductor N20 of the lead-out terminal part was printed.

The sheets of each layer pattern prepared separately above were laminated and thermocompressed, and the laminated structure is shown in Fig. 1θ. Layer four insulator green sheets 11 starting from the lower layer of the substrate, and then the electrode layer 13f in FIG. 4! : installed insulator sheet, printed electroconductor green sheet as shown in Figure 6, printed dielectric green sheet as shown in Fig. 7, printed electroconductor clean sheet as shown in Fig. 8
The insulator green sheet printed with the wiring conductor pattern shown in the figure and the insulator clean sheet with the top layer lead-out terminal section are stacked together and pressurized with a heat press at a total pressure of 6 tons for 30 minutes to form a VGM body and an insulator. The green sheet and the electrical layer are integrated.

Subsequently, the laminate was heated in a firing furnace (Fig.
It was fired in an oxidizing atmosphere at a temperature of 0° C. 't''.

The fabricated substrate after firing has a structure with a three-layer dielectric layer and a capacitor. In this way,
JAl-da capacitor composite laminated ceramic.

The capacitor part of the component is 4nF to 4μF.
T′j: was shown.

As described above, by using the manufacturing method of capacitor composite laminated ceramic parts of the present invention, the dielectric material and the insulating material having the same sieve conductivity can be fired at the same temperature and at a low temperature, resulting in an innovative This method has made it possible to create circuit boards with built-in large capacity capacitors, and has greatly improved the miniaturization of electronic components and their reliability and workability.

A bonding metal with a low melting point and sieve conductivity can be used as a conductor and can be fired in an oxidizing atmosphere.

[Brief explanation of drawings]

FIG. 1 is a sectional view showing the structure of a Fundenza composite substrate using the conventional aluminum cablean sheet method, and FIGS. 2 to 9 are plan views showing the manufacturing process of the present invention. FIG. 10 is a schematic cross-sectional view of a composite component manufactured by the manufacturing method of the present invention. In fig. 1,...Alumina sheet, 2...Conductor layer, 3...
Aluminum force sheet used as a poem N body layer, 4... Conde/su part, 11... Insulator green sheet, +2-4
1 electric body green sea), 13... capacitor Kawauchi tfl
T-electrode, 14...Through pole, 15...Internal opposing electrode for fundenza, 16.17...Conductor layer for top and bottom conduction, 18.19...Conductor wiring layer, 20...External lead-out terminal conductor layer. Fang l Circle 2nd mouth, 2!730 對 4 μs Okurooqen

Claims (1)

[Claims] A process of producing a dielectric clean sheet and an insulator clean sheet, a process of forming through holes in the dielectric clean sheet and an insulator green sheet, a process of forming a conductor on the surface of the Ti electric green sheet and the through holes, an insulator Forming a conductor on the surface of the clean sheet and/or through-holes - Molding the insulator green sheet on which no conductor is formed, the insulator green sheet on which the conductor is formed, and the dielectric clean sheet together (1. Baking) A method for manufacturing a composite ff1ll ceramic component characterized by having a certain degree.