JPH01321695A - Ceramic composite circuit substrate - Google Patents

Abstract

PURPOSE:To obtain a small-sized light-weight multifunctional ceramic circuit substrate having composite functions and high reliability by using various materials as a ceramic substrate material and joining a plural kind of ceramic substrates, to which elements having required functions are formed, by glass layers. CONSTITUTION:Ceramic substrates 1, on at least one surfaces of which electrodes are shaped, and glass layers 4 are laminated mutually, and the ceramic substrates 1 are joined mutually by the glass layers 4 on at least the partial surfaces of the ceramic substrates 1. Through-holes 7 are formed to at least one ceramic substrate 1, via holes 8 are shaped to at least one glass layer 4, the electrodes shaped onto the ceramic substrates 1 are connected according to a desired manner, and circuits 6 and functional devices are formed onto the laminated ceramic substrates 1. Accordingly, a high-performance circuit substrate capable of sufficiently displaying the features of various circuit elements can be manufactured, and a composite circuit substrate building in various functional devices can be prepared, thus acquiring the composite circuit substrate having the high reliability of the device and structure proper to the miniaturization and lightening of the circuits.

Description

[Detailed Description of the Invention] [Industrial Application Field] The present invention provides ceramic circuits J and I having a composite circuit function.
Regarding i-board. More specifically, it relates to a ceramic composite circuit board having a functional circuit using a substrate made of a functional material as a part of the ceramic substrate in a laminated ceramic substrate bonded with a glass material layer interposed therebetween. .

[Prior art] A conventional multilayer wiring board is disclosed in, for example, Japanese Patent Application Laid-Open No. 62-2796.
As shown in No. 95, an electric circuit is formed in a two-dimensional manner and wired three-dimensionally through through holes, but passive elements such as capacitors cannot be mounted on the surface of the board by soldering. Therefore, reliability becomes a problem when forming the junction, and various proposals have been made to solve this problem. In addition, as a composite part,
2-184728, parts with a resistor layer added to a chip capacitor, and Utility Model Application No. 62-20191
As shown in No. 9, a component is proposed in which a capacitive electrode film is formed on a dielectric substrate, and a conductive film and a resistive film are formed on the dielectric substrate through an insulating film.

In such a circuit board, since the capacitance component and the inductance component are soldered, there is a problem in mechanical and electrical reliability. Moreover, the cost for mounting also increases as the number of components increases. Furthermore, since the components are externally attached, it is difficult to make the entire circuit smaller and lighter and more compact.

In addition, although conventional composite parts have combination functions such as L, C1C, and R, they do not have circuit functions.
It was not possible to have comprehensive electrical or electronic functions.

Further, as a multilayer ceramic structure, the present applicant has submitted Japanese Patent Application Laid-Open Nos. 1968-1981 and 5594-1983.

[Problems to be Solved by the Invention] The first object of the present invention is to eliminate the deficiencies of the conventional circuit board and composite parts described below, and to solve the problems of L, C%R, and temperature sensors.
It has multiple functions including sensor functions such as vibration sensor,
The purpose of the present invention is to provide a small, lightweight, and highly reliable multifunctional ceramic circuit board.

Another object of the present invention is to provide a multifunctional ceramic circuit board whose cost does not increase significantly even when the number of mounted components increases.

[Structure of the Invention] [Means for Solving the Problems] The present invention has a structure in which a ceramic substrate having an electrode on at least one surface and a glass layer are laminated together, and at least a part of the surface of the ceramic substrate is provided with an electrode. The glass layers connect the ceramic substrates to each other, and at least one of the ceramic substrates has a through hole, and at least one of the glass layers has a via hole, and the electrodes formed on the ceramic substrate are connected to each other. This ceramic composite circuit board is characterized in that circuits and functional elements are formed on a laminated ceramic board by connecting them as desired. The ceramic substrates are two or more types of substrates made of individually fired materials with various electrical properties, and FJI'T! , the electrode is preferably made of an Ag-based or Ag-Pd-based electrode material. In addition, the ceramic substrates used are insulators, dielectrics, magnetic materials, piezoelectric materials,
This ceramic composite circuit board is made of materials selected from semiconductors as desired, and has conductive electrodes formed on ceramic substrates of each material to form unique functional elements. And among the electrodes provided on the helical board, there is one that has a high contact with the outside! The electrode is formed on the outer surface of the Lmost substrate and/or the bottom substrate of the laminated ceramic substrates, and the surface of the external electrode is plated with a metal such as Ni or CU that does not easily get soldered. It is preferable that this is done.

The structure of the multilayer ceramic composite circuit board of the present invention is composed of a heptadramic substrate and a glass adhesive layer, that is, a glass adhesive layer.
It is assembled by bonding and laminating ceramic substrates with an i-layer interposed between them.
An It polar pattern is formed. A desired circuit can be formed using this electrode pattern. Furthermore, at least one of the ceramic substrates has a through ball, and at least one of the glass layers has a via hole, which is filled with conductive paste and the TrL pole is connected to form a desired circuit. Form.

The glass layer that joins the helical substrates to each other can be bonded by melting the glass paste by forming a thick film of glass material paste at predetermined locations by thick film screen printing technology, drying, and baking. In this case, the glass paste can be left unprinted at necessary locations, such as where via holes are to be formed, and voids can be created at the necessary locations.

The present invention uses a ceramic substrate having desired characteristics, and forms functional elements having various functions within the laminated ceramic substrate.

In order to form a multilayered laminated board consisting of two or more types of materials with different characteristics, a glass material paste layer is used as a bonding layer. Desired ceramic substrates with a desired structure are stacked and fired at a relatively low temperature, and then fused and bonded. When a glass material paste layer is formed in the bonding glass layer without any voids or with some voids, and the laminate is fired, the ceramic substrates are bonded to each other and machined. A TRAMIC composite circuit board that maintains physical strength is obtained.

As a result of using glass as the bonding layer, a laminated ceramic composite circuit board with better heat resistance, better hermetic sealability, better characteristics, and ease of use can be obtained. In addition, since the glass bonding layer has excellent electrical insulation properties, the jIt electrode layers printed on the ceramic substrates used above and below the glass bonding layer have a phase difference. 1, good insulation properties can be maintained, and at the same time, excellent airtightness can be achieved. Since the glass layer is used as the bonding layer, the glass fills the spaces between the electrode patterns or the resistor patterns, and the airtightness of the electrodes is easily maintained.

In the present invention, a ceramic substrate made of a material having various functions such as an insulator, a dielectric, a magnetic, a piezoelectric, and a conductor is used as the substrate material as desired, and the circuit and functional element r° are On the ceramic substrate, an Ag-based or Ag-Pd-based electrode material that can be fired in the atmosphere is formed, and ceramic substrates with different functional materials and compositions are selected and used to match the desired electrical characteristics. Then, by forming a predetermined electrode pattern on the desired substrate and performing MW on the desired combination of ceramic substrates, a laminated substrate having a composite circuit having the desired function can be obtained.

For example, a substrate is obtained on which at least one element having one function, such as a capacitive component, and a circuit suitable for the element are formed, and at least one element having a different function, for example, a resistive component, is formed on the substrate. A glass bonding layer is provided between the substrate and another substrate on which a circuit including the above elements is formed.
It is laminated and bonded.

According to the present invention, circuits and functional elements are formed on a flexible substrate made of a material suitable for the characteristics required for each circuit element, and a semicircular substrate having separately formed elements is formed. By bonding them together via a glass adhesive layer and providing an external bonding terminal, a circuit board having multiple functions can be produced.

A multilayer ceramic wiring board with multiple functions can be created by incorporating capacitors, inductance, resistance, temperature sensors, vibration sensors, etc. inside the multilayer ceramic board.

Further, in accordance with the present invention, the substrate material used for the ceramic substrate is selected according to the desired properties of the element f to be formed on the substrate. A substrate made of an insulating material is effective for forming wiring circuits for this purpose.For example, alumina and mullite materials are suitable, but any other material that is stable in the firing process of glass paste can also be used. . Further, since a resistive element can be formed on the insulating substrate by a thick film method or the like, a circuit including a resistor is formed on the insulating material Jl (-1 of the plate).

Furthermore, if a dielectric material is used as the ceramic substrate material, electrodes can be formed on both sides of the yj heavy substrate to form a -capacitor. Circuitry for communicating this :I indenna with other circuitry can be formed on the dielectric substrate.

Further, when a magnetic material is used as a ceramic substrate material, an inductance element is formed by an electrode pattern formed on the magnetic material. A circuit for connecting this inductance to other circuits is formed on a ceramic substrate made of magnetic material.

Further, in order to produce a vibration sensor, a ceramic/reflective substrate made of a piezoelectric material is used, and the sensor pattern is formed by sandwiching the substrate. Then, a circuit connecting the vibration sensor and an external circuit is formed on the ceramic substrate made of piezoelectric material. After this vibration sensor element E is produced, a predetermined voltage is applied to electrodes formed by sandwiching the substrates to polarize it.
It can be a piezoelectric element with a vibration sensor function.

In addition, various materials can be used to fabricate a temperature sensor. For example, an insulating ceramic substrate may be used to measure changes in the aerobic conductivity of an electrical conductor formed thereon due to temperature. A method of detecting temperature from a change in the capacitor V which is formed using a substrate made of a dielectric material with a large temperature coefficient, or a method of detecting the temperature from a change in the capacitor V A method using an electromotive force due to a temperature change of a single element can be used.Alternatively, the temperature can also be measured by the NTC thermistor effect using a semiconductor material.

As described above, a circuit board with multiple functions can be obtained by bonding multiple types of ceramic substrates on which elements with desired functions are formed using various materials as desired as the ceramic substrate material using a glass layer. It will be done.

The laminated ceramic composite circuit board of the present invention is manufactured as follows. The ceramic substrates having electrical properties that exhibit desired characteristics are individually fired, and at least one of the ceramic substrates is fired individually. Then, a metal conductor layer pattern or an 'if pole pattern is formed by screen printing or the like.

Next, a glass paste layer is formed by a screen printing method on the bonding portions or bonding points of the ceramic substrates having each desired pattern, and a large number of such ceramic substrates are stacked according to a predetermined method to form a laminate. By firing, the multilayer ceramic substrate is attached with a glass paste layer. A ceramic composite circuit laminate having a glass paste layer is subjected to low-temperature firing treatment and melt-bonded.

Each substrate having a desired element is bonded using a glass layer.

The various types of ceramic substrates used in the present invention are manufactured using a method similar to the manufacturing technology of ordinary ceramic substrates. For example, a green sheet is formed by a doctor blade method or an extrusion method, and then punched from this green sheet. By this process, a desired external shape and through holes are formed to obtain a green sheet having a desired shape. Each green sheet is fired using the firing temperature and firing conditions suitable for each material, and the thickness is o, osm ~ o, s■
Ceramic/reliable substrates of about 100% are manufactured. A wiring pattern is printed on this substrate using an Ag-based or Ag-Pd-based conductive paste. Further, when forming a resistor element -r, a thick film resistor paste is printed on this. The circuitry necessary for electrical conduction between the front and back sides of the substrate is performed by an Ag-based or Ag-Pd-based conductor filled in through holes of 0.2 to 1°QfilΦ formed in the substrate. The ceramic substrate on which electrodes, circuits, etc. are printed in this manner is fired in an atmospheric oxidizing atmosphere at 750 to 900°C.

Next, glass paste is printed on one or both sides of the substrate on which circuits and elements are formed, avoiding through-hole locations. It is important to select the glass paste that is suitable for the two types of ceramic substrates to be joined. Glass paste is printed, and the required number of ceramic substrates are stacked on top of each other to ensure that the pattern does not deviate according to the circuit design, and are fired and bonded while applying a load.

In addition, in order to make electrical connections between ceramic plates, it is also possible to print an Ag-based conductor in the through holes where glass paste is not printed, and to bake it at the same time as the bonding with glass paste. It is also possible to provide a conductive path for board circuit connection on the side surface of the multilayer ceramic substrate, like the end f-main electrode of a chip capacitor. Finally, in the fabricated circuit device, connect r to the external circuit.
Ni plating or Cu plating is applied to the parts to prevent Ag solder erosion.After this solder erosion prevention plating, in order to maintain solder removability, The composite circuit board of the present invention may be plated with tin, gold, or solder.Furthermore, in order to surface mount the composite circuit board of the present invention on a ceramic board, all surfaces to be connected with solder may be plated as described below. It is preferable to do so.

In addition, as a method for creating a conductor layer pattern, an electrode pattern, or a resistor pattern, a printing method is used in Explanation 4-
However, thick film methods using screen printing are particularly useful. In addition, a photoetching technique can also be used, and a method of forming a thin film by photoetching can be used. Also, both techniques can be used.

The material used to form the electrode pattern is a conductive metal such as gold, silver, platinum, palladium, or a combination thereof, and the paste is printed on the surface of the desired substrate by screen printing or the like to form a conductive pattern or 'ITc polar pattern. Further, as the material for forming the conductor layer used in the present invention, it is preferable to use silver, gold, palladium, or a combination thereof, especially for high frequencies.

Among these electrodes, the electrode formed on the outermost side, for example, the electrode formed on the outer surface of the uppermost substrate and/or the bottom substrate of a multilayer ceramic substrate, is used for connection with the outside. However, for such a ML interpolar outer electrode, the baking of Ag-based or Ag--Pd-based is avoided by interposing another metal layer between the joint portions of the conductors. The metal used for this metal layer is a metal such as Ni or Cu that is less likely to diffuse into solder than Ag. This metal layer can be formed by metallization, vapor deposition, sputtering, thick film formation and firing, or the like. This metal layer allows the Ag conductor to enter the solder when soldering with an external circuit.
It is formed to prevent diffusion and reduce reliability.

The glass layer for joining each helical substrate is formed from a glass material paste, and is produced by printing the glass paste at desired locations using the thick film production method using screen printing as described above.

To form a glass layer for bonding each plate layer to another, glass that melts at a relatively low temperature, such as borosilicate glass, borosilicate lead glass, crystallized glass, etc. etc. can be used. It is best to choose a material that has a relatively low melting point and is easy to handle, depending on the material of the substrate to be bonded. Use materials that can be bonded at as low a temperature as possible to avoid failure 4°
Ru. The processing temperature for glass melt bonding is preferably 50
It is about 0°C to 1000″C, more preferably 7
It is in the range of 50 to 900°C.

Specifically, for example, an insulating substrate and a dielectric substrate (a dielectric), (a plate and a magnetic substrate, a dielectric), a ζ plate and a piezoelectric substrate are 17. In addition, they are bonded using borosilicate glass, lead borosilicate glass, crystallized glass, etc. And its composition is B
, Si, Na, Pb%Zn, etc. [depending on the type, A1, Ti1, Li, Mg, Ba, Ca,
Oxides such as Cu are also added.

The bonding temperature of the glass paste material to be used is preferably such that the electrode paste used does not burn at a temperature higher than that temperature. Also, do not use components that cause a significant reaction between the glass component and the substrate and have a large effect on the electrical characteristics of the substrate.)
is good.

Regarding the coefficient of thermal expansion, it is preferable that the coefficient of thermal expansion of the glass component is similar to that of the substrate.

In addition, if the glass component affects the electrical characteristics of the element formed on the substrate, it is recommended to form a glass bonding layer on the element part and create a gap and bond the element at 4°. For example, to prevent the vibration of the pressure element from being influenced by the glass layer! “Electron-f-
It is possible to take the -Jj method in which no glass layer is formed on one side or the r+11i side of the area where is formed. Further, the same method can be applied to C for other circuits and elements.

Examples include a ceramic composite circuit board that combines an insulator J, a dielectric J, a plate, a magnetic substrate, and a piezoelectric substrate. Other ceramic substrates that can be used include semiconductor substrates.

As the insulator material, °f alumina-based l, phyto-based, etc. are generally used, but thoorstethite-based etc. can also be used.

As the dielectric material, in addition to barium titanate type, stron titanate type 11 type, PLZT type, etc., alumina type with good high frequency characteristics can be used.

As the magnetic material, nickel-I1 [lead ferrite (Ni-Zn noelite), manganese-zinc ferrite, and light (Mn-Zn ferrite) magnetic materials are used.

IP: Electrical materials include titanium-based barium, PZ
PZ with T-system and its modified beta-Ubusite structure
T-based materials can be used.

'tL, as a conductor, for example, t with a negative temperature coefficient.
Conductor, ie, Mn, Ni, Co-based transition metal composite oxide (and other transition metal composite oxides such as Ti, V, Cr, Fe, CU, etc.) or ZrO*-Y, O,, Aj! *0
5-MgO, Altos-Bed.

A l * Om -Z r Og, Co O-A l
*Om,Als.

m-Ca5fO,, Mg(Aj!, Cr, Fe)zoa
There are other systems such as t-conductors with positive temperature coefficients, such as rare earth or MnO doped BaTfO,
type compounds can be used.

The laminated ceramic composite circuit board obtained by Zero Hatsu 2S1 can also be used, for example, for hybrid integrated circuits used in electronic devices and the like.

Next, the ceramic composite circuit board of the present invention will be explained with reference to examples, but the present invention is not limited to the following examples.

[Example 1] [LCR cycle] A ceramic composite circuit board according to the present invention, which is a combination of an insulating substrate and a 14-layer substrate, will be explained with reference to the cross-sectional view of FIG.

Using an insulating substrate 1 (alumina substrate), on one side,
After printing the circuit pattern 6, -11, dry it, print the circuit pattern 6 on the opposite side as well, and form the circuit pattern 6 on both sides.Next, fill the through hole 5 with silver paste and dry it. . The insulating substrate 1 treated in this way was
The circuit 20 is formed by baking at 0°C.

Next, in order to form the resistive element f9 with a thick film paste, a thick film paste ink containing oxidized lute; Print the resistor pattern 9. After drying, the thick film resistor pattern 9 is baked. In this way, resistor element? 9 has 4
A circuit board 1 is manufactured. This insulation)＾board and r are
An alumina substrate with a thickness of 1100t1 was used.

Next, a circuit pattern 6 containing condensate +1 is formed on both surfaces of the substrate 2 made of a titanate 11-based dielectric. This capacitor 21 has a flat plate: 2
The through holes 5 of this dielectric substrate, which can form a capacitor type or gap type, are filled with silver paste, dried and baked at 850° C. to obtain a capacitor circuit.

Next, a circuit pattern 6 including an inductance is formed on both sides of the N1-Zn ferrite magnetic substrate 3 using the screen printing technique. Filled, dried, 85
The inductance circuit 22 is formed by baking at 0°C. In this case, pattern 6 for inductance has
Various shapes are available.

, like Otsu, Fme + Jr. pattern 6 etc. and each passive element f
For three types of substrates having -21, etc., 1. With component and glass bonding paste 2,
You can print the joining pattern. At this time, do not print glass paste on the parts where electrical connection is required. After drying this bonding glass paste 2, via holes 8 are formed at the locations where electrical connection is required. To do this, print the silver thread paste and let it dry.

The three types of substrates 1.2.3 treated as described above were stacked as shown in the cross-sectional view of Figure 1 so that connections could be made between the circuits on each substrate, and It was fired at 800 to 900° C. while maintaining the temperature so that no deviation occurred. As a result, a laminated substrate shown in the cross-sectional view of FIG. 1 was manufactured. That is, this multilayer composite circuit board includes a circuit 2 including a resistive element.
0, circuit 21 including a capacitor, inductance element -
A circuit consisting of the circuit 22 including the following was formed, and a circuit board having a composite function including the circuit functions of LC, RC, LR, and LCR, instead of a circuit board for mourning, was fabricated.

[Example 2] [LCR cycle No-plate menu] With the same structure as the multilayer composite circuit board produced in Example 1,
As the insulating substrate, 11 light type, dielectric material (for the plate, barium titanate type, for the magnetic substrate, M
Using n-Zn ferrite material, borosilicate is used as bonding glass. A multilayer composite circuit (zeta board) was formed using glass as a component. Plating a layer of 10 layers on both sides of the multilayer board, leaving the part that connects with the external circuit.
A plated film 10 of Ni or Cu was further formed on the substrate after the resist was formed by printing (as shown in the cross-sectional view of FIG. 2) by electroless plating. Furthermore, in order to prevent oxidation of this surface and improve solderability, Au plating was performed as necessary. By processing in this manner, a ceramic composite circuit board was obtained in which the external electrodes shown in the cross-sectional view of FIG. 2 were covered with a plating layer 10 to improve heat resistance.

[Example 3] [CR time] A ceramic composite circuit board according to the present invention, which is a combination of an insulating substrate, a dielectric substrate, and a piezoelectric substrate, will be explained with reference to the cross-sectional view of FIG.

A circuit pattern 6 was printed on one side of an alumina-based insulating substrate 1 using a conductive paste.

After that, -[1, Dry, and print a circuit pattern 6 with conductive paste on the opposite side to form a circuit pattern 6 on both sides.0 Next, fill the through ball 5 with silver paste and dry it. Then, bake this insulating substrate 1 at 850°C,
0 Next, in order to form the resistive element 9 at -F, a thick film paste ink containing ruthenium oxide is printed on the necessary locations on the forming circuit using screen printing technology, dried, and then printed again. This insulating substrate 1 is fired, and the thick film resistor 9 is baked. Note that a material with a large temperature coefficient was used for the paste for this thick film resistor. Further, as the insulating substrate, an aluminum nanoplate (plate) in which a through hole 5 with a thickness of 10011 m was formed was used.

Next, using a dielectric substrate 2 made of 1 tonium titanate, a circuit pattern 6 including :1-f is printed with a conductive paste on both sides thereof. In this case, both types of capacitors can be used: flat plate type; capacitor or gear/pull type capacitor. Next, the through holes 5 are filled with silver paste, dried, and the plate 2 is fired at 850°C to form a circuit and obtain a circuit 21 including a capacitor.

Next, using the PZT piezoelectric substrate 11, circuit patterns 6 are printed on both sides thereof. At that time, flat plate electrodes 12 and 13 are inserted between the substrates and opposite to each other, and the first through hole 5 to be used as a piezoelectric element is filled with silver paste and dried, and this piezoelectric substrate 3 is baked at 850°C. Then, a circuit 23 having a piezoelectric element f before polarization is fabricated.

For the three types of substrates 1, 2, and 11 produced as described above, bonding glass paste 4 is printed and formed at the bonding locations thereof. At this time, glass paste is not printed on the locations where electrical connections are required between the respective boards. After drying the glass paste, via balls 8 are formed at the locations where electrical connections are required. For this purpose, a silver thread paste is printed and dried for 1 hour. The three types of substrates 1, 2, and 11 treated in this way were stacked on each other so that the circuits could be connected, as shown in the cross-sectional view of FIG.
It was baked at 750 to 850°C while being maintained so as not to be exposed to heat. As a result, a ceramic composite circuit board shown in the cross-sectional view of FIG. 3 was manufactured.

By the treatment method described in Example 2, a Ni or Cu plating film 10 is formed by electroless plating on the part connected to the external circuit, and furthermore, the oxidation of the surface is prevented and the wettability of solder is improved. In order to improve the quality, Au plating was applied.

The electrodes 12 and 13 are passed through the multilayer ceramic composite circuit board shown in the cross-sectional view of FIG.
An electric field of kV/W was applied to perform polarization treatment. The circuit 23 including this piezoelectric element serves as a vibration sensor or a temperature sensor 11 using the pyroelectric effect.

As shown in FIG. 4, when the multi-layered heramic composite circuit board according to the present invention is used, a composite circuit with built-in temperature sensor based on resistor element f1, pyroelectric element f, vibration hinge or R11 sensor based on piezoelectric element t can be created. (A plate device can be manufactured 4).

Note that the substrate materials and glass materials used in the examples described in the present invention are examples thereof, and are not actually limited thereto.

[Effects of the Invention] The multilayer t! of the present invention! By adopting the above-mentioned configuration, the lamic composite circuit board has the following advantages: Firstly, it is possible to produce a high-performance circuit board that can fully exhibit the characteristics of various circuit elements.Secondly, it has various functions. Since a composite circuit board incorporating element P can be produced, the reliability of the device is high, and a composite circuit board with a structure suitable for reducing the size and weight of the circuit can be provided. Thirdly, the entire circuit can be made with high density. Fourthly, as the circuit and wiring material, conductors made of Ag-based or Ag-Pd-based paste, which can be fired in the atmosphere and have high conductivity, are used. Technical effects such as the multilayer ceramic composite circuit board, which is suitable for high-frequency circuits, has become N-R capable.

[Brief explanation of the drawing]

FIG. 1 is an explanatory sectional view showing the structure of one example of the multilayer ceramic composite circuit board of the present invention. FIG. 2 is an explanatory cross-sectional view showing the multilayer ceramic composite circuit board of FIG. 1 in which surface-enriched vJIL and external electrodes are plated to improve solderability. FIG. 3 is an explanatory sectional view showing the structure of another example of a multilayer Hiramink composite circuit board according to the present invention. [1 Explanation of the symbols of important parts] 1, Flumina substrate 2, Dielectric substrate 3, Magnetic substrate 4, Glass (paste) layer 5, Conductor ( paste) layer 6, circuit pattern 7, through hole 8, via hole 9, resistance pattern 10, plating layer 11, piezoelectric substrate 12.13 ．． ,,,Electrode layer patent applicant Mitsubishi Mining Cement Co., Ltd. agent Hiroshi Kuramochi (and one other person) procedural amendment September 9, 1988 Commissioner of the Patent Office Yoshi Frl Moon Takeshi 1, indication of the case 1988 Patent Application No. 153443 2, Name of the invention Ceramic composite circuit board 3, Relationship to the amended case Applicant address 5-1 Marunouchi-chome, Chiyoda-ku, Tokyo Name Mitsubishi Mining Cement Co., Ltd. Representative Tadashi Fujimura Ya 4, Agent Address: 101 F, Tokyo [-N Ward Kami Ell, 1-2 Suda-cho, L1 Koku-Shikoku Building 3F 5, Supplementary IE Order [(Attachment 6, Subject of Supplementary IE 7, Amendment) Contents (1) Correct the [connection #-] in lines 2 and 3 on page 7 of the detailed reading to [by connecting 1-]. (2) Line 6 on page 14, same as above. and [750-b on page 17, line 17 of the same above] Correct.
Line 4 and 22 ¥1 line 9 of the same, and 25 of the same
Correct [Through Ball 5] in the second line F1 of the page and the 18th line of the 25th page to [Through Hole 7]. (4) Same as 1; 22nd Sada No. 2-3 lines 11, [can form things, can form] is changed to [can form things. ] to be corrected. (5) Revise [Glass Paste 2] to [Glass Paste 4] in 14th 22nd page 11, lines 16-17 and 19-20 lines 1 of the same page. (6) Same as above. :2500th line 11-12 [1 of [thickness 10
0 μm through hole 5] to 100 μm thick through hole 7. [, B's 10E body], (handling 11) revised IE
do.

Claims (4)

[Claims] (1) A ceramic substrate provided with an electrode on at least one surface and a glass layer are laminated together, and the ceramic substrates are bonded to each other by the glass layer on at least a part of the surface of the ceramic substrate, and at least one The two ceramic substrates are provided with through holes, and at least one
1. A ceramic composite circuit board characterized in that two glass layers are provided with via holes, electrodes formed on the ceramic substrate are connected as desired, and circuits and functional elements are formed on the laminated ceramic substrate. (2) The ceramic substrate is two or more types of substrates made of individually fired materials having various electrical properties, and the electrode is made of an Ag-based or Ag-Pd-based electrode material. A ceramic composite circuit board according to claim 1. (3) The ceramic substrate is made of a material selected from insulators, dielectrics, magnetic materials, piezoelectric materials, and semiconductors as desired, and conductive electrodes and/or
Alternatively, a ceramic composite circuit board according to claim 2, in which a resistor pattern is formed and necessary functional elements are formed. (4) Among the electrodes provided on the ceramic substrate, the electrodes for connection to the outside are formed on the outer surface of the top substrate and/or the bottom substrate among the laminated ceramic substrates, and the surface of the external electrode is , N that does not easily cause solder erosion
2. The ceramic composite circuit board according to claim 1, wherein the ceramic composite circuit board is plated with a metal such as copper or copper.