JPS6389313A - Molding of resin in mold for electronic component - Google Patents
Molding of resin in mold for electronic componentInfo
- Publication number
- JPS6389313A JPS6389313A JP23577286A JP23577286A JPS6389313A JP S6389313 A JPS6389313 A JP S6389313A JP 23577286 A JP23577286 A JP 23577286A JP 23577286 A JP23577286 A JP 23577286A JP S6389313 A JPS6389313 A JP S6389313A
- Authority
- JP
- Japan
- Prior art keywords
- resin
- molds
- electronic components
- base
- elastic bodies
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011347 resin Substances 0.000 title claims abstract description 47
- 229920005989 resin Polymers 0.000 title claims abstract description 47
- 238000000465 moulding Methods 0.000 title claims description 18
- 238000000034 method Methods 0.000 claims abstract description 34
- 238000007789 sealing Methods 0.000 claims abstract description 11
- 239000000758 substrate Substances 0.000 claims description 32
- 238000002347 injection Methods 0.000 claims description 8
- 239000007924 injection Substances 0.000 claims description 8
- 239000000919 ceramic Substances 0.000 abstract description 8
- 238000003825 pressing Methods 0.000 abstract description 2
- 238000010125 resin casting Methods 0.000 abstract 2
- 239000007769 metal material Substances 0.000 abstract 1
- 239000002184 metal Substances 0.000 description 6
- 229910052751 metal Inorganic materials 0.000 description 6
- 230000003287 optical effect Effects 0.000 description 6
- 238000004519 manufacturing process Methods 0.000 description 4
- 238000005266 casting Methods 0.000 description 2
- 230000005496 eutectics Effects 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 229910000881 Cu alloy Inorganic materials 0.000 description 1
- 229910002555 FeNi Inorganic materials 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000013307 optical fiber Substances 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
- B29C45/14336—Coating a portion of the article, e.g. the edge of the article
- B29C45/14418—Sealing means between mould and article
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
- B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
- B29C45/14655—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components connected to or mounted on a carrier, e.g. lead frame
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Engineering (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Abstract
Description
【発明の詳細な説明】 〔発明の目的〕 （産業上の利用分野） 本発明は電子部品の金型樹脂成形法に関する。[Detailed description of the invention] [Purpose of the invention] (Industrial application field) The present invention relates to a mold resin molding method for electronic parts.
（従来の技術）
金型を用いた樹脂成形により基板上に搭載された電子部
品を封止する方法として、金属封止。(Prior art) Metal sealing is a method of sealing electronic components mounted on a board by resin molding using a mold.
セラミック封止、ガラス封脂、樹脂封止等の各種方法が
従来から用いられている。Various methods such as ceramic sealing, glass sealing, resin sealing, etc. have been used in the past.
このうち、特に高い信頼性を要求される場合やある種の
大容量パワートランジスタの封止を行う場合を除き、樹
脂封止による方法が一般的である。Among these methods, resin encapsulation is commonly used except in cases where particularly high reliability is required or when a certain type of large capacity power transistor is to be encapsulated.
このような樹脂封止による成形法の一例を第９図を参照
して説明する。An example of such a molding method using resin sealing will be explained with reference to FIG. 9.
この樹脂封止による成形法は、まず各種の集積回路等の
電子部品２１を、リードフレーム等の金属製の基板２０
上にハンダ付は法、ペースト法又は共晶法を用いて搭載
した後、この基板２０の両側に電極端子２２ａ、２２ｂ
を配置し、電子部品２１と電極端子２２ａ、２２ｂとの
間にそれぞれワイヤボンディングの手法により金線２３
ａ、２３ｂを接続する。In this molding method using resin sealing, electronic components 21 such as various integrated circuits are first placed on a metal substrate 20 such as a lead frame.
Electrode terminals 22a and 22b are mounted on both sides of this board 20 after being mounted using a soldering method, a paste method, or a eutectic method.
A gold wire 23 is placed between the electronic component 21 and the electrode terminals 22a and 22b by wire bonding.
Connect a and 23b.
そして、第９図に示すように前記基板２０．電子部品２
１．金線２３ａ、２３ｂと電極端子２２ａ。Then, as shown in FIG. 9, the substrate 20. Electronic parts 2
1. Gold wires 23a, 23b and electrode terminal 22a.
２２ｂの一部とを、金型を用いた樹脂封止の方法により
封止し、樹脂部２４を形成するようにしたものである。22b is sealed by a resin sealing method using a mold to form a resin portion 24.
このような成形法の場合、一対の金型の型締めの際にこ
れら金型間に挟持される電子部品２１を搭載した基板２
０には数トン程度の大きな圧力が加わるため、基板２０
が例えば銅合金、 ＦｅＮｉ合金等の金属製であれば十
分な型締めにより樹脂の流れを防止しつつ所望の成形品
を得ることができる。In the case of such a molding method, the substrate 2 on which the electronic component 21 is mounted is held between a pair of molds when the molds are clamped.
Since a large pressure of several tons is applied to the substrate 20
If it is made of metal such as copper alloy or FeNi alloy, the desired molded product can be obtained while preventing resin flow by sufficient mold clamping.
しかし、上述した成形法でセラミック類等の基板２０上
に搭載した電子部品２１を樹脂封止しようとすれば、金
型による圧力のためセラミック類の基板２０に割れや亀
裂が生じることになり、この結果、セラミック類等の基
板２０を用いた電子部品２１に対してはこの成形法を適
用できないという問題がある。However, if an attempt is made to resin-seal electronic components 21 mounted on a ceramic substrate 20 using the above-described molding method, cracks or cracks will occur in the ceramic substrate 20 due to pressure from the mold. As a result, there is a problem in that this molding method cannot be applied to electronic components 21 using a substrate 20 made of ceramic or the like.
また、この成形法は電子部品２１を外部環境から保護し
たりこの電子部品２１の作動時に生じる熱を外部に放熱
させることを主目的としており、基板２０及び電子部品
２１が樹脂部２４で封止されるものであるため、成形品
における信号の処理態様は、電極端子２２ａ、２２ｂを
介しての電気信号の処理に限定され、わずかに樹脂部２
４に透明樹脂を用いて光信号の処理を行なうものが散見
される程度であった。In addition, this molding method is mainly aimed at protecting the electronic component 21 from the external environment and dissipating heat generated when the electronic component 21 is operated to the outside, and the substrate 20 and the electronic component 21 are sealed with the resin part 24. Therefore, the signal processing mode in the molded product is limited to the processing of electrical signals via the electrode terminals 22a and 22b, and the resin part 2 is slightly
There were only a few cases where optical signals were processed using transparent resin.
一方、金型を用いない成形法として、キャスティング、
ボッティング等の注型法、浸漬法１滴下法等が知られて
いる。これらの方法はいずれも基板の一部を電子部品か
ら外方に露出させることができ、これにより、光信号、
熱信号等電気信号以外の信号処理も可能な成形品を得る
ことができるものの、成形後の樹脂の寸法精度や量産性
の点で十分なものが得られないという問題がある。On the other hand, casting,
Casting methods such as botting, dipping methods, single drop methods, etc. are known. Both of these methods allow parts of the board to be exposed outward from the electronic components, thereby allowing optical signals,
Although it is possible to obtain a molded product that is capable of processing signals other than electrical signals such as thermal signals, there is a problem in that the resin after molding cannot be obtained with sufficient dimensional accuracy or mass productivity.
（発明が解決しようとする問題点）
本発明は上述した従来の問題点を解消すべ（なされたも
のであり、金属製基板以外の基板を用いた樹脂成形品を
製造する場合にも適用でき、電気信号以外の信号処理を
行う電子部品や機能素子を基板上に封止することが可能
であり、しかも、樹脂の寸法精度が良く、量産にも適す
る電子部品の金型樹脂成形法を提供するることを目的と
するものである。(Problems to be Solved by the Invention) The present invention has been made to solve the above-mentioned conventional problems, and can also be applied to the production of resin molded products using substrates other than metal substrates. To provide a mold resin molding method for electronic components that enables electronic components and functional elements that process signals other than electrical signals to be sealed on a substrate, has good dimensional accuracy of the resin, and is suitable for mass production. The purpose is to
（問題点を解決するための手段）
本発明の電子部品の金型樹脂成形法は、基板の任意領域
に電子部品や機能素子を設ける工程と、前記電子部品や
機能素子を設けた部分を一対の金型間に形成される樹脂
注入部に臨ませつつこれら金型の型締部に備えた所定の
硬度及び耐熱性を有する一対の弾性体で前記基板を加圧
保持する工程と、前記樹脂注入部に樹脂を注入して電子
部品の、搭載部を樹脂封止した後両金型を離型する工程
とを有して構成される。(Means for Solving the Problems) The mold resin molding method for electronic components of the present invention includes a step of providing an electronic component or functional element in an arbitrary area of a substrate, and a pair of parts where the electronic component or functional element is provided. a step of holding the substrate under pressure with a pair of elastic bodies having a predetermined hardness and heat resistance provided in the mold clamping part of these molds while facing the resin injection part formed between the molds; The process includes the steps of injecting resin into the injection part to seal the mounting part of the electronic component with resin, and then releasing both molds.
（作 用）
上記成形法によれば、基板の任意領域に電子部品や機能
素子を設け、その電子部品や機能素子を設けた部分を樹
脂封止するものであるから、この電子部品や機能素子に
接続された回路の一部を基板上に露出することができ、
これにより、電気信号の地熱信号、光信号等の信号処理
を容易に行うことが可能となる。(Function) According to the above molding method, an electronic component or a functional element is provided in an arbitrary area of the substrate, and the part where the electronic component or functional element is provided is sealed with resin. A part of the circuit connected to can be exposed on the board,
This makes it possible to easily process signals such as electrical signals, geothermal signals, and optical signals.
また、金型の型締部に所定の硬度及び耐熱性を有する弾
性体を用いるものであるから、金属製以外の材料を用い
た基板に対しても割れ等を生じさせることがないととも
に、成形品の寸法精度もよく、量産にも適する。In addition, since the clamping part of the mold uses an elastic body with a specified hardness and heat resistance, it does not cause cracks or the like on substrates made of materials other than metal, and can be molded easily. The product has good dimensional accuracy and is suitable for mass production.
（実施例）
以下に本発明方法の実施例を第１図乃至第８図を参照し
て説明する。(Example) Examples of the method of the present invention will be described below with reference to FIGS. 1 to 8.
まず、第１図、第２図に示すように例えばセラミック類
の基板１上で、かつ、その中央部より同図において左側
領域に各種の集積回路等の電子部品２をハンダ付は法、
ペースト法又は共晶法を用いて搭載するとともに、この
基板１上に、一方の端部が前記電子部品２に接続され、
他方の端部が基板ｌの他方の端部近傍に至る電極Ｊｉ３
ａ、３ｂを形成する。First, as shown in FIGS. 1 and 2, electronic components 2 such as various integrated circuits are soldered onto a substrate 1 made of ceramic, for example, and from the center to the left side area in the figure.
It is mounted using a paste method or a eutectic method, and one end is connected to the electronic component 2 on this substrate 1,
Electrode Ji3 whose other end reaches near the other end of the substrate l
Form a and 3b.
次に第３図に示すように電子部品２を搭載し、かつ、電
極層３ａ、３ｂを形成した基板１を、−対の金型４ａ、
４ｂ間に配置する。Next, as shown in FIG. 3, the substrate 1 on which the electronic component 2 is mounted and on which the electrode layers 3a and 3b are formed is placed in a pair of molds 4a,
Place it between 4b.
前記金型４ａ、４ｂは、同図に示すようにお互いに相対
向する面に略対称形状の凹部４ｃ、４ｄを設けてこれら
の間に形成される空間により樹脂注入部５を形成すると
ともに、前記凹部４ｃ、４ｄの一方の端部（型締部）側
に相対向配置に、且つ、両金型４ａ、４ｂの相対向する
面からそれぞれ若干突出する状態に一対のゴム製の弾性
体６ａ、６ｂを備えている。As shown in the figure, the molds 4a and 4b have substantially symmetrical recesses 4c and 4d on their opposing surfaces, and the space formed between them forms a resin injection part 5. A pair of rubber elastic bodies 6a are arranged opposite to each other on one end (mold clamping part) side of the recesses 4c and 4d, and slightly protrude from the opposing surfaces of both molds 4a and 4b. , 6b.
そして、第４図に示すように前記両弾性体５ａ。And, as shown in FIG. 4, both the elastic bodies 5a.
６ｂにより、基板１の中央部及び前記電極Ｎ ３ ａ
。6b, the central part of the substrate 1 and the electrode N 3 a
.
３ｂを上下方向から挟持しつつ両金型４ａ、４ｂに所定
の押圧力を付与して、樹脂注入部５内に電子部品２を臨
ませた状態でこの樹脂注入部５内に予め８０℃前後でプ
レヒートし、低粘度化した樹脂を注入し、電子部品２．
電極層３ａ、３ｂの一部及び基板１の一部の外周に樹脂
成形を行う。A predetermined pressing force is applied to both the molds 4a and 4b while holding the mold 3b from above and below, and the resin injection part 5 is heated to about 80 degrees Celsius in advance with the electronic component 2 facing inside the resin injection part 5. After preheating and injecting the low-viscosity resin, electronic parts 2.
Resin molding is performed on the outer periphery of a portion of the electrode layers 3a and 3b and a portion of the substrate 1.
ここで、前記弾性体５ａ、５ｂの硬度について考察する
と、第５図のＡ部に示すように弾性体５ａ、５ｂの硬度
が低すぎると金型４ａ、４ｂの加圧時に弾性体６ａ、６
ｂが必要以上に変形し、この結果、金型４ａ、４ｂを離
型した後の成形品８の側面に第６図に示すような弾性体
５ａ、５ｂの変形に伴う凹凸が生じ寸法精度が悪化する
とともに、第５図のＢ部に示すように一方の金型４ａと
弾性体６ａとの接触部でこの弾性体６ａが裂けてしまう
。他方、弾性体５ａ、６ｂの硬度が高いと基板ｌが破壊
してしまう。Now, considering the hardness of the elastic bodies 5a and 5b, as shown in part A of FIG.
b is deformed more than necessary, and as a result, after the molds 4a and 4b are released, the molded product 8 has unevenness on the side surface due to the deformation of the elastic bodies 5a and 5b as shown in FIG. 6, resulting in poor dimensional accuracy. As the condition worsens, the elastic body 6a is torn at the contact portion between one of the molds 4a and the elastic body 6a, as shown in section B in FIG. On the other hand, if the elastic bodies 5a and 6b have high hardness, the substrate l will be destroyed.
このため、弾性体５ａ、５ｂの硬度として例えばシェア
ーＤ３０程度のものを用いることが好ましい。For this reason, it is preferable to use a hardness of about Shear D30 for the elastic bodies 5a and 5b, for example.
また、これら弾性体６ａ、６ｂの耐熱性は高温の樹脂に
晒されることから、１５０ ’Ｃ以上の耐熱性を有する
ものも用いることが好ましい。Furthermore, since these elastic bodies 6a and 6b are exposed to high temperature resin, it is preferable to use those having a heat resistance of 150'C or more.
次に上述した樹脂成形の後、両金型６ａ、６ｂを離型し
、第７図に示すように電子部品２．電極層３ａ、３ｂの
一部及び基板１の一部の外周に樹脂部７が施された成形
品８を得る。Next, after the resin molding described above, both the molds 6a and 6b are released, and as shown in FIG. 7, the electronic component 2. A molded product 8 is obtained in which a resin portion 7 is provided on the outer periphery of a portion of the electrode layers 3a, 3b and a portion of the substrate 1.
その後、３ａ、３ｂが電）玉である場合第８図（ａ）。After that, if 3a and 3b are electric balls, then Fig. 8(a).
（′ｂ）に示すように樹脂部７から突出している基板１
の残余の部分に例えば光信号を処理する機能素子として
のフォトダイオード素子９を搭載し、このフォトダイオ
ード素子９と樹脂部７から突出している電極＠３ａ、３
ｂとを接続することにより、電子部品２による電気信号
の処理機能とフォトダイオード素子９による光信号の処
理機能とを併有する成形品１１を得ることができる。The substrate 1 protruding from the resin part 7 as shown in ('b)
For example, a photodiode element 9 as a functional element for processing an optical signal is mounted in the remaining part, and electrodes @3a, 3 protruding from the photodiode element 9 and the resin part 7 are mounted.
By connecting b, it is possible to obtain a molded product 11 that has both the electrical signal processing function of the electronic component 2 and the optical signal processing function of the photodiode element 9.
本発明は上述した実施例に限定されるものではなく、そ
の要旨の範囲内で種々の変形が可能である。The present invention is not limited to the embodiments described above, and various modifications can be made within the scope of the invention.
例えば、上述した実施例では電子部品２の電極層３ａ、
３ｂを樹脂部７から基板ｌ上に露出させる場合について
説明したが、樹脂部７内に例えばフォトダイオード素子
９を封止するとともに、このフォトダイオード素子９に
光を伝送する小径の光ファイバの一部を樹脂部７内に封
止し、残部を基板１上に露出させるようにすることもで
きる。For example, in the embodiment described above, the electrode layer 3a of the electronic component 2,
3b is exposed from the resin part 7 onto the substrate l. However, it is also possible to seal, for example, a photodiode element 9 within the resin part 7, and to use one of the small-diameter optical fibers that transmits light to the photodiode element 9. It is also possible to seal a portion within the resin portion 7 and expose the remaining portion on the substrate 1.
また、電子部品やフォトダイオード素子のほか、熱信号
の処理を行う熱電変換素子を用いても実施可能である。Furthermore, in addition to electronic components and photodiode elements, the present invention can also be implemented using thermoelectric conversion elements that process thermal signals.
更に、機能素子を後で設ける場合に限らず初めから設け
ておいてもよい。当然のことながら電子部品のみの装置
、あるいは機能素子のみの装置にも適用できる。Furthermore, the functional elements are not limited to being provided later, but may be provided from the beginning. Naturally, the present invention can also be applied to devices containing only electronic components or devices containing only functional elements.
以上詳述した本発明によれば、金型の型締部に所定の硬
度を有する弾性体を備え、この弾性体により基板を挟持
しつつこの基板の任意の領域に樹脂封止を行うものであ
るから、電気信号と光信号あるいは電気信号と熱信号等
信号処理の多様性を図れ、かつ、セラミック基板等金属
製以外の基板を用いる場合にも通用できる電子部品の樹
脂成形法を提供することができる。According to the present invention described in detail above, the mold clamping part of the mold is provided with an elastic body having a predetermined hardness, and resin sealing is performed on any area of the substrate while the substrate is held between the elastic bodies. To provide a resin molding method for electronic components that allows for diversity in signal processing such as electrical signals and optical signals or electrical signals and thermal signals, and that can also be used when using a substrate other than metal such as a ceramic substrate. Can be done.
また、金型を用い、かつ、その型締部に所定の硬度及び
耐熱性を有する弾性体を用いているため、成形品の寸法
精度が良く、しかも、量産性にも優れた電子部品の樹脂
成形法を提供することができる。In addition, since a mold is used and an elastic body with a specified hardness and heat resistance is used in the mold clamping part, the molded product has good dimensional accuracy and is also suitable for mass production. A molding method can be provided.
第１図は本発明の実施例のうち、基板上に電子部品及び
電極層を設けた状態を示す平面図、第２図は同上の側面
図、第３図は同上の金型間に前記基板を配置した状態を
示す断面図、第４図は同上の型締状態を示す断面図、第
５図は金型に備えた弾性体の硬度を説明するための部分
拡大断面図、第６図は硬度の高い弾性体を用いた場合の
成形品を示す部分拡大斜視図、第７図は本発明の実施例
における金型離型後の成形品を示す側面図、第８図ｆａ
）は第７図に示す成形品にさらにフォトダイオード素子
を搭載した状態を示す平面図、第８図（ｂｌは同上の側
面図、第９図は従来の金型樹脂成形により得られる成形
品の説明図である。
１・・・基板、２・・・電子部品、４ａ、４ｂ・・・金
型、５・・・樹脂注入部、５ａ、６ｂ・・・弾性体、７
・・・樹脂部、８．１１・・・成形品。
第１図 第２図
第３図
第４図
第５図 第６図
第７図
（Ｑ） （ｂ）
第８図
第９図FIG. 1 is a plan view showing an embodiment of the present invention in which electronic components and electrode layers are provided on a substrate, FIG. 2 is a side view of the same, and FIG. 4 is a sectional view showing the same mold clamped state, FIG. 5 is a partially enlarged sectional view for explaining the hardness of the elastic body provided in the mold, and FIG. FIG. 7 is a partially enlarged perspective view showing a molded product using an elastic body with high hardness; FIG. 7 is a side view showing a molded product after mold release in an embodiment of the present invention; FIG. 8 fa
) is a plan view showing a state in which a photodiode element is further mounted on the molded product shown in FIG. 7, FIG. It is an explanatory diagram. 1... Board, 2... Electronic component, 4a, 4b... Mold, 5... Resin injection part, 5a, 6b... Elastic body, 7
... Resin part, 8.11... Molded product. Figure 1 Figure 2 Figure 3 Figure 4 Figure 5 Figure 6 Figure 7 (Q) (b) Figure 8 Figure 9
Claims (1)
前記電子部品や機能素子を設けた部分を一対の金型間に
形成される樹脂注入部に臨ませつつこれら金型の型締部
に備えた所定の硬度及び耐熱性を有する一対の弾性体で
前記基板の任意部分を加圧保持する工程と、前記樹脂注
入部に樹脂を注入して電子部品や機能素子を設けた部分
を樹脂封止した後両金型を離型する工程とを有すること
を特徴とする電子部品の金型樹脂成形法。A process of providing electronic components and functional elements in arbitrary areas of the board,
A pair of elastic bodies having a predetermined hardness and heat resistance are provided in the mold clamping part of these molds, with the part where the electronic components and functional elements are provided facing the resin injection part formed between the pair of molds. The method includes a step of pressurizing and holding an arbitrary part of the substrate, and a step of releasing both molds after injecting resin into the resin injection part and sealing the part where electronic components and functional elements are provided with the resin. A mold resin molding method for electronic components featuring:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP23577286A JPS6389313A (en) | 1986-10-03 | 1986-10-03 | Molding of resin in mold for electronic component |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP23577286A JPS6389313A (en) | 1986-10-03 | 1986-10-03 | Molding of resin in mold for electronic component |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6389313A true JPS6389313A (en) | 1988-04-20 |
Family
ID=16991009
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP23577286A Pending JPS6389313A (en) | 1986-10-03 | 1986-10-03 | Molding of resin in mold for electronic component |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6389313A (en) |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2001009940A2 (en) * | 1999-07-28 | 2001-02-08 | Infineon Technologies Ag | Method and molding tool for coating electronic components |
| WO2001084618A2 (en) * | 2000-05-02 | 2001-11-08 | Siemens Production And Logistics Systems Ag | Method and mould for encapsulating electronic circuit carriers by injection moulding |
| NL1019042C2 (en) * | 2001-09-26 | 2003-03-27 | Europ Semiconductor Assembly E | Method for encapsulating a chip and / or other object. |
| JP2007329450A (en) * | 2006-06-09 | 2007-12-20 | Lg Electronics Inc | Apparatus and method for manufacturing light emitting unit, apparatus for molding lens of light emitting unit, and light emitting device package |
| JP2008297921A (en) * | 2007-05-29 | 2008-12-11 | Toyota Motor Corp | Engine mounting device |
| KR20120021195A (en) * | 2010-08-30 | 2012-03-08 | 토와 가부시기가이샤 | Manufacturing method for resin sealed molded product and manufacturing apparatus for resin sealed molded product |
| WO2020094411A1 (en) * | 2018-11-07 | 2020-05-14 | Danfoss Silicon Power Gmbh | Mold tool for molding a semiconductor power module with top-sided pin connectors and method of manufacturing such a semiconductor power module |
-
1986
- 1986-10-03 JP JP23577286A patent/JPS6389313A/en active Pending
Cited By (18)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2001009940A2 (en) * | 1999-07-28 | 2001-02-08 | Infineon Technologies Ag | Method and molding tool for coating electronic components |
| WO2001009940A3 (en) * | 1999-07-28 | 2001-10-04 | Infineon Technologies Ag | Method and molding tool for coating electronic components |
| WO2001084618A2 (en) * | 2000-05-02 | 2001-11-08 | Siemens Production And Logistics Systems Ag | Method and mould for encapsulating electronic circuit carriers by injection moulding |
| WO2001084618A3 (en) * | 2000-05-02 | 2002-02-07 | Siemens Production & Logistics | Method and mould for encapsulating electronic circuit carriers by injection moulding |
| NL1019042C2 (en) * | 2001-09-26 | 2003-03-27 | Europ Semiconductor Assembly E | Method for encapsulating a chip and / or other object. |
| WO2003028086A1 (en) * | 2001-09-26 | 2003-04-03 | European Semiconductor Assembly (Eurasem) B.V. | Method for encapsulating a chip and/or other article |
| US7205175B2 (en) | 2001-09-26 | 2007-04-17 | Elmos Advanced Packaging B.V. | Method for encapsulating a chip and/or other article |
| EP1864780A3 (en) * | 2006-06-09 | 2008-02-20 | LG Electronics Inc. | Light emitting unit, apparatus and method for manufacturing the same, apparatus for moulding lens thereof, and light emitting device package thereof |
| JP2007329450A (en) * | 2006-06-09 | 2007-12-20 | Lg Electronics Inc | Apparatus and method for manufacturing light emitting unit, apparatus for molding lens of light emitting unit, and light emitting device package |
| US7496270B2 (en) | 2006-06-09 | 2009-02-24 | Lg Electronics Inc. | Light emitting unit, apparatus and method for manufacturing the same, apparatus for molding lens thereof, and light emitting device package thereof |
| US7869674B2 (en) | 2006-06-09 | 2011-01-11 | Lg Electronics Inc. | Light emitting unit, apparatus and method for manufacturing the same, apparatus for molding lens thereof, and light emitting device package thereof |
| TWI426621B (en) * | 2006-06-09 | 2014-02-11 | Lg Electronics Inc | Light emitting unit, apparatus and method for manufacturing the same, apparatus for molding lens thereof, and light emitting device package thereof |
| JP2008297921A (en) * | 2007-05-29 | 2008-12-11 | Toyota Motor Corp | Engine mounting device |
| KR20120021195A (en) * | 2010-08-30 | 2012-03-08 | 토와 가부시기가이샤 | Manufacturing method for resin sealed molded product and manufacturing apparatus for resin sealed molded product |
| JP2012049414A (en) * | 2010-08-30 | 2012-03-08 | Towa Corp | Method and apparatus for manufacturing resin encapsulation molded article having substrate exposure face |
| WO2020094411A1 (en) * | 2018-11-07 | 2020-05-14 | Danfoss Silicon Power Gmbh | Mold tool for molding a semiconductor power module with top-sided pin connectors and method of manufacturing such a semiconductor power module |
| CN112969563A (en) * | 2018-11-07 | 2021-06-15 | 丹佛斯硅动力有限责任公司 | Molding tool for molding semiconductor power module with top-side pin connector and method of manufacturing such semiconductor power module |
| CN112969563B (en) * | 2018-11-07 | 2023-06-30 | 丹佛斯硅动力有限责任公司 | Molding tool and method for molding semiconductor power modules |
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