WO2001009940A3 - Method and molding tool for coating electronic components - Google Patents

Method and molding tool for coating electronic components Download PDF

Info

Publication number
WO2001009940A3
WO2001009940A3 PCT/DE2000/002502 DE0002502W WO0109940A3 WO 2001009940 A3 WO2001009940 A3 WO 2001009940A3 DE 0002502 W DE0002502 W DE 0002502W WO 0109940 A3 WO0109940 A3 WO 0109940A3
Authority
WO
WIPO (PCT)
Prior art keywords
molding tool
electronic components
coating electronic
cavity
substrate
Prior art date
Application number
PCT/DE2000/002502
Other languages
German (de)
French (fr)
Other versions
WO2001009940A2 (en
Inventor
Georg Ernst
Thomas Zeiler
Original Assignee
Infineon Technologies Ag
Georg Ernst
Thomas Zeiler
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Infineon Technologies Ag, Georg Ernst, Thomas Zeiler filed Critical Infineon Technologies Ag
Publication of WO2001009940A2 publication Critical patent/WO2001009940A2/en
Publication of WO2001009940A3 publication Critical patent/WO2001009940A3/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H01L21/565—Moulds
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)

Abstract

The invention relates to a method for coating electronic components (1) that are mounted on a substrate (2) by means of a molding tool. Said molding tool comprises at least one cavity (5) that is defined by two molding elements (3, 4). For the inventive method, either flexible pressure elements (8, 9, 13, 14) or auxiliary substrates (19) are used to seal the cavity (5) and to compensate for work tolerances and differences in thickness of the substrate (2).
PCT/DE2000/002502 1999-07-28 2000-07-28 Method and molding tool for coating electronic components WO2001009940A2 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE19935441.3 1999-07-28
DE1999135441 DE19935441A1 (en) 1999-07-28 1999-07-28 Method and mold for wrapping electronic components

Publications (2)

Publication Number Publication Date
WO2001009940A2 WO2001009940A2 (en) 2001-02-08
WO2001009940A3 true WO2001009940A3 (en) 2001-10-04

Family

ID=7916355

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/DE2000/002502 WO2001009940A2 (en) 1999-07-28 2000-07-28 Method and molding tool for coating electronic components

Country Status (2)

Country Link
DE (1) DE19935441A1 (en)
WO (1) WO2001009940A2 (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102015219103A1 (en) * 2015-10-02 2017-04-06 Weeke Bohrsysteme Gmbh Device for forming attachments
DE102018201028B3 (en) 2018-01-23 2019-06-06 Conti Temic Microelectronic Gmbh Printed circuit board and method for producing a printed circuit board

Citations (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS56124237A (en) * 1980-03-04 1981-09-29 Toshiba Corp Method for resin sealing
JPS58159A (en) * 1981-06-25 1983-01-05 Nec Corp Semiconductor device
JPS6389313A (en) * 1986-10-03 1988-04-20 Tdk Corp Molding of resin in mold for electronic component
JPS63162206A (en) * 1986-12-25 1988-07-05 Mitsubishi Electric Corp Resin molding apparatus
JPS63316460A (en) * 1987-06-18 1988-12-23 Sony Corp Mold device for package formation
US4861251A (en) * 1988-02-29 1989-08-29 Diehard Engineering, Inc. Apparatus for encapsulating selected portions of a printed circuit board
JPH02265721A (en) * 1989-04-06 1990-10-30 Nec Corp Encapsulation die for semiconductor device
JPH05211187A (en) * 1991-12-26 1993-08-20 Nippon Steel Corp Molding die for ic package
EP0692820A1 (en) * 1994-07-15 1996-01-17 Shinko Electric Industries Co. Ltd. Manufacturing one sided resin sealed semiconductor devices and a carrier used for it
EP0726598A1 (en) * 1995-02-09 1996-08-14 Fico B.V. Moulding apparatus with compensation element
JPH08288326A (en) * 1995-04-14 1996-11-01 Towa Kk Method and die for resin molding electronic device
US5744084A (en) * 1995-07-24 1998-04-28 Lsi Logic Corporation Method of improving molding of an overmolded package body on a substrate
US5766535A (en) * 1997-06-04 1998-06-16 Integrated Packaging Assembly Corporation Pressure-plate-operative system for one-side injection molding of substrate-mounted integrated circuits
US5852870A (en) * 1996-04-24 1998-12-29 Amkor Technology, Inc. Method of making grid array assembly
JPH11126787A (en) * 1997-10-24 1999-05-11 Towa Corp Method and mold for resin sealing electronic component
EP0923047A1 (en) * 1997-07-18 1999-06-16 Rohm Co., Ltd. Ic module, method of fabricating the same and ic card provided with ic module

Patent Citations (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS56124237A (en) * 1980-03-04 1981-09-29 Toshiba Corp Method for resin sealing
JPS58159A (en) * 1981-06-25 1983-01-05 Nec Corp Semiconductor device
JPS6389313A (en) * 1986-10-03 1988-04-20 Tdk Corp Molding of resin in mold for electronic component
JPS63162206A (en) * 1986-12-25 1988-07-05 Mitsubishi Electric Corp Resin molding apparatus
JPS63316460A (en) * 1987-06-18 1988-12-23 Sony Corp Mold device for package formation
US4861251A (en) * 1988-02-29 1989-08-29 Diehard Engineering, Inc. Apparatus for encapsulating selected portions of a printed circuit board
JPH02265721A (en) * 1989-04-06 1990-10-30 Nec Corp Encapsulation die for semiconductor device
JPH05211187A (en) * 1991-12-26 1993-08-20 Nippon Steel Corp Molding die for ic package
EP0692820A1 (en) * 1994-07-15 1996-01-17 Shinko Electric Industries Co. Ltd. Manufacturing one sided resin sealed semiconductor devices and a carrier used for it
EP0726598A1 (en) * 1995-02-09 1996-08-14 Fico B.V. Moulding apparatus with compensation element
JPH08288326A (en) * 1995-04-14 1996-11-01 Towa Kk Method and die for resin molding electronic device
US5744084A (en) * 1995-07-24 1998-04-28 Lsi Logic Corporation Method of improving molding of an overmolded package body on a substrate
US5852870A (en) * 1996-04-24 1998-12-29 Amkor Technology, Inc. Method of making grid array assembly
US5766535A (en) * 1997-06-04 1998-06-16 Integrated Packaging Assembly Corporation Pressure-plate-operative system for one-side injection molding of substrate-mounted integrated circuits
EP0923047A1 (en) * 1997-07-18 1999-06-16 Rohm Co., Ltd. Ic module, method of fabricating the same and ic card provided with ic module
JPH11126787A (en) * 1997-10-24 1999-05-11 Towa Corp Method and mold for resin sealing electronic component

Non-Patent Citations (9)

* Cited by examiner, † Cited by third party
Title
PATENT ABSTRACTS OF JAPAN vol. 005, no. 205 (E - 088) 25 December 1981 (1981-12-25) *
PATENT ABSTRACTS OF JAPAN vol. 007, no. 072 (E - 166) 25 March 1983 (1983-03-25) *
PATENT ABSTRACTS OF JAPAN vol. 012, no. 321 (M - 736) 31 August 1988 (1988-08-31) *
PATENT ABSTRACTS OF JAPAN vol. 012, no. 428 (M - 762) 11 November 1988 (1988-11-11) *
PATENT ABSTRACTS OF JAPAN vol. 013, no. 164 (E - 745) 19 April 1989 (1989-04-19) *
PATENT ABSTRACTS OF JAPAN vol. 015, no. 013 (M - 1069) 11 January 1991 (1991-01-11) *
PATENT ABSTRACTS OF JAPAN vol. 017, no. 649 (E - 1468) 2 December 1993 (1993-12-02) *
PATENT ABSTRACTS OF JAPAN vol. 1997, no. 03 31 March 1997 (1997-03-31) *
PATENT ABSTRACTS OF JAPAN vol. 1999, no. 10 31 August 1999 (1999-08-31) *

Also Published As

Publication number Publication date
WO2001009940A2 (en) 2001-02-08
DE19935441A1 (en) 2001-03-01

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