WO2001009940A3 - Method and molding tool for coating electronic components - Google Patents
Method and molding tool for coating electronic components Download PDFInfo
- Publication number
- WO2001009940A3 WO2001009940A3 PCT/DE2000/002502 DE0002502W WO0109940A3 WO 2001009940 A3 WO2001009940 A3 WO 2001009940A3 DE 0002502 W DE0002502 W DE 0002502W WO 0109940 A3 WO0109940 A3 WO 0109940A3
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- molding tool
- electronic components
- coating electronic
- cavity
- substrate
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
- H01L21/565—Moulds
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
Abstract
The invention relates to a method for coating electronic components (1) that are mounted on a substrate (2) by means of a molding tool. Said molding tool comprises at least one cavity (5) that is defined by two molding elements (3, 4). For the inventive method, either flexible pressure elements (8, 9, 13, 14) or auxiliary substrates (19) are used to seal the cavity (5) and to compensate for work tolerances and differences in thickness of the substrate (2).
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE19935441.3 | 1999-07-28 | ||
DE1999135441 DE19935441A1 (en) | 1999-07-28 | 1999-07-28 | Method and mold for wrapping electronic components |
Publications (2)
Publication Number | Publication Date |
---|---|
WO2001009940A2 WO2001009940A2 (en) | 2001-02-08 |
WO2001009940A3 true WO2001009940A3 (en) | 2001-10-04 |
Family
ID=7916355
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/DE2000/002502 WO2001009940A2 (en) | 1999-07-28 | 2000-07-28 | Method and molding tool for coating electronic components |
Country Status (2)
Country | Link |
---|---|
DE (1) | DE19935441A1 (en) |
WO (1) | WO2001009940A2 (en) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102015219103A1 (en) * | 2015-10-02 | 2017-04-06 | Weeke Bohrsysteme Gmbh | Device for forming attachments |
DE102018201028B3 (en) | 2018-01-23 | 2019-06-06 | Conti Temic Microelectronic Gmbh | Printed circuit board and method for producing a printed circuit board |
Citations (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS56124237A (en) * | 1980-03-04 | 1981-09-29 | Toshiba Corp | Method for resin sealing |
JPS58159A (en) * | 1981-06-25 | 1983-01-05 | Nec Corp | Semiconductor device |
JPS6389313A (en) * | 1986-10-03 | 1988-04-20 | Tdk Corp | Molding of resin in mold for electronic component |
JPS63162206A (en) * | 1986-12-25 | 1988-07-05 | Mitsubishi Electric Corp | Resin molding apparatus |
JPS63316460A (en) * | 1987-06-18 | 1988-12-23 | Sony Corp | Mold device for package formation |
US4861251A (en) * | 1988-02-29 | 1989-08-29 | Diehard Engineering, Inc. | Apparatus for encapsulating selected portions of a printed circuit board |
JPH02265721A (en) * | 1989-04-06 | 1990-10-30 | Nec Corp | Encapsulation die for semiconductor device |
JPH05211187A (en) * | 1991-12-26 | 1993-08-20 | Nippon Steel Corp | Molding die for ic package |
EP0692820A1 (en) * | 1994-07-15 | 1996-01-17 | Shinko Electric Industries Co. Ltd. | Manufacturing one sided resin sealed semiconductor devices and a carrier used for it |
EP0726598A1 (en) * | 1995-02-09 | 1996-08-14 | Fico B.V. | Moulding apparatus with compensation element |
JPH08288326A (en) * | 1995-04-14 | 1996-11-01 | Towa Kk | Method and die for resin molding electronic device |
US5744084A (en) * | 1995-07-24 | 1998-04-28 | Lsi Logic Corporation | Method of improving molding of an overmolded package body on a substrate |
US5766535A (en) * | 1997-06-04 | 1998-06-16 | Integrated Packaging Assembly Corporation | Pressure-plate-operative system for one-side injection molding of substrate-mounted integrated circuits |
US5852870A (en) * | 1996-04-24 | 1998-12-29 | Amkor Technology, Inc. | Method of making grid array assembly |
JPH11126787A (en) * | 1997-10-24 | 1999-05-11 | Towa Corp | Method and mold for resin sealing electronic component |
EP0923047A1 (en) * | 1997-07-18 | 1999-06-16 | Rohm Co., Ltd. | Ic module, method of fabricating the same and ic card provided with ic module |
-
1999
- 1999-07-28 DE DE1999135441 patent/DE19935441A1/en not_active Withdrawn
-
2000
- 2000-07-28 WO PCT/DE2000/002502 patent/WO2001009940A2/en active Application Filing
Patent Citations (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS56124237A (en) * | 1980-03-04 | 1981-09-29 | Toshiba Corp | Method for resin sealing |
JPS58159A (en) * | 1981-06-25 | 1983-01-05 | Nec Corp | Semiconductor device |
JPS6389313A (en) * | 1986-10-03 | 1988-04-20 | Tdk Corp | Molding of resin in mold for electronic component |
JPS63162206A (en) * | 1986-12-25 | 1988-07-05 | Mitsubishi Electric Corp | Resin molding apparatus |
JPS63316460A (en) * | 1987-06-18 | 1988-12-23 | Sony Corp | Mold device for package formation |
US4861251A (en) * | 1988-02-29 | 1989-08-29 | Diehard Engineering, Inc. | Apparatus for encapsulating selected portions of a printed circuit board |
JPH02265721A (en) * | 1989-04-06 | 1990-10-30 | Nec Corp | Encapsulation die for semiconductor device |
JPH05211187A (en) * | 1991-12-26 | 1993-08-20 | Nippon Steel Corp | Molding die for ic package |
EP0692820A1 (en) * | 1994-07-15 | 1996-01-17 | Shinko Electric Industries Co. Ltd. | Manufacturing one sided resin sealed semiconductor devices and a carrier used for it |
EP0726598A1 (en) * | 1995-02-09 | 1996-08-14 | Fico B.V. | Moulding apparatus with compensation element |
JPH08288326A (en) * | 1995-04-14 | 1996-11-01 | Towa Kk | Method and die for resin molding electronic device |
US5744084A (en) * | 1995-07-24 | 1998-04-28 | Lsi Logic Corporation | Method of improving molding of an overmolded package body on a substrate |
US5852870A (en) * | 1996-04-24 | 1998-12-29 | Amkor Technology, Inc. | Method of making grid array assembly |
US5766535A (en) * | 1997-06-04 | 1998-06-16 | Integrated Packaging Assembly Corporation | Pressure-plate-operative system for one-side injection molding of substrate-mounted integrated circuits |
EP0923047A1 (en) * | 1997-07-18 | 1999-06-16 | Rohm Co., Ltd. | Ic module, method of fabricating the same and ic card provided with ic module |
JPH11126787A (en) * | 1997-10-24 | 1999-05-11 | Towa Corp | Method and mold for resin sealing electronic component |
Non-Patent Citations (9)
Title |
---|
PATENT ABSTRACTS OF JAPAN vol. 005, no. 205 (E - 088) 25 December 1981 (1981-12-25) * |
PATENT ABSTRACTS OF JAPAN vol. 007, no. 072 (E - 166) 25 March 1983 (1983-03-25) * |
PATENT ABSTRACTS OF JAPAN vol. 012, no. 321 (M - 736) 31 August 1988 (1988-08-31) * |
PATENT ABSTRACTS OF JAPAN vol. 012, no. 428 (M - 762) 11 November 1988 (1988-11-11) * |
PATENT ABSTRACTS OF JAPAN vol. 013, no. 164 (E - 745) 19 April 1989 (1989-04-19) * |
PATENT ABSTRACTS OF JAPAN vol. 015, no. 013 (M - 1069) 11 January 1991 (1991-01-11) * |
PATENT ABSTRACTS OF JAPAN vol. 017, no. 649 (E - 1468) 2 December 1993 (1993-12-02) * |
PATENT ABSTRACTS OF JAPAN vol. 1997, no. 03 31 March 1997 (1997-03-31) * |
PATENT ABSTRACTS OF JAPAN vol. 1999, no. 10 31 August 1999 (1999-08-31) * |
Also Published As
Publication number | Publication date |
---|---|
WO2001009940A2 (en) | 2001-02-08 |
DE19935441A1 (en) | 2001-03-01 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
WO1999055640A8 (en) | Article having a modified mullite coating and method of making the same | |
WO2001073146A3 (en) | Cemented carbide tool and method of making | |
WO2001042694A3 (en) | Distribution system of modular process lines | |
CA2404853A1 (en) | Photoengraved printed data carrier | |
AU2360897A (en) | Method of producing opaque adherent coating on the surface of substantially hydrated cemetitious substrate | |
EP1333708A4 (en) | Circuit board, circuit board-use member and production method therefor and method of laminating fexible film | |
WO1999053319A3 (en) | High-density, miniaturized arrays and methods of manufacturing same | |
AU1433497A (en) | Printable film | |
CA2274785A1 (en) | A chip module and process for the production thereof | |
WO2006132919A3 (en) | High and low refractive index and metallic surface relief coatings | |
CA2416093A1 (en) | Vapour deposition | |
AU2723499A (en) | Door inner element | |
WO2002053298A3 (en) | Coating method and coating agent | |
WO2002028640A3 (en) | Substrate processing apparatus having pressed together supply rolls | |
WO2005000553A3 (en) | Process for applying a material to a member | |
AU2259101A (en) | Microreaction systems and molding methods | |
WO2002094457A3 (en) | Method and device for producing parts having a sealing layer on the surface, and corresponding parts | |
AU2002317146A1 (en) | Method and device for producing veneer and veneered parts and veneer and veneered parts | |
WO1992000399A3 (en) | Method for forming a surface coating | |
AU8859798A (en) | Method for applying a coating to a metal substrate or repairing a coating applied to the same | |
WO2001009940A3 (en) | Method and molding tool for coating electronic components | |
TW357405B (en) | Method for pre-shaping a semiconductor substrate for polishing and structure | |
AU2003245876A1 (en) | Method for forming housings for electronic components and electronic components that are hermetically encapsulated thereby | |
EP0632684A3 (en) | Process for manufacturing metal-ceramic substrate. | |
WO2003026023A3 (en) | Synthesis of layers, coatings or films using pressure containment exerted on precursor layers |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
AK | Designated states |
Kind code of ref document: A2 Designated state(s): JP KR US |
|
AL | Designated countries for regional patents |
Kind code of ref document: A2 Designated state(s): AT BE CH CY DE DK ES FI FR GB GR IE IT LU MC NL PT SE |
|
121 | Ep: the epo has been informed by wipo that ep was designated in this application | ||
DFPE | Request for preliminary examination filed prior to expiration of 19th month from priority date (pct application filed before 20040101) | ||
AK | Designated states |
Kind code of ref document: A3 Designated state(s): JP KR US |
|
AL | Designated countries for regional patents |
Kind code of ref document: A3 Designated state(s): AT BE CH CY DE DK ES FI FR GB GR IE IT LU MC NL PT SE |
|
122 | Ep: pct application non-entry in european phase | ||
NENP | Non-entry into the national phase |
Ref country code: JP |