JP4645911B2 - Composite parts - Google Patents

Composite parts Download PDF

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JP4645911B2
JP4645911B2 JP2006289567A JP2006289567A JP4645911B2 JP 4645911 B2 JP4645911 B2 JP 4645911B2 JP 2006289567 A JP2006289567 A JP 2006289567A JP 2006289567 A JP2006289567 A JP 2006289567A JP 4645911 B2 JP4645911 B2 JP 4645911B2
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substrate
antenna
case
base
electrode
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JP2008109340A (en
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健 天竺桂
公一 岩崎
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Murata Manufacturing Co Ltd
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Murata Manufacturing Co Ltd
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
    • H01L2223/58—Structural electrical arrangements for semiconductor devices not otherwise provided for
    • H01L2223/64—Impedance arrangements
    • H01L2223/66—High-frequency adaptations
    • H01L2223/6661—High-frequency adaptations for passive devices
    • H01L2223/6677—High-frequency adaptations for passive devices for antenna, e.g. antenna included within housing of semiconductor device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73201—Location after the connecting process on the same surface
    • H01L2224/73203—Bump and layer connectors
    • H01L2224/73204—Bump and layer connectors the bump connector being embedded into the layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/191—Disposition
    • H01L2924/19101—Disposition of discrete passive components
    • H01L2924/19105—Disposition of discrete passive components in a side-by-side arrangement on a common die mounting substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/191—Disposition
    • H01L2924/19101—Disposition of discrete passive components
    • H01L2924/19106—Disposition of discrete passive components in a mirrored arrangement on two different side of a common die mounting substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3025—Electromagnetic shielding

Description

本発明は、複合に関し、詳しくは、第１基体と第２基体とを接合してなる複合部品に関する。   The present invention relates to a composite, and more particularly to a composite part formed by joining a first base and a second base.

従来、高周波送受信機などに用いられるアンテナ付き高周波モジュール（複合部品）が提供されている。例えば、高速道路料金の支払をノンストップで行うことを目的としたＥＴＣ装置に搭載されるものがある。   Conventionally, a high-frequency module with antenna (composite component) used for a high-frequency transceiver is provided. For example, there is one installed in an ETC device for the purpose of non-stop payment of highway tolls.

例えば特許文献１には、図１２の断面図に示すアンテナ付き高周波モジュールが開示されている。このアンテナ付き高周波モジュールは、高周波回路の部品１１２が設けられたプリント基板１１１と、高周波回路の近傍に設けられたアンテナ端１２３と、このアンテナ端１２３に接続されたアンテナ（アンテナ用放射電極）１１７と、このアンテナ１１７とプリント基板１１１との間に設けられたグランドプレーン１１４とを備え、アンテナ１１７はアンテナ端１２３の上方あるいは下方に設けられている。プリント基板１１１の側面あるいは底面には外部と接続される端子１２５が設けられている。   For example, Patent Document 1 discloses a high-frequency module with an antenna shown in the cross-sectional view of FIG. This high-frequency module with an antenna includes a printed circuit board 111 on which a high-frequency circuit component 112 is provided, an antenna end 123 provided in the vicinity of the high-frequency circuit, and an antenna (radiation electrode for antenna) 117 connected to the antenna end 123. And a ground plane 114 provided between the antenna 117 and the printed board 111, and the antenna 117 is provided above or below the antenna end 123. A terminal 125 connected to the outside is provided on the side surface or bottom surface of the printed circuit board 111.

プリント基板１１１上に設けられた高周波回路を覆うように金属製のケース１１３が設けられ、このケース１１３がグランドに接続されるとともに、このケース１１３の上面にアンテナ１１７が載置されている。ケース１１３の脚１１５は、グランドにしっかりとはんだ１１６で電気的にも機構的にも接続されているので、このケース１１３の上面全面をアンテナ１１７のグランドプレーン１１４としている。   A metal case 113 is provided so as to cover the high-frequency circuit provided on the printed board 111, the case 113 is connected to the ground, and an antenna 117 is placed on the upper surface of the case 113. Since the legs 115 of the case 113 are firmly connected to the ground both electrically and mechanically by the solder 116, the entire upper surface of the case 113 serves as the ground plane 114 of the antenna 117.

ケース１１３には、アンテナ１１７を嵌合する凹部１１８が設けられ、凹部１１８にアンテナ１１７が実装されている。アンテナ１１７の上面に形成されている導体パターン１１９と、アンテナ端１２３に電気的に接続される第一の給電端子１２０ａとは、はんだ１２２で接合されている。第一の給電端子１２０ａは、その断面が「Ｔ」字型の形状であり、アンテナ１１７に設けられた孔１２１を貫通し、アンテナ１１７の抜け落ち、ずれを防止する。アンテナ１１７側に取り付けられる第一の給電端子１２０ａは、プリント基板１１１側のアンテナ端１２３にはんだ１２４で固定された第二の給電端子１２０ｂに、嵌合される。これにより、アンテナ１１７以外を組み立てた状態で特性検査を行った後、アンテナ１１７を取り付けることができる。   The case 113 is provided with a recess 118 into which the antenna 117 is fitted, and the antenna 117 is mounted in the recess 118. The conductor pattern 119 formed on the upper surface of the antenna 117 and the first power supply terminal 120 a electrically connected to the antenna end 123 are joined by solder 122. The first power supply terminal 120 a has a “T” -shaped cross section and penetrates the hole 121 provided in the antenna 117, thereby preventing the antenna 117 from falling off and shifting. The first power supply terminal 120a attached to the antenna 117 side is fitted into the second power supply terminal 120b fixed to the antenna end 123 on the printed board 111 side with solder 124. Accordingly, the antenna 117 can be attached after performing the characteristic inspection in a state where the antenna 117 other than the antenna 117 is assembled.

プリント基板１１１の側面と底面に接続端子１２５が設けられている。本モジュールは、マザー基板１２７に接続端子１２５がはんだ１２６を介して接合され、マザー基板１２７に接続、固定される。
特開２００２−１１１３８１号公報 Connection terminals 125 are provided on the side and bottom surfaces of the printed circuit board 111. In this module, the connection terminal 125 is joined to the mother board 127 via the solder 126, and is connected and fixed to the mother board 127.
JP 2002-111381 A

近年、大容量通信を必要とするマルチメディア用無線通信システムの機器の小型化と低価格化の要求が増している。小型化機器に対応したアンテナ素子を内蔵する半導体モジュールを、大容量通信を必要とするマルチメディア用無線通信システムのサブシステムとして使用することにより、種々の環境におけるマルチメディア通信が可能となる。   In recent years, there has been an increasing demand for downsizing and cost reduction of devices in multimedia wireless communication systems that require large-capacity communication. Multimedia communication in various environments is possible by using a semiconductor module incorporating an antenna element corresponding to a miniaturized device as a subsystem of a multimedia wireless communication system that requires large-capacity communication.

しかしながら、図１２に示した従来のアンテナ付き高周波モジュール（複合部品）には、次のような問題点がある。   However, the conventional high-frequency module with antenna (composite component) shown in FIG. 12 has the following problems.

（１）本モジュールは、接続端子とはんだで接合され、マザー基板に接続、固定される。特許文献１には、アンテナ特性の測定するための測定用端子については記載されていない。仮に測定用端子を設けるとしたら、プリント基板に引き回し配線を設けて、マザー基板上に設置けることが一般的であると考えられる。しかしながら、アンテナ特性を測定するための測定用端子をマザー基板上に設けると、アンテナと測定用端子とのライン長が長くなる。そのため、ラインの寄生インダクタ成分の影響が多くなり、測定精度が劣化してしまう。他方、測定用端子をプリント基板に配置することも考えられる。この場合、アンテナと測定用端子のライン長が比較的短くなるが、近年の基板の小型化に伴い、測定用端子を設置する場所が少なく、測定用端子を設けると、部品の搭載量が少なくなってしまう。また、比較的短いもののライン長による寄生インダクタンスの発生や、アンテナと基板の接続部（特にはんだ接続部）における信号損失が生じてしまう。   (1) This module is joined to the connection terminal with solder, and is connected and fixed to the mother board. Patent Document 1 does not describe a measurement terminal for measuring antenna characteristics. If the measurement terminal is provided, it is generally considered that the wiring is provided on the printed board and can be installed on the mother board. However, if the measurement terminal for measuring the antenna characteristics is provided on the mother substrate, the line length between the antenna and the measurement terminal becomes long. Therefore, the influence of the parasitic inductor component of the line is increased, and the measurement accuracy is deteriorated. On the other hand, it is also conceivable to arrange the measurement terminals on the printed circuit board. In this case, the line length of the antenna and the measurement terminal is relatively short, but with the recent miniaturization of the board, there are few places to install the measurement terminal, and if the measurement terminal is provided, the mounting amount of parts is small. turn into. In addition, although the line length is relatively short, parasitic inductance is generated and signal loss occurs at the connection portion (particularly, the solder connection portion) between the antenna and the substrate.

（２）ケース上面にアンテナ素子を嵌合する凹部が設けられている。その下には、凹部とプリント基板との隙間より高い部品を実装することができず、凹部の下以外の領域に部品を実装する必要がある。これにより、配線回路の配置に制約が生じ、設計の自由度を広くとれない。そして実装領域に制限がかかり、基板の小型化が困難である。また、凹部の形成により、製品の低背化が困難である。   (2) A recess for fitting the antenna element is provided on the upper surface of the case. Below that, a component higher than the gap between the recess and the printed board cannot be mounted, and it is necessary to mount the component in a region other than the region below the recess. As a result, the arrangement of the wiring circuit is restricted, and the degree of design freedom cannot be increased. And the mounting area is limited, and it is difficult to reduce the size of the substrate. Moreover, it is difficult to reduce the height of the product due to the formation of the recess.

（３）アンテナ付き高周波モジュールは、マザー基板へ実装するためのはんだ付けの際に、ケースとプリント基板の距離がはんだの再溶融などで変化して、アンテナ特性ずれが発生しないように考慮する必要がある。また、プリント基板に搭載する表面実装部品に過度の熱が加わらないように考慮する必要がある。そのため、融点の違う３種類のはんだを使用しなければならない。それぞれのリフロー条件が異なるため、３つのリフロープロファイルで加熱する必要があり、量産する場合にはリフロープロファイルごとに専用炉を設置する必要があり、加工コストがかかる。   (3) For high-frequency modules with antennas, it is necessary to consider that the distance between the case and the printed board changes due to remelting of the solder, etc., and the antenna characteristics do not shift when soldering for mounting on the mother board There is. In addition, it is necessary to consider that excessive heat is not applied to the surface-mounted components mounted on the printed circuit board. Therefore, three types of solder with different melting points must be used. Since each reflow condition is different, it is necessary to heat with three reflow profiles, and in the case of mass production, it is necessary to install a dedicated furnace for each reflow profile, which requires processing costs.

（４）アンテナの有無の状態での高周波モジュール特性検査が可能ではあるが、アンテナの取り外し取り付け作業が必要なため、工数がかかりコスト高となる。取り付け取り外しの際にアンテナ端及び給電端子が損傷し、高周波信号の損失が生じる可能性がある。   (4) Although it is possible to inspect the characteristics of the high-frequency module in the presence or absence of an antenna, it is necessary to detach and attach the antenna, which increases man-hours and costs. During the attachment / detachment, the antenna end and the power supply terminal may be damaged, and a high-frequency signal may be lost.

（５）アンテナを取り外し可能にするため、アンテナに設けた孔にＴ字型の給電端子を貫通するとともに、アンテナ上に形成した導体パターンとはんだ付けしている。このようなアンテナの構成は複雑であり、製作の工数がかかりコスト高である。   (5) In order to make the antenna detachable, a T-shaped feeding terminal is passed through a hole provided in the antenna and soldered to a conductor pattern formed on the antenna. The structure of such an antenna is complicated and requires a lot of manufacturing steps and is expensive.

本発明は、かかる実情に鑑み、低コストで作製することができ、容易に特性を測定することができる、複合部品を提供しようとするものである。   In view of such circumstances, the present invention is intended to provide a composite part that can be manufactured at low cost and can easily measure characteristics.

本発明は、上記課題を解決するために、以下のように構成した複合部品を提供する。   In order to solve the above problems, the present invention provides a composite part configured as follows.

複合部品は、少なくとも一方主面に表面電極が形成された第１基体と、金属薄板の折り曲げ加工によって形成された表面部と接続部とを含む測定用接続部材を樹脂モールド成型してなる第２基体とが、前記第１基体の前記表面電極と前記第２基体の前記表面部とを介して接合されてなる。前記測定用接続部材は、前記接続部の一部が前記第２基体の側面に露出して形成された側面電極部を有している。 The composite part is formed by resin-molding a measuring connection member including a first base body having a surface electrode formed on at least one main surface, a surface portion formed by bending a metal thin plate, and a connection portion. A base is bonded via the surface electrode of the first base and the surface portion of the second base . Before SL measuring connection member, a part of the connecting portion has a side surface electrode portion formed to expose a side surface of the second substrate.

上記構成によれば、第１基体に、金属薄板の折り曲げ加工と樹脂モールド成形により形成した第２基体を接合することにより、複合部品を低コストで作製することができる。複合部品の特性は、第２基体の側面に露出している測定用接続部材の側面電極部を利用することにより、第１基体と第２基体とが接合された状態のままで、容易に測定することができる。 According to the said structure, a composite component can be produced at low cost by joining to the 1st base | substrate the 2nd base | substrate formed by the bending process and resin molding of a metal thin plate. The characteristics of the composite part can be easily measured by using the side electrode portion of the connecting member for measurement exposed on the side surface of the second base, with the first base and the second base being joined. can do.

さらに、複合部品は、前記第１基体の前記一方主面上に表面実装型電子部品が搭載されている。前記第２基体は、（１）前記第１基体の前記一方主面上に搭載された前記表面実装型電子部品の周囲に配置される支持部と、（２）前記支持部に接続され、前記第１基体の前記一方主面上に搭載された前記表面実装型電子部品を覆う天板部と、を有する、ケース型基体である。前記天板部には、金属薄板によって形成されたアンテナ用放射電極が設けられている。前記測定用接続部材は、前記支持部に設けられ、前記アンテナ用放射電極に電気的に接続される。前記測定用接続部材の前記側面電極部は、前記アンテナ用放射電極のアンテナ特性を測定するための測定用電極部である。 Further, in the composite component , a surface mount electronic component is mounted on the one main surface of the first base. The second base is (1) a support part disposed around the surface-mounted electronic component mounted on the one main surface of the first base, and (2) connected to the support part, And a top plate portion that covers the surface-mounted electronic component mounted on the one main surface of the first base. Wherein the top plate, the antenna radiation electrode formed by the metallic thin plate is provided. The measuring connection member is provided in the support portion, Ru is electrically connected to the radiation electrode the antenna. The side electrode portion of the measurement connection member is a measurement electrode portion for measuring antenna characteristics of the antenna radiation electrode.

この場合、アンテナ用放射電極を有する複合部品について、第１基体と第２基体とが接合した状態のまま、部品の取り外し作業なしに、アンテナ用放射電極のアンテナ特性を測定することができる。アンテナ用放射電極と側面電極部との間のライン長を短くすることができるので、精度よく測定することができる。   In this case, with respect to the composite part having the antenna radiation electrode, the antenna characteristics of the antenna radiation electrode can be measured without removing the part while the first base and the second base are joined. Since the line length between the antenna radiation electrode and the side electrode portion can be shortened, measurement can be performed with high accuracy.

また、表面実装型電子部品の上にアンテナ用放射電極を配置することができるので、複合部品の小型化が容易である。また、測定用接続部材によって、アンテナ用放射電極と第１基体との間を電気的に接続する構成を簡単にすることができるので、複合部品の低背化が容易である。 In addition, since the antenna radiation electrode can be disposed on the surface-mounted electronic component, the composite component can be easily downsized. In addition, since the configuration for electrically connecting the antenna radiation electrode and the first base can be simplified by the measurement connecting member, it is easy to reduce the height of the composite component.

アンテナ用放射電極の位置は第２基体の樹脂モールド成型によって保持されるので、はんだの種類を減らし、加工コストを低減することができる。   Since the position of the antenna radiation electrode is held by resin molding of the second substrate, the type of solder can be reduced and the processing cost can be reduced.

好ましくは、前記ケース型基体は、前記天板部に、前記アンテナ用放射電極と対向して配置されたグランド電極が設けられている。より好ましくは、前記第２基体に、金属薄板の折り曲げ加工によって形成された表面部を含み前記グランド電極と前記第１基体の前記表面電極とを接続する接続部材が設けられる。 Preferably, the case-type substrate is provided with a ground electrode disposed on the top plate portion so as to face the antenna radiation electrode. More preferably, a connection member that includes a surface portion formed by bending a thin metal plate and connects the ground electrode and the surface electrode of the first substrate is provided on the second substrate.

この場合、グランド電極は、アンテナ用放射電極と第１基体に搭載された表面実装型電子部品との間に設けられているので、電磁シールの効果が得られる。   In this case, since the ground electrode is provided between the antenna radiation electrode and the surface-mounted electronic component mounted on the first base, an electromagnetic seal effect can be obtained.

好ましくは、前記金属薄板は可撓性を有している。   Preferably, the metal thin plate has flexibility.

この場合、金属薄板は、第２基体の樹脂の変形に追随して変形する。第２基体は、金属薄板に拘束されることなく変形できるので、第１基体と第２基体との間の接合部に作用する応力を緩和し、第１基体と第２基体との間や複合部品と回路基板との間の接合信頼性を向上することができる。   In this case, the metal thin plate is deformed following the deformation of the resin of the second base. Since the second base body can be deformed without being constrained by the metal thin plate, the stress acting on the joint between the first base body and the second base body is relaxed, and the first base body and the second base body are combined with each other. Bonding reliability between the component and the circuit board can be improved.

好ましくは、前記第１基体は、複数のセラミック層を積層してなるセラミック多層基板である。   Preferably, the first base is a ceramic multilayer substrate formed by laminating a plurality of ceramic layers.

セラミック多層基板は、内部に電気回路を構成することにより実装密度を高めることができるので、複合部品に好適である。   The ceramic multilayer substrate is suitable for composite parts because the mounting density can be increased by forming an electric circuit therein.

本発明の複合部品は、低コストで作製することができ、容易に特性を測定することができる。   The composite part of the present invention can be produced at low cost, and the characteristics can be easily measured.

以下、本発明の実施の形態について、図１〜図１１を参照しながら説明する。   Hereinafter, embodiments of the present invention will be described with reference to FIGS.

図１の断面図に示すように、複合部品１０は、基板１４の一方主面（図において上面）１４ａにケース１２が接合されている。   As shown in the sectional view of FIG. 1, the composite component 10 has a case 12 bonded to one main surface (upper surface in the drawing) 14 a of a substrate 14.

基板１４は、プリント配線板、フレキシブルプリント配線板、アルミナ基板、単層又は多層のセラミック基板などを用いることができる。複数のセラミック層を積層してなるセラミック多層基板は、内部に電気回路を構成することにより実装密度を高めることができるので、複合部品１０の基板１４に好適である。   As the substrate 14, a printed wiring board, a flexible printed wiring board, an alumina substrate, a single layer or a multilayer ceramic substrate, or the like can be used. A ceramic multilayer substrate formed by laminating a plurality of ceramic layers is suitable for the substrate 14 of the composite component 10 because the mounting density can be increased by forming an electric circuit therein.

基板１４の一方主面１４ａには、導電パターンが形成され、ダイボンドされたり、Ａｕ，Ａｌ，Ｃｕなどのワイヤー７４によってワイヤーボンドされたＳｉ半導体基板やＧａＡｓ半導体基板を含むＩＣチップ７２や、コンデンサやインダクタなどのチップ部品７０が搭載されている。ＩＣチップ７２の周囲には、ＩＣチップ７２を被覆するように、封止材７６が充填されている。封止材７６は、ＩＣチップ７２やワイヤー７４を、機械的破壊もしくは熱や水分といった環境から保護する。   On one main surface 14a of the substrate 14, a conductive pattern is formed, die-bonded, or an IC chip 72 including a Si semiconductor substrate or GaAs semiconductor substrate wire-bonded by a wire 74 such as Au, Al, Cu, a capacitor, A chip component 70 such as an inductor is mounted. A sealing material 76 is filled around the IC chip 72 so as to cover the IC chip 72. The sealing material 76 protects the IC chip 72 and the wire 74 from an environment such as mechanical destruction or heat or moisture.

基板１４の一方主面１４ａにワイヤーボンド実装がない場合、すなわち、表面実装部品、ＡｕもしくははんだバンプによるＩＣフリップチップ実装のみの場合には、表面実装部品と基板１４との間のアンダーフィル樹脂の有無にかかわらず、封止材７６は要らない。   In the case where there is no wire bond mounting on the one main surface 14a of the substrate 14, that is, in the case of only IC flip chip mounting by surface mounting components, Au or solder bumps, the underfill resin between the surface mounting components and the substrate 14 Regardless of the presence or absence, the sealing material 76 is not required.

基板１４は、ケース１２とは反対側の他方主面１４ｂに、チップ部品８０やＩＣチップ８２が搭載されている。図２の断面図に示す複合部品１０ａのように、必要に応じて、基板１４の他方主面１４ｂに金属ケース１６が接合される。金属ケース１６は、特に、高周波用に用いられる場合の電磁シールド用である。   The substrate 14 has a chip component 80 and an IC chip 82 mounted on the other main surface 14 b opposite to the case 12. A metal case 16 is bonded to the other main surface 14b of the substrate 14 as necessary, as in the composite part 10a shown in the cross-sectional view of FIG. The metal case 16 is particularly for electromagnetic shielding when used for high frequency.

電磁シールドが不要な場合は、図３の断面図に示す複合部品１０ｂのように、基板１４の他方主面１４ｂには、表面実装型電子部品８０，８２を被覆するようにエポキシ樹脂等の熱硬化性樹脂１７を塗布したり、トランスファー成形し、底面１８を平らにする。   When an electromagnetic shield is not required, a heat such as an epoxy resin is applied to the other main surface 14b of the substrate 14 so as to cover the surface-mounted electronic components 80 and 82, as in the composite component 10b shown in the sectional view of FIG. A curable resin 17 is applied or transfer molded to flatten the bottom surface 18.

ケース１２は、図１に示したように、無線信号を送信及び／又は受信するためのアンテナ板２２、グランド板２４などが、ケース本体２０と一体にモールド樹脂を用いて一体成型されている。ケースは、基板１４の一方主面１４ａ上に搭載された表面実装型電子部品７０，７２の周囲に配置される支持部１２ａと、支持部１２ａに接続され、基板１４の一方主面１４ａ上に搭載された表面実装型電子部品７０，７２を覆う天板部１２ｂとを有する。   As shown in FIG. 1, the case 12 includes an antenna plate 22 for transmitting and / or receiving radio signals, a ground plate 24, and the like integrally formed with the case main body 20 using a mold resin. The case is connected to the support portion 12a and the support portion 12a disposed around the surface-mounted electronic components 70 and 72 mounted on the one main surface 14a of the substrate 14, and on the one main surface 14a of the substrate 14. And a top plate portion 12b covering the surface-mounted electronic components 70 and 72 mounted thereon.

図１、図４の上方から見た斜視図、及び図５の平面図に示すように、アンテナ板２２は、ケース本体２０の上面２０ａに配置され、外部に露出している。   As shown in the perspective view seen from the top of FIGS. 1 and 4 and the plan view of FIG. 5, the antenna plate 22 is disposed on the upper surface 20a of the case body 20 and exposed to the outside.

グランド板２４は、図１に示すように、アンテナ板２２の下に配置され、ケース本体２０の内部を貫通しており、図５に示すように、ケース本体２０から外部に延出している延出部分２４ｐ，２４ｑ，２４ｍ，２４ｎを有する。すなわち、延出部分２４ｐ，２４ｑ，２４ｍ，２４ｎは、ケース本体２０から飛び出ている。延出部分２４ｐ，２４ｑ，２４ｍ，２４ｎには、複合部品１０を他の装置に取り付ける際の位置決めのために用いてもよい。図１に示すように、グランド板２４に接続された接続部材２４ｋは折り曲げられ、接続部材２４ｋの先端には、ケース本体２０の底面２０ｂに露出する接続端子２４ｓが形成されている。   As shown in FIG. 1, the ground plate 24 is disposed under the antenna plate 22 and penetrates the inside of the case body 20. As shown in FIG. 5, the ground plate 24 extends outward from the case body 20. It has output portions 24p, 24q, 24m, 24n. That is, the extended portions 24p, 24q, 24m, and 24n protrude from the case body 20. The extended portions 24p, 24q, 24m, and 24n may be used for positioning when the composite component 10 is attached to another device. As shown in FIG. 1, the connection member 24k connected to the ground plate 24 is bent, and a connection terminal 24s exposed to the bottom surface 20b of the case body 20 is formed at the tip of the connection member 24k.

図５に示したように、グランド板２４の図において左側の延出部分２４ｍ，２４ｎを形成する切り欠き２４ｘ内に、給電端子２８が配置されている。給電端子２８は、図５の直線Ａ−Ａに沿って切断した断面図である図６に示すように、ケース本体２０内にアンテナ板２２と間隔を設けて配置され、図において上側２８ｔがアンテナ板２２と容量結合し、下側には、ケース本体２０の底面２０ｂに露出する接続端子２８ｓが形成されている。   As shown in FIG. 5, the power supply terminal 28 is disposed in the notch 24 x that forms the left extension portions 24 m and 24 n in the drawing of the ground plate 24. As shown in FIG. 6, which is a cross-sectional view taken along the line AA in FIG. 5, the power supply terminal 28 is disposed in the case body 20 with a space from the antenna plate 22. A connection terminal 28 s that is capacitively coupled to the plate 22 and is exposed on the bottom surface 20 b of the case body 20 is formed on the lower side.

図５に示したように、図において左上側には、グランド板２４に隣接して供給電源用端子２６がケース本体２０から飛び出ている。供給電源端子２６は、複合部品１０を他の装置に取り付ける際に、プラス側電源端子に接続され、グランド板２４の延出部分２４ｐはマイナス側電源端子に接続される。   As shown in FIG. 5, a power supply terminal 26 protrudes from the case body 20 adjacent to the ground plate 24 on the upper left side in the drawing. The supply power terminal 26 is connected to the plus-side power terminal when the composite component 10 is attached to another device, and the extended portion 24p of the ground plate 24 is connected to the minus-side power terminal.

図５の線Ｂ−Ｂに沿って切断された断面図である図７に示すように、ケース１２の支持部１２ａに、金属薄板の折り曲げ加工により形成された測定用接続部材３０が配置されている。測定用接続部材３０は、図７に示すように、第１片３１〜第６片３６が直角に折り曲げられている。第１片３１は、図８の下方から見た斜視図及び図９の底面図に示すように、ケース本体２０の底面２０ｂに露出する。第４片３４は、図４及び図８に示すように、ケース２１の外周面１２ｓに露出する。第６片３６は、アンテナ板２２及びグランド板２４と間隔を設けて配置され、アンテナ板２２と容量結合している。したがって、ケース２１の外周面１２ｓに露出している測定用接続部材３０の第４片３４を利用すれば、複合部品１０のアンテナ板２２のアンテナ特性を、カバー１２と基板１４とが接合された状態のままで、容易に測定することができる。このとき、アンテナ板２２と測定用接続部材３０の第４片３４とのライン長を短くすることができるので、精度よく測定することができる。 As shown in FIG. 7 which is a cross-sectional view taken along the line BB in FIG. 5, a measurement connecting member 30 formed by bending a thin metal plate is disposed on the support portion 12a of the case 12. Yes. As shown in FIG. 7 , the measurement connecting member 30 has the first piece 31 to the sixth piece 36 bent at a right angle. The first piece 31 is exposed on the bottom surface 20b of the case body 20, as shown in a perspective view seen from below in FIG. 8 and a bottom view in FIG. As shown in FIGS. 4 and 8, the fourth piece 34 is exposed on the outer peripheral surface 12 s of the case 21. The sixth piece 36 is spaced from the antenna plate 22 and the ground plate 24 and is capacitively coupled to the antenna plate 22. Therefore, if the fourth piece 34 of the measurement connection member 30 exposed on the outer peripheral surface 12 s of the case 21 is used, the antenna characteristics of the antenna plate 22 of the composite component 10 are bonded to the cover 12 and the substrate 14. It can be easily measured in the state. At this time, the line length between the antenna plate 22 and the fourth piece 34 of the measuring connection member 30 can be shortened, so that measurement can be performed with high accuracy.

図８及び図９に示すように、ケース本体２０の底面２０ｂに露出している接続端子２４ｓ，２６ｓ，２８ｓや測定用接続部材３０の第１片３１は、図１に示すように、基板１４の一方主面１４ａ上に形成された導電パターン（図示せず）に、はんだや導電性接着剤を介して電気的に接続され、これによって、ケース１２と基板１４とが接合される。 As shown in FIGS. 8 and 9, the connection terminals 24s, 26s, 28s exposed on the bottom surface 20b of the case body 20 and the first piece 31 of the measurement connection member 30 are formed on the substrate 14 as shown in FIG. Are electrically connected to a conductive pattern (not shown) formed on one main surface 14a via solder or a conductive adhesive, whereby the case 12 and the substrate 14 are joined .

図１に示すように、ケース本体２０にモールド成型されたグランド板２４は、アンテナ板２２と基板１４との間にあるので、アンテナ板２２により形成されるアンテナ素子と基板１４側に形成される周波数変換回路及び増幅回路との間で起きる電磁的相互干渉の影響を防ぐことができる。   As shown in FIG. 1, since the ground plate 24 molded in the case body 20 is between the antenna plate 22 and the substrate 14, it is formed on the antenna element formed by the antenna plate 22 and the substrate 14 side. The influence of electromagnetic mutual interference occurring between the frequency conversion circuit and the amplification circuit can be prevented.

ケース１２のモールド成型の際に、型内には、図１０の平面図に示す形状に打ち抜かれた板部材４０，５０，６０が、適宜形状に折り曲げ加工された後に配置され、金型内の空洞部に樹脂が充填される。各板部材４０，５０，６０は、青銅、洋白、Ｎｉ合金などの金属薄板を金型で打ち抜き、折り曲げ加工される。図１０は、打ち抜き後、折り曲げ加工前の形状を示している。   When the case 12 is molded, the plate members 40, 50, 60 punched into the shape shown in the plan view of FIG. 10 are placed in the mold after being bent into an appropriate shape, and placed in the mold. The cavity is filled with resin. Each plate member 40, 50, 60 is formed by punching a thin metal plate such as bronze, white, or Ni alloy with a die. FIG. 10 shows the shape after punching and before bending.

図１０（ａ）に示した第１の板部材４０は、枠部４２に、位置決めピンを挿通するための貫通穴４４が形成されている。枠部４４の内側には、アンテナ板２２になる部分が形成され、接続部４６を介して枠部４４に接続されている。   In the first plate member 40 shown in FIG. 10A, a through hole 44 for inserting a positioning pin is formed in the frame portion 42. A portion that becomes the antenna plate 22 is formed inside the frame portion 44, and is connected to the frame portion 44 via the connection portion 46.

図１０（ｂ）に示した第２の板部材５０は、枠部５２に、位置決めピンを挿通するための貫通穴５４が形成されている。枠部５２の内側には、グランド板２４、供給電源端子２６、グランド板２４に接続された接続部材２４ｋ、給電端子２８になる部分が形成され、接続部５６を介して枠部５２に接続されている。接続部材２４ｋ、供給電源端子２６、給電端子２８になる部分は、樹脂成形の前に、塑性加工で折り曲げ、それ自体が容易にＸ、Ｙ、Ｚの３方向に弾性変形するように、所定形状に形成される。   In the second plate member 50 shown in FIG. 10 (b), a through hole 54 for inserting a positioning pin is formed in the frame portion 52. Inside the frame portion 52, a ground plate 24, a power supply terminal 26, a connection member 24 k connected to the ground plate 24, and a portion that becomes a power supply terminal 28 are formed, and connected to the frame portion 52 via a connection portion 56. ing. The parts that become the connection member 24k, the power supply terminal 26, and the power supply terminal 28 are bent in a plastic shape before the resin molding, and have a predetermined shape so that they themselves can be easily elastically deformed in three directions of X, Y, and Z. Formed.

図１０（ｃ）に示した第３の板部材６０は、枠部６２に、位置決めピンを挿通するための貫通穴６４が形成されている。枠部６２の内側には、測定用接続部材３０になる部分が接続部６６を介して枠部６２に接続されている。測定用接続部材３０になる部分は、樹脂成形の前に、塑性加工で折り曲げ、それ自体が容易にＸ、Ｙ、Ｚの３方向に弾性変形するように、所定形状に形成される。   In the third plate member 60 shown in FIG. 10C, a through hole 64 for inserting a positioning pin is formed in the frame portion 62. Inside the frame portion 62, a portion that becomes the measurement connection member 30 is connected to the frame portion 62 via the connection portion 66. The portion to be the measurement connecting member 30 is formed in a predetermined shape so that it is easily bent elastically in three directions of X, Y, and Z by plastic working before resin molding.

第２及び第３の板部材５０，６０の厚みは、５０〜３００μｍが好ましい。厚みが５０μｍ未満では、折り曲げ加工時のばらつきが大きくなり、折り曲げて形成した各端子の位置や高さのばらつきが大きくなる。端子位置がばらつき、ケース１２と基板１４の位置合わせ精度が悪いと、基板１４側の接合パッドサイズの余裕を大きくしなければならず、基板１４の小型化、ひいては複合部品１０の小型化を損ねる。高さがばらつくと、例えば、基板１４とケース１２と間のはんだの厚みがばらつき、接合信頼性が損なわれる。また、高さのばらつきを大きく見込んで設計すると、複合部品１０の低背化を阻害する。グランド板２４の延出部分２４ｐ，２４ｑ，２４ｍ，２４ｎを利用して、複合部品１０を他の装置に取り付ける場合、板部材５０の厚みが５０μｍ未満では、機械的保持力が不足する。熱応力や衝撃応力で、第２の板部材５０の折り曲げ部が繰り返し疲労を受けるが、厚みが薄いと疲労破壊し易く、接合信頼性を損ねる。板部材５０，６０の厚みが３００μｍを越えると、折り曲げ加工が困難になる。   The thickness of the second and third plate members 50 and 60 is preferably 50 to 300 μm. If the thickness is less than 50 μm, the variation at the time of bending increases, and the variation in the position and height of each terminal formed by bending increases. If the terminal positions vary and the alignment accuracy between the case 12 and the substrate 14 is poor, the margin of the bonding pad size on the substrate 14 side must be increased, thereby reducing the size of the substrate 14 and the size of the composite component 10. . If the height varies, for example, the thickness of the solder between the substrate 14 and the case 12 varies, and the bonding reliability is impaired. In addition, if the design is performed with a large variation in height, a reduction in the height of the composite component 10 is hindered. When the composite part 10 is attached to another apparatus using the extended portions 24p, 24q, 24m, and 24n of the ground plate 24, the mechanical holding force is insufficient when the thickness of the plate member 50 is less than 50 μm. The bent portion of the second plate member 50 is repeatedly subjected to fatigue by thermal stress or impact stress, but if the thickness is thin, fatigue failure is liable to occur and joint reliability is impaired. When the thickness of the plate members 50 and 60 exceeds 300 μm, the bending process becomes difficult.

第２及び第３の板部材５０，６０は、基板１４に接合する部分２４ｓ，２６ｓ，２８ｓ，３１があるので、基板１４の導電パターン（図示せず）との接合性を上げるべく、Ｎｉ／Ｓｎ、Ｎｉ／Ａｕ、Ｎｉ／はんだなどのめっきが施される。これは、基板１４とケース１２との接合に使用されるはんだや導電性接着剤との濡れ性を良くするためである。必要に応じて、基板１４に接合される部分２４ｓ，２６ｓ，２８ｓ，３１の接合面のみの部分めっきを選択してもよい。   Since the second and third plate members 50, 60 have portions 24s, 26s, 28s, 31 to be bonded to the substrate 14, in order to improve the bondability with the conductive pattern (not shown) of the substrate 14, Ni / Plating such as Sn, Ni / Au, Ni / solder is performed. This is to improve the wettability with the solder and conductive adhesive used for joining the substrate 14 and the case 12. If necessary, partial plating of only the bonding surfaces of the portions 24s, 26s, 28s, and 31 bonded to the substrate 14 may be selected.

次に、複合部品の製造手順について、図１１の工程図を参照しながら説明する。   Next, the manufacturing procedure of the composite part will be described with reference to the process diagram of FIG.

まず、基板１４とケース１２をそれぞれ別個に製造する。ケース１２は、前述したように、モールド成型により、ケース本体２０を、アンテナ板２２、グランド板２４、供給電源端子２６、給電端子２８等とともに一体成型する。   First, the substrate 14 and the case 12 are manufactured separately. As described above, the case 12 integrally molds the case main body 20 together with the antenna plate 22, the ground plate 24, the power supply terminal 26, the power supply terminal 28, and the like by molding.

そして、図１１（ａ）に示すように、基板１４の一方主面１４ａに、はんだもしくはＡｇ等を含む導電性ペーストを印刷し、これに表面実装型電子部品７０を搭載し、リフローもしくは熱硬化する。導体であるはんだもしくは導電性ペーストにより、表面実装型電子部品７０を基板１４の一方主面１４ａに形成された導電パターン（図示せず）に電気的に接続する。   Then, as shown in FIG. 11A, a conductive paste containing solder or Ag or the like is printed on one main surface 14a of the substrate 14, and a surface-mounted electronic component 70 is mounted on the conductive paste, and reflow or thermosetting is performed. To do. The surface-mounted electronic component 70 is electrically connected to a conductive pattern (not shown) formed on the one main surface 14a of the substrate 14 by a solder or conductive paste as a conductor.

次いで、基板１４の一方主面１４ａを洗浄し、基板１４の一方主面１４ａに形成されたワイヤーボンドパッド（図示せず）の汚れを除去する。これは、次にワイヤー７４（図１１（ｂ）参照）との接合性を向上させるためである。   Next, the one main surface 14a of the substrate 14 is washed, and the stain on the wire bond pad (not shown) formed on the one main surface 14a of the substrate 14 is removed. This is to improve the bondability with the wire 74 (see FIG. 11B).

次いで、図１１（ｂ）に示すように、Ｓｉ半導体基板やＧａＡｓ半導体基板を含むＩＣチップ７２をエポキシ系樹脂又は導電性樹脂等で、基板１４の一方主面１４ａに搭載、熱硬化した後、ＩＣチップ７２の電極端子と基板１４の一方主面１４ａに形成されたワイヤーボンドパッドとの間を、Ａｕ、Ａｌ、Ｃｕ等のワイヤー７４で接合し、電気的に接続する。ワイヤーボンドパッドには、接合強度を上げるため、Ｎｉ／ＡｕやＮｉ／Ｐｄ／Ａｕ等のめっきを施すことが好ましい。   Next, as shown in FIG. 11B, an IC chip 72 including a Si semiconductor substrate or a GaAs semiconductor substrate is mounted on one main surface 14a of the substrate 14 with an epoxy resin or a conductive resin and thermally cured. The electrode terminal of the IC chip 72 and the wire bond pad formed on the one main surface 14a of the substrate 14 are joined by a wire 74 such as Au, Al, Cu or the like and electrically connected. The wire bond pad is preferably plated with Ni / Au or Ni / Pd / Au in order to increase the bonding strength.

次いで、図１１（ｃ）に示すように、ＩＣチップ７２の周囲に、エポキシ系樹脂からなる封止材７６を充填し、熱硬化する。   Next, as shown in FIG. 11C, a sealing material 76 made of an epoxy resin is filled around the IC chip 72 and thermally cured.

次に、図１１（ｄ）に示すように、基板１４の一方主面１４ａに導電性接着材又ははんだを塗布し、これにケース１２を搭載し、リフローもしくは熱硬化し、ケース１２と基板１４とを接合すると同時に、電気的に接続する。   Next, as shown in FIG. 11 (d), a conductive adhesive or solder is applied to one main surface 14a of the substrate 14, and the case 12 is mounted on the main surface 14a, followed by reflow or thermosetting. And are electrically connected at the same time.

次いで、図１１（ｅ）に示すように、上下を反転して、基板１４の他方主面１４ｂに、はんだもしくはＡｇ等を含む導電性ペーストを印刷し、表面実装型電子部品８０を搭載する。また、はんだバンプ等の付いたＩＣチップ８４をフリップチップ実装し、リフローもしくは熱硬化する。必要に応じて、フリップチップ実装したＩＣチップ８４と基板１４との間に、エポキシ系樹脂からなるアンダーフィル樹脂８７を充填、熱硬化する。   Next, as shown in FIG. 11 (e), the substrate 14 is turned upside down, and a conductive paste containing solder or Ag is printed on the other main surface 14 b of the substrate 14, and the surface mount electronic component 80 is mounted. Further, an IC chip 84 with solder bumps is flip-chip mounted and reflowed or thermally cured. If necessary, an underfill resin 87 made of an epoxy resin is filled between the IC chip 84 mounted on the flip chip and the substrate 14 and is thermally cured.

次いで、図１１（ｆ）に示すように、必要に応じて、洋白又はりん青銅等からなる金属ケース１６を、基板１４の他方主面１４ｂもしくは基板１４の側面に搭載、接合する。   Next, as shown in FIG. 11 (f), a metal case 16 made of white or phosphor bronze is mounted and bonded to the other main surface 14 b of the substrate 14 or the side surface of the substrate 14 as necessary.

金属ケース１６を搭載、接合する工程は、図１１（ｅ）に示した基板１４の他方主面１４ｂに表面実装型電子部品８０，８４を搭載する工程と同時に行ってもよい。例えば、リフローもしくは熱硬化により、表面実装型電子部品８０，８４と金属ケース１６を同時に接合するようにしてもよい。   The process of mounting and joining the metal case 16 may be performed simultaneously with the process of mounting the surface mount type electronic components 80 and 84 on the other main surface 14b of the substrate 14 shown in FIG. For example, the surface mount electronic components 80 and 84 and the metal case 16 may be bonded simultaneously by reflow or thermosetting.

以上により、複合部品が完成する。   Thus, the composite part is completed.

以上に説明した複合部品１０は、金属薄板を加工したアンテナ板２２、グランド板２４、供給電源用端子２６、給電端子２８、測定用接続部材３０がケース本体２０と一体となったケース１２を、樹脂モールド成型によって作製することができる。そのため、工程が簡素化され、容易にかつ安価に作製できる。   The composite component 10 described above includes a case 12 in which a metal thin plate is processed, an antenna plate 22, a ground plate 24, a power supply terminal 26, a power supply terminal 28, and a measurement connecting member 30 integrated with the case body 20. It can be produced by resin molding. Therefore, the process is simplified and can be manufactured easily and inexpensively.

アンテナ特性の測定するための端子である第４片３４を含む測定用接続部材３０をケース１２の支持部１２ａに形成することにより、従来のように測定端子をマザー基板上に設ける必要はないため、ライン長が短く、インダクタ成分の影響が少なくなり、測定精度が向上する。また、基板上に測定端子を形成する必要もないため、基板の小型化が可能となる。   By forming the measurement connecting member 30 including the fourth piece 34, which is a terminal for measuring antenna characteristics, on the support portion 12a of the case 12, there is no need to provide the measurement terminal on the mother board as in the conventional case. , The line length is short, the influence of the inductor component is reduced, and the measurement accuracy is improved. Further, since it is not necessary to form a measurement terminal on the substrate, the substrate can be miniaturized.

アンテナ特性の測定するための端子である第４片３４がケース１２の外周面１２ｓに露出するように、測定用接続部材３０はコの字形状に折り曲げ加工されている。このように折り曲げ加工された測定用接続部材３０が一体成型されたケース１２は、外力が加わった場合、測定用接続部材３０のコの字の部分で応力を分散することができ、ケース１２の変形が小さくなる。そのため、振動やねじりに強くなる。   The connecting member 30 for measurement is bent into a U shape so that the fourth piece 34 that is a terminal for measuring antenna characteristics is exposed on the outer peripheral surface 12 s of the case 12. The case 12 in which the measurement connection member 30 bent in this way is integrally molded can disperse the stress at the U-shaped portion of the measurement connection member 30 when an external force is applied. Deformation is reduced. Therefore, it becomes strong against vibration and torsion.

アンテナ特性の測定するための端子である第４片３４がケース１２の外周面１２ｓに露出しているので、横から測定用ピンを測定端子である第４片３４に当てながら測定することができるため、基板を押圧する負荷荷重が作用しない。   Since the fourth piece 34, which is a terminal for measuring antenna characteristics, is exposed on the outer peripheral surface 12s of the case 12, measurement can be performed while applying the measurement pin to the fourth piece 34, which is a measurement terminal, from the side. Therefore, the load load that presses the substrate does not act.

アンテナへの給電は、アンテナ板２２下にある給電端子２８と容量結合にて供給される。そのため、従来品のようなプリント基板上にアンテナとアンテナ端を接続する給電端子を設置する必要はない。基板の小型化の際に、基板上に給電端子を設置する領域を確保する必要がないため、基板の小型化が可能である。   Power is supplied to the antenna by capacitive coupling with the power supply terminal 28 under the antenna plate 22. Therefore, it is not necessary to install a power feeding terminal for connecting the antenna and the antenna end on a printed circuit board as in the conventional product. When the substrate is downsized, it is not necessary to secure a region for installing the power supply terminal on the substrate, and thus the substrate can be downsized.

また、アンテナへの給電は、アンテナ板２２の下にある給電端子２８と容量結合にて供給され、従来のアンテナとアンテナ端を接続する給電端子のようにはんだで接合する構造でないため、はんだによる高周波信号の損失もない。   In addition, power is supplied to the antenna by capacitive coupling with the power supply terminal 28 under the antenna plate 22 and is not joined by solder like the conventional power supply terminal connecting the antenna and the antenna end. There is no loss of high-frequency signals.

アンテナ板２２はケース１２上にモールド成型されているため、従来品のように金属ケース上面にアンテナ素子を嵌合する凹部を設ける必要がない。このため、ケース１２と基板１４との隙間の制限がなく、配線回路の配置の自由度が広くとれる。よって、基板１２の小型化が可能である。   Since the antenna plate 22 is molded on the case 12, there is no need to provide a recess for fitting the antenna element on the upper surface of the metal case unlike the conventional product. For this reason, there is no restriction | limiting of the clearance gap between the case 12 and the board | substrate 14, and the freedom degree of arrangement | positioning of a wiring circuit can be taken widely. Therefore, the substrate 12 can be downsized.

アンテナ板２２はケース１２上にモールド成型されているため、従来品ように金属ケース上面にアンテナ素子を嵌合する凹部を設ける必要はない。そのため、製品の低背化が可能である。   Since the antenna plate 22 is molded on the case 12, it is not necessary to provide a recess for fitting the antenna element on the upper surface of the metal case as in the conventional product. Therefore, the product can be reduced in height.

アンテナ板２２、グランド板２４、供給電源用端子２６、給電端子２８、測定用接続部材３０を一体で樹脂モールド成型したケース１２は、基板１４が、表裏面に表面実装型電子部品を実装したセラミック多層基板である場合、基板１４のＬＧＡ電極部とはんだ接合することができる。よって、はんだ溶融によるケース１２と基板１４の距離の変化に起因するアンテナ特性ずれはない。すなわち、アンテナ付き高周波モジュールを作製する場合、はんだの種類は融点の異なる２種類もしくは１種類でよく、従来品のような融点の違う３種類のはんだを使用する必要はない。そのため、３つのリフロープロファイルを準備したり、量産のためにリフロープロファイルごとに専用炉を設置したりする必要がないため、コストダウンとなる。   In the case 12 in which the antenna plate 22, the ground plate 24, the power supply terminal 26, the power supply terminal 28, and the measurement connection member 30 are integrally molded with resin, the substrate 14 is a ceramic in which surface-mounted electronic components are mounted on the front and back surfaces. In the case of a multilayer substrate, it can be soldered to the LGA electrode portion of the substrate 14. Therefore, there is no antenna characteristic deviation due to a change in the distance between the case 12 and the substrate 14 due to solder melting. That is, when producing a high-frequency module with an antenna, the type of solder may be two or one with different melting points, and there is no need to use three types of solder with different melting points unlike conventional products. For this reason, it is not necessary to prepare three reflow profiles or to install a dedicated furnace for each reflow profile for mass production, resulting in cost reduction.

複合部品１０は、アンテナ板２２と給電端子２６がモールド成型されている。アンテナ有り無しの高周波モジュール特性検査は、基板１４に実装しているスイッチコネクタのオンオフにて行うことができる。よって、従来品のようなアンテナの取り外し取り付け作業は必要ないため、工数がかからずコストダウンとなる。そして、従来品のようなアンテナの取り付け取り外しの際にアンテナ端及び給電端子が損傷し、高周波信号の損失が生じる可能性もない。   In the composite component 10, the antenna plate 22 and the power supply terminal 26 are molded. The high frequency module characteristic inspection with and without the antenna can be performed by turning on and off the switch connector mounted on the substrate 14. Therefore, since there is no need to remove and attach the antenna as in the conventional product, the number of steps is not increased and the cost is reduced. Further, there is no possibility that the antenna end and the power supply terminal are damaged at the time of attaching and removing the antenna as in the conventional product, and the loss of the high frequency signal is caused.

基板１４の表裏面に半導体チップ及び表面実装型電子部品を搭載することで、基板の小型化及び低価格化が実現できる。   By mounting the semiconductor chip and the surface-mount type electronic components on the front and back surfaces of the substrate 14, it is possible to reduce the size and price of the substrate.

ケース１２と基板１４とは、接続端子２４ｓ，２６ｓ，２８ｓ，３１を介して接続されており、接続端子２４ｓ，２６ｓ，２８ｓ，３１は、金属薄板を折り曲げ加工された接続部材２４ｘ、供給電源用端子２６、給電端子２８、測定用接続部材３０の端部に形成されている。接続部材２４ｘ、供給電源用端子２６、給電端子２８、測定用接続部材３０は可撓性を有するので、ケース１２と基板１４との間の接合部に応力が作用したときに、弾性変形で応力を吸収し、基板１４とケース１２の接合強度を向上させ、接合信頼性を向上することができる。よって、接続部材２４ｘ、供給電源用端子２６、給電端子２８、測定用接続部材３０の材質選定の自由度は高い。   The case 12 and the substrate 14 are connected via connection terminals 24s, 26s, 28s, and 31. The connection terminals 24s, 26s, 28s, and 31 are a connection member 24x formed by bending a metal thin plate, and a supply power source. The terminal 26, the power supply terminal 28, and the measuring connection member 30 are formed at the end portions. Since the connection member 24x, the power supply terminal 26, the power supply terminal 28, and the measurement connection member 30 have flexibility, when stress acts on the joint between the case 12 and the substrate 14, the stress is caused by elastic deformation. Can be absorbed, the bonding strength between the substrate 14 and the case 12 can be improved, and the bonding reliability can be improved. Therefore, the degree of freedom in selecting materials for the connection member 24x, the power supply terminal 26, the power supply terminal 28, and the measurement connection member 30 is high.

ケース本体２０の成形樹脂と、接続部材２４ｘ、供給電源用端子２６、給電端子２８、測定用接続部材３０とは強固に接合されている必要はない。そのため、ケース本体２０の樹脂材質の自由度も高い。   The molding resin of the case body 20, the connection member 24x, the power supply terminal 26, the power supply terminal 28, and the measurement connection member 30 do not need to be firmly joined. Therefore, the degree of freedom of the resin material of the case body 20 is high.

安価な材質、折り曲げ易い材質、成型し易い材質を選定でき、工業上、有用である。   Inexpensive materials, easy-to-bend materials, and easy-to-mold materials can be selected and are industrially useful.

＜まとめ＞ 以上に説明したように、本発明の複合部品は、低コストで作製することができ、容易に特性を測定することができる。   <Summary> As described above, the composite part of the present invention can be manufactured at low cost, and its characteristics can be easily measured.

なお、本発明は、上記した実施の形態に限定されるものではなく、種々変更を加えて実施することが可能である。   The present invention is not limited to the above-described embodiment, and can be implemented with various modifications.

例えば、基板（第１基体）のいずれか一方の主面にのみ、表面実装型電子部品を搭載するようにしてもよい。   For example, the surface mount electronic component may be mounted only on one main surface of the substrate (first base).

アンテナ板は、全体としてケース本体に保持されていればよく、ケース本体の表面又は内部に配置されずにケース本体から離れている部分があっても構わない。例えば、アンテナ板の周囲のみがケース本体の側面部に保持され、アンテナ板の中央部がケース本体から浮いた状態でも構わない。   The antenna plate may be held by the case main body as a whole, and there may be a portion separated from the case main body without being arranged on the surface or inside of the case main body. For example, only the periphery of the antenna plate may be held by the side surface portion of the case body, and the center portion of the antenna plate may be lifted from the case body.

また、アンテナ板は、湾曲しながら、あるいは基板（第１基体）に対して非平行（例えば、斜め方向）に、基板（第１基体）に沿って延在してもよい。例えば、平板状の基板（第１基体）に、半筒状、半球状等の断面円弧状のケース本体が接合され、このケース本体の外表面に半筒状、半球状等の断面円弧状のアンテナ板が配置され、平板状の基板（第１基体）に沿って、湾曲したアンテナ板が延在しても構わない。この場合、アンテナ板と基板（第１基体）との間に配置されるグランド板は、アンテナ板に沿って平行にアンテナ板と同心の半筒状あるいは半球状に延在する湾曲部分と、基板（第１基体）と平行にケース本体よりも外側に延出している延出部分とを含むことが好ましい。   The antenna plate may extend along the substrate (first substrate) while being curved or non-parallel (for example, in an oblique direction) to the substrate (first substrate). For example, a case body having a semi-cylindrical or hemispherical cross-section arc shape is joined to a flat substrate (first base), and a semi-cylindrical or hemispherical cross-sectional arc shape is formed on the outer surface of the case body. An antenna plate may be disposed, and a curved antenna plate may extend along a flat substrate (first base). In this case, the ground plate disposed between the antenna plate and the substrate (first base) includes a curved portion extending in parallel with the antenna plate in a semi-cylindrical shape or a hemispherical shape, and the substrate. It is preferable to include an extension portion extending outward from the case body in parallel with the (first base).

アンテナ板やグランド板は、金属の板部材以外の材料を用いて形成してもよい。例えば、表面又は内部に金属膜や金属箔等が形成された樹脂シート等を用いて、アンテナ板やグランド板を形成しても構わない。   The antenna plate and the ground plate may be formed using a material other than a metal plate member. For example, the antenna plate or the ground plate may be formed using a resin sheet or the like having a metal film or metal foil formed on the surface or inside.

また、基板（第１基体）は、ケース（第２基体）に接続される複数の表面電極が同一平面上に設けられた基板であればよく、ケース（第２基体）が接続される平面部以外の部分に、凸部や凹部が設けられていれてもよい。   Further, the substrate (first substrate) may be a substrate in which a plurality of surface electrodes connected to the case (second substrate) are provided on the same plane, and a plane portion to which the case (second substrate) is connected. A convex portion or a concave portion may be provided in a portion other than.

複合部品の断面図である。（実施例）It is sectional drawing of a composite component. (Example) 複合部品の断面図である。（変形例１）It is sectional drawing of a composite component. (Modification 1) 複合部品の断面図である。（変形例２）It is sectional drawing of a composite component. (Modification 2) ケースの上面を見る斜視図である。（実施例）It is a perspective view which looks at the upper surface of a case. (Example) ケースの平面図である。（実施例）It is a top view of a case. (Example) 図５の線Ａ−Ａに沿って切断した断面図である。（実施例）It is sectional drawing cut | disconnected along line AA of FIG. (Example) 図５の線Ｂ−Ｂに沿って切断した断面図である。（実施例）It is sectional drawing cut | disconnected along line BB of FIG. (Example) ケースの底面を見る斜視図である。（実施例）It is a perspective view which looks at the bottom of a case. (Example) ケースの底面図である。（実施例）It is a bottom view of a case. (Example) 板部材の平面図である。（実施例）It is a top view of a plate member. (Example) 複合部品の製造工程図である。（実施例）It is a manufacturing process figure of a composite part. (Example) 複合部品の断面図である。（従来例）It is sectional drawing of a composite component. (Conventional example)

符号の説明Explanation of symbols

１０ 複合部品
１２ ケース（第２基体）
１２ａ 支持部
１２ｂ 天板部
１４ 基板（第１基体）
１４ａ 一方主面
１４ｂ 他方主面
２０ ケース本体
２２ アンテナ板（アンテナ用放射電極）
２４ グランド板（グランド電極）
２４ａ，２４ｂ，２４ｍ，２４ｎ 延出部分
２４ｓ 接続端子（表面部）
２４ｘ 接続部材
２６ 供給電源用端子（接続部材）
２６ｓ 接続端子（表面部）
２８ 給電端子（接続部材）
２８ｓ 接続端子（表面部）
３０ 測定用接続部材（接続部材）
３１ 第１片（表面部）
３４ 第４片（側面電極部）
７０ チップ部品（表面実装型電子部品）
７２ ＩＣチップ（表面実装型電子部品）
８０ チップ部品（表面実装型電子部品）
８２，８４ ＩＣチップ（表面実装型電子部品） 10 Composite parts 12 Case (second base)
12a Support portion 12b Top plate portion 14 Substrate (first base)
14a One main surface 14b The other main surface 20 Case body 22 Antenna plate (radiation electrode for antenna)
24 Ground plate (ground electrode)
24a, 24b, 24m, 24n Extension part 24s Connection terminal (surface part)
24x connection member 26 Power supply terminal (connection member)
26s connection terminal (surface)
28 Power supply terminal (connection member)
28s connection terminal (surface)
30 Connection member for measurement (connection member)
31 1st piece (surface part)
34 4th piece (side electrode part)
70 Chip components (surface mount electronic components)
72 IC chip (surface mount electronic component)
80 chip components (surface mount electronic components)
82,84 IC chip (surface mount electronic component)

Claims (5)

少なくとも一方主面に表面電極が形成された第１基体と、金属薄板の折り曲げ加工によって形成された表面部と接続部とを含む測定用接続部材を樹脂モールド成型してなる第２基体とが、前記第１基体の前記表面電極と前記第２基体の前記表面部とを介して接合されてなる複合部品であって、
前記測定用接続部材は、前記接続部の一部が前記第２基体の側面に露出して形成された側面電極部を有し、
前記第１基体の前記一方主面上に表面実装型電子部品が搭載され、
前記第２基体は、
前記第１基体の前記一方主面上に搭載された前記表面実装型電子部品の周囲に配置される支持部と、
前記支持部に接続され、前記第１基体の前記一方主面上に搭載された前記表面実装型電子部品を覆う天板部と、
を有する、ケース型基体であり、
前記天板部には、金属薄板によって形成されたアンテナ用放射電極が設けられ、
前記測定用接続部材は、前記支持部に設けられ、前記アンテナ用放射電極に電気的に接続され、
前記測定用接続部材の前記側面電極部は、前記アンテナ用放射電極のアンテナ特性を測定するための測定用電極部であることを特徴とする複合部品。 A first substrate having a surface electrode formed on at least one main surface, and a second substrate formed by resin molding a measuring connection member including a surface portion and a connection portion formed by bending a metal thin plate; A composite part joined through the surface electrode of the first base and the surface portion of the second base,
Before SL measuring connection member has a side surface electrode portion a part of which is formed so as to be exposed to the side surface of the second substrate of the connecting portion,
A surface-mounted electronic component is mounted on the one main surface of the first base,
The second base is
A support portion disposed around the surface-mounted electronic component mounted on the one main surface of the first base;
A top plate portion that is connected to the support portion and covers the surface-mounted electronic component mounted on the one main surface of the first base;
A case-type substrate,
The top plate portion is provided with an antenna radiation electrode formed of a thin metal plate,
The measurement connection member is provided in the support portion, and is electrically connected to the antenna radiation electrode;
The composite part according to claim 1, wherein the side electrode portion of the measurement connecting member is a measurement electrode portion for measuring antenna characteristics of the antenna radiation electrode . 前記ケース型基体は、前記天板部に、前記アンテナ用放射電極と対向して配置されたグランド電極が設けられていることを特徴とする、請求項１に記載の複合部品。 2. The composite part according to claim 1 , wherein the case base has a ground electrode disposed on the top plate portion so as to face the antenna radiation electrode. 3. 前記第２基体に、金属薄板の折り曲げ加工によって形成された表面部を含み前記グランド電極と前記第１基体の前記表面電極とを接続する接続部材が設けられたことを特徴とする、請求項２に記載の複合部品。3. The connecting member for connecting the ground electrode and the surface electrode of the first substrate, including a surface portion formed by bending a thin metal plate, is provided on the second substrate. Composite parts as described in. 前記金属薄板は可撓性を有していることを特徴とする、請求項１〜３のいずれか一項に記載の複合部品。   The composite part according to any one of claims 1 to 3, wherein the metal thin plate has flexibility. 前記第１基体は、複数のセラミック層を積層してなるセラミック多層基板であることを特徴とする、請求項１〜４のいずれか一項に記載の複合部品。   The composite part according to any one of claims 1 to 4, wherein the first base is a ceramic multilayer substrate formed by laminating a plurality of ceramic layers.
JP2006289567A 2006-10-25 2006-10-25 Composite parts Expired - Fee Related JP4645911B2 (en)

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JP2014011746A (en) * 2012-07-02 2014-01-20 Sharp Corp Antenna member, communication device, and conduction inspection method
JP6622649B2 (en) * 2015-12-21 2019-12-18 ホシデン株式会社 Non-contact communication module

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JPH07142881A (en) * 1993-11-18 1995-06-02 Murata Mfg Co Ltd Composite electronic component
JPH0742126U (en) * 1993-12-27 1995-07-21 株式会社村田製作所 Composite parts
JPH07288422A (en) * 1993-04-23 1995-10-31 Murata Mfg Co Ltd Surface mounted antenna system
JPH0964636A (en) * 1995-08-21 1997-03-07 Matsushita Electric Ind Co Ltd Planar antenna
JP2002290140A (en) * 2001-03-26 2002-10-04 Furukawa Electric Co Ltd:The Antenna device
JP2005019649A (en) * 2003-06-25 2005-01-20 Kyocera Corp Package for housing high-frequency element integrated with antenna and antenna device
JP2005039330A (en) * 2003-07-15 2005-02-10 Alps Electric Co Ltd Antenna system
JP2006101494A (en) * 2004-09-01 2006-04-13 Sanyo Electric Co Ltd Antenna integrated circuit device

Patent Citations (8)

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Publication number Priority date Publication date Assignee Title
JPH07288422A (en) * 1993-04-23 1995-10-31 Murata Mfg Co Ltd Surface mounted antenna system
JPH07142881A (en) * 1993-11-18 1995-06-02 Murata Mfg Co Ltd Composite electronic component
JPH0742126U (en) * 1993-12-27 1995-07-21 株式会社村田製作所 Composite parts
JPH0964636A (en) * 1995-08-21 1997-03-07 Matsushita Electric Ind Co Ltd Planar antenna
JP2002290140A (en) * 2001-03-26 2002-10-04 Furukawa Electric Co Ltd:The Antenna device
JP2005019649A (en) * 2003-06-25 2005-01-20 Kyocera Corp Package for housing high-frequency element integrated with antenna and antenna device
JP2005039330A (en) * 2003-07-15 2005-02-10 Alps Electric Co Ltd Antenna system
JP2006101494A (en) * 2004-09-01 2006-04-13 Sanyo Electric Co Ltd Antenna integrated circuit device

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