JP2008072175A - Composite electronic component and fixing method thereof - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a composite electronic component which can be miniaturized with a simple configuration without causing deterioration in antenna characteristics, and a fixing method thereof and an antenna device. <P>SOLUTION: The composite electronic component 10 is provided with a wiring board 14 having surface-mounting electronic components 70, 72 mounted on at least one main surface, and a case 12 joined to the one main surface of the wiring board 14 and used for covering the electronic components 70, 72. The case 12 includes: (a) an antenna plate 22 held in a case body 20, extending along the wiring board 14 and used for transmitting and/or receiving a radio signal; and (b) a ground plate 24 held in the case body 20 and extending between the antenna plate 22 and the wiring board 14. The ground plate 24 has extending portions 24a, 24b extending to the outside from the case body 20. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to a composite electronic component and a fixing structure thereof, and more particularly to a composite electronic component incorporating an antenna element and a fixing structure thereof.

  Conventionally, composite electronic components incorporating antenna elements that can be used in the millimeter wave and quasi-millimeter wave regions have been provided.

  For example, the composite electronic component (semiconductor module) including the antenna element shown in (1) top view and (2) cross-sectional view of FIG. 19 includes an antenna element 105 used for millimeter wave or quasi-millimeter wave, and a frequency conversion circuit. The semiconductor integrated circuits 106 and 107 constituting the amplifier circuit are formed on the upper surface of the wiring substrate 101, and these are hermetically sealed by the sealing cover 112.

  The antenna element 105 is a planar antenna such as a patch antenna or a slot antenna, and an antenna plate is formed on the dielectric substrate 104. The frequency conversion circuit and the amplification circuit are constituted by semiconductor integrated circuits 106 and 107 formed on a GaAs semiconductor substrate. The wiring substrate 101 is a substrate of a good conductor material such as a copper plate, and the size thereof is 25 mm × 50 mm. An electromagnetic wave transmission window 102 of an antenna is formed on the sealing cover 112. The sealing cover 112 has a part of the region facing the antenna element 105 formed of a non-conductive member and the other region formed of a conductive member. Simultaneously with the electromagnetic shield for the frequency conversion circuit and the amplification circuit It is possible to reliably radiate radio waves from the antenna element 105 to the outside of the apparatus.

  The antenna element 105 is formed on the dielectric substrate 104 so as to face the electromagnetic wave transmission window 102 of the sealing cover 112. Although the size of the dielectric substrate 104 is more than several times the patch size of the antenna plate of the antenna element 105, the size of the dielectric substrate 104 is naturally larger than the size of the composite electronic component incorporating the antenna element 105. Limited.

  An IF signal introduction terminal 110 and a power supply introduction terminal 111 are provided on the back surface of the wiring board 101. Bias power is supplied to the semiconductor integrated circuits 106 and 107 through the power introduction terminal 111, respectively.

The wiring board 101 is formed with a screw through hole 108 for attaching the composite electronic component to another device. (For example, refer to Patent Document 1).
JP-A-10-79623

  In recent years, there has been an increasing demand for downsizing and cost reduction of devices in multimedia wireless communication systems that require large-capacity communication. Multimedia communication in various environments is possible by using a semiconductor module incorporating an antenna element corresponding to a miniaturized device as a subsystem of a multimedia wireless communication system that requires large-capacity communication.

  However, the composite electronic component incorporating the conventional antenna element shown in FIG. 19 has the following problems.

  (1) Since the antenna element, the frequency conversion circuit, and the amplifier circuit are formed on the same wiring board, it is difficult to reduce the size and cost of the wiring board.

  (2) The antenna element is formed on a dielectric substrate. Since the size of the dielectric substrate is more than several times the patch size of the antenna plate, the overall size of the composite electronic component incorporating the antenna element is limited, and it is difficult to reduce the size.

  (3) Since the antenna element, the frequency conversion circuit, and the amplification circuit are formed on the same wiring board, it is necessary to provide an electromagnetic shielding plate that prevents electromagnetic mutual interference occurring between the antenna element and the frequency conversion circuit and the amplification circuit. There is. As a result, the arrangement of the wiring circuit is restricted, and the degree of design freedom cannot be increased.

  (4) With respect to the sealing cover, in order to reliably radiate radio waves from the antenna element to the outside of the apparatus, it is necessary to make a partial region facing the antenna element non-conductive. In addition, it is necessary to form an electromagnetic wave transmission window in that region. The other regions need to be conductive for electromagnetic shielding against the frequency conversion circuit and the amplification circuit. For this reason, the structure of the sealing cover becomes complicated, which requires man-hours for manufacturing and is expensive.

  (5) Since the antenna element formed on the wiring board and the frequency conversion circuit and the amplifier circuit are hermetically sealed, it is necessary to manufacture a man-hour for hermetic sealing and a cover for hermetic sealing. The cost is high.

  In view of such a situation, the present invention is intended to provide a composite electronic component, a fixing structure thereof, and an antenna device that can be reduced in size with a simple configuration without deterioration of antenna characteristics.

  In order to solve the above-described problems, the present invention provides a composite electronic component configured as follows.

  The composite electronic component includes a wiring board having a surface-mounted electronic component mounted on at least one main surface, and a case that is bonded to the one main surface of the wiring board and covers the surface-mounted electronic component. The case includes: (a) an antenna plate that is held by the case body and extends along the wiring board, and transmits and / or receives a radio signal; and (b) the antenna body that is held by the case body. A ground plate extending between the board and the wiring board. The ground plate has an extending portion that extends outward from the case body.

  In the above configuration, the antenna plate and the ground plate may be exposed from the case body or may be disposed inside the case body.

  According to the above configuration, the ground plate sufficiently covers the antenna plate by the extended portion protruding from the case main body, so that the antenna due to electromagnetic mutual interference between the surface mount type electronic component mounted on the wiring board and the antenna. The deterioration of characteristics can be effectively prevented.

  According to the above configuration, the antenna characteristics can be prevented from deteriorating even if the composite electronic component is downsized. In addition, the size can be reduced with a simple configuration, and surface mount electronic components can be freely arranged on the wiring board.

  Preferably, at least one positioning portion for positioning the composite electronic component on the housing member is formed in the extended portion of the ground plate.

  In the above configuration, the positioning portion can be easily formed by processing a through hole, a notch, a bent portion, or the like in the extended portion of the ground plate.

  According to the above configuration, the composite electronic component can be easily and accurately positioned with respect to the housing member by the positioning portion even if the composite electronic component is downsized.

  Preferably, the case body is made of resin.

  In this case, the dielectric constant of the resin can be adjusted by the amount of additive of the resin, so that downsizing can be realized.

  Preferably, the antenna plate and the ground plate are integrally formed with the resin case body by a resin mold.

  In this case, since it can be integrally formed with the case body while accurately maintaining the distance between the antenna plate and the ground plate, variations in antenna characteristics can be eliminated.

  Preferably, the case body is provided with a power supply terminal for supplying power to the wiring board.

  In this case, the case and the wiring board can be joined by joining the power supply terminal on the case side to the wiring board. With a simple configuration, it is possible to connect the power supply terminal and the external power supply, and it is easy to prevent excessive force such as thermal stress from acting on the composite electronic component due to the restriction by the connection of the power supply terminal. is there.

  Moreover, in order to solve the said subject, this invention provides the fixing structure of the composite electronic component comprised as follows.

  The composite component fixing structure positions a composite electronic component including a wiring board on which a surface-mounted electronic component is mounted and a case joined to the wiring board so as to cover the surface-mounted electronic component on a housing member. This is a structure for fixing a composite electronic component. The case of the composite electronic component is (a) an antenna plate that is held by the case body, extends along the wiring board, and transmits and / or receives a radio signal; and (b) the case body. A ground plate that is held and extends between the antenna plate and the wiring board and has an extending portion that extends outward from the case body. The composite electronic component is positioned on the housing member through the extended portion of the ground plate.

  In the above configuration, the antenna plate and the ground plate may be exposed from the case body or may be disposed inside the case body.

  The positioning of the composite electronic component can be performed, for example, by bringing the outer edge of the extended portion of the ground plate into contact with a predetermined portion of the housing member. An appropriate positioning portion such as a notch for positioning or a bent portion may be provided in the extended portion of the ground plate, and a pin may be engaged with such a positioning portion.

  According to the above configuration, by providing the extended portion on the ground plate, the antenna characteristics can be prevented from deteriorating even if the composite electronic component is downsized.

  Preferably, a positioning hole is provided in the extended portion of the ground plate of the composite electronic component, and a positioning pin provided in the housing member is fitted into the positioning hole, so that the composite electronic component is Positioned on the housing member.

  In this case, accurate positioning can be performed with a simple configuration.

  Moreover, in order to solve the said subject, this invention provides the antenna apparatus comprised as follows.

  The antenna device is of a type including a holding member, an antenna plate member held along the surface of the holding member, and a ground plate held by the holding member in parallel with the antenna plate. The ground plate has an extending portion that extends outward from the holding member.

  In the above configuration, the antenna plate and the ground plate may be exposed from the holding member or may be disposed inside the holding member.

  According to the above configuration, the antenna characteristics can be prevented from deteriorating even if the composite electronic component is downsized.

  According to the composite electronic component, the fixing structure thereof, and the antenna device of the present invention, it is possible to reduce the size with a simple configuration without deterioration of the antenna characteristics.

  Hereinafter, embodiments of the present invention will be described with reference to FIGS.

  Example 1 A composite electronic component of Example 1 of the present invention will be described with reference to FIGS.

  As shown in the sectional view of FIG. 1, the composite electronic component 10 has a case 12 bonded to one main surface (upper surface in the drawing) 14 a of a wiring board 14.

  The wiring board 14 is a printed wiring board, a flexible printed wiring board, an alumina substrate, a single layer or a multilayer ceramic substrate, or the like. On one main surface 14a of the wiring board 14, a conductive pattern is formed, die-bonded, or an IC chip 72 including a Si semiconductor substrate or GaAs semiconductor substrate wire-bonded by a wire 74 such as Au, Al, Cu, etc., a capacitor And chip components 70 such as inductors are mounted. A sealing material 76 is filled around the IC chip 72 so as to cover the IC chip 72. The sealing material 76 protects the IC chip 72 and the wire 74 from an environment such as mechanical destruction or heat or moisture.

  When there is no wire bond mounting on one main surface 14a of the wiring board 14, that is, when only IC flip-chip mounting by surface mounting components, Au or solder bumps, underfill between the surface mounting components and the wiring substrate 14 is performed. Regardless of the presence or absence of resin, the sealing material 76 is not required.

  The wiring board 14 has a chip component 60 and an IC chip 62 mounted on the other main surface 14 b opposite to the case 12. As shown in the cross-sectional view of FIG. 2, a metal case 16 is joined to the other main surface 14b of the wiring board 14 as necessary. The metal case 16 is particularly for electromagnetic shielding when used for high frequency.

  When the electromagnetic shield is unnecessary, as shown in the cross-sectional view of FIG. 3, the other main surface 14b of the wiring board 14 is coated with a thermosetting resin such as an epoxy resin so as to cover the surface mount type electronic components 60 and 62. 17 is applied or transfer molded to flatten the bottom surface 18.

  As shown in FIG. 1, the case 12 includes an antenna plate 22 for transmitting and / or receiving radio signals, a ground plate 24, a power supply terminal 26, and the like integrally with the case body 20 using a mold resin. Molded.

  4, the antenna plate 22 extends in a direction parallel to the main surface of the wiring board 14 and is disposed on the upper surface 20a of the case body 20, Exposed outside.

  As shown in FIGS. 1 and 4, the ground plate 24 is disposed below the antenna plate 22, penetrates the inside of the case body 20, and extends to the outside from the case body 20. 24b. That is, the extended portions 24 a and 24 b protrude from the case body 20. The extending portions 24a and 24b are formed with through holes 25 for positioning when the composite electronic component 10 is attached to another device.

  Further, as shown in FIG. 4, the power supply terminal 28 protrudes from the case main body 20 between the extended portions 24 a on the left side of the ground plate 24. The power feeding terminal 28 is disposed with a gap from the antenna plate 22 and is capacitively coupled to the antenna plate 22.

  Under the ground plate 24, as shown in FIGS. 1 and 4, two power supply terminals 26 protrude from the case body 20. The power supply terminal 26 is connected to the power supply terminal when the composite electronic component 10 is attached to another device.

  As shown in the bottom view of FIG. 6 and the perspective view of the bottom surface of FIG. 7, a recess 21 is formed in the center of the case body 20, and the ground plate 24 and the power supply terminal 26 are formed on the bottom surface 20 b of the case body 20. The connection terminals 24s and 26s that are electrically connected to each other are exposed.

  The connection terminals 24s and 26s are electrically connected to a conductive pattern (not shown) formed on the one main surface 14a of the wiring board 14 via solder or a conductive adhesive. The wiring board 14 is joined.

  As shown in FIG. 1, the ground plate 24 molded in the case body 20 is between the antenna plate 22, the wiring board 14, and the power supply terminal 26. It is possible to prevent electromagnetic mutual interference occurring between the frequency conversion circuit and the amplifier circuit formed on the substrate 14 side and the influence of the electromagnetic wave of the power supply terminal 26.

  When the case 12 is molded, the plate members 30, 40, and 50 punched into the shapes shown in the plan views of FIGS. 8 to 10 are placed in the mold, and after being bent into an appropriate shape, the gold Resin is filled in the cavity in the mold. Each of the plate members 30, 40, 50 is formed by punching a metal plate such as bronze, white, or Ni alloy with a die and bending it. 8 to 10 show shapes after punching and before bending.

  Each plate member 30, 40, 50 is arranged in a state of being positioned with a pin in the mold, and is thermosetting such as injection molding of thermoplastic resin such as LCP (liquid crystal polymer) or PPS (polyphenylene sulfide), or epoxy resin. The case 12 is resin-molded by transfer molding of the conductive resin. FIG. 13 shows a cross section other than the mold at the time of molding.

  In the first plate member 30 shown in FIG. 8, a through hole 32 for inserting a positioning pin is formed in the frame portion, and the antenna plate 22 (FIG. 1, FIG. 4, see FIG. 5).

  The second plate member 40 shown in FIG. 9 has a through hole 42 through which a positioning pin is inserted in the frame portion. The power supply terminal 26 (FIGS. 1, 4, and 5) is formed inside the frame portion. 5) and connection terminals 26s (see FIGS. 6 and 7) and the like are formed. Of these, the distal end portion 48 is bent as shown in the cross-sectional view of FIG. 13 to form the connection terminal 26s. Both sides 46 of the proximal end portion 44 are bent to form the power supply terminal 26 having a U-shaped cross section (substantially U-shaped) as shown in FIGS.

  As for the 3rd board member 50 shown in FIG. 10, the through-hole 52 for inserting a positioning pin is formed in the frame part. On the inner side of the frame portion, the ground plate 24 corresponds to the position of the portion 36 (see FIG. 8) that becomes the antenna plate 22 (see FIGS. 1, 4, and 5) of the first plate member 30 indicated by a chain line. A portion 54 to be (see FIGS. 1, 4, and 5) and a portion 58 to be a power supply terminal 28 (see FIGS. 1, 4, and 5) are formed. A through hole 25 for positioning the composite electronic component 10 is formed in the portion 54 to be the ground plate 24. A portion 56 continuing to the portion 54 to be the ground plate 24 is bent as shown in FIG. 13 to form a connection terminal 24s.

  The connection terminals 24 s and 26 s of the second and third plate members 40 and 50 and the portions that continue to the connection terminals 24 s and 26 s are bent by plastic working and formed so as to be easily elastically deformed in three directions of X, Y, and Z. .

  The thickness of the second and third plate members 40 and 50 is preferably 50 to 300 μm. If the thickness is less than 50 μm, the variation at the time of bending increases, and the variation in the position and height of each terminal formed by bending increases. If the terminal positions vary and the alignment accuracy between the case 12 and the wiring board 14 is poor, the margin of the bonding pad size on the wiring board 14 side must be increased, and the wiring board 14 can be downsized and eventually the composite electronic component 10 Reduces size reduction. If the height varies, for example, the thickness of solder between the wiring board 14 and the case 12 varies, and the bonding reliability is impaired. In addition, if the design is performed with a large variation in height, a reduction in the height of the composite electronic component 10 is hindered. When the composite electronic component 10 is attached to another device using the extended portions 24a and 24b of the ground plate 24 and the power supply terminal 26, if the thickness of the plate members 40 and 50 is less than 50 μm, the mechanical holding force is insufficient. To do. The bent portions of the second and third plate members 40 and 50 are repeatedly subjected to fatigue due to thermal stress and impact stress. However, if the thickness is thin, fatigue failure is liable to occur and joint reliability is impaired. If the thickness of the plate members 40 and 50 exceeds 300 μm, the bending process becomes difficult.

  Since the second and third plate members 40, 50 have portions to be connection terminals 24s, 26s, Ni / Sn, Ni / Ni / Sn, and Ni / Sn are provided in order to improve the bondability with the conductive pattern (not shown) of the wiring board 14. Plating such as Au, Ni / solder is performed. This is to improve the wettability with the solder and conductive adhesive used for joining the wiring substrate 14 and the case 12. If necessary, partial plating of only the entire surfaces of the portions 48 and 56 (see FIGS. 9 and 10) to be the connection terminals 24 s and 26 s or only the joint surfaces that are bent and exposed from the case body 20 may be selected. .

  The composite electronic component 10 is attached to a housing member 80 of another device as schematically shown in the cross-sectional view of FIG. The housing member 80 is provided with a power terminal 82 and positioning pins 84. The composite electronic component 10 is positioned with respect to the housing member 80 by fitting the positioning pins 84 into the positioning through holes 25 formed in the extending portions 24 a and 24 b of the ground plate 24. At the same time, the power supply terminal 26 of the composite electronic component 10 is connected to the power supply terminal 82 of the housing member 80, and power is supplied to the composite electronic component 10 from the housing member 80 side. As a result, bias power is supplied to components and antennas mounted on both sides of the wiring board of the composite electronic component 10.

  Specifically, as shown in the perspective view of the main part of FIG. 11, the power supply terminal 26 having a U-shaped cross section (substantially U-shaped) of the composite electronic component 10, as indicated by an arrow 88, is connected to the power terminal 82 of the housing member 80. The power supply terminal 26 is electrically connected to the power supply terminal 82 by inserting the tip of the power supply terminal 26 and sandwiching the power supply terminal 26 by the power supply terminal 82.

  Even if the shape of the power supply terminal is rectangular (plate-like) like the power supply terminal 26a shown in the perspective view of the main part in FIG. 12A, the power supply terminal shown in the perspective view of the main part in FIG. It may be a round shape (round bar shape) with a circular cross section like the supply terminal 26b.

  In such a joining method by insertion, since soldering is not performed, insertion and removal is easy, and parts are easily replaced. In addition, since there is a clearance at the joint portion due to friction, the influence of thermal fatigue due to the heat cycle is small and the joint reliability is high as compared with the solder joint that firmly restrains the joint portion.

  Next, the manufacturing procedure of the composite electronic component will be described with reference to the process diagram of FIG.

  First, the wiring board 14 and the case 12 are manufactured separately.

  As described above, the case 12 integrally molds the case body 20 together with the antenna plate 22, the ground plate 24, the power supply terminal 26, the power supply terminal 28, the connection terminals 24s and 26s, etc. by molding.

  As for the wiring board 14, as shown in FIG. 15A, a conductive paste containing solder or Ag is printed on one main surface 14a of the wiring board 14, and a surface mount electronic component 70 is mounted thereon. Reflow or heat cure. The surface mount type electronic component 70 is electrically connected to a conductive pattern (not shown) formed on the one main surface 14a of the wiring board 14 by a solder or conductive paste as a conductor.

  Next, the one main surface 14a of the wiring substrate 14 is washed, and the dirt of the wire bond pad formed on the one main surface 14a of the wiring substrate 14 is removed. This is to improve the bondability with the wire 74 (see FIG. 15B).

  Next, as shown in FIG. 15B, an IC chip 72 including a Si semiconductor substrate or a GaAs semiconductor substrate is mounted on one main surface 14a of the wiring substrate 14 with an epoxy resin or a conductive resin and thermally cured. The electrode terminals of the IC chip 72 and the wire bond pads formed on the one main surface 14a of the wiring substrate 14 are joined by wires 74 such as Au, Al, and Cu, and are electrically connected. The wire bond pad is preferably plated with Ni / Au or Ni / Pd / Au in order to increase the bonding strength.

  Next, as shown in FIG. 15C, the sealing material 76 made of an epoxy resin is filled around the IC chip 72 and thermally cured.

  Next, as shown in FIG. 15 (d), a conductive adhesive or solder is applied to one main surface 14 a of the wiring board 14, and a case 12 is mounted on this, and reflow or thermosetting is performed. At the same time as bonding the substrate 14, it is electrically connected.

  Next, as shown in FIG. 15 (e), the surface mounting electronic component 60 is mounted by inverting the top and bottom and printing a conductive paste containing solder or Ag on the other main surface 14 b of the wiring substrate 14. . Further, the IC chip 64 with solder bumps or the like is flip-chip mounted and reflowed or thermally cured. If necessary, an underfill resin 67 made of an epoxy resin is filled between the IC chip 64 and the wiring board 14 that are flip-chip mounted, and is thermally cured.

  Next, as shown in FIG. 15 (f), a metal case 16 made of white or phosphor bronze is mounted and joined to the other main surface 14 b of the wiring board 14 or the side surface of the wiring board 14 as necessary.

  The process of mounting and joining the metal case 16 may be performed simultaneously with the process of mounting the surface mount type electronic components 60 and 64 on the other main surface 14b of the wiring board 14 shown in FIG. For example, the surface mount electronic components 60 and 64 and the metal case 16 may be bonded simultaneously by reflow or thermosetting.

  Thus, the composite electronic component is completed.

  The composite electronic component of Example 1 has the following operations and effects.

  (1) The antenna plate is formed on the case, and electronic components such as a semiconductor chip are mounted on the wiring board. Since the antenna element, the frequency conversion circuit, and the amplifier circuit are not arranged on the same plane of the wiring board, the wiring board can be reduced in size and cost.

  (2) Since the semiconductor chip and the surface mount type electronic component can be mounted on both surfaces of the wiring board, the wiring board can be reduced in size and price.

  (3) The antenna plate is formed on the case. The size of the antenna plate is determined by the dielectric constant of the resin that is the case material. The dielectric constant can be adjusted by the additive amount of the resin. Therefore, the size of the dielectric substrate that occurs when the conventional antenna is formed on the dielectric wiring substrate is not several times larger than that of the antenna element, and downsizing can be realized. Further, the conventional sealing cover on the antenna element is unnecessary, and radio waves can be radiated efficiently, reliably and easily to the outside of the apparatus.

  (4) Since the antenna element, the frequency conversion circuit, and the amplification circuit are not formed on the same plane of the wiring board, an electromagnetic shielding plate that prevents electromagnetic mutual interference occurring between the antenna element, the frequency conversion circuit, and the amplification circuit is provided. There is no need to provide it. Thereby, there is no restriction | limiting in the arrangement | positioning of the wiring circuit on a wiring board, and the freedom degree of design can be taken widely. Since the ground plate molded in the case is placed under the antenna plate, the antenna characteristics are affected by electromagnetic interference generated between the antenna element, the frequency conversion circuit and the amplification circuit, and the electromagnetic wave generated from the power supply terminal. Deterioration can be prevented.

  (5) Since the antenna plate, the ground plate, the power supply terminal, and the connection terminal can be made integrally with the case by processing the metal plate and resin molding, the process is simplified and can be easily and inexpensively produced. it can.

  (6) Since the semiconductor chip mounted on the wiring substrate is sealed with resin, it can be manufactured more easily and at a lower cost than conventional hermetic sealing.

  (7) The plate member including the ground plate is bent so as to be connected to the wiring board, and therefore cannot be thickened. Since the ground plate is thin, the ground plate hits somewhere when the housing is inserted, and it is easy to bend. However, by forming a through hole in the extended part of the ground plate and inserting a positioning pin standing on the housing member side into this through hole, the ground plate can be placed accurately and easily at a predetermined mounting position. Even if the putter is thinned, deformation and deterioration of antenna characteristics can be prevented.

  (8) By fitting the positioning pin into the through hole formed in the extended portion of the ground plate, the composite electronic component can be supported by the positioning pin, and the load on the power supply terminal can be reduced.

  (9) By fitting the positioning pin into the through hole of the ground plate, the composite electronic component can be floated from the housing member. Thereby, the composite electronic component can be made hard to break by preventing the composite electronic component from hitting the housing member due to external vibration and impact.

  (10) The case and the wiring board are basically joined by a bent metal terminal. That is, the elastic deformation of the metal absorbs stress and improves the strength. Therefore, there is a high degree of freedom in selecting the metal terminal material. Further, the molding resin and the metal terminal do not need to be firmly joined. That is, the degree of freedom of the resin material is high. Inexpensive materials, easy-to-bend materials, and easy-to-mold materials can be selected and are industrially useful.

  <Example 2> A composite electronic component of Example 2 of the present invention will be described with reference to FIGS.

  As shown in the cross-sectional view of FIG. 16, the composite electronic component 10x of the second embodiment is configured in substantially the same manner as the composite electronic component 10 of the first embodiment, and the case 12x and the wiring board 14x are joined. In the following, the same reference numerals are used for the same components, and differences will be mainly described.

  Unlike the first embodiment, the composite electronic component 10x according to the second embodiment is configured to supply power from the wiring board 14x side. That is, in the case 12x, the antenna plate 22 and the ground plate 24 are arranged on the case main body 20, but the power supply terminal is not arranged. As shown in the plane of FIG. 17, the wiring board 14x joined to the case 12x is larger than the case 12x, and a through hole 15 is formed in a portion extending to the outside of the case 12x.

  As shown in the enlarged cross-sectional view of the main part of FIG. 18, the wiring board 14x is fixed to the housing member 81 of another apparatus by inserting and screwing a metal screw 86 into the through hole 15 of the wiring board 14x. At the same time, the conductor 85 formed in the housing member 81 and the conductor 27 formed in the periphery of the through hole 15 of the wiring board 14x are pressed together to electrically connect the wiring board 14x and the housing member 81. In order to electrically connect between the conductor 27 around the through hole 15 and a predetermined position where the component is mounted on the wiring board 14x, the wiring board 14x is not shown on the front or back surface of the wiring board 14x or inside the wiring board 14x. There is no conductive pattern.

  In order to electrically connect with the housing member 81 while ensuring electrical insulation, the wiring board 14x is preferably made of resin.

  The composite electronic component 10x according to the second embodiment has the following functions and effects in addition to the same functions and effects as those of the first embodiment.

  (1) Since the wiring board and the housing members of other devices are mechanically connected and held by screwing, the bonding strength is less affected by thermal fatigue due to heat cycles compared to solder bonding, and the reliability of the bonding The nature is high.

  (2) Since the power supply line can be formed on the wiring board and the line length can be designed short, the influence of the inductor component can be reduced and the antenna characteristics can be improved.

  (3) Since the wiring board also functions as a power supply terminal, the power supply terminal is unnecessary, the configuration is simplified, and the manufacturing cost can be reduced.

  (4) The screw serves as both a mechanical connection and an electrical connection to the housing member, and there is no need for soldering, so that the manufacturing cost can be reduced.

  <Summary> The composite electronic component described above can be reduced in size with a simple configuration without deterioration of antenna characteristics.

  The present invention is not limited to the above-described embodiment, and can be implemented with various modifications.

  For example, surface-mount type electronic components may be mounted only on one main surface of the wiring board.

  The antenna plate may be held by the case main body as a whole, and there may be a portion separated from the case main body without being arranged on the surface or inside of the case main body. For example, only the periphery of the antenna plate may be held by the side surface portion of the case body, and the center portion of the antenna plate may be lifted from the case body.

  Further, the antenna plate may extend along the wiring board while being curved or non-parallel (for example, in an oblique direction) to the wiring board. For example, a case body having a semicircular or hemispherical cross section arc shape is joined to a flat wiring board, and an antenna plate having a semicircular or hemispherical cross section arc shape is disposed on the outer surface of the case body. The curved antenna plate may extend along the flat wiring board. In this case, the ground plate disposed between the antenna plate and the wiring board is parallel to the wiring board and the curved portion extending in a semi-cylindrical shape or hemispherical concentric with the antenna plate in parallel with the antenna board. It is preferable to include an extending portion that extends outward from the case body.

  The antenna plate and the ground plate may be formed using a material other than a metal plate member. For example, the antenna plate or the ground plate may be formed using a resin sheet or the like having a metal film or metal foil formed on the surface or inside.

It is sectional drawing of a composite electronic component. Example 1 It is sectional drawing of a composite electronic component. (Modification 1) It is sectional drawing of a composite electronic component. (Modification 2) It is a top view of a composite electronic component. Example 1 It is a perspective view which sees the upper surface of a composite electronic component. Example 1 It is a bottom view of a composite electronic component. Example 1 It is a perspective view which looks at the bottom of a composite electronic component. Example 1 It is a top view of a plate member. Example 1 It is a top view of a plate member. Example 1 It is a top view of a plate member. Example 1 It is a perspective view which shows a terminal connection structure. Example 1 It is a perspective view which shows a terminal connection structure. (Modifications 3 and 4) It is sectional drawing at the time of mold forming. Example 1 It is sectional drawing which shows the attachment structure of a composite electronic component. Example 1 It is a manufacturing process figure of a composite electronic component. Example 1 It is sectional drawing of a composite electronic component. (Example 2) It is a top view of a composite electronic component. (Example 2) It is principal part sectional drawing which shows the attachment structure of a composite electronic component. (Example 2) It is (1) top view and (2) sectional drawing of a composite electronic component. (Conventional example)

Explanation of symbols

10, 10x Composite electronic parts 12, 12x Case 14, 14x Wiring board 20 Case body 22 Antenna plate 24 Ground plate 24a, 24b Extension part 24s Connection terminal 25 Through hole (positioning part)
26 Power supply terminal 26s Connection terminal 28 Power supply terminal 60 Chip component (surface mount electronic component)
62, 64 IC chip (Surface-mount type electronic components)
70 Chip components (surface mount electronic components)
72 IC chip (surface mount electronic component)
80 Housing member 82 Power supply terminal

Claims (8)

A composite electronic component comprising: a wiring board having a surface-mounted electronic component mounted on at least one main surface; and a case that is bonded to the one main surface of the wiring substrate and covers the surface-mounted electronic component. ,
The case is
An antenna plate that is held by the case body, extends along the wiring board, and transmits and / or receives a radio signal;
A ground plate that is held by the case body and extends between the antenna plate and the wiring board;
Including
The composite electronic component according to claim 1, wherein the ground plate has an extending portion that extends outward from the case body.   2. The composite electronic component according to claim 1, wherein at least one positioning portion for positioning the composite electronic component on a housing member is formed in the extended portion of the ground plate. 3.   The composite electronic component according to claim 1, wherein the case main body is made of a resin.   The composite electronic component according to claim 3, wherein the antenna plate and the ground plate are integrally formed with the case body made of resin by a resin mold.   The composite electronic component according to claim 1, wherein a power supply terminal for supplying power to the wiring board is provided on the case body. Fixing a composite electronic component that positions a composite electronic component comprising a wiring board on which a surface mount electronic component is mounted and a case joined to the wiring substrate so as to cover the surface mount electronic component on a housing member Structure,
The case of the composite electronic component is
An antenna plate that is held by the case body, extends along the wiring board, and transmits and / or receives a radio signal;
A ground plate that is held by the case body, extends between the antenna plate and the wiring board, and has an extending portion that extends outward from the case body;
Including
The composite electronic component fixing structure, wherein the composite electronic component is positioned on the housing member through the extended portion of the ground plate.   A positioning hole is provided in the extended portion of the ground plate of the composite electronic component, and a positioning pin provided in the housing member is fitted into the positioning hole, so that the composite electronic component is connected to the housing member. The composite electronic component fixing structure according to claim 6, wherein the composite electronic component fixing structure is positioned at a position. In the antenna device, comprising: a holding member; an antenna plate held along the surface of the holding member; and a ground plate held by the holding member in parallel with the antenna plate.
The antenna device according to claim 1, wherein the ground plate has an extending portion that extends outward from the holding member.

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