JPH0315815B2 - - Google Patents
Info
- Publication number
- JPH0315815B2 JPH0315815B2 JP59101059A JP10105984A JPH0315815B2 JP H0315815 B2 JPH0315815 B2 JP H0315815B2 JP 59101059 A JP59101059 A JP 59101059A JP 10105984 A JP10105984 A JP 10105984A JP H0315815 B2 JPH0315815 B2 JP H0315815B2
- Authority
- JP
- Japan
- Prior art keywords
- pair
- lead wires
- bottomed
- resin case
- capacitor element
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000003990 capacitor Substances 0.000 claims description 44
- 239000011347 resin Substances 0.000 claims description 27
- 229920005989 resin Polymers 0.000 claims description 27
- 229910052782 aluminium Inorganic materials 0.000 claims description 24
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 24
- 239000011888 foil Substances 0.000 description 9
- 229910052751 metal Inorganic materials 0.000 description 7
- 239000002184 metal Substances 0.000 description 7
- 230000006866 deterioration Effects 0.000 description 5
- 238000005452 bending Methods 0.000 description 3
- 239000003792 electrolyte Substances 0.000 description 3
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 3
- 238000007788 roughening Methods 0.000 description 3
- 238000007789 sealing Methods 0.000 description 3
- 238000002048 anodisation reaction Methods 0.000 description 1
- 238000007743 anodising Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 239000003566 sealing material Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
- 238000004804 winding Methods 0.000 description 1
Description
【発明の詳細な説明】
産業上の利用分野
本発明はフエースボンデイングタイプのアルミ
電解コンデンサに関する。DETAILED DESCRIPTION OF THE INVENTION Field of Industrial Application The present invention relates to a face bonding type aluminum electrolytic capacitor.
従来例の構成とその問題点
従来のこの種のいわゆるフエースボンデイング
タイプのチツプ形アルミ電解コンデンサは第１図
ａ，ｂに示すように構成されていた。すなわち、
アルミニウム箔を粗面化し、さらに陽極酸化によ
り誘電体酸化皮膜を形成した陽極箔と、アルミニ
ウム箔を粗面化して形成した陰極箔とをセパレー
タを介して巻回し、駆動用電解液を含浸させてコ
ンデンサ素子１を構成し、このコンデンサ素子１
を有底円筒状の金属ケース２内に収納するととも
に、金属ケース２の開放端をゴムなどの弾性を有
する封口材３を用いて封口してアルミ電解コンデ
ンサを構成し、そして前記アルミ電解コンデンサ
から引き出されているリード線４をゴム状端子５
に溶接などの方法により電気的、機械的に接続
し、さらにゴム状端子５を除く全体にモールド樹
脂外装６を施して完成品としていた。Conventional Structure and its Problems Conventional chip-type aluminum electrolytic capacitors of this type, so-called face bonding type, were constructed as shown in FIGS. 1a and 1b. That is,
An anode foil made by roughening aluminum foil and forming a dielectric oxide film through anodization, and a cathode foil made by roughening aluminum foil are wound through a separator and impregnated with a driving electrolyte. This capacitor element 1 constitutes a capacitor element 1.
is housed in a bottomed cylindrical metal case 2, and the open end of the metal case 2 is sealed using an elastic sealing material 3 such as rubber to form an aluminum electrolytic capacitor. Connect the lead wire 4 that has been pulled out to the rubber terminal 5.
The terminals were electrically and mechanically connected by methods such as welding, and then a molded resin sheath 6 was applied to the entire body except for the rubber terminals 5 to produce a completed product.
このようなチツプ形アルミ電解コンデンサは、
プリント基板への実装に際して、半田耐熱性をも
たせるために、前述したようにモールド樹脂外装
６を施しているが、一般にモールド樹脂外装６で
は、100℃〜150℃の温度で、５分間程度10Kg／cm3
の圧力で加圧しており、このような過酷な条件下
では、電解コンデンサの駆動用電解液が蒸散し
て、静電容量の減少やtanδの増大などの特性劣化
をきたし、またモールド樹脂外装６を施している
ため、極めて高価なものになるという問題点を有
していた。 This type of chip-type aluminum electrolytic capacitor is
When mounting on a printed circuit board, the molded resin exterior 6 is applied as described above in order to provide solder heat resistance.Generally, the molded resin exterior 6 is heated at a temperature of 100℃ to 150℃ for about 10kg/5 minutes. cm3
Under such harsh conditions, the driving electrolyte of the electrolytic capacitor evaporates, causing characteristic deterioration such as a decrease in capacitance and an increase in tanδ, and the molded resin exterior 6 However, the problem is that it is extremely expensive.
発明の目的
本発明はこのような従来の欠点を除去するもの
で、特性劣化のない、安価なフエースボンデイン
グタイプのアルミ電解コンデンサを提供すること
を目的とするものである。OBJECTS OF THE INVENTION The present invention aims to eliminate these conventional drawbacks, and provides an inexpensive face bonding type aluminum electrolytic capacitor that does not suffer from characteristic deterioration.
発明の構成
上記目的を達成するために本発明は、コンデン
サ素子をケース内に収納することにより構成さ
れ、かつ前記コンデンサ素子に接続した一対のリ
ード線を同一端面より引き出してなるコンデンサ
本体と、このコンデンサ本体の一対のリード線を
引き出した端面に内底部が当接するように配設さ
れ、かつ前記一対のリード線が貫通する貫通孔を
有底部に設けた有底筒状で、かつ外形が角形の樹
脂ケースとで構成し、前記有底筒状の樹脂ケース
の有底部側の外表面に、有底部の一部を残した形
で前記貫通孔につながる一対の凹部を設け、かつ
この一対の凹部は、有底筒状の樹脂ケースの側部
の外表面にも連続して設け、前記貫通孔を貫通し
た一対のリード線の先端部を有底部側から側部に
かけて設けた一対の凹部内に完全に収まるように
折曲したものである。Structure of the Invention In order to achieve the above object, the present invention provides a capacitor body which is constructed by housing a capacitor element in a case, and in which a pair of lead wires connected to the capacitor element are drawn out from the same end face; The capacitor body is arranged so that the inner bottom part is in contact with the end face from which the pair of lead wires are pulled out, and the bottomed part is provided with a through hole through which the pair of lead wires are drawn out, and the outer shape is square. A pair of recesses connected to the through hole are provided on the outer surface of the bottomed cylindrical resin case on the bottomed side side, with a part of the bottomed part remaining, and The recess is also provided continuously on the outer surface of the side part of the bottomed cylindrical resin case, and the tips of the pair of lead wires passing through the through hole are inserted into the pair of recesses provided from the bottomed part side to the side part. It is bent so that it fits perfectly.
上記した構成とすることにより、一対のリード
線の先端部は、有底筒状の樹脂ケースの有底部側
から側部にかけて設けた一対の凹部内に完全に収
納されるため、有底筒状の樹脂ケースのプリント
基板に当接する面においては凸部が全くない状
態、つまり、一対のリード線が有底筒状の樹脂ケ
ースの外表面とほぼ面一の状態となり、その結
果、自動実装機によりアルミ電解コンデンサをプ
リント基板に実装する場合においては、アルミ電
解コンデンサをプリント基板に装着したときの傾
きやぐらつきなどは全くないため、安定した実装
化が可能となるとともに、アルミ電解コンデンサ
を自動実装機によりつかんでプリント基板に装着
する場合の位置決めも確実に行うことができる。 With the above configuration, the tips of the pair of lead wires are completely housed in the pair of recesses provided from the bottom side to the side of the bottomed cylindrical resin case. The surface of the resin case that comes into contact with the printed circuit board has no protrusions at all, in other words, the pair of lead wires is almost flush with the outer surface of the bottomed cylindrical resin case, and as a result, the automatic mounting machine When mounting an aluminum electrolytic capacitor on a printed circuit board, there is no tilting or wobbling when the aluminum electrolytic capacitor is mounted on the printed circuit board, so stable mounting is possible, and the aluminum electrolytic capacitor can be mounted automatically. Positioning can also be performed reliably when the device is gripped by a machine and attached to a printed circuit board.
また前記有底筒状の樹脂ケースの有底部側の外
表面に設けた一対の凹部は、有底部の一部を残し
た形で、一対のリード線が貫通する貫通孔につな
がるように設けているため、一対のリード線を折
り曲げ加工する場合においては、前記残された有
底部の一部で、折り曲げ時における機械的応力は
支えられることになり、その結果、一対のリード
線からコンデンサ素子に直接加わる機械的応力を
低減させることができるため、アルミ電解コンデ
ンサの特性劣化も極めて少なくすることができも
のである。 Further, the pair of recesses provided on the outer surface of the bottomed part side of the bottomed cylindrical resin case are provided so as to connect to the through holes through which the pair of lead wires pass, leaving a part of the bottomed part. Therefore, when a pair of lead wires is bent, the mechanical stress at the time of bending is supported by the remaining bottomed portion, and as a result, the mechanical stress from the pair of lead wires to the capacitor element is supported. Since the directly applied mechanical stress can be reduced, deterioration of the characteristics of the aluminum electrolytic capacitor can also be extremely reduced.
実施例の説明
以下、本発明の一実施例を第２図および第３図
ａ，ｂの図面を用いて説明する。なお、図中、第
１図と同一部品については同一番号を付してい
る。DESCRIPTION OF EMBODIMENTS An embodiment of the present invention will be described below with reference to FIG. 2 and FIGS. 3a and 3b. In addition, in the figure, the same parts as in FIG. 1 are given the same numbers.
図において、１は従来と同様なコンデンサ素子
で、このコンデンサ素子１は高純度アルミニウム
箔を電気化学的に粗面化し、その後陽極酸化を行
つて誘電体酸化皮膜を形成してなる陽極箔と、粗
面化した陰極アルミニウム箔とを間に絶縁紙を介
して巻回し、そしてその巻回物に駆動用電解液を
含浸させることにより構成されている。このコン
デンサ素子１は有底円筒状の金属ケース２内に収
納されている。また、前記コンデンサ素子１の陽
極箔と陰極箔には一対のリード線４が接続されて
いる。 In the figure, 1 is a capacitor element similar to the conventional one, and this capacitor element 1 includes an anode foil made by electrochemically roughening a high-purity aluminum foil and then anodizing it to form a dielectric oxide film. It is constructed by winding a roughened cathode aluminum foil with an insulating paper in between, and impregnating the wound material with a driving electrolyte. This capacitor element 1 is housed in a cylindrical metal case 2 with a bottom. Further, a pair of lead wires 4 are connected to the anode foil and the cathode foil of the capacitor element 1.
そして、前記金属ケース２の開放端には、弾性
体よりなる封口部材３を装着し、絞り加工を施す
ことにより、金属ケース２の開放端を封口してい
る。また前記コンデンサ素子１を接続した一対の
リード線４は、封口部材３を貫通して同一端面よ
り外部に引き出されている。 A sealing member 3 made of an elastic body is attached to the open end of the metal case 2, and the open end of the metal case 2 is sealed by drawing. Further, a pair of lead wires 4 connecting the capacitor element 1 pass through the sealing member 3 and are drawn out from the same end surface.
８はコンデンサ素子１を金属ケース２内に収納
すること等により構成されたアルミ電解コンデン
サ本体を収納する有底筒状の樹脂ケースで、この
樹脂ケース８の内面は円形状に構成され、かつ外
形は角形に構成されている。そしてこの樹脂ケー
ス８は、アルミ電解コンデンサ本体の一対のリー
ド線４を引き出した端面に内底部が当接するよう
に配設されており、またこの樹脂ケース８の有底
部には、前記一対のリード線４が貫通する貫通孔
８ａを設け、さらにこの有底部側の外表面には、
有底部の一部を残した形で前記貫通孔８ａにつな
がる一対の凹部８ｂを設け、そしてこの一対の凹
部８ｂは有底筒状の樹脂ケース８の側部の外表面
にも連続して設けている。前記貫通孔８ａを貫通
した一対のリード線４の先端部４ａは、有底部か
ら側部にかけて設けた一対の凹部８ａ内に完全に
収まるように折曲されている。また前記丸棒より
なる一対のリード線４の先端部４ａは、第４図ａ
に示すように偏平加工したもので良く、あるいは
第４図ｂに示すように丸棒のリード線のままの状
態であつても良いものである。 Reference numeral 8 denotes a bottomed cylindrical resin case that houses an aluminum electrolytic capacitor body constructed by housing the capacitor element 1 in a metal case 2, etc. The resin case 8 has a circular inner surface and an outer shape. is structured in a rectangular shape. The resin case 8 is arranged so that the inner bottom part is in contact with the end surface from which the pair of lead wires 4 of the aluminum electrolytic capacitor body are pulled out, and the bottomed part of the resin case 8 is provided with the pair of leads 4. A through hole 8a is provided through which the wire 4 passes, and the outer surface of the bottomed portion side is provided with a through hole 8a.
A pair of recesses 8b connected to the through hole 8a are provided with a portion of the bottomed portion remaining, and the pair of recesses 8b are also provided continuously on the outer surface of the side portion of the bottomed cylindrical resin case 8. ing. The tip portions 4a of the pair of lead wires 4 passing through the through holes 8a are bent so as to be completely accommodated in a pair of recesses 8a provided from the bottomed portion to the side portions. Further, the tip portions 4a of the pair of lead wires 4 made of the round rods are as shown in Fig. 4a.
The lead wire may be flattened as shown in FIG. 4, or it may be a round bar lead wire as shown in FIG. 4b.
発明の効果
以上のように本発明のアルミ電解コンデンサ
は、コンデンサ本体の一対のリード線を引き出し
た端面に内底部が当接するように配設され、かつ
前記一対のリード線が貫通する貫通孔を有底部に
設けた有底筒状で、かつ外形が角形の樹脂ケース
を備え、この樹脂ケースの有底部側の外表面に、
有底部の一部を残した形で前記貫通孔につながる
一対の凹部を設け、かつこの一対の凹部は、有底
筒状の樹脂ケースの側部の外表面にも連続して設
け、前記貫通孔を貫通した一対のリード線の先端
部を有底部から側部にかけて設けた一対の凹部内
に完全に収まるように折曲しているため、有底筒
状の樹脂ケースのプリント基板に当接する面にお
いては凸部が全くない状態、つまり、一対のリー
ド線が有底筒状の樹脂ケースの外表面とほぼ面一
の状態となり、その結果、自動実装機によりアル
ミ電解コンデンサをプリント基板に実装する場合
においては、アルミ電解コンデンサをプリント基
板に装着したときの傾きやぐらつきなどは全くな
いため、安定した実装化が可能となるとともに、
アルミ電解コンデンサを自動実装機によりつかん
でプリント基板に装着する場合の位置決めも確実
に行うことができる。Effects of the Invention As described above, the aluminum electrolytic capacitor of the present invention is arranged such that the inner bottom part is in contact with the end face from which the pair of lead wires are drawn out from the capacitor body, and has a through hole through which the pair of lead wires pass. A resin case is provided in the bottomed part and has a cylindrical shape with a square outer shape, and on the outer surface of the resin case on the bottomed part side,
A pair of recesses connected to the through hole are provided with a portion of the bottomed portion remaining, and the pair of recesses are also provided continuously on the outer surface of the side portion of the bottomed cylindrical resin case, so that the through hole is connected to the through hole. The tips of the pair of lead wires that passed through the hole are bent so that they fit completely into the pair of recesses provided from the bottomed part to the side, so they come into contact with the printed circuit board of the bottomed cylindrical resin case. There are no protrusions on the surface, in other words, the pair of lead wires are almost flush with the outer surface of the bottomed cylindrical resin case, and as a result, the aluminum electrolytic capacitor can be mounted on the printed circuit board using an automatic mounting machine. When mounting an aluminum electrolytic capacitor on a printed circuit board, there is no tilting or wobbling, making stable mounting possible.
It is also possible to securely position an aluminum electrolytic capacitor when it is gripped by an automatic mounting machine and mounted on a printed circuit board.
また前記有底筒状の樹脂ケースの有底部側の外
表面に設けた一対の凹部は、有底部の一部を残し
た形で、一対のリード線が貫通する貫通孔につな
がるように設けているため、一対のリード線折り
曲げ加工する場合においては、前記残された有底
部の一部で、折り曲げ時における機械的応力は支
えられることになり、その結果、一対のリード線
からコンデンサ素子に直接加わる機械的応力を低
減させることができるため、アルミ電解コンデン
サの特性劣化も極めて少なくすることができる。 Further, the pair of recesses provided on the outer surface of the bottomed part side of the bottomed cylindrical resin case are provided so as to connect to the through holes through which the pair of lead wires pass, leaving a part of the bottomed part. Therefore, when bending a pair of lead wires, the mechanical stress at the time of bending is supported by the remaining bottomed part, and as a result, the mechanical stress from the pair of lead wires is directly connected to the capacitor element. Since the applied mechanical stress can be reduced, deterioration of the characteristics of the aluminum electrolytic capacitor can also be extremely reduced.
さらに従来のようにモールド樹脂外装を行つて
いないため、特性劣化のないアルミ電解コンデン
サを安価に製造することができるものである。 Furthermore, since the capacitor is not covered with a molded resin as in the conventional case, an aluminum electrolytic capacitor with no deterioration in characteristics can be manufactured at low cost.
第１図ａ，ｂは従来のチツプ形アルミ電解コン
デンサを示す断面図と側面図、第２図は本発明の
一実施例によるフエースボンデイングタイプのチ
ツプ形アルミ電解コンデンサを示す斜視図、第３
図ａ，ｂは本発明の一実施例を示す底面図とＡ−
A′断面図、第４図ａ，ｂは本発明の一実施例に
よるリード形状を示す斜視図である。
１……コンデンサ素子、２……金属ケース、３
……封口部材、４……一対のリード線、８……有
底筒状の樹脂ケース、８ａ……貫通孔、８ｂ……
一対の凹部。
1a and 1b are cross-sectional views and side views showing a conventional chip-type aluminum electrolytic capacitor, FIG. 2 is a perspective view showing a face-bonding type chip-type aluminum electrolytic capacitor according to an embodiment of the present invention, and FIG.
Figures a and b are a bottom view showing one embodiment of the present invention, and Figures A-
A' sectional view and FIGS. 4a and 4b are perspective views showing a lead shape according to an embodiment of the present invention. 1...Capacitor element, 2...Metal case, 3
...Sealing member, 4...Pair of lead wires, 8...Bottomed cylindrical resin case, 8a...Through hole, 8b...
A pair of recesses.
Claims (1)
より構成され、かつ前記コンデンサ素子に接続し
た一対のリード線を同一端面より引き出してなる
コンデンサ本体と、このコンデンサ本体の一対の
リード線を引き出した端面に内底部が当接するよ
うに配設され、かつ前記一対のリード線が貫通す
る貫通孔を有底部に設けた有底筒状で、かつ外形
が角形の樹脂ケースとで構成し、前記有底筒状の
樹脂ケースの有底部側の外表面に、有底部の一部
を残した形で前記貫通孔につながる一対の凹部を
設け、かつこの一対の凹部は、有底筒状の樹脂ケ
ースの側部の外表面にも連続して設け、前記貫通
孔を貫通した一対のリード線の先端部を有底部側
から側部にかけて設けた一対の凹部内に完全に収
まるように折曲したことをことを特徴とするアル
ミ電解コンデンサ。1 A capacitor body constructed by housing a capacitor element in a case and having a pair of lead wires connected to the capacitor element drawn out from the same end face, and a capacitor body formed by housing the capacitor element in a case and having a pair of lead wires connected to the capacitor element drawn out from the same end face. and a resin case having a bottomed cylindrical shape and a rectangular outer shape, the resin case having a bottomed cylindrical shape and having a through hole through which the pair of lead wires pass through, the bottomed cylindrical A pair of recesses connected to the through hole are provided on the outer surface of the bottomed side of the resin case, leaving a part of the bottomed part, and the pair of recesses are connected to the side of the bottomed cylindrical resin case. The lead wires are bent so that the tips of the pair of lead wires passing through the through hole are completely fitted into the pair of recesses provided from the bottomed part side to the side part. Features of aluminum electrolytic capacitors.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10105984A JPS60245116A (en) | 1984-05-18 | 1984-05-18 | Electronic part |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10105984A JPS60245116A (en) | 1984-05-18 | 1984-05-18 | Electronic part |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS60245116A JPS60245116A (en) | 1985-12-04 |
| JPH0315815B2 true JPH0315815B2 (en) | 1991-03-04 |
Family
ID=14290538
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10105984A Granted JPS60245116A (en) | 1984-05-18 | 1984-05-18 | Electronic part |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS60245116A (en) |
Families Citing this family (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2720390B2 (en) * | 1988-04-15 | 1998-03-04 | 日本ケミコン株式会社 | Chip type capacitors |
| US4972299A (en) * | 1987-12-09 | 1990-11-20 | Nippon Chemi-Con Corporation | Chip type capacitor and manufacturing thereof |
| EP0332411B1 (en) * | 1988-03-07 | 1994-05-25 | Nippon Chemi-Con Corporation | Chip type capacitor and manufacturing thereof |
| JP2829858B2 (en) * | 1988-04-01 | 1998-12-02 | 日本ケミコン株式会社 | Chip type capacitor and manufacturing method thereof |
| JP2653024B2 (en) * | 1988-05-17 | 1997-09-10 | 日本ケミコン株式会社 | Continuum of chip type capacitors |
| JP2673989B2 (en) * | 1988-05-17 | 1997-11-05 | 日本ケミコン株式会社 | Manufacturing method of chip type capacitor |
| JPH0268913A (en) * | 1988-09-02 | 1990-03-08 | Matsushita Electric Ind Co Ltd | Chip type electrolytic capacitor |
| JPH02267920A (en) * | 1989-04-07 | 1990-11-01 | Matsushita Electric Ind Co Ltd | Chip type electrolytic capacitor |
| DE60144181D1 (en) * | 2000-02-03 | 2011-04-21 | Panasonic Corp | Chip capacitor with sheath |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5540517B2 (en) * | 1974-12-24 | 1980-10-18 |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS593557Y2 (en) * | 1978-09-05 | 1984-01-31 | 日本ケミコン株式会社 | chip capacitor |
| JPS6083232U (en) * | 1983-11-15 | 1985-06-08 | エルナ−株式会社 | chip parts |
-
1984
- 1984-05-18 JP JP10105984A patent/JPS60245116A/en active Granted
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5540517B2 (en) * | 1974-12-24 | 1980-10-18 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS60245116A (en) | 1985-12-04 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPH0314221B2 (en) | ||
| JPH0315815B2 (en) | ||
| JPH0310220B2 (en) | ||
| JPH034020Y2 (en) | ||
| JPS6357937B2 (en) | ||
| JPH0424845B2 (en) | ||
| JP2606297B2 (en) | Electronic components | |
| JPH0544813B2 (en) | ||
| JPH0419695B2 (en) | ||
| JPH0459767B2 (en) | ||
| JPH0328505Y2 (en) | ||
| JPH0328504Y2 (en) | ||
| JPH0244135B2 (en) | CHITSUPUGATAARUMIDENKAIKONDENSA | |
| JPH0466375B2 (en) | ||
| JPH0311538B2 (en) | ||
| JPS60245117A (en) | Electronic part | |
| JPH0251247B2 (en) | ||
| JPH0368530B2 (en) | ||
| JPH0249530B2 (en) | DENSHIBUHIN | |
| JPS60170930A (en) | Electronic part | |
| JPS60245105A (en) | Electronic part | |
| JPH0256806B2 (en) | ||
| JPH01175221A (en) | Chip-type aluminum electrolytic capacitor | |
| JPH0257696B2 (en) | ||
| JPS62226615A (en) | Electronic parts |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| EXPY | Cancellation because of completion of term |