JPH0328504Y2 - - Google Patents

Description

[Detailed Description of the Invention] [Technical Field of the Invention] The present invention relates to a chip-type aluminum electrolytic capacitor.

[Technical background of the invention and its problems] In recent years, as the trend toward smaller and lighter electronic devices has increased, there has been a remarkable progress in the use of chips in various electronic components, and small-capacity aluminum electrolytic capacitors are no exception. Various leadless chip-type aluminum electrolytic capacitors have been proposed and are now at the stage of full-scale practical use. Among the various chip-type aluminum electrolytic capacitors that have been proposed, one that has attracted attention is one disclosed in Japanese Patent Laid-Open No. 170926/1983.

The technology disclosed in the publication includes, as shown in FIGS. 10 and 11, a capacitor element 11 impregnated with a driving electrolyte, a metal case 12 housing the element 11, and a lead wire led out from the element 11. 13 from the same end surface, and a recess 15 connected to the through hole 14 on the outer surface.
and a sealing member 16 provided with the sealing member 1.
A part of the wire 6 is stored in the opening of the case 12 and sealed, and then the tip of the lead wire 13 that has passed through the through hole 14 is left as a round rod or is flattened and fits in the recess 15. The bent portion serves as the bonding portion to the substrate.
As shown in FIG. 12, the chip-type aluminum electrolytic capacitor having the above structure consists of a wound-type capacitor element 19 impregnated with a driving electrolyte.
is stored in a metal case 20, and the open end is sealed with a sealing material 21.
The lead wire 22 drawn out from an aluminum electrolytic capacitor sealed and configured with a comb-shaped terminal is connected to a comb-shaped terminal 23, and the entire body except the comb-shaped terminal is covered with a molded resin exterior 24. Because it is not exposed to harsh conditions such as high temperature and high pressure during operation, there is no characteristic deterioration such as a decrease in capacitance or an increase in tanδ due to evaporation of the driving electrolyte, and there is no problem of increased costs associated with molded resin exterior. Furthermore, it can be said to be a suitable structure that can contribute to miniaturization to the maximum extent. However, since the lead wire 13 has a very thin diameter of 0.45 to 0.8 mm, the through hole 1 provided in the sealing member 16
It is a difficult task to flatten the tip of the lead wire 13 that has passed through the lead wire 13. Moreover, the flattened wall thickness becomes thinner and is susceptible to mechanical stress, so it is difficult to flatten the tip end of the lead wire 13. At the same time, there is a risk that the lead wire 13 may be cut off from the part 13a, and even if the lead wire 13 is flattened, the adhesive area with the board will not be that large and there will be a problem with the adhesive strength.
If it is made by bending it as a round bar, there is no risk of cutting it, but the contact with the board is in a line contact state, so even with this structure, there are concerns about the adhesive strength, and in any case, this is an issue that needs to be solved in practical terms. I was holding on to something.

[Purpose of the invention] The present invention was made in view of the above points, and its purpose is to provide an inexpensive chip-type aluminum electrolytic capacitor that is easy to work with and can ensure stable attachment to a circuit board. be.

[Summary of the invention] The chip-type aluminum electrolytic capacitor of the invention includes a cylindrical metal case with a bottom, a capacitor element housed in the case, a lead wire led out from the element, and a part of the metal case inserted into the opening of the metal case. A pair of metal terminal surfaces are integrally molded on the sealed outer surface of the housing, and a sealing member is provided in which a lead wire fitting groove and a through hole for passing the lead wire are provided at one end of the fitting groove. A tip end portion of the lead wire passing through the through hole is bent and fitted into the lead wire fitting groove.

[Embodiment of the invention] An embodiment of the invention will be described below with reference to the drawings. That is, as shown in FIGS. 1 and 2, a capacitor element 1 formed by winding an anode foil and a cathode foil with a spacer interposed therebetween and impregnating the drive electrolyte is placed inside a bottomed cylindrical metal case 2. As shown in FIGS. 3 and 4, a pair of metal terminal surfaces 3 and 4 are integrally formed on one outer surface of the opening of the metal case 2, and lead wires are attached to the metal terminal surfaces 3 and 4. A fitting groove 5 and an elastic sealing member 7 provided with a through hole 6 at one end of the lead wire fitting groove 5 are attached to the metal terminal surfaces 3 and 4.
The opening of the metal case 2 is sealed, the lead wire 8 led out from the capacitor element 1 is passed through the through hole 6, the tip of the lead wire 8 is bent, and the lead wire 8 is closed. It fits into the wire fitting groove 5, and the metal terminal surfaces 3 and 4 serve as adhesive portions to the board.

According to the chip-type aluminum electrolytic capacitor constructed as described above, since the bonding surface structure with the substrate is the metal terminal surfaces 3 and 4 which are integrally molded in advance with the sealing member 7, the lead wire 8 used is Regardless of the thickness, a sufficient adhesive area can be secured and excellent adhesive strength can be obtained. In addition, the connection between the metal terminal surfaces 3 and 4 and the lead wire 8 is made by bending the lead wire 8 that has passed through the through hole 6 in a round bar shape and inserting the tip into the lead wire fitting groove 5 provided on the metal terminal surfaces 3 and 4. Because of the fitting structure, there is no danger of the lead wire 8 being cut due to bending, and moreover, a reliable connection between the lead wire 8 and the metal terminal surfaces 3 and 4 can be obtained without using any special means. Furthermore, even if there is any concern about the electrical connection between the lead wire 8 and the metal terminal surfaces 3, 4, the structure allows the connection between the lead wire 8 and the metal terminal surfaces 3, 4 to be the bonded portion to the board, so that it is difficult to bond. The two are electrically connected reliably through the solder used for this purpose, and there are no problems such as insufficient contact with the board. In addition, the structure is such that the lead wire 8 is fitted into the lead wire fitting groove 5. Therefore, the lead wire 8 has many advantages such as being able to secure a stable attachment state to the board without protruding from the metal terminal surfaces 3 and 4 which are the bonding surfaces of the board.

In addition, in the above embodiment, a pair of metal terminal surfaces 3, 4 are used as the structure of the metal terminal surfaces 3, 4 constituting the sealing member 7.
4 are arranged in a straight line, but as shown in FIG.
Of course, it can be applied to a structure in which the metal terminal surfaces 3 and 4 are arranged in parallel, or in which the positions of the pair of metal terminal surfaces 3 and 4 are appropriately changed as shown in FIGS. 6 to 8. Other parts in FIGS. 5 to 8 are given the same numbers as in FIG. 3, and their explanations are omitted.

Further, in the above embodiment, an elastic body is used as the sealing member 7, but as shown in FIG. good. Note that other parts in FIG. 9 are given the same numbers as in the above embodiment, and explanations thereof are omitted.

[Effects of the invention] According to the invention, it is possible to obtain a chip-type aluminum electrolytic capacitor of high practical value, which is easy to work with, has no risk of lead wire breakage, and can ensure stable attachment to the board.

[Brief explanation of the drawing]

Figures 1 to 4 relate to one embodiment of the present invention, and Figures 1 and 2 show a chip-type aluminum electrolytic capacitor, with Figure 1 being a perspective view and Figure 2 being a perspective view.
The figure is a partially sectional front view, and Figure 3 is the same as Figures 1 and 2.
A perspective view of the insulating plate constituting the figure, Figure 4 is Figure 3A
-A sectional view, FIGS. 5 to 8 are perspective views showing insulating plates according to other embodiments, FIG. 9 is a perspective view showing a sealing member according to another embodiment, and FIGS. 10 and 11. The figures show a chip-type aluminum electrolytic capacitor according to a conventional example, and FIG. 10 is a perspective view, FIG. 11 is a partially sectional front view, and FIG. 12 is a chip-type aluminum electrolytic capacitor according to another conventional example. be. 1... Capacitor element, 2... Metal case,
3, 4...Metal terminal surface, 5...Lead wire fitting groove,
6... Through hole, 7... Sealing member, 8... Lead wire.

Claims (1)

[Scope of utility model registration request] A cylindrical metal case with a bottom, a capacitor element housed in the case, a lead wire led out from the element, and a pair of metal terminal surfaces are integrally formed on the sealed outer surface of the case, which is partially housed in the opening of the case. The terminal surface is provided with a lead wire fitting groove and a sealing member provided with a through hole at one end of the fitting groove, and the lead wire tip portion passing through the through hole is bent and inserted into the lead wire fitting groove. A chip-type aluminum electrolytic capacitor characterized by mating.