JPH0325395Y2 - - Google Patents

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Publication number
JPH0325395Y2
JPH0325395Y2 JP1384486U JP1384486U JPH0325395Y2 JP H0325395 Y2 JPH0325395 Y2 JP H0325395Y2 JP 1384486 U JP1384486 U JP 1384486U JP 1384486 U JP1384486 U JP 1384486U JP H0325395 Y2 JPH0325395 Y2 JP H0325395Y2
Authority
JP
Japan
Prior art keywords
lead wire
capacitor
pair
recess
aluminum electrolytic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP1384486U
Other languages
Japanese (ja)
Other versions
JPS62126823U (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1384486U priority Critical patent/JPH0325395Y2/ja
Publication of JPS62126823U publication Critical patent/JPS62126823U/ja
Application granted granted Critical
Publication of JPH0325395Y2 publication Critical patent/JPH0325395Y2/ja
Expired legal-status Critical Current

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Description

【考案の詳細な説明】 〔考案の技術分野〕 本考案はチツプ型アルミニウム電解コンデンサ
に関する。
[Detailed Description of the Invention] [Technical Field of the Invention] The present invention relates to a chip-type aluminum electrolytic capacitor.

〔考案の技術的背景とその問題点〕[Technical background of the invention and its problems]

近年、電子機器の小形・軽量化指向が強まるな
かで各種電子部品におけるチツプ化の進展はめざ
ましいものがあり、小容量アルミニウム電解コン
デンサにおいても例外でなく、リードレス化した
チツプ型アルミニウム電解コンデンサが各種提案
され、本格的な実用化の段階を迎えている。しか
して、種々提案されているチツプ型アルミニウム
電解コンデンサの中で従来最も注目をあつめてい
る構造は特開昭59−211213号公報、特開昭59−
214216号公報および特開昭59−219922号公報など
に開示されているものである。
In recent years, as electronic devices have become increasingly compact and lightweight, there has been remarkable progress in chipping various electronic components, and small-capacity aluminum electrolytic capacitors are no exception; leadless chip-type aluminum electrolytic capacitors are now available in various types. It has been proposed and is now at the stage of full-scale practical application. Among the various chip-type aluminum electrolytic capacitors that have been proposed, the structure that has attracted the most attention so far is disclosed in Japanese Patent Application Laid-Open No. 59-211213;
This is disclosed in JP-A No. 214216 and Japanese Patent Application Laid-Open No. 59-219922.

上記公報に開示されている技術は、例えば第5
図および第6図に示すように駆動用電解液を含浸
したコンデンサ素子21を金属ケース22内に収
納し、前記素子21に接続したリード線23を前
記ケース22開口端を封口する封口部材24をと
おして引出してなるコンデンサ本体25と、該コ
ンデンサ本体25のリード線23を引出した端面
に当接して配設し、かつ前記リード線23が貫通
する貫通孔26と外表面に前記貫通孔26につな
がる凹部27を設けた絶縁板28とで構成し、前
記貫通孔26を貫通した前記リード線23の先端
部を丸棒のまままたは偏平加工を施し前記凹部2
7内に納まるよう折曲げて折曲げ部分を基板との
接着部としてなるものである。しかして、上記構
成になるチツプ型アルミニウム電解コンデンサ
は、第8図に示すように駆動用電解液を含浸して
なる巻回型のコンデンサ素子29を金属ケース3
0に収納し、開口端を封口材31にて封口した構
成したアルミニウム電解コンデンサから引出され
たリード線32をコム状端子33に接続し、該コ
ム状端子33を除く全体にモールド樹脂外装34
を施してなるものと比較して、モールド樹脂外装
時における高温,高圧の過酷な条件下にさらされ
ないため、駆動用電解液の蒸散による静電容量の
減少やtanδの増大などの特性劣化がなく、またモ
ールド樹脂外装にともなうコストアツプの問題も
なく、さらに小形化に最大限貢献できる構造とし
て好適なものと言える。しかしながら、前記絶縁
板28を構成する貫通孔26は第7図に示すよう
に一般に断面形状が丸形であり、また基板との接
着安定性を考慮し、リード線23の先端を絶縁板
28貫通前に偏平加工を行うのが一般的であるこ
とから、前記貫通孔26はリード線23直径の約
2倍の大きさとなり、貫通孔26とリード線23
の嵌合度としては相当ゆるいものとなる。したが
つて、リード線23の偏平部を貫通孔26に貫通
し偏平部を折曲げる際、偏平部の方向が定まらず
折曲げ部分が凹部27内に納まらず、該凹部27
からはみ出た状態で折曲げられる欠点を有し、こ
の場合リード線23の折曲げ部分が絶縁板28の
外表面から突出した状態となり基板に載せたとき
安定性が悪く倒れる危険性を有し実用上不都合な
問題をかかえていた。
The technology disclosed in the above publication is, for example, the 5th publication.
As shown in the figures and FIG. 6, a capacitor element 21 impregnated with a driving electrolyte is housed in a metal case 22, and a sealing member 24 for sealing the open end of the case 22 is connected to a lead wire 23 connected to the element 21. A capacitor main body 25 is drawn out through the capacitor main body 25, a through hole 26 is disposed in contact with the end surface from which the lead wire 23 of the capacitor main body 25 is drawn out, and a through hole 26 through which the lead wire 23 passes, and a through hole 26 is formed on the outer surface of the capacitor main body 25. and an insulating plate 28 provided with a connecting recess 27, and the tip of the lead wire 23 passing through the through hole 26 is left as a round rod or is flattened to form the recess 2.
7, and the bent portion serves as an adhesive portion to the substrate. As shown in FIG. 8, the chip-type aluminum electrolytic capacitor having the above structure has a wound-type capacitor element 29 impregnated with a driving electrolyte and placed in a metal case.
A lead wire 32 pulled out from an aluminum electrolytic capacitor, which is housed in a comb-shaped terminal 33 and whose opening end is sealed with a sealing material 31, is connected to a comb-shaped terminal 33, and the entire body except the comb-shaped terminal 33 is covered with a molded resin exterior 34.
Compared to products that are coated with molded resin, they are not exposed to the harsh conditions of high temperature and high pressure during the molded resin exterior, so there is no deterioration in characteristics such as a decrease in capacitance or an increase in tanδ due to evaporation of the drive electrolyte. Furthermore, there is no problem of increased costs associated with molded resin exterior packaging, and it can be said to be suitable as a structure that can contribute to miniaturization to the maximum extent. However, the through hole 26 constituting the insulating plate 28 generally has a round cross-sectional shape as shown in FIG. Since it is common to perform flattening beforehand, the through hole 26 is approximately twice the diameter of the lead wire 23, and the through hole 26 and the lead wire 23 are
The degree of fit is quite loose. Therefore, when the flat part of the lead wire 23 is passed through the through hole 26 and the flat part is bent, the direction of the flat part is not determined and the bent part does not fit into the recess 27 .
In this case, the bent portion of the lead wire 23 protrudes from the outer surface of the insulating plate 28, resulting in poor stability and the risk of it falling over when placed on the board, making it unsuitable for practical use. I had an extremely inconvenient problem.

〔考案の目的〕[Purpose of invention]

本考案は上記の点に鑑みてなされたもので、作
業性容易にして基板に対する安定した取付状態を
確保できる安価なチツプ型アルミニウム電解コン
デンサを提供することを目的とするものである。
The present invention has been devised in view of the above points, and it is an object of the present invention to provide an inexpensive chip-type aluminum electrolytic capacitor that is easy to work with and can ensure stable attachment to a circuit board.

〔考案の概要〕[Summary of the idea]

本考案のチツプ型アルミニウム電解コンデンサ
は、有底筒状の金属ケースと、該ケース内に収納
したコンデンサ素子と、該素子から導出した一対
のリード線と、該リード線を貫通させ前記ケース
開口端を封口した封口体と、前記一対のリード線
先端部に形成した偏平部からなるコンデンサ本体
と、該コンデンサ本体の前記リード線引出面に当
接して配置した断面形状が前記リード線引出面側
で丸形、外表面側で長形とした一対のリード線貫
通孔と、外表面に該一対の貫通孔につなげて設け
た凹部とからなる絶縁板とを具備し、前記貫通孔
それぞれを貫通した前記一対のリード線の偏平部
を折曲げ前記凹部内に納めたことを特徴とするも
のである。
The chip-type aluminum electrolytic capacitor of the present invention includes a bottomed cylindrical metal case, a capacitor element housed in the case, a pair of lead wires led out from the element, and a pair of lead wires extending through the case opening end. a capacitor body comprising a sealing body sealed with a capacitor body, a flat part formed at the tip of the pair of lead wires, and a cross-sectional shape of the capacitor body arranged in contact with the lead wire extraction surface on the lead wire extraction surface side; It is equipped with an insulating plate consisting of a pair of lead wire through holes that are round and elongated on the outer surface side, and a recess provided on the outer surface to connect to the pair of through holes, and a recess that extends through each of the through holes. The device is characterized in that the flat portions of the pair of lead wires are bent and housed in the recess.

〔考案の実施例〕[Example of idea]

以下、本考案の一実施例につき図面を参照して
説明する。すなわち、第1図および第2図に示す
ように、陽極箔と陰極箔との間にスペーサを介し
て巻回し駆動用電解液を含浸してなるコンデンサ
素子1を有底筒状の金属ケース2内に収納し前記
コンデンサ素子1に接続した一対のリード線3を
開口端を封口した封口体4を貫通して引出し、前
記一対のリード線3先端部に偏平部5を形成して
なるコンデンサ本体6のリード線3引出端面に第
3図および第4図に示すように一方面側で長形
7、他方面側で丸形8とし略中央部に段部9を設
けたリード線貫通孔10と、該リード線貫通孔1
0の長形7となる一方面側に該長形7につながり
該長形7の幅B方向に延びた凹部11を設けた絶
縁板12の前記凹部11を設けた面を外側にして
当接し、前記一対のリード線3を前記貫通孔10
それぞれに貫通し、前記一対のリード線3先端部
の偏平部5をそれぞれ反対方向に折曲げて前記凹
部11内に納めてなるものである。
Hereinafter, one embodiment of the present invention will be described with reference to the drawings. That is, as shown in FIGS. 1 and 2, a capacitor element 1 formed by winding an anode foil and a cathode foil with a spacer interposed therebetween and impregnating the drive electrolyte is placed in a bottomed cylindrical metal case 2. A pair of lead wires 3 housed in a capacitor element 1 and connected to the capacitor element 1 are drawn out through a sealing body 4 whose open end is sealed, and a flat portion 5 is formed at the tip of the pair of lead wires 3. As shown in FIGS. 3 and 4, the lead wire through hole 10 has a long shape 7 on one side, a round shape 8 on the other side, and a stepped portion 9 approximately in the center on the end surface of the lead wire 3 of 6. and the lead wire through hole 1
An insulating plate 12 having a recess 11 connected to the elongate 7 and extending in the width B direction of the elongate 7 on one side of the elongate 7 of 0 is brought into contact with the surface on which the recess 11 is provided on the outside. , the pair of lead wires 3 are inserted into the through hole 10.
The flat portions 5 at the tips of the pair of lead wires 3 are respectively bent in opposite directions and housed in the recess 11.

以上のように構成してなるチツプ型アルミニウ
ム電解コンデンサによれば、リード線3先端部の
偏平部5が引出される部分の絶縁板12に設けた
リード線貫通孔10形状が長形7となつているた
め偏平部5の方向が長形7にそつて統一した方向
で引出され、しかも該長形7につながり設けた凹
部11は前記長形7の幅B方向に延びた形で形成
されているため、リード線3先端部の偏平部5を
折曲げた場合折曲げた部分が凹部11からはみ出
ることなく、確実に凹部11内に納まるようにな
る。
According to the chip type aluminum electrolytic capacitor constructed as described above, the shape of the lead wire through hole 10 provided in the insulating plate 12 at the portion where the flat portion 5 at the tip of the lead wire 3 is drawn out is elongated. Therefore, the direction of the flat part 5 is pulled out in a uniform direction along the elongate 7, and the recess 11 connected to the elongate 7 is formed to extend in the width B direction of the elongate 7. Therefore, when the flat portion 5 at the tip of the lead wire 3 is bent, the bent portion does not protrude from the recess 11 and is reliably accommodated within the recess 11.

したがつて、リード線3をリード線貫通孔10
に貫通させ引出されたリード線3先端部の偏平部
5の方向を凹部11内に納まるよう方向修正など
のめんどうな作業をともなうことなく、リード線
貫通孔10から引出されたリード線3先端部の偏
平部5をあらかじめ設定した一定方向に単に折曲
げるのみで基板への安定した取付け状態を確保で
きる利点を有する。
Therefore, the lead wire 3 is inserted into the lead wire through hole 10.
The tip of the lead wire 3 pulled out from the lead wire through-hole 10 can be removed without any troublesome work such as direction correction so that the direction of the flat part 5 of the tip of the lead wire 3 that has been passed through the lead wire and pulled out is accommodated in the recess 11. It has the advantage that a stable attachment state to the board can be ensured by simply bending the flat portion 5 of the board in a predetermined direction.

〔考案の効果〕[Effect of idea]

本考案によれば、作業性容易にして基板に対す
る安定した取付状態を確保できる安価で実用的価
値の高いチツプ型アルミニウム電解コンデンサを
得ることができる。
According to the present invention, it is possible to obtain a chip-type aluminum electrolytic capacitor that is inexpensive and of high practical value, which is easy to work with and can ensure a stable mounting state on a board.

【図面の簡単な説明】[Brief explanation of the drawing]

第1図〜第4図は本考案の一実施例に係るもの
で第1図および第2図はチツプ型アルミニウム電
解コンデンサを示すもので第1図は斜視図、第2
図は一部断面正面図、第3図は第1図および第2
図を構成する絶縁板の平面図、第4図は第3図A
−A断面図、第5図および第7図は従来例に係る
チツプ型アルミニウム電解コンデンサを示すもの
で第5図は斜視図、第6図は一部断面正面図、第
7図は第5図および第6図を構成する絶縁板の平
面図、第8図は従来の他の参考例に係るチツプ型
アルミニウム電解コンデンサの正断面図である。 1……コンデンサ素子、2……金属ケース、3
……リード線、4……封口体、5……偏平部、6
……コンデンサ本体、7……長形、8……丸形、
10……リード線貫通孔、11……凹部、12…
…絶縁板。
Figures 1 to 4 relate to one embodiment of the present invention, and Figures 1 and 2 show a chip-type aluminum electrolytic capacitor, with Figure 1 being a perspective view and Figure 2 being a perspective view.
The figure is a partially sectional front view, and Figure 3 is the same as Figures 1 and 2.
A plan view of the insulating plate composing the figure, Figure 4 is Figure 3A.
-A sectional view, FIGS. 5 and 7 show a chip-type aluminum electrolytic capacitor according to a conventional example. FIG. 5 is a perspective view, FIG. 6 is a partially sectional front view, and FIG. 6 is a plan view of an insulating plate constituting the insulating plate, and FIG. 8 is a front sectional view of a chip type aluminum electrolytic capacitor according to another conventional reference example. 1...Capacitor element, 2...Metal case, 3
... Lead wire, 4 ... Sealing body, 5 ... Flat part, 6
...Capacitor body, 7...Long shape, 8...Round shape,
10...Lead wire through hole, 11...Recess, 12...
...Insulating board.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 有底筒状の金属ケースと、該ケース内に収納し
たコンデンサ素子と、該素子から導出した一対の
リード線と、該リード線を貫通させ前記ケース開
口端を封口した封口体と、前記一対のリード線先
端部に形成した偏平部からなるコンデンサ本体
と、該コンデンサ本体の前記リード線引出面に当
接して配置した断面形状が前記リード線引出面側
で丸形、外表面側で長形とした一対のリード線貫
通孔と、外表面に該一対の貫通孔につなげて設け
た凹部とからなる絶縁板とを具備し、前記貫通孔
それぞれを貫通した前記一対のリード線の偏平部
を折曲げ前記凹部内に納めたことを特徴とするチ
ツプ型アルミニウム電解コンデンサ。
A cylindrical metal case with a bottom, a capacitor element housed in the case, a pair of lead wires led out from the element, a sealing body that allows the lead wires to pass through and seals the open end of the case, and the pair of capacitor elements. A capacitor body consisting of a flat part formed at the tip of the lead wire, and a cross-sectional shape of the capacitor body disposed in contact with the lead wire extraction surface are round on the lead wire extraction surface side and elongated on the outer surface side. an insulating plate comprising a pair of lead wire through-holes, and a recess provided on an outer surface of the plate connected to the pair of through-holes; A chip-type aluminum electrolytic capacitor characterized in that it is bent and housed in the recess.
JP1384486U 1986-01-31 1986-01-31 Expired JPH0325395Y2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1384486U JPH0325395Y2 (en) 1986-01-31 1986-01-31

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1384486U JPH0325395Y2 (en) 1986-01-31 1986-01-31

Publications (2)

Publication Number Publication Date
JPS62126823U JPS62126823U (en) 1987-08-12
JPH0325395Y2 true JPH0325395Y2 (en) 1991-06-03

Family

ID=30803283

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1384486U Expired JPH0325395Y2 (en) 1986-01-31 1986-01-31

Country Status (1)

Country Link
JP (1) JPH0325395Y2 (en)

Also Published As

Publication number Publication date
JPS62126823U (en) 1987-08-12

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