JPH0322902Y2 - - Google Patents

Description

[Detailed Description of the Invention] [Technical Field of the Invention] The present invention relates to a chip-type aluminum electrolytic capacitor.

[Technical background of the invention and its problems] In recent years, as the trend toward smaller and lighter electronic devices has increased, there has been a remarkable progress in the use of chips in various electronic components, and small-capacity aluminum electrolytic capacitors are no exception. Various leadless chip-type aluminum electrolytic capacitors have been proposed, and are now at the stage of full-scale commercialization. Among the various chip-type aluminum electrolytic capacitors that have been proposed, the structure that has attracted the most attention so far is disclosed in Japanese Patent Application Laid-Open No. 59-211213;
This is disclosed in JP-A No. 214216 and Japanese Patent Application Laid-Open No. 59-219922.

The technology disclosed in the above publication is, for example, the 9th publication.
As shown in the figures and FIG. 10, a capacitor element 21 impregnated with a driving electrolyte is housed in a metal case 22, and a sealing member 24 for sealing the open end of the case 22 is connected to a lead wire 23 connected to the element 21. A capacitor main body 25 is drawn out through the capacitor main body 25, a through hole 26 is disposed in contact with the end surface from which the lead wire 23 of the capacitor main body 25 is drawn out, and a through hole 26 through which the lead wire 23 passes, and a through hole 26 is formed on the outer surface of the capacitor main body 25. It consists of an insulating plate 28 provided with a connecting recess 27,
The tip end of the lead wire 23 passing through the through hole 26 is left as a round bar or is flattened and bent to fit within the recess 27, with the bent portion serving as a bonding portion to the substrate. As shown in FIG. 11, the chip-type aluminum electrolytic capacitor having the above structure houses a wound-type capacitor element 29 impregnated with a driving electrolyte in a metal case 30, and the open end is sealed with a sealing material. A lead wire 32 drawn out from an aluminum electrolytic capacitor sealed at 31 is connected to a comb-shaped terminal 33, and the entire body except for the comb-shaped terminal 33 is coated with a molded resin exterior 34.
Compared to products that are coated with molded resin, they are not exposed to the harsh conditions of high temperature and high pressure during the molded resin exterior, so there is no characteristic deterioration such as a decrease in capacitance or an increase in tanδ due to evaporation of the driving electrolyte. Furthermore, there is no problem of increased costs associated with molded resin exterior packaging, and it can be said to be suitable as a structure that can contribute to miniaturization to the maximum extent. However, when a chip-type aluminum electrolytic capacitor having such a configuration is attached to a board, as shown in FIG. Even if the bent portion at the tip of the lead wire 23 is flattened in consideration of adhesion stability with the substrate 35, it will only be a one-sided bonded structure via the adhesive 36, and furthermore, it will be flattened. Even so, since the diameter of the lead wire 23 is extremely thin at 0.45 to 0.8 mm, the bonding area with the substrate 35 is not very large, and there are concerns about the bonding strength, making it difficult to obtain a highly reliable bonding strength. Furthermore, in consideration of adhesion stability with the substrate 35, it is common to flatten the tip of the lead wire 23 before penetrating the insulating plate 28.
Through hole 26 provided in insulating plate 28 in a flattened state
It is difficult to make the direction of the flat part constant and to easily accommodate the flat part in the recess 27 when it is bent, and in any case, there are problems that need to be solved practically.

[Purpose of the invention] The present invention has been made in view of the above points, and is a chip-type aluminum electrolytic capacitor that is easy to work with, can ensure stable attachment to the board, and has highly reliable adhesive strength. The purpose is to provide the following.

[Summary of the invention] The chip-type aluminum electrolytic capacitor of the invention includes a bottomed cylindrical metal case, a capacitor element housed in the case, a pair of lead wires led out from the element, and a pair of lead wires extending through the lead wires. A capacitor body consisting of a sealing body with a convex cross section that seals the opening end of the case, and a flat part formed at the tip of the pair of lead wires, and from both side surfaces disposed in contact with the surface of the convex part of the sealing body. The insulating plate includes a groove formed in communication with the outer surface, and a lead wire storage groove formed in a surface that communicates with the groove and comes into contact with the surface of the convex portion. The flat portions of the pair of lead wires pulled out from above are bent and housed in grooves on the outer surface of the insulation plate through grooves on both sides of the insulation plate, thereby integrating the capacitor body and the insulation plate. This is a characteristic feature.

[Embodiment of the invention] An embodiment of the invention will be described below with reference to the drawings. That is, as shown in FIGS. 1 and 2, a capacitor element 1 impregnated with an electrolyte for winding and driving is placed in a bottomed cylindrical metal case 2 with a spacer interposed between an anode foil and a cathode foil. As shown in FIG. 3, the open end of the case 2 is passed through the pair of lead wires 3 connected to the capacitor element 1, sealed with a convex sealing body 4, and the tips of the pair of lead wires 3 are sealed. As shown in FIGS. 4 and 5, grooves 8 are provided on the surface of the convex portion 7 of the convex sealing body 4 of the capacitor body 6 formed with the flat portion 5, communicating from both side surfaces to one surface, an insulating plate 10 provided with a lead wire storage groove 9 that communicates with the groove 8 and is formed on the other side in a straight line;
contact with one surface forming the groove 8 on the outside,
The pair of lead wires 3 are pulled out along each of the lead wire storage grooves 9, and the flat portions 5 at the tips of the pair of lead wires 3 are bent and passed through the grooves 8 located on both sides of the outer surface. Concave groove 8 located at
The capacitor main body 6 and the insulating plate 1 are housed in the
It is formed by integrating 0 and 0.

In the chip-type aluminum electrolytic capacitor constructed as described above, the flat portion 5 formed at the tip of the lead wire 3 extends along both sides of the insulating plate 10 to the outer surface of the insulating plate 10 without penetrating the insulating plate 10. Because of the structure, when attached to the substrate 11 as shown in FIG. The L-sided bonding structure includes the flat portions 5 of the lead wires 3 located on both sides of the insulating plate 10 through the L-sided bonding structure, and it is possible to obtain adhesive strength that is more reliable than the conventional single-sided bonding structure. In addition, a lead wire storage groove 9 is provided in the insulating plate 10, which is the abutting surface of the convex portion 7 of the convex sealing body 4, and the lead wire 3 is pulled out along the lead wire storage groove 9, so that the convex sealing member 4 can be closed. The insulating plate 10 is in surface contact with the capacitor body 4, and the flat part 5 at the tip of the lead wire 3 is accommodated in a groove 8 provided in communication with the outer surface from both sides of the insulating plate 10. 6 and the insulating plate 10 are also fixed in a stable state. Furthermore, the flat part 5 at the tip of the lead wire 3, which is the part to be bonded to the substrate 11, is simply bent, without penetrating the insulating plate 10 as in the conventional structure, so assembly work is easy. have

In the above embodiment, the lead wire storage groove 9 structure provided on the insulating plate 10 is provided in a straight line, and the recessed groove 8 structure provided on the insulating plate 10 is provided on both sides communicating with the lead wire storage groove 9. Although the explanation has been given by exemplifying a case in which the convex portion 7 of the convex sealing body 4 is provided in a straight line so as to communicate from one surface to the other, as shown in FIG.
Lead wire storage grooves 9 are provided in parallel positions on the surface that contacts the surface, and the lead wire storage grooves 9 are formed as shown in FIG.
A pair of insulating plates 10 are provided with concave grooves 8 communicating with each other from both opposing sides communicating with the other surface, or the position of a lead wire storage groove provided in the insulating plate as necessary and the lead wire storage groove. Of course, the present invention can be applied to a structure in which the position of the groove is appropriately changed depending on the position of the groove.

[Effects of the Invention] According to the present invention, it is possible to obtain a chip-type aluminum electrolytic capacitor of high practical value, which is easy to work with and can ensure a stable attachment state to a board.

[Brief explanation of the drawing]

Figures 1 to 6 relate to one embodiment of the present invention, and Figures 1 and 2 show a chip-type aluminum electrolytic capacitor, with Figure 1 being a perspective view and Figure 2 being a perspective view.
The figure is a partially sectional front view, and Figure 3 is the same as Figures 1 and 2.
FIG. 4 is a perspective view of an insulating plate that constitutes FIGS. 1 and 2,
FIG. 5 is a sectional view taken along the line A-A in FIG. 4, FIG. 6 is a partially sectional front view showing the state in which it is attached to a board, and FIGS. 7 and 8 show insulating plates according to other embodiments. 7 is a bottom view, FIG. 8 is a perspective view of the insulating plate shown in FIG. 7, FIGS. 9 and 10 are chip-type aluminum electrolytic capacitors according to conventional examples, and FIG. 9 is a perspective view, Figure 10 is a partially sectional front view,
Figure 1 is a front cross-sectional view of a chip-type aluminum electrolytic capacitor according to another conventional reference example, and Figure 12 is a
FIG. 2 is a partially sectional front view showing a state in which the capacitor shown in FIG. 0 is attached to a substrate. 1...Capacitor element, 2...Metal case, 3
... Lead wire, 4 ... Convex sealing body, 5 ... Flat part, 6 ... Capacitor body, 7 ... Convex part, 8 ...
Concave groove, 9... Lead wire storage groove, 10... Insulating plate.

Claims (1)

[Scope of utility model registration request] A cylindrical metal case with a bottom, a capacitor element housed in the case, a pair of lead wires led out from the element, and a sealing body with a convex cross section that seals the open end of the case through which the lead wires pass. a capacitor body consisting of a flat part formed at the tips of the pair of lead wires; a concave groove provided in communication with the outer surface from both side surfaces disposed in contact with the convex surface of the sealing body; and the concave groove. and an insulating plate comprising a lead wire storage groove provided on a surface that communicates with the convex portion surface and comes into contact with the convex portion surface, and bends the flat portions of the pair of lead wires pulled out along the lead wire storage groove. A chip type aluminum electrolytic capacitor, characterized in that the capacitor body and the insulating plate are integrated by being housed in a groove on the outer surface of the insulating plate via grooves on both sides of the insulating plate.