JPH0319217Y2 - - Google Patents

Description

[Detailed Description of the Invention] [Technical Field of the Invention] The present invention relates to a chip-type aluminum electrolytic capacitor.

[Technical background of the invention and its problems] In recent years, as the trend toward smaller and lighter electronic devices has increased, there has been a remarkable progress in the use of chips in various electronic components, and small-capacity aluminum electrolytic capacitors are no exception. Various leadless chip-type aluminum electrolytic capacitors have been proposed, and are now at the stage of full-scale commercialization. Among the various chip-type aluminum electrolytic capacitors that have been proposed, the structure that has attracted the most attention so far is disclosed in Japanese Patent Application Laid-Open No. 59-211213;
This is disclosed in JP-A No. 214216 and Japanese Patent Application Laid-Open No. 59-219922.

The technology disclosed in the above publication is, for example, the 9th publication.
As shown in the figures and FIG. 10, a capacitor element 21 impregnated with a driving electrolyte is housed in a metal case 22, and a sealing member 24 for sealing the open end of the case 22 is connected to a lead wire 23 connected to the element 21. A capacitor main body 25 is drawn out through the capacitor main body 25, a through hole 26 is disposed in contact with the end surface from which the lead wire 23 of the capacitor main body 25 is drawn out, and a through hole 26 through which the lead wire 23 passes, and a through hole 26 is formed on the outer surface of the capacitor main body 25. It is composed of an insulating plate 28 provided with a connecting recess 27,
The tip end of the lead wire 23 passing through the through hole 26 is left as a round bar or is flattened, and the bent portion is bent to fit within the recess 27 and serves as a bonding portion to the substrate. However, the chip-type aluminum electrolytic capacitor having the above structure is
As shown in Fig. 1, a wound type capacitor element 29 impregnated with a driving electrolyte is housed in a metal case 30, and the open end is sealed with a sealing material 31.A lead drawn out from an aluminum electrolytic capacitor is constructed. Compared to a case where the wire 32 is connected to a comb-shaped terminal 33 and the entire body except for the comb-shaped terminal 33 is covered with a molded resin sheathing 34, it is not exposed to the harsh conditions of high temperature and high pressure during the molded resin sheathing. Therefore, the capacitance decreases due to evaporation of the driving electrolyte and
There is no characteristic deterioration such as an increase in tanδ, and there is no problem of increased costs associated with molded resin exterior.
Furthermore, it can be said to be a suitable structure as it can contribute to miniaturization to the maximum extent possible. However, when installing a chip-type aluminum electrolytic capacitor with such a configuration on a board, the board 3 is attached as shown in Figure 12.
5 is only the bent portion of the tip of the lead wire 23 located in the recess 27 provided on the outer surface of the insulating plate 28. Even if the bent portion is flattened, it will only be a one-sided adhesive structure via the adhesive 36, and even if it is flattened, the lead wire 2
3. The substrate 3 is extremely thin with a diameter of 0.45 to 0.8 mm.
Since the bonding area with No. 5 was not so large, there were concerns about the bonding strength, and it was difficult to obtain a highly reliable bonding strength. In addition, in consideration of adhesion stability with the substrate 35, it is common to flatten the tip of the lead wire 23 before penetrating the insulating plate 28. It is difficult to make the direction of the flat part constant in 26 so that the flat part can be easily accommodated in the recess 27 when bent, and if the flat part is further flattened, the thickness of the flattened part becomes thinner and mechanical stress is generated. When the lead wire is bent to fit in the weak recess 27, there is a risk that the lead wire may be cut from the bent portion 23a, and in any case, there is a problem that needs to be solved practically.

[Purpose of the invention] The present invention has been made in view of the above points, and is a chip-type aluminum electrolytic capacitor that is easy to work with, can ensure stable attachment to the board, and has highly reliable adhesive strength. The purpose is to provide the following.

[Summary of the invention] The chip-type aluminum electrolytic capacitor of the invention includes a bottomed cylindrical metal case, a capacitor element housed in the case, a pair of lead wires led out from the element, and a pair of lead wires extending through the lead wires. a capacitor body comprising a sealing body having a convex cross section and sealing the opening end of the case; and a lead wire storage groove provided on the surface of the convex portion of the sealing body and communicating with the lead wire penetration portion to the outside;
an insulating plate comprising a pair of metal terminal surfaces integrally molded on an outer surface disposed in contact with the convex surface of the sealing body, and a lead wire fitting groove provided in communication with each of the side surfaces from the metal terminal surfaces; a lead wire fitting groove provided in the metal terminal surface on the outer surface by bending the pair of lead wires pulled out along the lead wire storage groove and passing through the lead wire fitting groove on the side surface of the insulating plate. The capacitor main body and the insulating plate are integrated with each other.

[Embodiment of the invention] An embodiment of the invention will be described below with reference to the drawings. That is, as shown in FIGS. 1 and 2, a capacitor element 1 impregnated with an electrolyte for winding and driving is placed in a bottomed cylindrical metal case 2 with a spacer interposed between an anode foil and a cathode foil. As shown in FIG. 3, the pair of lead wires 3 connected to the capacitor element 1 are passed through the open end of the case 2, and the outer sides facing each other from the penetration portions of the pair of lead wires 3 are formed on the surface of the convex portion 4. 4 and 5 on the surface of the convex portion 4 of the convex sealing body 6 of the capacitor main body 7 sealed with a convex sealing body 6 provided with a lead wire storage groove 5 formed in a straight line and communicating with the capacitor body 7. The lead wire fitting of the insulating plate 10 has a pair of metal terminal surfaces 8 integrally molded on one outer surface and a lead wire fitting groove 9 communicating from the metal terminal surface 8 to each side surface as shown in FIG. The pair of lead wires 3 are pulled out along each of the lead wire storage grooves 5, and the pair of lead wires 3 are bent and placed on each side of the insulating plate 10. The capacitor body 7 and the insulating plate 10 are integrated into a lead wire fitting groove 9 which is housed in a lead wire fitting groove 9 provided on the metal terminal surface 8 located on the outer surface. .

The chip-type aluminum electrolytic capacitor constructed as described above has a structure in which the lead wire 3 is drawn out to the outer surface of the insulating plate 10 along the side surface of the insulating plate 10 without penetrating the insulating plate 10. ,
As shown in FIG. 6, the adhesive part when attached to the board 11 is the metal terminal surface 8 integrally formed on the outer surface of the insulating plate 10, so there is a sufficient adhesive area regardless of the thickness of the lead wire 3 used. Furthermore, the L-sided bonding structure includes the lead wire 3 located on the side surface of the insulating plate 10 via the adhesive 12, making it possible to obtain adhesive strength that is more reliable than the conventional single-sided bonding structure. .

Further, since the lead wire storage groove 5 is provided on the surface of the convex portion 4 of the convex sealing body 6 and the lead wire 3 is drawn out along the lead wire housing groove 5, the insulating plate 10 is in surface contact with the convex sealing body 6. , the lead wire 3 is connected to the insulating plate 1
Since the capacitor main body 7 and the insulating plate 10 are housed in the lead wire fitting grooves 9 provided in communication with the outer surface from both sides of the capacitor body 7, the fixing state of the capacitor body 7 and the insulating plate 10 is also stable. Furthermore, the lead wire 3 that is to be bonded to the substrate 11 does not need to pass through the insulating plate 10 as in the conventional structure, but is simply bent, making the assembly work easier. In addition, the lead wire 3 can be flattened. Since it has a structure that can be bent as it is in a round bar state without any damage, it has many advantages such as there is no risk of cutting the lead wire 3.

In the above embodiment, the structure of the lead wire storage groove 5 provided in the convex sealing body 6 is such that the storage groove 5 is arranged in a straight line, and the structure of the insulating plate 10 is such that the pair of metal terminal surfaces 8 are arranged in a straight line. As explained by way of example, a convex sealing body 6 with lead wire storage grooves 5 provided in parallel positions as shown in FIG. 7, and a pair of metal terminal surfaces 8 provided in parallel as shown in FIG. Insulating plate 10
or a combination structure in which the position of the lead wire storage groove provided in the convex sealing body and the position of the metal terminal surface are appropriately changed according to the position of the lead wire storage groove. Of course, it can be applied. Other parts in FIG. 8 are given the same numbers as in FIG. 4, and their explanations are omitted.

[Effects of the invention] According to the invention, it is possible to obtain a chip-type aluminum electrolytic capacitor of high practical value, which is easy to work with, has no risk of lead wire breakage, and can ensure stable attachment to the board.

[Brief explanation of the drawing]

Figures 1 to 6 relate to one embodiment of the present invention, and Figures 1 and 2 show a chip-type aluminum electrolytic capacitor, with Figure 1 being a perspective view and Figure 2 being a perspective view.
The figure is a partially sectional front view, and Figure 3 is the same as Figures 1 and 2.
FIG. 4 is a perspective view of an insulating plate that constitutes FIGS. 1 and 2,
FIG. 5 is a sectional view taken along the line A-A in FIG. FIG. 8 is a perspective view showing a convex sealing body, FIG. 8 is a perspective view showing an insulating plate, and FIGS.
The figure is a perspective view, Figure 10 is a partially sectional front view, and Figure 11 is a partially sectional front view.
The figure is a front cross-sectional view of a chip-type aluminum electrolytic capacitor according to another conventional reference example, and FIG.
FIG. 3 is a partially sectional front view showing a state in which the capacitor shown in the figure is attached to the base end. 1...Capacitor element, 2...Metal case, 3
... Lead wire, 4 ... Convex portion, 5 ... Lead wire storage groove, 6 ... Convex sealing body, 7 ... Capacitor body,
8...Metal terminal surface, 9...Lead wire fitting groove, 10
...Insulating board.

Claims (1)

[Scope of utility model registration request] A cylindrical metal case with a bottom, a capacitor element housed in the case, a pair of lead wires led out from the element, and a sealing body with a convex cross section that seals the open end of the case through which the lead wires pass. A capacitor body consisting of a lead wire storage groove provided on the surface of the convex portion of the sealing body and communicating with the lead wire penetrating portion to the outside, and a pair integrally formed on the outer surface of the sealing body and disposed in contact with the surface of the convex portion of the sealing body. and an insulating plate consisting of a metal terminal surface and a lead wire fitting groove provided in communication with each side surface from the metal terminal surface, and the pair of lead wires drawn out along the lead wire storage groove. The capacitor main body and the insulating plate are integrated by bending the insulating plate and storing the capacitor body in the lead wire fitting groove provided on the metal terminal surface on the outer surface through the lead line fitting groove on the side surface of the insulating plate. Chip type aluminum electrolytic capacitor.