JPH0249704Y2 - - Google Patents

Description

[Detailed Description of the Invention] [Technical Field of the Invention] The present invention relates to a chip-type aluminum electrolytic capacitor.

[Technical background of the invention and its problems] In recent years, as the trend toward smaller and lighter electronic devices has increased, there has been a remarkable progress in the use of chips in various electronic components, and small-capacity aluminum electrolytic capacitors are no exception. Various leadless chip-type aluminum electrolytic capacitors have been proposed, and are now at the stage of full-scale commercialization. Among the various chip-type aluminum electrolytic capacitors that have been proposed, the structure that has attracted the most attention so far is disclosed in Japanese Patent Application Laid-Open No. 59-211213;
This is disclosed in JP-A No. 214216 and Japanese Patent Application Laid-Open No. 59-219922.

The technology disclosed in the above publication is, for example, the 9th publication.
As shown in the figures and FIG. 10, a capacitor element 11 impregnated with a driving electrolyte is housed in a metal case 12, and a sealing member 14 for sealing the open end of the case 12 is connected to a lead wire 13 connected to the element 11. A capacitor main body 15 is drawn out through the capacitor main body 15, a through hole 16 is disposed in contact with the end surface of the capacitor main body 15 from which the lead wire 13 is drawn out, and a through hole 16 through which the lead wire 13 passes, and a through hole 16 in the outer surface is provided. It consists of an insulating plate 18 provided with a connecting recess 17,
The tip of the lead wire 13 that has passed through the through hole 16 is left as a round bar or is flattened and bent so as to fit within the recess 17, with the bent portion serving as a bonding portion to the substrate. As shown in FIG. 11, the chip-type aluminum electrolytic capacitor having the above structure houses a wound-type capacitor element 19 impregnated with a driving electrolyte in a metal case 20, and the open end is sealed with a sealing material. A lead wire 22 drawn out from an aluminum electrolytic capacitor sealed and configured at 21 is connected to a comb-shaped terminal 23, and the entire body except the comb-shaped terminal 23 is covered with a molded resin exterior 24.
Compared to products that are coated with molded resin, they are not exposed to the harsh conditions of high temperature and high pressure during the molded resin exterior, so there is no characteristic deterioration such as a decrease in capacitance or an increase in tanδ due to evaporation of the driving electrolyte. Furthermore, there is no problem of increased costs associated with molded resin exterior packaging, and it can be said to be suitable as a structure that can contribute to miniaturization to the maximum extent. However, since the lead wire 13 has a very thin diameter of 0.45 to 0.8 mm, it is difficult to flatten the tip of the lead wire 13 that has passed through the through hole 16 provided in the insulating plate 18. When the lead wire is bent to fit into the recess 17 due to its thinness and is susceptible to mechanical stress, there is a risk that the lead wire will be cut from the bent portion 13a. However, if the lead wire 13 is bent as a round bar, the contact with the board will be in line contact, so this structure However, there were concerns about adhesive strength, and in any case, there were practical issues that needed to be resolved.

[Purpose of the invention] The present invention was made in view of the above points, and its purpose is to provide an inexpensive chip-type aluminum electrolytic capacitor that is easy to work with and can ensure stable attachment to a circuit board. be.

[Summary of the invention] The chip-type aluminum electrolytic capacitor of the invention has a structure in which a lead wire led out from a capacitor element housed in a bottomed cylindrical metal case is drawn out through a sealing member that seals the open end of the metal case. A pair of metal terminal surfaces are integrally molded on the outer surface of the capacitor body that is arranged in contact with the lead wire extraction end surface of the capacitor body, and a lead wire fitting groove and the lead wire fitting groove are formed on the metal terminal surface. an insulating plate provided at one end with a through hole through which the lead wire passes, and the tip of the lead wire passing through the through hole is bent and fitted into the lead wire fitting groove. It is.

[Embodiment of the invention] An embodiment of the invention will be described below with reference to the drawings. That is, as shown in FIGS. 1 and 2, a capacitor element 1 formed by winding an anode foil and a cathode foil with a spacer interposed therebetween and impregnating the drive electrolyte is placed in a bottomed cylindrical metal case 2. As shown in FIGS. 3 and 4, the lead wire 3 of the capacitor main body 5 is formed by passing the lead wire 3 housed in the capacitor element 1 and connected to the capacitor element 1 through the sealing member 4 whose open end is sealed. A pair of metal terminal surfaces 6 and 7 are formed on one outer surface, and a lead wire fitting groove 8 is provided in the metal terminal surfaces 6 and 7, and a through hole 9 is provided in one end of the lead wire fitting groove 8. 6 and 7 are integrally molded into an insulating plate 10 which is brought into contact with the metal terminal surfaces 6 and 7 on the outside, and the lead wire 3 is passed through the through hole 9,
The tip of the lead wire 3 is bent and fitted into the lead wire fitting groove 8.

According to the chip-type capacitor constructed as described above, since the bonding surface structure with the substrate is the metal terminal surfaces 6 and 7 configured in advance on the insulating plate 10, the thickness of the lead wire 3 used can vary. Regardless of the bonding area, a sufficient bonding area can be secured and excellent bonding strength can be obtained. In addition, the capacitor body 5 and the insulating plate 10
Fixing and connection of the metal terminal surfaces 6, 7 and the lead wire 3 are achieved by simply bending the lead wire 3 that has passed through the through hole 9 and fitting the tip into the lead wire fitting groove 8 provided on the metal terminal surfaces 6, 7. Because of the matching structure, there is no danger of the lead wire being cut due to bending, and moreover, reliable fixing and connection can be achieved without using special fixing and connecting means. Furthermore, even if there is any concern about the electrical connection between the lead wire 3 and the metal terminal surfaces 6, 7, the structure is such that the connecting portion between the lead wire 3 and the metal terminal surfaces 6, 7 serves as the bonding portion to the board. The structure is such that the two are electrically connected reliably through the solder used for this purpose, and there are no problems such as insufficient contact between the capacitor body and the board. 8, the lead wire 3 does not protrude from the metal terminal surfaces 6, 7, which are the bonding surfaces of the substrate, and has many advantages such as being able to secure a stable attachment state to the substrate.

In the above embodiment, the structure of the insulating plate 10 is explained by exemplifying the structure in which the pair of metal terminal surfaces 6 and 7 are arranged in a straight line, but as shown in FIG. one provided in parallel, or a pair of metal terminal surfaces 6, as shown in FIGS.
Of course, it can be applied to structures in which the 7 positions are changed as appropriate. Other parts in FIGS. 5 to 8 are given the same numbers as in FIG. 3, and their explanations are omitted.

[Effects of the invention] According to the invention, it is possible to obtain a chip-type aluminum electrolytic capacitor that is easy to work with, has no risk of lead wire breakage, and can ensure stable attachment to the board at low cost and has high practical value. .

[Brief explanation of the drawing]

Figures 1 to 4 relate to one embodiment of the present invention, and Figures 1 and 2 show a chip-type aluminum electrolytic capacitor, with Figure 1 being a perspective view and Figure 2 being a perspective view.
The figure is a partially sectional front view, and Figure 3 is the same as Figures 1 and 2.
A perspective view of the insulating plate constituting the figure, Figure 4 is Figure 3A
-A sectional view, FIGS. 5 to 8 are perspective views showing insulating plates according to other embodiments, FIG.
Fig. 0 shows a chip-type aluminum electrolytic capacitor according to a conventional example, Fig. 9 is a perspective view, Fig. 10 is a partially sectional front view, and Fig. 11 shows a chip-type aluminum electrolytic capacitor according to another conventional example. It is. 1...Capacitor element, 2...Metal case, 3
... Lead wire, 4 ... Sealing body, 5 ... Capacitor body, 6, 7 ... Metal terminal surface, 8 ... Lead wire fitting groove, 9 ... Through hole, 10 ... Insulating plate.

Claims (1)

[Scope of utility model registration request] A capacitor body formed by drawing out a lead wire from a capacitor element housed in a bottomed cylindrical metal case through a sealing plug that seals the opening end of the case, and a capacitor body formed by drawing out a lead wire from a capacitor element housed in a bottomed cylindrical metal case, and a capacitor body formed by drawing out a lead wire from a capacitor element housed in a bottomed cylindrical metal case; A pair of metal terminal surfaces are integrally molded on the outer surfaces arranged in contact with each other, and the metal terminal surface includes a lead wire fitting groove and an insulating plate provided with a through hole at one end of the fitting groove, and the through hole A chip-type aluminum electrolytic capacitor, characterized in that a tip end portion of the lead wire passing through is bent and fitted into the lead wire fitting groove.