JPH0249530B2 - DENSHIBUHIN - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention relates to electronic components, and more specifically, to so-called leadless electronic components. In the following description, an aluminum electrolytic capacitor will be explained in detail, but the present invention is not limited to aluminum electrolytic capacitors, and the same applies to other electronic components.

Conventional structure and its problems Conventional so-called leadless electronic components of this type,
For example, a chip-type aluminum electrolytic capacitor is constructed as shown in FIGS. 1a and 1b. That is,
An anode foil, which is made by roughening aluminum foil and forming a dielectric oxide film by anodizing, and a cathode foil, which is made by roughening aluminum foil, are wound through a separator and impregnated with a driving electrolyte to form a capacitor. This capacitor element 1 is housed in a cylindrical metal case 2 with a bottom, and the open end is sealed using an elastic sealing material 3 such as rubber to form an aluminum electrolytic capacitor. The lead wire 4 drawn out from the aluminum electrolytic capacitor is electrically and mechanically connected to the comb-shaped terminal 5 by a method such as welding, and a molded resin sheath 6 is applied to the entire body except for the comb-shaped terminal 5 to create a completed product. It was. When these chip-type aluminum electrolytic capacitors are mounted on a printed circuit board, they are coated with a molded resin exterior 6 as described above in order to provide solder heat resistance. 10 for about 5 minutes at a temperature of
The electrolytic capacitor is pressurized at a pressure of Kg/cm ² , and under such harsh conditions, the driving electrolyte of the electrolytic capacitor evaporates, causing characteristic deterioration such as a decrease in capacitance and an increase in tanδ. Since the molded resin exterior 6 is provided, there is a problem in that the product is extremely expensive. Furthermore, since it is a horizontal type, when it is mounted on a printed circuit board, it occupies a large area of the printed circuit board, which is a factor that hinders miniaturization of various devices.

OBJECTS OF THE INVENTION The present invention eliminates such conventional drawbacks, and aims to provide an inexpensive vertical type leadless electronic component that does not deteriorate in characteristics and can sufficiently withstand external shocks. It is something.

Structure of the Invention In order to achieve this object, the present invention provides an electronic component main body which is constructed by housing a component element in a case and has lead wires connected to the component element drawn out from the same end surface, and an elastic insulating plate provided with a through hole through which the lead wire passes and is disposed so as to come into contact with an end surface from which the lead wire is drawn out of the main body, and a space connected to the through hole on the outer surface of the elastic insulating plate; The lead wire is provided with a space, and the tip of the lead wire passing through the through hole is bent so as to fit within the space.

With this configuration, when electronic components are mounted on a printed circuit board, the tips of the lead wires are housed in the space provided in the insulating board, so there are no convex parts on the surface of the insulating board that comes into contact with the printed circuit board. In other words, the lead wire is in a so-called tangential position with the insulating plate, so there is no tilting or wobbling of the electronic component, and it is stable, making it possible to perform extremely fast mounting work and reduce impact resistance. Becomes excellent.

DESCRIPTION OF EMBODIMENTS An embodiment of the present invention will be described below with reference to FIGS. 2 to 4 regarding an aluminum electrolytic capacitor. In addition, in the figure, the same parts as in FIG. 1 are given the same numbers.

In the figure, 1 is a capacitor element similar to the conventional one, with an anode foil made by electrochemically roughening a high-purity aluminum foil and then anodizing it to form a dielectric oxide film, and a roughened aluminum foil. It is constructed by winding a cathode aluminum foil with an insulating paper interposed therebetween, and impregnating the wound material with a driving electrolyte. This capacitor element 1 is housed in a cylindrical metal case 2 with a bottom. Further, a lead wire 4 is connected to the anode foil and the cathode foil of the capacitor element 1.

The open end of the metal case 2 is connected to an elastic body 7a.
and a non-elastic body 7b.
is attached and sealed by drawing, forming the main body of the electronic component. Further, the lead wire 4 connected to the capacitor element 1 passes through the sealing member 7 and is drawn out from the same end surface.

Reference numeral 8 denotes a rubber-like elastic insulating plate disposed so as to come into contact with the end surface from which the lead wire 4 is drawn out of the electronic component body, and this elastic insulating plate 8 is provided with a through hole 8a through which the lead wire 4 passes. It is being Moreover, since the insulating plate 8 is made of an elastic material,
If a mechanical shock is applied after being mounted on a printed circuit board, the elastic insulating plate 8 absorbs it, so that the electronic component does not come off the printed circuit board.

The elastic insulating plate 8 may be made of isobutylpropylene rubber, ethylene propylene terpolymer, styrene butadiene rubber, isobutylene rubber, thermoplastic elastomer, or the like.

Further, a recess 8b forming a space connected to the through hole 8a is provided on the outer surface of the elastic insulating plate 8, and a lead wire 4 passing through the through hole 8a is provided.
The distal end portion 4a is bent so as to fit within the recess 8b.

In this case, as shown in FIGS. 4a and 4b, the round bar lead wire 4 may have its tip 4a flattened and bent, or the round bar lead wire may remain as it is. good. With such a configuration, when mounted on a printed circuit board, the leadless electronic component 21 of the present invention can be mounted on a printed circuit board, as shown in FIG.
is placed on the printed circuit board 22 so that the terminal portion of the lead wire is in contact with the conductive pattern 23, and is temporarily fixed with an adhesive 24. Then, using a soldering method such as reflow, the electronic component 21 is attached with solder 25. What is necessary is to connect and fix the terminal portion to the conductive pattern 23 of the printed circuit board 22. Further, if cream solder is used as the solder, temporary fixation is possible without using adhesive, and in this case, mounting becomes easy.

Effects of the Invention As described above, according to the electronic component of the present invention, since an elastic insulating plate having a space is used and the lead wire is housed in the space, there is no tilting or wobbling when mounting it on a printed circuit board. , the mounting work can be done extremely well and at high speed. In addition, by using an elastic body for the insulating plate, external impact on the main body is alleviated, and since there is no molded resin exterior, it is possible to produce electronic components at low cost without deterioration of characteristics.

[Brief explanation of drawings]

Figures 1a and b are cross-sectional views and side views of a conventional chip-type aluminum electrolytic capacitor, Figure 2 is a perspective view of a leadless aluminum electrolytic capacitor according to an embodiment of the present invention, and Figure 3 is a cross-sectional view of a conventional chip-type aluminum electrolytic capacitor. 4a and 4b are perspective views showing a lead shape according to an embodiment of the present invention, and FIG. 5 is a front view showing a state in which the capacitor is mounted on a printed circuit board. . 1...Capacitor element, 2...Metal case, 4
... Lead wire, 7 ... Sealing member, 7a ... Elastic body, 7b ... Inelastic body, 8 ... Elastic insulating plate, 8a
...Through hole, 8b...Recess.

Claims (1)

[Scope of Claims] 1. An electronic component main body constructed by housing component elements in a case, and having lead wires connected to the component elements drawn out from the same end surface, and a lead wire of the electronic component main body drawn out from the same end face. an elastic insulating plate provided with a through hole through which the lead wire passes, the elastic insulating plate being arranged so as to come into contact with the end surface of the elastic insulating plate, and a space connected to the through hole being provided on the outer surface of the elastic insulating plate; An electronic component characterized in that a tip of a lead wire passing through the through hole is bent so as to fit within the space. 2 The elastic insulation board is made of isoptyl isopropylene rubber, ethylene propylene terpolymer, styrene butadiene rubber, silicone rubber, fluoro rubber,
The electronic component according to claim 1, which is either isobutylene rubber or thermoplastic elastomer. 3. The electronic component according to claim 1, wherein the lead wire accommodated in the space has a plate-shaped tip. 4. The electronic component according to claim 1, wherein the electronic component main body has a sealing member made of a rubber-like elastic body and a non-rubber-like elastic body.