JPS62186521A - Electronic parts - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention relates to electronic components, and more particularly to so-called leadless electronic components. In the following description, an aluminum electrolytic capacitor will be explained in detail, but the present invention is not limited to aluminum electrolytic capacitors, and the same applies to other electronic components.

Conventional technology A conventional chip aluminum electrolytic capacitor is shown in Figure 3a.

It was configured as shown in b. That is, an anode foil formed by roughening aluminum foil and forming a dielectric oxide film by anodizing the surface, and a cathode foil formed by roughening aluminum foil are wound through a seven-layer coil, and a driving electrolyte is applied. The capacitor element 1 is impregnated with aluminum to form a capacitor element 1, and the capacitor element 1 is housed in a bottomed cylindrical metal case 2, and the open end is sealed with an elastic sealant 3 such as rubber. An l route line 3λ that constitutes an electrolytic capacitor and is drawn out from the aluminum electrolytic capacitor
- 4 to the comb-shaped terminal 6 by a method such as welding.

After mechanical connection, a resin molded exterior 6 was applied to the entire body except for the comb-shaped terminal 5, resulting in a completed product 2.

Chip aluminum electrolytic capacitors, such as the problem to be solved by the present invention, are coated with a resin molded exterior 6 as described above in order to provide solder heat resistance when mounted on a printed circuit board, but generally resin molded The exterior 6 is pressurized at a temperature of 100°C to 160°C and a pressure of 10Kyd for about 6 minutes. Under such harsh conditions, the driving electrolyte of the electrolytic capacitor evaporates and the capacitance decreases. This causes deterioration of characteristics such as a decrease in tan δ and an increase in tan δ, and since the resin molded exterior 6 is provided, the product becomes extremely expensive. Furthermore, since it is a horizontal type, when mounted on a printed circuit board, it occupies a large area of the printed circuit board, which is a factor that hinders miniaturization of various electronic devices.

Recently, moldless electronic components have been proposed as a solution to these problems.

In other words, as shown in FIG.
an electronic component body configured by housing the lead wire 9 connected to the component element 7 in the same end face and having the lead wire 2 drawn out from the same end face; an insulating plate 11 provided with a through hole 10 through which the lead wire 9 passes, and a recess 1 connected to the through hole 10 on the outer surface of the insulating plate 11.
2, and a lead wire 9 passing through the through hole 10.
The distal end portion 9N is bent so as to fit within the recess 12.

The moldless electronic component with the configuration shown in the figure is vertically shaped and uses an insulating plate 11, which limits the ability to make the electronic device thinner when mounted on a printed circuit board. Ta.

Means for Solving the Problems The present invention is intended to solve the following problems, and is constructed by housing the component elements in a case.
and an electronic component body formed by leading out the lead wires connected to the component element from the same end surface, and a through hole through which the lead wires are arranged so as to come into contact with the end surface from which the lead wires are drawn out of the electronic component body. The insulating film has a hole, and the tip of the lead wire passing through the through hole is bent along the outer surface of the insulating film.

Due to this structure, the electronic component body is not affected by the molded resin exterior, so there is no characteristic deterioration, and when the electronic component is mounted on the printed circuit board, an insulating film is used in the part that comes into contact with the printed circuit board. Therefore, the height of the entire electronic component is reduced.

EXAMPLE Hereinafter, an example of the present invention will be described with reference to FIGS. 1 and 2 regarding an aluminum electrolytic capacitor.

In the figure, 13 is a capacitor element similar to the conventional one, with an anode foil made by electrochemically roughening a high-purity aluminum foil and then anodizing it to form a dielectric oxide film, and a roughened aluminum foil. It is constructed by winding a cathode aluminum foil with an insulating paper between them, and impregnating the wound material with a driving electrolyte. The capacitor element 13 is housed in a cylindrical metal case 14 with a bottom. 1, the capacitor element 1
A lead wire 16 is connected to the anode foil and the cathode foil of No. 3.

The open end of the metal case 13 is sealed by attaching a sealing member 16 having a two-layer structure of an elastic body 16& and an inelastic body 16b, and performing a drawing process. The main body is configured. Further, the lead wire 16 connected to the capacitor element 13 is connected to the sealing member 1
6 and is drawn out from the same end surface.

Reference numeral 17 denotes an insulating film disposed so as to come into contact with the end surface from which the lead wire 16 of the electronic component body is drawn out, and the insulating film 17 has a through hole 1 through which the lead wire 16 passes.
72L is provided. And the tip 15 of the lead wire
After passing through the through hole 171L of the insulating film 1T, tL is bent along the outer surface of the insulating film 1T. In this case, as shown in Fig. 7-2 a and b, the round bar lead wire 16 is connected to the tip 1.
689 may be flattened and bent, or it may be a round bar lead wire.

Furthermore, the tip of the lead wire 16, the end 15a, is bent upward along the end surface of the insulating film 17 as shown in FIG. It is also possible to improve the soldering strength during surface mounting.

Effects of the Invention As described above, according to the electronic component of the present invention, since an insulating film is used, the height of the entire electronic component is reduced, which can contribute to making electronic devices thinner. Moreover, since no mold resin exterior is used, it is possible to manufacture electronic components at low cost without deteriorating their characteristics, and it is also possible to reliably mount them on a printed circuit board.

[Brief explanation of drawings]

FIG. 1 is a partially sectional front view showing a chip aluminum electrolytic capacitor according to an embodiment of the present invention, and FIG. 2a is a partial sectional front view. Figures 3a and 3b show conventional chip aluminum electrolytic capacitors. 13... Capacitor element, 14... Metal case, 15... Lead wire, 161L...
... Tip part, 16 ... Sealing body, 17 ...
...Insulating film, 171L...Through hole. Name of agent: Patent attorney Toshio Nakao and 1 other person No. 1
Figure 2 ((L) (b) Figure 3 (Repiji Figure 4)

Claims (3)

[Claims] (1) An electronic component body constructed by housing a component element in a case and having lead wires connected to the component element drawn out from the same end surface; and an insulating film arranged so as to be in contact with each other and having a through hole through which the lead wire passes, and the tip of the lead wire passing through the through hole is arranged along the outer surface of the insulating film. An electronic component characterized by being bent. (2) The electronic component according to claim 1, wherein the tip of the lead wire along the outer surface of the insulating film is plate-shaped. (3) The electronic component according to claim 1, wherein the electronic component main body has a sealing member made of a rubber-like elastic body and a non-rubber-like elastic body.