JPS61194706A - Chip aluminum electrolytic capacitor - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION Field of Industrial Application The present invention relates to electrolytic capacitors used in various electronic devices, and more specifically, to chip aluminum electrolytic capacitors.

Conventional technology A conventional chip aluminum electrolytic capacitor is shown in Figure 4a.

It was configured as shown in b. That is, an anode foil made by roughening aluminum foil and forming a dielectric oxide film by anodization, and a cathode foil made by roughening aluminum foil are wound through a separator and impregnated with a driving electrolyte. constitute a capacitor element 1, and house this capacitor element 1 in a bottomed cylindrical metal case 2,
An aluminum electrolytic capacitor is constructed by sealing the open end with a sealing member 3 having elasticity such as rubber, and the lead wire 4 drawn out from the aluminum electrolytic capacitor is electrically connected to a comb-shaped terminal 5 by a method such as welding. Target.

After mechanical connection, a resin molded exterior 6 was applied to the entire body except for the comb-shaped terminal 5, resulting in a completed product.

(For example, Japanese Unexamined Utility Model Publication No. 183739/1983, Japanese Unexamined Patent Publication No. 57/1983
(Refer to Publication No. 4.5221) Problems to be Solved by the Invention When such a chip aluminum electrolytic capacitor is mounted on a printed circuit board, in order to provide solder heat resistance, the resin molded exterior 6 is applied as described above. However, in general, with a resin molded exterior 6, the driving electrolyte of the electrolytic capacitor evaporates, resulting in deterioration of characteristics such as a decrease in capacitance and an increase in tami. Therefore, there was a problem in that it was extremely expensive. Furthermore, since it is a horizontal type, when it is mounted on a printed circuit board, it occupies a large area of the printed circuit board, which is a factor that hinders miniaturization of various electronic devices.

The present invention eliminates these conventional drawbacks by improving the boiling point of the electrolyte to provide heat resistance when soldering to a printed circuit board, thereby creating a vertically mounted chip aluminum electrolytic capacitor without a resin mold. The purpose is to provide

Means for Solving the Problems ゛To achieve this objective, the present invention provides
- A capacitor element impregnated with an electrolytic solution consisting of two types of high boiling point solvents of butyrolactone and 3-methyl-1,3-oxazolidin-2-one with a boiling point of 200°C or higher is housed in a case and connected to the capacitor element. Consisting of a capacitor body with lead wires drawn out from the same end face, and an insulating plate disposed so as to come into contact with the end face of the capacitor body from which the lead wires are drawn out, and provided with a through hole through which the lead wires pass, A recess connected to the through hole is provided on the outer surface of the insulating plate, and the tip of a lead wire passing through the through hole is bent so as to fit within the recess.

Function The present invention has this configuration, even when a chip aluminum electrolytic capacitor is mounted and soldered on a printed circuit board, since an electrolytic solution containing a high boiling point solvent of 200°C or higher is used for the capacitor element, a resin mold that can withstand heat is used. Since the exterior is unnecessary and the tip of the lead wire is stored in the recess provided in the insulating board, there is no convex part on the surface of the insulating board that contacts the printed circuit board, that is, the lead wire is connected to the insulating board. Since the capacitor is so-called flush, there is no tilting or wobbling of the capacitor, and the capacitor is stable, making the mounting work extremely easy and fast. Also, since it is a vertically mounted type, the mounting area on the board is small, making it easier to achieve high-density mounting.

EXAMPLE An example of the present invention will be described below with reference to FIGS. 1 and 2. In addition, in the figure, the same parts as in FIG. 4 are given the same numbers.

In the figure, 1 is a capacitor element similar to the conventional one,
An anode foil made by electrochemically roughening high-purity aluminum foil and then anodizing it to form a dielectric oxide film, and a roughened cathode aluminum foil are wound with insulating paper interposed between them. , and two solvents, r-butyrolactone with a boiling point of 206°C and 3-methyl-1,3-oxazolidin-2-one with a boiling point of 262°C, were mixed in the rolled material at a weight ratio of 8 (τ-butyrolactone) = 2. It is constructed by impregnating it with an electrolyte solution containing a solute. This capacitor element 1 is housed in a bottomed cylindrical case 2 made of gold. Further, a lead wire 4 is connected to the anode foil and the cathode foil of the capacitor element 1.

The open end of the metal case 2 is sealed with a sealing body 7 having a two-layer structure of an elastic body 7a and an inelastic body 7b to prevent external stress from being transmitted to the capacitor element 1. . Further, the lead wire 4 connected to the capacitor element 1 passes through the sealing body 7 and is drawn out from the same end surface. 8 is lead wire 4 of the capacitor body
This is an insulating plate disposed so as to come into contact with the end surface of the lead wire 8, and this insulating plate 8 is provided with a through hole 8a through which the lead wire 4 passes. Further, the outer surface of the insulating plate 8 is provided with a recess connected to the through hole 8a, and the tip 4a of the lead wire 4 passing through the through hole 8a is bent so as to fit within the recess 8b. ing.

In this case, as shown in Figure 3a and b, the round bar lead wire 4
The leading end portion 4a may be flattened and bent, or may be a round bar lead wire.

Effects of the Invention As described above, according to the chip aluminum electrolytic capacitor of the present invention, the boiling point of the electrolyte is 215°C or higher at 1 atm, and it increases even more when the capacitor is sealed, so it is difficult to solder it to the printed circuit board. In addition, since the insulating plate with recesses is used and the lead wires are housed in the recesses, there is no tilting or wobbling when mounting on the printed circuit board, making the mounting process extremely easy and fast. It becomes possible to Moreover, there is no need for a resin molded exterior, making it possible to manufacture the product at low cost.

[Brief explanation of the drawing]

FIG. 1 is a perspective view showing a chip aluminum electrolytic capacitor according to an embodiment of the present invention, FIG. 2 is a partially sectional view showing an embodiment of the present invention, and FIGS. 3 a and b are according to an embodiment of the present invention. FIGS. 4A and 4B are a perspective view showing the lead shape, and a cross-sectional view and a side view showing a conventional chip aluminum electrolytic capacitor. 1... Capacitor element, 2... Metal case, 4... I-wire, 4a... Tip, 7... Sealing Body, 8...Insulating plate, 8
a: through hole, 8b: recess. Name of agent: Patent attorney Toshio Nakao and 1 other person No. 1
Figure 2--Metal case 4^--Reed's previous creation duck key preparation 5--Ichimachiten 1-11>Chin's appearance "3-4"---Reed's predecessor was also old P7- Light ℃蓓7α--Ichibaku) Raw 1 door b-=I r # +aiz, δ-t!Kuhui

Claims (3)

[Claims] (1) A capacitor element impregnated with an electrolyte solution using 1-butyrolactone and 3-methyl-1,3-oxazolidin-2-one as the electrolyte solvent is housed in a case, and a lead connected to the capacitor element. The capacitor body is composed of a capacitor body having wires drawn out from the same end face, and an insulating plate provided with a through hole through which the lead wires pass and which is disposed so as to come into contact with the end face of the capacitor body from which the lead wires are drawn out. A chip aluminum electrolytic capacitor, characterized in that a recess connected to the through hole is provided on the outer surface of the insulating plate, and a tip of a lead wire passing through the through hole is bent so as to fit within the recess. (2) The chip aluminum electrolytic capacitor according to claim 1, wherein the tip of the lead wire accommodated in the recess is plate-shaped. (3) The chip aluminum electrolytic capacitor according to claim 1, wherein the capacitor body has a sealing member made of a rubber-like elastic body and a non-rubber-like elastic body.