JPH0378774B2 - - Google Patents
Info
- Publication number
- JPH0378774B2 JPH0378774B2 JP60034831A JP3483185A JPH0378774B2 JP H0378774 B2 JPH0378774 B2 JP H0378774B2 JP 60034831 A JP60034831 A JP 60034831A JP 3483185 A JP3483185 A JP 3483185A JP H0378774 B2 JPH0378774 B2 JP H0378774B2
- Authority
- JP
- Japan
- Prior art keywords
- capacitor
- lead wire
- insulating plate
- aluminum electrolytic
- capacitor element
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000003990 capacitor Substances 0.000 claims description 40
- 229910052782 aluminium Inorganic materials 0.000 claims description 18
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 18
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical group [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims description 18
- 239000008151 electrolyte solution Substances 0.000 claims description 7
- 239000002904 solvent Substances 0.000 claims description 6
- 238000007789 sealing Methods 0.000 claims description 5
- VWIIJDNADIEEDB-UHFFFAOYSA-N 3-methyl-1,3-oxazolidin-2-one Chemical compound CN1CCOC1=O VWIIJDNADIEEDB-UHFFFAOYSA-N 0.000 claims description 3
- 239000012046 mixed solvent Substances 0.000 claims description 2
- YEJRWHAVMIAJKC-UHFFFAOYSA-N 4-Butyrolactone Chemical compound O=C1CCCO1 YEJRWHAVMIAJKC-UHFFFAOYSA-N 0.000 claims 2
- 239000011888 foil Substances 0.000 description 10
- 238000009835 boiling Methods 0.000 description 7
- 239000011347 resin Substances 0.000 description 6
- 229920005989 resin Polymers 0.000 description 6
- 239000003792 electrolyte Substances 0.000 description 5
- 229910052751 metal Inorganic materials 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- 229910000679 solder Inorganic materials 0.000 description 4
- 238000000034 method Methods 0.000 description 3
- 238000007788 roughening Methods 0.000 description 3
- 238000005476 soldering Methods 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 238000007743 anodising Methods 0.000 description 2
- 230000006866 deterioration Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- IZXIZTKNFFYFOF-UHFFFAOYSA-N 2-Oxazolidone Chemical compound O=C1NCCO1 IZXIZTKNFFYFOF-UHFFFAOYSA-N 0.000 description 1
- 239000006071 cream Substances 0.000 description 1
- 230000006355 external stress Effects 0.000 description 1
- 230000008642 heat stress Effects 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Landscapes
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
- Semiconductor Integrated Circuits (AREA)
- Weting (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Description
【発明の詳細な説明】
産業上の利用分野
本発明は各種電子機器に利用される電解コンデ
ンサに関するものであり、さらに詳しく言えば、
チツプアルミ電解コンデンサに関するものであ
る。[Detailed Description of the Invention] Industrial Application Field The present invention relates to electrolytic capacitors used in various electronic devices, and more specifically,
This relates to chip aluminum electrolytic capacitors.
従来の技術
従来のチツプアルミ電解コンデンサは第４図
ａ，ｂに示すように構成されていた。すなわち、
アルミニウム箔を粗面化しさらに陽極酸化により
誘電体酸化皮膜を形成した陽極箔と、アルミニウ
ム箔を粗面化して形成した陰極箔とをセパレータ
を介して巻回し、駆動用電解液を含浸してコンデ
ンサ素子１を構成し、このコンデンサ素子１を有
底筒状の金属ケース２に収納するとともに、開放
端をゴムなどの弾性を有する封口体３を用いて封
口してアルミ電解コンデンサを構成し、そして前
記アルミ電解コンデンサから引出されているリー
ド線４をゴム状端子５に溶接などの方法により電
気的、機械的に接続し、さらにコム状端子５を除
く全体に樹脂モールド外装６を施して完成品とし
ていた。（例えば実開昭57−183739号公報、特開
昭57−45221号公報参照）
発明が解決しようとする問題点
このようなチツプアルミ電解コンデンサは、プ
リント基板への実装に際して、半田耐熱性をもた
せるために、前述したように樹脂モールド外装６
を施しているが、一般に樹脂モールド外装６で
は、100℃〜150℃の温度で、５分間程度10Kg／cm2
の圧力で加圧しており、このような過酷な条件下
では、電解コンデンサの駆動用電解液が蒸散し
て、静電容量の減少やtamiの増大などの特性劣
化をきたし、また樹脂モールド外装６を施してい
るため、極めて高価なものになるという問題点を
有していた。さらに、横置きタイプであるため、
プリント基板に実装した場合に、プリント基板の
面積を多く占領してしまい、各種電子機器の小形
化を阻害する要因となつていた。Prior Art A conventional chip aluminum electrolytic capacitor was constructed as shown in FIGS. 4a and 4b. That is,
An anode foil, which is made by roughening aluminum foil and forming a dielectric oxide film by anodizing, and a cathode foil, which is made by roughening aluminum foil, are wound through a separator and impregnated with a driving electrolyte to form a capacitor. This capacitor element 1 is housed in a cylindrical metal case 2 with a bottom, and the open end is sealed using an elastic sealing body 3 such as rubber to form an aluminum electrolytic capacitor. The lead wire 4 drawn out from the aluminum electrolytic capacitor is electrically and mechanically connected to the rubber terminal 5 by a method such as welding, and a resin molded exterior 6 is applied to the entire body except for the comb-shaped terminal 5 to create a completed product. It was. (For example, see Japanese Utility Model Application Publication No. 57-183739 and Japanese Patent Application Publication No. 57-45221.) Problems to be Solved by the Invention Such chip aluminum electrolytic capacitors are designed to have solder heat resistance when mounted on a printed circuit board. Then, as mentioned above, the resin mold exterior 6
However, in general, the resin mold exterior 6 is heated at a temperature of 100℃ to 150℃ for about 5 minutes at 10Kg/cm 2
Under such harsh conditions, the driving electrolyte of the electrolytic capacitor evaporates, resulting in deterioration of characteristics such as a decrease in capacitance and an increase in tami. However, the problem was that it was extremely expensive. Furthermore, since it is a horizontal type,
When mounted on a printed circuit board, it occupies a large area of the printed circuit board, which is a factor that hinders miniaturization of various electronic devices.
本発明はこのような従来の欠点を除去するもの
で電解液の沸点を向上させて、プリント基板への
はんだ付時の耐熱性をもたせることにより、樹脂
モールドレスで縦置形のチツプアルミ電解コンデ
ンサを提供することを目的とするものである。 The present invention eliminates these conventional drawbacks by improving the boiling point of the electrolytic solution and providing heat resistance when soldering to a printed circuit board, thereby providing a vertically mounted chip aluminum electrolytic capacitor without resin molding. The purpose is to
問題点を解決するための手段
この目的を達成するために本発明は、電解液の
溶媒にｒ−ブチロラクトンと３−メチル−１，３
−オキサゾリジン−２−オンの沸点200℃以上の
高沸点溶媒二種類からなる電解液を含浸したコン
デンサ素子をケース内に収納し、かつ前記コンデ
ンサ素子に接続したリード線を同一端面より引出
してなるコンデンサ本体と、このコンデンサ本体
のリード線を引出した端面に当接するように配設
されかつ前記リード線が貫通する貫通孔を備えた
絶縁板とで構成し、前記絶縁板の、貫通孔を貫通
したリード線の先端部を絶縁板の外表面に沿つて
折曲して構成したものである。Means for Solving the Problems In order to achieve this object, the present invention uses r-butyrolactone and 3-methyl-1,3 as the solvent of the electrolyte.
- A capacitor formed by housing a capacitor element impregnated with an electrolytic solution consisting of two types of high-boiling solvents having a boiling point of oxazolidine-2-one of 200°C or higher in a case, and having lead wires connected to the capacitor element drawn out from the same end face. The capacitor is composed of a main body and an insulating plate provided with a through hole that is disposed so as to come into contact with an end surface from which a lead wire is drawn out of the capacitor main body and through which the lead wire passes, and the capacitor body has a through hole that is inserted through the through hole of the insulating plate. The tip of the lead wire is bent along the outer surface of the insulating plate.
作 用
本発明はこの構成によつてチツプアルミ電解コ
ンデンサをプリント基板に実装はんだ付する場合
でも、コンデンサ素子に200℃以上の高沸点溶媒
を用いた電解液を使用するため耐熱性に耐えるた
めの樹脂モールド外装が不必要となり、また安定
しているため、実装作業が極めて良好かつ高速化
が可能となる。又縦置タイプのため基板への取付
面積が小さくてすみ高密度実装化が図れやすくな
る。Effects The present invention has this configuration, even when a chip aluminum electrolytic capacitor is mounted and soldered on a printed circuit board, because the capacitor element uses an electrolytic solution containing a high boiling point solvent of 200°C or higher, a resin with high heat resistance is used. Since a mold exterior is not required and it is stable, the mounting work can be performed extremely well and at high speed. Also, since it is a vertically mounted type, the mounting area on the board is small, making it easier to achieve high-density mounting.
実施例
以下、本発明の一実施例を第１図および第２図
の図面を用いて説明する。なお、図中、第４図と
同一部品については同一番号を付している。Embodiment Hereinafter, an embodiment of the present invention will be described using the drawings of FIGS. 1 and 2. In addition, in the figure, the same parts as in FIG. 4 are given the same numbers.
図において、１は従来と同様なコンデンサ素子
であり、高純度アルミニウム箔を電気化学的に粗
面化し、その後陽極酸化を行つて誘電体酸化皮膜
を形成してなる陽極箔と、粗面化した陰極アルミ
ニウム箔とを間に絶縁紙を介して巻回し、そして
その巻回物に沸点206℃のｒ−ブチロラクトンと
沸点262℃の３−メチル−１，３−オキサゾリジ
ン−２−オンの二溶媒を重量比８（ｒ−ブチロラ
クトン）：２の割合で混合し、それに溶質を加え
た電解液を含浸して構成されている。このコンデ
ンサ素子１は有底筒状の金属ケース２内に収納さ
れている。また、前記コンデンサ素子１の陽極箔
と陰極箔とにはリード線４が接続されている。そ
して、金属ケース２の開放端は、弾性体７ａと非
弾性体７ｂとの二層構造からなる封口体７を装着
し封口されており外からのストレスがコンデンサ
素子１に伝わらないようにしてある。また、前記
コンデンサ素子１に接続したリード線４は、封口
体７を貫通して同一端面より外部に引出されてい
る。８はコンデンサ本体のリード線４を引出した
端面に当接するように配設した絶縁板であり、こ
の絶縁板８には、前記リード線４が貫通する貫通
孔８ａが設けられている。また、この絶縁板８の
外表面には、前記貫通孔８ａにつながる凹部８ｂ
が設けられ、前記貫通孔８ａを貫通したリード線
４の先端部４ａは前記凹部８ｂ内に収まるように
折曲されている。 In the figure, 1 is a capacitor element similar to the conventional one, with an anode foil made by electrochemically roughening a high-purity aluminum foil and then anodizing it to form a dielectric oxide film, and a roughened aluminum foil. The cathode aluminum foil was wound with insulating paper in between, and two solvents, r-butyrolactone with a boiling point of 206°C and 3-methyl-1,3-oxazolidin-2-one with a boiling point of 262°C, were added to the wound material. It is constructed by mixing the mixture at a weight ratio of 8 (r-butyrolactone): 2 and impregnating it with an electrolytic solution to which a solute is added. This capacitor element 1 is housed in a cylindrical metal case 2 with a bottom. Further, a lead wire 4 is connected to the anode foil and the cathode foil of the capacitor element 1. The open end of the metal case 2 is sealed with a sealing body 7 having a two-layer structure of an elastic body 7a and an inelastic body 7b, so that external stress is not transmitted to the capacitor element 1. . Further, the lead wire 4 connected to the capacitor element 1 passes through the sealing body 7 and is drawn out from the same end face. Reference numeral 8 denotes an insulating plate disposed so as to come into contact with the end face of the capacitor body from which the lead wire 4 is drawn out, and this insulating plate 8 is provided with a through hole 8a through which the lead wire 4 passes. Further, the outer surface of this insulating plate 8 has a recess 8b connected to the through hole 8a.
is provided, and the tip end 4a of the lead wire 4 passing through the through hole 8a is bent so as to fit within the recess 8b.
この場合、第３図ａ，ｂに示すように丸棒のリ
ード線４は先端部４ａに偏平加工を施し、折曲し
たものであつても、丸棒のリード線のままの状態
であつても良い。 In this case, as shown in FIGS. 3a and 3b, even if the round bar lead wire 4 is flattened at the tip 4a and bent, it remains the round bar lead wire. Also good.
このような構成とすることにより、プリント基
板に実装する場合には、第５図に示すように、本
発明のリードレスの電子部品２１をプリント基板
２２上にリード線による端子部が導電パターン２
３と接触するように配置するとともに、接着剤２
４で仮固定し、その後リフローなどの半田付け方
法を用い、半田２５によつて電子部品２１の端子
部をプリント基板２２の導電パターン２３に接続
固定すればよい。また、半田としてクリーム半田
を用いれば、接着剤を用いることなく、仮固定が
可能であり、この場合、実装も容易となる。 With this configuration, when mounting on a printed circuit board, the leadless electronic component 21 of the present invention is mounted on the printed circuit board 22 so that the terminal portion by the lead wire is connected to the conductive pattern 2, as shown in FIG.
3 and place it in contact with adhesive 2.
4, and then use a soldering method such as reflow to connect and fix the terminal portion of the electronic component 21 to the conductive pattern 23 of the printed circuit board 22 with the solder 25. Further, if cream solder is used as the solder, temporary fixation is possible without using adhesive, and in this case, mounting becomes easy.
発明の効果
以上のように本発明のチツプアルミ電解コンデ
ンサによれば、コンデンサ素子に、電解液の溶媒
にｒ−ブチロラクトンと３−メチル−１，３−オ
キサゾリジン−２−オンの混合溶媒を使用した電
解液を含浸しているため、電解液の沸点は１気圧
で215℃以上となり、そしてコンデンサの密封状
態ではさらにアツプするため、プリント基板への
コンデンサのはんだ付工程における熱ストレスと
いうものはなくなり、その結果、特性の劣化を防
止することができ、また実装作業も極めて良好
で、かつ高速化が可能となる。しかも樹脂モール
ド外装が不要となるため、コスト的にも安価に製
造できるという効果が得られるものである。Effects of the Invention As described above, according to the chip aluminum electrolytic capacitor of the present invention, the capacitor element is electrolyzed using a mixed solvent of r-butyrolactone and 3-methyl-1,3-oxazolidin-2-one as the solvent of the electrolytic solution. Because the electrolyte is impregnated with liquid, the boiling point of the electrolyte is over 215°C at 1 atm, and even higher when the capacitor is sealed, so there is no heat stress during the process of soldering the capacitor to the printed circuit board. As a result, deterioration of the characteristics can be prevented, and the mounting work can be performed very easily and at high speed. Moreover, since a resin molded exterior is not required, it is possible to produce the product at a low cost.
第１図は本発明の一実施例によるチツプアルミ
電解コンデンサを示す斜視図、第２図は本発明の
一実施例を示す一部分断面図、第３図ａ，ｂは本
発明の一実施例によるリード形状を示す斜視図、
第４図ａ，ｂは従来のチツプアルミ電解コンデン
サを示す断面図と側面図、第５図は本発明のコン
デンサのプリント基板への実装状態を示す正面図
である。
１……コンデンサ素子、２……金属ケース、４
……リード線、４ａ……先端部、７……封口体、
８……絶縁板、８ａ……貫通孔、８ｂ……凹部。
FIG. 1 is a perspective view showing a chip aluminum electrolytic capacitor according to an embodiment of the present invention, FIG. 2 is a partially sectional view showing an embodiment of the present invention, and FIGS. 3 a and b are leads according to an embodiment of the present invention. A perspective view showing the shape,
4a and 4b are a sectional view and a side view showing a conventional chip aluminum electrolytic capacitor, and FIG. 5 is a front view showing a state in which the capacitor of the present invention is mounted on a printed circuit board. 1...Capacitor element, 2...Metal case, 4
... Lead wire, 4a ... Tip part, 7 ... Sealing body,
8... Insulating plate, 8a... Through hole, 8b... Recess.
Claims (1)
チル−１，３−オキサゾリジン−２−オンの混合
溶媒を使用した電解液を含浸したコンデンサ素子
をケース内に収納し、かつ前記コンデンサ素子に
接続したリード線を同一端面より引出してなるコ
ンデンサ本体と、このコンデンサ本体のリード線
を引出した端面に当接するように配設され、かつ
前記リード線が貫通する貫通孔を備えた絶縁板と
で構成し、前記絶縁板の貫通孔を貫通したリード
線の先端部を前記絶縁板の外表面に沿つて折曲し
たことを特徴とするチツプアルミ電解コンデン
サ。 ２ 折曲されるリード線の先端部が板状である特
許請求の範囲第１項記載のチツプアルミ電解コン
デンサ。 ３ コンデンサ本体がゴム状弾性体と非ゴム状弾
性体とで構成された封口部材を有していることを
特徴とする特許請求の範囲第１項記載のチツプア
ルミ電解コンデンサ。[Scope of Claims] 1. A capacitor element impregnated with an electrolytic solution using a mixed solvent of γ-butyrolactone and 3-methyl-1,3-oxazolidin-2-one as the electrolytic solution solvent is housed in a case, and A capacitor body having a lead wire connected to the capacitor element drawn out from the same end face, and a through hole arranged so as to come into contact with the end face of the capacitor body from which the lead wire is drawn out, and through which the lead wire passes. 1. A chip aluminum electrolytic capacitor comprising an insulating plate, the tip of a lead wire passing through a through hole of the insulating plate being bent along the outer surface of the insulating plate. 2. The chip aluminum electrolytic capacitor according to claim 1, wherein the tip of the lead wire to be bent is plate-shaped. 3. The chip aluminum electrolytic capacitor according to claim 1, wherein the capacitor body has a sealing member made of a rubber-like elastic body and a non-rubber-like elastic body.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3483185A JPS61194706A (en) | 1985-02-22 | 1985-02-22 | Chip aluminum electrolytic capacitor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3483185A JPS61194706A (en) | 1985-02-22 | 1985-02-22 | Chip aluminum electrolytic capacitor |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS61194706A JPS61194706A (en) | 1986-08-29 |
| JPH0378774B2 true JPH0378774B2 (en) | 1991-12-16 |
Family
ID=12425142
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3483185A Granted JPS61194706A (en) | 1985-02-22 | 1985-02-22 | Chip aluminum electrolytic capacitor |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61194706A (en) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS547564A (en) * | 1977-06-20 | 1979-01-20 | Sanyo Electric Co | Electrolyte for driving electrolytic capacitor |
| JPS59211213A (en) * | 1983-05-17 | 1984-11-30 | 松下電器産業株式会社 | Electronic part |
-
1985
- 1985-02-22 JP JP3483185A patent/JPS61194706A/en active Granted
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS547564A (en) * | 1977-06-20 | 1979-01-20 | Sanyo Electric Co | Electrolyte for driving electrolytic capacitor |
| JPS59211213A (en) * | 1983-05-17 | 1984-11-30 | 松下電器産業株式会社 | Electronic part |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS61194706A (en) | 1986-08-29 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| EXPY | Cancellation because of completion of term |