JPS6164116A - Electronic part - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention relates to electronic components, and more specifically to a so-called leadless aluminum solid electrolytic capacitor having an organic semiconductor as a solid electrolyte.

Conventional structure and its problems A conventional chip type aluminum electrolytic capacitor was constructed as shown in FIGS. 1a and 1b. That is, an anode foil made by roughening aluminum foil and forming a dielectric oxide film by anodization, and a cathode foil made by roughening aluminum foil are wound through a separator and impregnated with a driving electrolyte. This capacitor element 1 is housed in a cylindrical metal case 2 with a bottom, and the open end is sealed using an elastic sealing material 3 such as rubber to form an aluminum electrolytic capacitor. Then, the single lead wire 4 drawn out from the aluminum electrolytic capacitor is electrically and mechanically connected to the comb-shaped terminal 6 by a method such as welding, and the entire body except the comb-shaped terminal 5 is coated with a molded resin sheath 6. It was made into a finished product.

When mounting such chip-type aluminum electrolytic capacitors on a printed circuit board, in order to have soldering heat resistance,
As mentioned above, the molded resin exterior 6 is applied, but generally the molded resin exterior 6 is used to pressurize the canopy at a temperature of 100°C to 150°C with a pressure of 1 kg/ca for about 5 minutes. Under these conditions, the driving electrolyte of the electrolytic capacitor evaporates, causing characteristic deterioration such as a decrease in capacitance and an increase in tan δ.Furthermore, because the capacitor is coated with molded resin, it becomes extremely expensive. It had some problems. Furthermore, since it is a horizontal type, when it is mounted on a printed circuit board, it occupies a large area of the printed circuit board, which is a factor that hinders miniaturization of various devices.

OBJECTS OF THE INVENTION The present invention eliminates such conventional drawbacks, and aims to provide a vertical type leadless electronic component that eliminates characteristic deterioration caused by the use of an electrolyte. It is.

Structure of the Invention To achieve this object, the present invention provides
A lead connected to the component element is configured such that a component element having a solid electrolyte containing a tetracyanoquinodimethane compound as a main component is housed in a case, and at the same time, a resin is also filled in the case to fix the component element. It consists of an electronic component main body with wires drawn out from the same end surface, and an insulating plate disposed so as to abut the end surface of the electronic component main body from which the lead wires are drawn out, and provided with a through hole through which the lead wires pass. A recess connected to the through hole is provided on the outer surface of the insulating plate, and a tip of a lead wire passing through the through hole is bent so as to fit within the recess.

With this configuration, when electronic components are mounted on a printed circuit board, the tips of the lead wires are housed in the recesses provided in the insulating board, so there is no protrusion at all on the surface of the insulating board that comes into contact with the printed circuit board. .

In other words, since the lead wire is in a so-called tangential position with the insulating plate, there is no tilting or wobbling of the electronic component, and the electronic component is stable, making it possible to perform the mounting work extremely well and at high speed.

DESCRIPTION OF EMBODIMENTS An embodiment of the present invention will be described below with reference to FIGS. 2 and 3 regarding an aluminum solid electrolytic capacitor. In addition, in the figure, the same parts as in FIG. 1 are given the same numbers.

In the figure, 1 is a capacitor element similar to the conventional one,
An anode foil made by electrochemically roughening high-purity aluminum foil and then anodizing it to form a dielectric oxide film, and a roughened cathode aluminum foil are wound with insulating paper interposed between them. , and is constructed using an organic semiconductor containing a 7,7,8,8-tetracyanoquinodimethane compound as a solid electrolyte in the wound material. This capacitor element 1 is housed in a cylindrical metal case 2 with a bottom. Further, a lead wire 4 is connected to the anode foil and the cathode foil of the capacitor element 1.

Then, the open end of the metal case 2 is filled with a thermosetting resin mixed with an acid anhydride curing agent to fix the capacitor element 1 and is sealed, thereby forming an electronic component body.

Further, the lead wire 4 connected to the capacitor element 1 is
It is drawn out from the same end surface.

Reference numeral 8 denotes an insulating plate disposed so as to come into contact with the end face of the electronic component main body from which the lead wire 4 is drawn out, and this insulating plate 8 is provided with a through hole 8a through which the lead wire 4 passes.

Further, a recess 8b connected to the through hole 8a is provided on the outer surface of the insulating plate 8, and the tip 4a of the lead wire 4 passing through the through hole 8a is bent so as to fit within the recess 8b. ing.

In this case, as shown in Fig. 4a and b, the round bar lead wire 4
The leading end portion 4a may be flattened and bent, or may be a round bar lead wire as it is.

Effects of the Invention As described above, according to the electronic component of the present invention, since a solid electrolyte is used, characteristics deterioration due to heat stress during soldering to a printed circuit board is eliminated, and an insulating plate having a recessed portion is used. In order to store the lead wire in this recess,
Since there is no inclination or wobbling when mounting on a printed circuit board, the mounting work can be performed extremely well and at high speed.

In addition, there is no need for a molded resin exterior, and it can be manufactured at low cost.

[Brief explanation of the drawing]

1a and 1b are cross-sectional views and side views showing a conventional chip-type aluminum electrolytic capacitor, FIG. 2 is a perspective view showing a leadless aluminum solid electrolytic capacitor according to an embodiment of the electronic component of the present invention, and FIG. FIGS. 4A and 4B are perspective views showing a lead shape according to an embodiment of the present invention. FIGS. 1...Capacitor element, 2...Metal case, 4...Lead wire, 4a...Tip, 7...Resin filler , 8...Insulating plate, 8a...Through hole, 8b...Recess. Figure 1 (a,) (b)
Figure 2

Claims (3)

[Claims] (1) Constructed by storing component elements using an organic semiconductor electrolyte whose main component is a 7,7,8,8-tetracyanoquinodimethane compound in a case, and at the same time filling the case with resin to fix the component elements. an electronic component body formed by a lead wire connected to the component element drawn out from the same end surface; and a through hole through which the lead wire passes and is arranged so as to come into contact with the end surface from which the lead wire is drawn out of the electronic component body. an insulating plate provided with a hole, a recess connected to the through hole is provided on the outer surface of the insulating plate, and a tip of a lead wire passing through the through hole is bent so as to fit in the recess. An electronic component characterized by: (2) The electronic component according to claim 1, wherein the tip of the lead wire accommodated in the recess is plate-shaped. (3) The electronic component according to claim 1, wherein the curing agent of the resin for fixing the component element is an acid anhydride-based curing agent.