JPS585373U - Printed board - Google Patents
Printed boardInfo
- Publication number
- JPS585373U JPS585373U JP9821681U JP9821681U JPS585373U JP S585373 U JPS585373 U JP S585373U JP 9821681 U JP9821681 U JP 9821681U JP 9821681 U JP9821681 U JP 9821681U JP S585373 U JPS585373 U JP S585373U
- Authority
- JP
- Japan
- Prior art keywords
- land portion
- solder land
- conductive pattern
- printed board
- small width
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Abstract] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第１図は従来のプリント基板の要部の平面図、第２図は
同要部断面図、第３図は本考案のプリント基板の要部の
平面図、第４図は同要部断面図、第５図Ａ、 Ｂ、 Ｃ
はプリント基板の製作工程を示す説明図である。
１・・・プリント基板、２・・・絶縁基板、３ａ、
３ｂ。
４・・・導電パターン、３ａ□・・・広幅の半田ランド
部、３ａ２・・・微少幅の半田ランド部、５・・・孔、
６・・・電極、７・・・リードレス部品、８・・・レジ
スト、９・・・半田。Fig. 1 is a plan view of the main parts of a conventional printed circuit board, Fig. 2 is a sectional view of the main parts, Fig. 3 is a plan view of the main parts of the printed circuit board of the present invention, and Fig. 4 is a sectional view of the main parts. , Figure 5 A, B, C
FIG. 2 is an explanatory diagram showing the manufacturing process of a printed circuit board. 1... Printed circuit board, 2... Insulating board, 3a,
3b. 4... Conductive pattern, 3a□... Wide solder land part, 3a2... Minute width solder land part, 5... Hole,
6... Electrode, 7... Leadless component, 8... Resist, 9... Solder.
Claims (1)
レス部品が挿入される孔を囲むよ・）に互いに連結され
た広幅の半田ランド部と微少幅の半田ランド部とを設け
ると共に、該微少幅の半田ランド部、近接する他の導電
パターン側に配置し、広幅の半田ランド部を除く、前記
導電パターンおよび微少幅の半田ランド部の上面にレジ
ストを施したことを特徴とするプリント基板。A conductive pattern for connecting leadless components by soldering is provided with a wide solder land portion and a small width solder land portion connected to each other surrounding the hole into which the leadless component is inserted. 1. A printed circuit board, characterized in that the solder land portion is placed on the side of another conductive pattern adjacent thereto, and a resist is applied to the upper surfaces of the conductive pattern and the small width solder land portion, excluding the wide solder land portion.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9821681U JPS585373U (en) | 1981-07-01 | 1981-07-01 | Printed board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9821681U JPS585373U (en) | 1981-07-01 | 1981-07-01 | Printed board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS585373U true JPS585373U (en) | 1983-01-13 |
Family
ID=29892982
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9821681U Pending JPS585373U (en) | 1981-07-01 | 1981-07-01 | Printed board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS585373U (en) |
-
1981
- 1981-07-01 JP JP9821681U patent/JPS585373U/en active Pending
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