JPH0614455Y2 - Resin exterior type electronic parts - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION [Industrial field of application] The present invention relates to a resin-coated electronic component such as a capacitor, a resistor, a thyristor, and a coil, and more particularly to a small resin-coated electronic component suitable for automatic mounting.

[Prior Art] FIG. 3 is a sectional view showing an example of a conventional resin-covered electronic component, and FIG. 4 is a side sectional view showing a state where the conventional example is held.

Conventionally, in this type of resin-covered electronic component, as shown in FIG. 3, the lead wires 4 and 5 are connected to the external electrodes 2 and 3 of the electronic component element 1 inside the package resin 6 and linearly connected to the outside. I was supposed to be drawn to. In this structure, electronic component device 1
Is small, the entire surface becomes spherical due to the surface tension of the resin when the exterior resin 6 is attached. The degree of this spherical shape depends only on the size of the electronic component element 1, and is a fate when the electronic component is downsized.

[Problems to be solved by the invention]

The claw that holds the electronic components of the mounting machine used when automatically mounting the electronic components on the wiring board has a flat contact portion with the electronic components in order to commonly hold several types of electronic components. The flat portion 7a on the inner side of the claw 7 holds the thickness of the electronic component shown in FIG. Therefore, when the size of the electronic component element 1 is sufficiently large, the outer side 6a of the resin has a relatively flat portion and can be easily held.

However, as described above, when the electronic component element 1 is miniaturized and the entire outer shape is spherical, the outer side 6a of the resin also has a round shape, so the claw 7 of the mounting machine has the electronic component element 1 Can not be held accurately, and there is a problem of causing an implementation error. Therefore, there is a disadvantage that a dedicated claw must be prepared for each part and a means for replacing the claw each time must be taken.

SUMMARY OF THE INVENTION It is an object of the present invention to solve the above conventional drawbacks and provide a resin-covered electronic component that does not cause a mounting error by using the same claw of an automatic mounting machine as other components.

In contrast to the conventional resin-clad electronic parts described above, the present invention has a difference in that the outer surface can be flattened without increasing the external dimensions, and the electronic parts of the mounting machine can be easily held by the claws. Have.

[Means for solving problems]

The resin-covered electronic component of the present invention has a structure in which both electrode portions of an electronic component element having a pair of electrodes at both ends are connected at the tip portions of a pair of lead wires that are parallel to each other. The portion has a flat plate shape, and the width of the tip portion is larger than the thickness of the electronic component element.

〔Example〕

 Next, the present invention will be described with reference to the drawings.

FIG. 1 is a sectional view of an embodiment of the present invention, and FIG. 2 is a side sectional view showing a state where the present embodiment is held.

In this embodiment, the electronic component element 1, the external electrodes 2 and 3, the lead wires 4 and 5, the lead wire tip flat portions 4a and 5a, the exterior resin 6,
The outer surface 6a of the exterior resin, the claw 7, and the flat surface 7a of the claw are included.

Small electronic component elements such as monolithic ceramic capacitors 1
In the external electrodes 2 and 3 at both ends of the electronic component element 1, the lead wire tip flat surface portions 4a and 5a have a dimension of 0.05 to 1 as compared with the end dimension of the electronic component element 1.
Connect the lead wires 4 and 5 that are mm-sized.

Next, the electronic component element 1 is dipped and coated with an epoxy-based thermosetting resin to apply the exterior resin 6. At this time, the exterior resin 6 not only covers the electronic component element 1 but also covers the tip end flat surface portions 4a, 5a of the lead wires 4, 5.
The electronic component element 1 is also covered with the exterior resin 6 so as to fill the stepped portion formed between the components 5a and 5a and the electronic component element 1. By doing so, the outer surface of the exterior resin 6 can be flattened.

As shown in FIG. 2, the flat end portions 4 of the lead wires 4 and 5 are formed.
The outer surface 6a of the exterior resin in which a and 5a are also covered with the exterior resin 6 has a flat shape, and the flat surface 7a inside the claw 7 of the automatic mounting machine can surely hold the electronic component element 1. I understand.

In the structure of the present embodiment, regardless of the size of the electronic component element 1, the dimensions of the flat end portions 4a, 5a of the lead wires 4, 5 are appropriately designed and provided so that the claws 7 of the automatic mounting machine can be used. The holding condition can be improved.

[Effect of device]

As described above, according to the present invention, the tip of the lead wire connected to the electronic component element is made flat, and the flat portion of the tip of the lead wire is made larger than the end dimension of the electronic component element so as to be flat on the side surface of the exterior resin. Since the part can be set wide,
The claw of the automatic mounter makes it easy to grip the electronic component, and has the effect that the claw common to other types of electronic components can be collectively mounted at the same time.

At the same time, the electronic component element, which has been limited in miniaturization of the electronic component due to the limitation of the gripping of the claw of the mounting machine, can be freely miniaturized, and it is expected that the cost can be reduced.

[Brief description of drawings]

FIG. 1 is a sectional view of an embodiment of the present invention, FIG. 2 is a side sectional view showing a state in which the present embodiment is held, and FIG. 3 is a sectional view showing an example of a conventional resin-clad electronic component. FIG. 4 is a side sectional view showing a state where the conventional example is held. 1 ... Electronic component element, 2, 3 ... External electrode, 4, 5 ...
Lead wire, 4a, 5a ... Lead wire bent portion, 6 ...
Exterior resin, 6a ... Outer surface of exterior resin, 7 ... Claw, 7a
…… The flat surface of the nail.

Claims (1)

[Scope of utility model registration request] 1. A resin-covered electronic component having a structure in which both electrode portions of an electronic component element having a pair of electrodes at both ends are connected to each other at the tip portions of a pair of parallel lead wires. Has a flat plate shape, the dimension of the lead wire tip connecting portion is larger than the end portion dimension of the electronic component element, and the dimension between the flat plate terminals is larger than the end portion dimension. Resin-clad electronic parts characterized by: