JPH02110308U - - Google Patents
Info
- Publication number
- JPH02110308U JPH02110308U JP1873689U JP1873689U JPH02110308U JP H02110308 U JPH02110308 U JP H02110308U JP 1873689 U JP1873689 U JP 1873689U JP 1873689 U JP1873689 U JP 1873689U JP H02110308 U JPH02110308 U JP H02110308U
- Authority
- JP
- Japan
- Prior art keywords
- coil
- chip
- lead terminals
- conductor wire
- type
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004020 conductor Substances 0.000 claims description 5
- 239000004593 Epoxy Substances 0.000 claims description 2
- 239000000853 adhesive Substances 0.000 claims description 2
- 230000001070 adhesive effect Effects 0.000 claims description 2
- 230000000694 effects Effects 0.000 claims 2
- 229910000679 solder Inorganic materials 0.000 claims 1
- 238000005476 soldering Methods 0.000 claims 1
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
Description
第１図は本考案の一実施例を示し、コイルの端
子台上端より露出するコイル部を樹脂により覆つ
た状態の一部透視外観斜視図。第２図は従来の一
例を示し、端子台にコイルを固定した状態の一部
透視外観斜視図。
１……リード端子、２……コア、３……導線か
らげ部、４……端子台、５……導線、６……モー
ルド樹脂、７……コア固定部、８……エポキシ等
接着剤。
FIG. 1 is a partially transparent external perspective view showing an embodiment of the present invention, in which the coil portion exposed from the upper end of the terminal block of the coil is covered with resin. FIG. 2 is a partially transparent external perspective view of a conventional example in which a coil is fixed to a terminal block. 1...Lead terminal, 2...Core, 3...Conductor binding part, 4...Terminal block, 5...Conductor wire, 6...Mold resin, 7...Core fixing part, 8...Adhesive such as epoxy .
Claims (1)
なリード端子の配列でモールド加工が施されたチ
ツプ型コイルにおいて、リード端子と導線端部と
の接続半田付け作業による熱的影響を小さくする
ため、コイル上部の導線及びコアがおおいかくさ
れる程度にエポキシ等接着剤を塗布した構造を特
徴とし、導線からげ部分を半田デイツプ等により
加工したときコイル部への熱的影響を小さくした
チツプ型コイル。 In chip-type coils that are molded with an array of lead terminals that can be surface-mounted on printed wiring boards of electronic devices, etc., in order to reduce the thermal effects of the connection soldering work between the lead terminals and the ends of the conductor wires, A chip-type coil characterized by a structure in which an adhesive such as epoxy is applied to such an extent that the conductor wire and core at the top of the coil are covered, and the thermal effect on the coil part is reduced when the exposed portion of the conductor wire is processed with a solder dip or the like.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1873689U JPH02110308U (en) | 1989-02-20 | 1989-02-20 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1873689U JPH02110308U (en) | 1989-02-20 | 1989-02-20 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02110308U true JPH02110308U (en) | 1990-09-04 |
Family
ID=31233641
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1873689U Pending JPH02110308U (en) | 1989-02-20 | 1989-02-20 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02110308U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH07197117A (en) * | 1993-12-28 | 1995-08-01 | Honda Motor Co Ltd | Coil body in induction hardening deice |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61113240A (en) * | 1984-11-07 | 1986-05-31 | Mitsubishi Electric Corp | Method for sealing electronic parts |
| JPS62213213A (en) * | 1986-03-14 | 1987-09-19 | Matsushita Electric Ind Co Ltd | Chip inductor |
-
1989
- 1989-02-20 JP JP1873689U patent/JPH02110308U/ja active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61113240A (en) * | 1984-11-07 | 1986-05-31 | Mitsubishi Electric Corp | Method for sealing electronic parts |
| JPS62213213A (en) * | 1986-03-14 | 1987-09-19 | Matsushita Electric Ind Co Ltd | Chip inductor |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH07197117A (en) * | 1993-12-28 | 1995-08-01 | Honda Motor Co Ltd | Coil body in induction hardening deice |
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