JPH0171429U - - Google Patents

Info

Publication number
JPH0171429U
JPH0171429U JP16750387U JP16750387U JPH0171429U JP H0171429 U JPH0171429 U JP H0171429U JP 16750387 U JP16750387 U JP 16750387U JP 16750387 U JP16750387 U JP 16750387U JP H0171429 U JPH0171429 U JP H0171429U
Authority
JP
Japan
Prior art keywords
electronic component
component piece
terminals
terminal
piece
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP16750387U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP16750387U priority Critical patent/JPH0171429U/ja
Publication of JPH0171429U publication Critical patent/JPH0171429U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch

Landscapes

  • Details Of Resistors (AREA)
  • Ceramic Capacitors (AREA)

Description

【図面の簡単な説明】[Brief explanation of drawings]

第１図は本考案の一実施例を示す平面図、第２
図はその側面図、第３図は第１図の切断面線−
から見た断面図、第４図、第５図および第６図
は電子部品１０の取付状態を説明するための図、
第７図は典型的な先行技術の平面図、第８図はそ
の側面図である。 １０……電子部品、１１，１２，１３，１４…
…端子、１５……被覆体、１６……電子部品片、
１８……リード線、２０……半田ペースト、２１
……基板、２２……配線。 Figure 1 is a plan view showing one embodiment of the present invention;
The figure is a side view, and Figure 3 is the section line of Figure 1.
4, 5 and 6 are diagrams for explaining the mounting state of the electronic component 10,
FIG. 7 is a plan view of a typical prior art device, and FIG. 8 is a side view thereof. 10...Electronic parts, 11, 12, 13, 14...
...Terminal, 15...Sheath, 16...Electronic component piece,
18...Lead wire, 20...Solder paste, 21
... Board, 22 ... Wiring.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 細長い複数の端子の長手方向の途中位置に複数
の端子にまたがつて電子部品片を接続し、この電
子部品片および電子部品片近傍の端子の部分を電
気絶縁性を有する合成樹脂製被覆体で被覆し、各
端子の両端部を被覆体から露出したことを特徴と
する電子部品。 An electronic component piece is connected to a plurality of elongated terminals midway in the longitudinal direction across the plurality of terminals, and the electronic component piece and the portion of the terminal near the electronic component piece are covered with a synthetic resin covering having electrical insulation properties. An electronic component characterized by being coated and having both ends of each terminal exposed from the cover.
JP16750387U 1987-10-30 1987-10-30 Pending JPH0171429U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP16750387U JPH0171429U (en) 1987-10-30 1987-10-30

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP16750387U JPH0171429U (en) 1987-10-30 1987-10-30

Publications (1)

Publication Number Publication Date
JPH0171429U true JPH0171429U (en) 1989-05-12

Family

ID=31455859

Family Applications (1)

Application Number Title Priority Date Filing Date
JP16750387U Pending JPH0171429U (en) 1987-10-30 1987-10-30

Country Status (1)

Country Link
JP (1) JPH0171429U (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012004594A (en) * 2011-09-02 2012-01-05 Renesas Electronics Corp Semiconductor device
US8816411B2 (en) 1999-01-28 2014-08-26 Renesas Electronics Corporation Mosfet package

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8816411B2 (en) 1999-01-28 2014-08-26 Renesas Electronics Corporation Mosfet package
JP2012004594A (en) * 2011-09-02 2012-01-05 Renesas Electronics Corp Semiconductor device

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