JPH01106073U - - Google Patents
Info
- Publication number
- JPH01106073U JPH01106073U JP103288U JP103288U JPH01106073U JP H01106073 U JPH01106073 U JP H01106073U JP 103288 U JP103288 U JP 103288U JP 103288 U JP103288 U JP 103288U JP H01106073 U JPH01106073 U JP H01106073U
- Authority
- JP
- Japan
- Prior art keywords
- terminals
- nline
- dip
- dual
- package
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000009977 dual effect Effects 0.000 claims 1
- 239000004020 conductor Substances 0.000 description 1
Landscapes
- Connections By Means Of Piercing Elements, Nuts, Or Screws (AREA)
Description
第1図は本考案の一実施例の斜視図、第2図は
第1図の実施例の接続ピンを詳細に示す平面図で
ある。
1……接続ピン、2……端子板、3……導線、
11……接点部、12……溝部、31……心線。
FIG. 1 is a perspective view of one embodiment of the present invention, and FIG. 2 is a plan view showing details of the connecting pin of the embodiment of FIG. 1. 1... Connection pin, 2... Terminal board, 3... Conductor,
11... Contact portion, 12... Groove portion, 31... Core wire.
Claims (1)
を先端に設けた接続ピンをDIP(Dual I
nline Package)型ICの端子と同
一ピツチで配列した構造を有して成ることを特徴
とする電気回路の無半田接続部品。 DIP (Dual I
1. A solderless connection component for an electric circuit, characterized in that it has a structure in which the terminals are arranged at the same pitch as the terminals of a (nline package) type IC.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP103288U JPH01106073U (en) | 1988-01-08 | 1988-01-08 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP103288U JPH01106073U (en) | 1988-01-08 | 1988-01-08 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH01106073U true JPH01106073U (en) | 1989-07-17 |
Family
ID=31200566
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP103288U Pending JPH01106073U (en) | 1988-01-08 | 1988-01-08 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH01106073U (en) |
-
1988
- 1988-01-08 JP JP103288U patent/JPH01106073U/ja active Pending
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