JP2007087011A - Non-contact type ic tag and method for manufacturing the same - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To surely insulate an interposer from the pattern of an antenna without interposing any insulating layer when joining the interposer to the antenna. <P>SOLUTION: In a non-contact type IC tag, an adhesive layer (5) is formed in either a base material (4) or a conductive layer (6) made of a metallic foil or an alloy film, and the conductive layer (6) is adhered across the adhesive layer (5) on one face of the base material (4), and an interposer (3) is joined to the opposite position of the conductive layer (6) on the other face of the base material (4), and the interposer (3) is electrically connected to the conductive layer (6). <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to a non-contact type IC tag produced using a non-contact type data carrier conductive member such as an antenna, an interposer, and a bridge, and a manufacturing method thereof.

  For example, a non-contact type IC tag used for a product is manufactured using a non-contact type data carrier conductive member such as an antenna or an interposer.

  Conventionally, the non-contact type IC tag 1 shown in FIGS. 11 and 12 is manufactured using an antenna 2 that is a non-contact type data carrier conductive member and an interposer 3 that is a non-contact type data carrier conductive member. . The antenna 2 has a layer configuration. That is, a thermoplastic adhesive layer 5 is printed in the same pattern as the pattern of the antenna 2 on the sheet-like base material 4, and a conductive layer made of a metal foil in the pattern of the antenna 2 on the thermoplastic adhesive layer 5. 6 is heat bonded. The end portions of the antenna 2 are electrically connected by an interposer 3.

  The interposer 3 is formed by electrically connecting strip-like conductive sheets 8 and 8 to electrodes (not shown) on both sides of the IC chip 7. These conductive sheets 8 and 8 are formed by bonding or laminating a conductive layer 10 made of a metal foil and an alloy foil on a base material 9 via an adhesive layer or the like.

  In the conventional example shown in FIG. 11, the IC chip 7 of the interposer 3 is mounted in the direction facing the antenna 2 through the insulating layer 11 from the surface side of the pattern of the antenna 2. In the conventional example shown in FIG. 12, the base material 9 of the interposer 3 is mounted in the direction facing the antenna 2 through the insulating layer 11 from the surface side of the pattern of the antenna 2.

  As a first means for forming the insulating layer 11, the insulating layer 11 is formed on the surface of the antenna 2. As a second means, an insulating layer 11 is formed on the surface of the conductive layer 6 of the pattern of the antenna 2. Further, as a third means, an insulating layer 11 is formed on the surface of the interposer 3.

An example of a method for forming an antenna that is a conductive member for a non-contact type data carrier is disclosed in Patent Document 1.
JP 2003-37427 A

  As described above, when the IC chip 7 of the interposer 3 is mounted on the antenna 2 so as to face the antenna 2 as shown in FIG. 11, in order to prevent short-circuiting with the antenna 2 pattern, It is necessary to provide an insulating layer 11 such as a film.

  In addition, when the substrate 9 of the interposer 3 is mounted in a direction facing the antenna 2 as shown in FIG. 12, if the substrate 9 of the interposer 3 is a PET (polyethylene-terephthalate) film, it has a slightly insulating role. However, there is a possibility of short-circuiting at the edge portion of the interposer 3 located on the pattern of the antenna 2, and in order to ensure reliability, it is necessary to provide the insulating layer 11 as described above.

  As a result, the number of manufacturing steps is increased, and the insulating layer 11 needs to be accurately positioned and interposed between the antenna 2 and the interposer 3, resulting in low production efficiency.

  The present invention has been made in order to solve the above-described problems, and the object of the present invention is to ensure that the interposer is securely attached to the antenna pattern without interposing an insulating layer when the interposer is joined to the antenna. An object of the present invention is to provide a non-contact type IC tag that can be insulated and improve production efficiency, and a method for manufacturing the same.

  In order to solve the above-mentioned problem, the invention according to claim 1 is such that the adhesive layer (5) is formed on either the base material (4) and the conductive layer (6) made of metal foil or alloy foil, The conductive layer (6) is bonded onto one surface of the base material (4) through the adhesive layer (5), and the interposer is disposed at the opposite position of the conductive layer (6) on the other surface of the base material (4). A non-contact type IC tag is employed in which (3) is joined and the interposer (3) is electrically connected to the conductive layer (6).

  The invention according to claim 2 is the non-contact type IC tag according to claim 1, wherein the interposer (3) has a metal foil (10) on the insulating base (9) on both sides of the IC chip (7). A non-contact type IC tag is employed, in which the laminated conductive sheets (8) are connected and the metal foil (10) side is joined to the other surface of the substrate (4).

  The invention according to claim 3 is the non-contact type IC tag according to claim 1, wherein an opening (4b) is formed at a joining position of the interposer (3) in the base material (4), and the opening (4b). A non-contact type IC tag is employed, in which the interposer (3) and the conductive layer (6) are electrically connected through each other.

  The invention according to claim 4 is the non-contact type IC tag according to claim 3, wherein the interposer (3) has the metal foil (10) on the insulating base (9) on both sides of the IC chip (7). The laminated conductive sheets (8) are connected, both sides of the insulating base (9) are formed short relative to the metal foil (10), and the insulating base (9) side is on the other side of the base (4) In the case of joining, a non-contact type IC tag characterized by the metal foil (10) facing the opening (4b) is adopted.

  The invention according to claim 5 includes an adhesion step of adhering the conductive layer (6) to one surface of the substrate (4) via the adhesive layer (5) while running the substrate (4), and on the substrate (4). A punching process for punching the conductive layer (6), and a bonding process for bonding the interposer (3) electrically connected to the conductive layer (6) at a position facing the conductive layer (6) on the other surface of the substrate (4). A method for manufacturing a non-contact type IC tag is employed.

  The invention according to claim 6 is the non-contact type IC tag manufacturing method according to claim 5, wherein the opening (4b) is formed at the joining position of the interposer (3) in the substrate (4). The manufacturing method of the non-contact type IC tag characterized by including these is employ | adopted.

  The invention according to claim 7 is the non-contact type IC tag manufacturing method according to claim 5 or 6, wherein the bonding step is performed after the opening forming step. The manufacturing method is adopted.

  According to the invention which concerns on Claim 1, an adhesive bond layer (5) is formed in any one of a base material (4) and a conductive layer (6) which consists of metal foil or alloy foil, and this adhesive bond layer ( 5), the conductive layer (6) is bonded onto one surface of the substrate (4), and the interposer (3) is bonded to the opposite position of the conductive layer (6) on the other surface of the substrate (4). Since the interposer (3) is a non-contact type IC tag electrically connected to the conductive layer (6), the interposer (3) can be reliably insulated from the pattern of the antenna (2). Therefore, the interposer (3) is not short-circuited with the pattern of the antenna (2), and the reliability can be improved.

  According to the invention according to claim 2, in the non-contact type IC tag according to claim 1, the interposer (3) has the metal foil (10 on the insulating substrate (9) on both sides of the IC chip (7). ) Are connected, and the metal foil (10) is electrically connected to the conductive layer (6) by joining the metal foil (10) side to the other surface of the base material (4). Since the base material (4) which is an insulating layer is only interposed when connecting to, it becomes easy to caulking or ultrasonic processing, and the connection work efficiency can be increased.

  According to the invention according to claim 3, in the non-contact type IC tag according to claim 1, the opening (4b) is formed at the joining position of the interposer (3) in the base material (4). Since the interposer (3) and the conductive layer (6) are electrically connected through 4b), the interposer (3) is electrically connected to the conductive layer (6) through a simple fixing mechanism through the opening (4b). Can be easily connected to.

  According to the invention according to claim 4, in the non-contact type IC tag according to claim 3, the interposer (3) has the metal foil (10 on the insulating substrate (9) on both sides of the IC chip (7). ) Is laminated, both sides of the insulating base material (9) are formed short with respect to the metal foil (10), and the insulating base material (9) side is the other side of the base material (4). When bonded to the surface, the metal foil (10) is opposed to the opening (4b), so that the metal foil (10) is not bonded to the conductive layer (6) via a conductive adhesive. Since direct connection is possible, connection work is facilitated.

  According to the invention which concerns on Claim 5, the adhesion process which adhere | attaches a conductive layer (6) on the one surface through a thermoplastic adhesive layer (5), making a base material (4) run, and a base material ( 4) A punching process for punching the conductive layer (6) above, and an interposer (3) electrically connected to the conductive layer (6) at the opposite position of the conductive layer (6) on the other surface of the substrate (4). Since the non-contact type IC tag manufacturing method includes a bonding step for bonding, the interposer (3) can be reliably insulated from the pattern of the antenna (2) without interposing an insulating layer. As a result, production efficiency can be improved.

  According to the invention which concerns on Claim 6, in the manufacturing method of the non-contact-type IC tag of Claim 5, the opening part which forms an opening part (4b) in the joining position of the interposer (3) in a base material (4) By including the forming step, the electrical connection work to the conductive layer (6) by the fixing device (23) such as caulking or ultrasonic processing can be simplified.

  According to the invention of claim 7, in the method of manufacturing a non-contact type IC tag according to claim 5 or 6, the base material (4) is obtained by performing the bonding step after performing the opening forming step. The opening (4b) can be easily formed at the joining position of the interposer (3).

  The best mode for carrying out the present invention will be described below with reference to the drawings. In the following embodiments and modifications, the same reference numerals are used for the same or corresponding parts as those in the conventional configuration shown in FIGS. 10 and 11.

<First Embodiment>
A non-contact type IC tag 1 shown in FIG. 1 is produced using an antenna 2 which is a non-contact type data carrier conductive member and an interposer 3 which is a non-contact type data carrier conductive member. The end portions of the antenna 2 are electrically connected by an interposer 3 as described later, and the surface of the antenna 2 is covered with a protective layer made of an adhesive layer as necessary.

  The antenna 2 has a layer configuration as shown in FIG. That is, the thermoplastic adhesive layer 5 is printed in the same pattern as the pattern of the antenna 2 on the surface (one surface) of the sheet-like base material 4 made of paper, resin, etc., and this thermoplastic adhesive layer 5 A conductive layer 6 made of a metal foil such as aluminum, copper, copper alloy, phosphor bronze, SUS or the like is heated and bonded in the pattern of the antenna 2.

  Here, the antenna has various patterns such as a bar-shaped pattern, a pad-shaped pattern, and a cross-shaped pattern depending on the communication frequency band in addition to the spiral pattern. And the protective layer which consists of an adhesion layer is laminated | stacked on the conductive layer 6 as needed.

  The thermoplastic adhesive layer 5 is applied to the pattern of the antenna 2 by a printing method such as ink jet printing, gravure printing, flexographic printing, offset printing, or screen printing.

  Since the thermoplastic adhesive layer 5 is formed on the base material 4 by such a printing method, the conductive layer 6 is formed on the base material 4 without being greatly raised, and the thermoplastic adhesion from below the conductive layer 6 is performed. The protrusion of the agent 5 is prevented.

  Moreover, the interposer 3 is joined to the opposing position where the conductive layer 6 is adhered on the back surface (the other surface) of the base material 4. As shown in FIG. 1, the interposer 3 is formed by electrically connecting strip-like conductive sheets 8 and 8 to electrodes (not shown) on both sides of the IC chip 7, respectively. Is electrically connected to the conductive layer 6 at the end of the antenna 2 by a fixing device such as caulking or ultrasonic machining.

  As shown in FIG. 2, the conductive sheets 8 and 8 have substantially the same layer structure as the antenna 2, and an adhesive layer or the like (not shown) is formed on a base material 9 that is relatively thinner than the base material 4 of the antenna 2. The conductive layer 10 made of metal foil such as aluminum, copper, copper alloy, phosphor bronze, SUS, or alloy foil is bonded or laminated. Note that a protective layer may be laminated on the conductive layer 10 as necessary, similarly to the antenna 2.

  As described above, in the present embodiment, the conductive layer 10 of the conductive sheets 8 and 8 of the interposer 3 is attached to the opposite position where the conductive layer 6 is adhered on the back surface of the substrate 4 by a fixing device such as caulking or ultrasonic processing. The substrate 4 is electrically connected to the conductive layer 6 at the end of the antenna 2.

  When the non-contact type IC tag 1 having the above configuration is used, various information is read or written in the electromagnetic field by the reading / writing device (not shown) with respect to the IC chip 7.

  Next, a method for manufacturing the non-contact type IC tag 1 will be described based on a manufacturing apparatus shown in FIG.

  (1) First, the continuous body 4a of the base material 4 and the continuous body 6a of the conductive layer 6 which is a metal foil are prepared, and both continuous bodies 4a and 6a are continuously run in the direction of the arrow at the same speed.

  (2) An inkjet nozzle 13 is disposed above the travel path of the continuum 4a of the substrate 4, and the inkjet nozzle 13 discharges the liquid thermoplastic adhesive 5a toward the surface of the continuum 4a of the substrate 4. To do. Thereby, the thermoplastic adhesive layer 5 is printed on the surface of the continuous body 4a of the base material 4 in the same pattern as the pattern of the antenna 2 at regular intervals. Note that the thermoplastic adhesive layer 5 may be printed on the surface of the continuous body 6a of the conductive layer 6 in the same pattern as the antenna 2 at regular intervals.

  (3) A dryer 14 is disposed downstream from the inkjet nozzle 13. The thermoplastic adhesive layer 5 printed on the surface of the continuous body 4a of the substrate 4 is dried by removing the solvent and the like contained therein by a dryer 14. The dryer 14 is omitted depending on the type of the thermoplastic adhesive 5a used.

  (4) The continuous body 6 a of the conductive layer 6, which is a metal foil, overlaps the continuous body 4 a of the base material 4 from above the thermoplastic adhesive layer 5 while being guided by the guide roller 15.

  (5) On the downstream side of the guide roller 15, the processing cylinder 16 and the receiving roller 17 are arranged so as to sandwich the continuous body 4 a of the base material 4 and the continuous body 6 a of the conductive layer 6 that is a metal foil.

  The processing cylinder 16 is a metal roller incorporating an electric heater (not shown), and a punching blade 18 corresponding to the pattern of the antenna 2 is formed on the peripheral surface thereof. For example, four sets of punching blades 18 for punching the pattern of one antenna 2 are arranged around the processing cylinder 16. However, the number of sets to be arranged differs depending on the antenna dimensions, machining cylinder diameter, and the like. A heat transfer body 19 is inserted between the blades of the pattern portion of the punching blade 18. The heat transfer body 19 is preferably made of a cushioning material made of rubber, heat-resistant resin or the like. It is also possible to form a portion corresponding to the heat transfer body 19 with the same material as the punching blade 18.

  Further, the receiving roller 17 is formed of a metal roller. The distance (gap) from the processing cylinder 16 can be adjusted in accordance with the thickness of the substrate 4 by changing the position of the metal roller. A rotary die can be used as the processing cylinder 16.

  The continuum 4a of the base material 4 and the continuum 6a of the conductive layer 6 which is a metal foil are drawn between the processing cylinder 16 and the receiving roller 17 in an overlapping state, and the pattern of the antenna 2 is formed on the metal foil by the punching blade 18. Is punched out. The punched conductive layer 6 of the antenna 2 pattern is pressed against the thermoplastic adhesive layer 5 having the same pattern as the antenna 2 on the continuous body 4 a of the base material 4 by the heat transfer body 19. At that time, the thermoplastic adhesive layer 5 is melted by heat transfer from the heat transfer body 19, and the conductive layer 6 is bonded to the base material continuous body 4 a by the melted thermoplastic adhesive layer 5. In this way, since the bonding process and the punching process of the conductive layer 6 are performed simultaneously, the antenna 2 can be manufactured easily and accurately. Further, the manufacturing apparatus is made compact and the installation space is reduced.

  Further, in the continuous body 4a of the base material 4, a cut is formed along the outline of the antenna 2 by the tip of the punching blade 18 obtained by punching the continuous body 6a of the conductive layer 6 which is a metal foil. As a result, the conductive layer 6 is accurately punched according to the pattern of the antenna 2, and the pattern outline of the antenna 2 is finely arranged.

  As shown in FIG. 3, the air holes 27 are preferably formed at locations corresponding to unnecessary portions other than the heat transfer body 19 in the processing cylinder 16. These air holes 27 function as suction means for sucking unnecessary portions to the punching blade 18 side, and also function as discharge means for discharging unnecessary portions from the punching blade 18 side after punching. That is, when the punching blade 18 punches the conductive layer 6 which is a metal foil, the air is sucked in the punching blade side, that is, in the direction of the arrow a from the air hole 27, thereby sucking the unnecessary portion to the punching blade side. Thereby, the conductive layer 6 is punched with a more accurate pattern. Further, after punching, air is blown out from the air hole 27 in the direction of the arrow b, and unnecessary portions are pushed out of the punching blade 18. Thereby, collection | recovery of an unnecessary part can be performed easily. Further, it is possible to prevent the unnecessary portion from clogging with the portion corresponding to the unnecessary portion other than the heat transfer body 19 in the processing cylinder 16.

  The air hole 27 may be connected to an intake mechanism and an exhaust mechanism (not shown) in a switchable manner, or an air hole connected to the intake mechanism and an air hole connected to the exhaust mechanism may be provided independently. Good.

  Separation rollers 20a and 20b are provided on the downstream side of the processing cylinder 16, and the continuum 4a of the base material 4 and the continuum 6a of the conductive layer 6 which is a metal foil are in different directions after passing through the separation rollers 20a and 20b. The antenna 2 travels in the direction of the arrow while being carried on the continuum 4a of the base material 4, and the unnecessary portion 6b of the metal foil travels in the direction of the arrow while being separated from the continuum 4a of the base material 4.

  (6) Further, the interposer 3 is supplied from the interposer supply device 22 to the back surface on the opposite side of the substrate 4 to which the conductive layer 6 is bonded, and the conductive sheets 8 and 8 are caulked or superposed as shown in FIG. It is electrically connected to the conductive layer 6 by a fixing device 23 that performs sonic processing or the like.

  Thereafter, the continuum 4a of the base material 4 is divided for each antenna 2 and used for manufacturing the non-contact IC tag 1 as described above, for example.

  The strip-shaped conductive sheet 9 of the interposer 3 can also be manufactured by a method and apparatus similar to the method and apparatus used for manufacturing the antenna 2.

  As described above, according to the non-contact type IC tag of the present embodiment, the interposer 3 is joined to the opposite position where the conductive layer 6 is adhered on the back surface (the other surface) of the base material 4, and this interposer 3 is connected to the conductive layer. Since the interposer 3 can be reliably insulated from the pattern of the antenna 2 by being electrically connected to the antenna 6, the interposer 3 is not short-circuited with the pattern of the antenna 2 and the reliability can be improved. .

  In the present embodiment, the conductive layer 10 is electrically connected to the conductive layer 6 by joining from the conductive layer 10 side of the interposer 3 to the opposite position where the conductive layer 6 is bonded on the back surface of the base material 4. Since the base material 4 which is an insulating layer is only interposed when connecting to the wire, crimping processing, ultrasonic processing, or the like is facilitated, and connection work efficiency can be increased.

  Furthermore, according to the manufacturing method of the non-contact type IC tag of the present embodiment, the pattern forming step of forming the thermoplastic adhesive layer 5 in a predetermined pattern on one surface of the substrate 4 while traveling, the thermoplasticity An adhesion process in which the conductive layer 6 is superposed on the adhesive layer 5 by heating and bonded, a punching process in which the conductive layer 6 is punched out in the above pattern on the base material 4, and the conductive layer 6 on the other surface of the base material 4 By including a joining step for joining the interposer 3 electrically connected to the conductive layer 6 at a position, the interposer 3 can be reliably insulated from the pattern of the antenna 2 without interposing an insulating layer. Production efficiency can be improved.

<Modification of Non-contact IC Tag of First Embodiment>
FIG. 5 is a sectional view showing a modification of the first embodiment of the non-contact type IC tag according to the present invention.

  In the modification shown in FIG. 5, the conductive sheet 6 on the back surface (the other surface) of the base material 4 is bonded to the opposing position from the base material 9 side of the conductive sheets 8 and 8 of the interposer 3. ing.

  In this modification, when the conductive layer 10 is electrically connected to the conductive layer 6, both the base material 4 and the base material 9, which are insulating layers, are interposed, so that the caulking process is performed as compared with the first embodiment. Alternatively, although ultrasonic processing or the like is somewhat difficult, the conductive layer 10 is electrically connected to the conductive layer 6 at the end of the antenna 2, and the same effect as in the first embodiment can be obtained.

  In addition, since the structure and manufacturing method except joining to the back surface of the base material 4 from the base material 9 side of the interposer 3 are the same as that of the said 1st Embodiment, the description is abbreviate | omitted.

<Modification of Manufacturing Method of Non-Contact IC Tag in First Embodiment>
A modification of the method for manufacturing the non-contact type IC tag 1 will be described based on a manufacturing apparatus shown in FIG. In the following manufacturing methods of the embodiment and the modified example, the same or corresponding parts as those in FIG. 3 for explaining the manufacturing method of the non-contact type IC tag in the first embodiment will be described using the same reference numerals.

  (1) First, the continuous body 4a of the base material 4 and the continuous body 6a of the conductive layer 6 which is a metal foil are prepared, and both continuous bodies 4a and 6a are continuously run in the direction of the arrow at the same speed. In addition, in the continuous body 6a of the conductive layer 6 that is a metal foil, the thermoplastic adhesive layer 5 is previously formed on the entire surface by solid printing or coating. Note that the thermoplastic adhesive layer 5 may be formed in advance on the entire surface of the continuous body 4a of the substrate 4 by solid printing or coating.

  (2) The continuous body 6 a of the conductive layer 6, which is a metal foil, overlaps the continuous body 4 a of the base material 4 from above the thermoplastic adhesive layer 5 while being guided by the guide roller 15.

  (3) Furthermore, the continuous body 4a of the base material 4 and the continuous body 6a of the conductive layer 6 which is a metal foil are drawn between the processing cylinder 16 and the receiving roller 17 in an overlapping state, and a punching blade 18 is formed on the metal foil. The pattern of the antenna 2 is punched out. The punched conductive layer 6 of the antenna 2 pattern is pressed against the thermoplastic adhesive layer 5 having the same pattern as the antenna 2 on the continuous body 4 a of the base material 4 by the heat transfer body 19.

  (4) A separation roller 21 is provided on the downstream side of the processing cylinder 16, and the continuum 4a of the base material 4 and the continuum 6a of the conductive layer 6 that is a metal foil are pulled in different directions after passing through the separation roller 21. The antenna 2 travels in the direction of the arrow while being supported on the continuum 4a of the base material 4, and the unnecessary portion 6b of the metal foil travels in the direction of the arrow while being separated from the continuum 4a of the base material 4.

  Since the following manufacturing method is the same as that of the first embodiment, the description thereof is omitted.

  Therefore, in this modified example, the thermoplastic adhesive layer 5 is not formed on one surface of the substrate 4 as in the first embodiment, but is previously formed on the conductive layer 6 by solid printing or coating. Yes.

  As described above, according to the manufacturing method of the non-contact type IC tag of the present modification, the thermoplastic adhesive layer 5 is formed on the entire surface of the continuous body 6a of the conductive layer 6 in advance by solid printing or coating. Since the pattern forming step for forming the thermoplastic adhesive layer 5 in a predetermined pattern is not required, the production efficiency can be further improved.

Second Embodiment
FIG. 7 is a cross-sectional view showing a second embodiment of the non-contact type IC tag according to the present invention, and FIG. 8 is a schematic side view showing a non-contact type IC tag manufacturing apparatus according to the second embodiment of the present invention.

  As shown in FIG. 7, in the present embodiment, a conductive bonding opening 4 b is formed at a portion where the conductive layer 6 is formed at the end of the antenna 2 of the base material 4, that is, at the joint position of the interposer 3 in the base material 4. The conductive layer 10 of the interposer 3 is electrically connected to the conductive layer 6 at the end of the antenna 2 by a fixing device 23 such as caulking or ultrasonic processing through the opening 4b.

  Moreover, in this embodiment, from the conductive layer 10 side of the conductive sheets 8 and 8 of the interposer 3 to the bonding position of the interposer 3 on the back surface on the opposite side of the base material 4 where the opening 4b for conductive bonding is formed in advance. I try to join them.

  Next, the manufacturing method of the non-contact type IC tag according to the second embodiment will be described based on the manufacturing apparatus shown in FIG.

  First, the continuous body 4a of the base material 4 and the continuous body 6a of the conductive layer 6 which is metal foil are prepared, and both continuous bodies 4a and 6a are continuously run at the same speed in the arrow direction. At this time, in the continuous body 4 a of the base material 4, the openings 4 b are formed at a constant pitch at the joining position of the interposer 3 by the opening forming device 24. This pitch is set for each position of the end of the antenna 2 carried on the continuous body 4 a of the base material 4. In addition, in the continuous body 6a of the conductive layer 6 which is a metal foil, the thermoplastic adhesive layer 5 is previously formed on the entire surface by solid printing or coating.

  Next, the continuum 6 a of the conductive layer 6, which is a metal foil, overlaps the continuum 4 a of the base material 4 from above the thermoplastic adhesive layer 5 while being guided by the guide roller 15. Since the following manufacturing method is the same as that of the first embodiment, the description thereof is omitted.

  As described above, according to the non-contact type IC tag of the present embodiment, the opening 4b is formed at the joining position of the interposer 3 in the base material 4, so that the interposer 3 is weak while applying heat, for example, through the opening 4b. The conductive layer 10 can be easily electrically connected to the conductive layer 6 by a simple fixing mechanism that performs caulking.

  Moreover, according to the manufacturing method of the non-contact type IC tag of the present embodiment, by including the opening forming step of forming the opening 4b at the joining position of the interposer 3 in the base material 4, caulking processing, ultrasonic processing, etc. It is possible to simplify the electrical connection work to the conductive layer 6 by the fixing device 23 that performs the above.

  Furthermore, according to the manufacturing method of the non-contact type IC tag of the present embodiment, after the opening forming step is performed by the opening forming device 24, the continuous body 6a of the conductive layer 6 is changed to the continuous body 4a of the base material 4. By performing the bonding process overlapping from above the thermoplastic adhesive layer 5, the opening 4 b can be easily formed at the bonding position of the interposer 3 in the base material 4.

<Modification of Second Embodiment>
FIG. 9 is a sectional view showing a modification of the second embodiment of the non-contact type IC tag according to the present invention.

  In the modification shown in FIG. 9, the base material of the conductive sheets 8 and 8 of the interposer 3 is formed on the back surface opposite to the base material 4 on which the conductive bonding opening 4 b is formed in advance and the conductive layer 6 is bonded. It is made to join from 9 side.

  In this modified example, when the conductive layer 10 is electrically connected to the conductive layer 6, caulking processing, ultrasonic processing, or the like is performed as compared with the second embodiment by interposing the base material 9 that is an insulating layer. Although somewhat difficult, the conductive layer 10 is electrically connected to the conductive layer 6 at the end of the antenna 2 through the base material 9 and the opening 4b by the fixing device 23, and the same effect as in the first embodiment can be obtained. .

  In addition, since the structure and manufacturing method except joining to the back surface of the base material 4 from the base material 9 side of the interposer 3 are the same as that of the said 2nd Embodiment, the description is abbreviate | omitted.

<Third Embodiment>
FIG. 10 is a cross-sectional view showing a third embodiment of the non-contact type IC tag according to the present invention.

  As shown in FIG. 10, in this embodiment, the opening 4b for conduction | bonding joining is previously formed in the joining position of the interposer 3 in the base material 4, and the length of the base material 9 of the interposer 3 is for conduction | electrical_connection joining. It is formed in advance shorter than the pitch of the openings 4b.

  Therefore, when joining to the back surface of the base material 4 from the base material 9 side of the interposer 3, the portion located at the opening 4b of the base material 9 is removed, and the conductive layer 10 faces the opening 4b. Become.

  Thus, according to the non-contact type IC tag of the present embodiment, the length of the base material 9 of the interposer 3 is formed in advance shorter than the pitch of the openings 4b for conduction bonding, and the interposer 3 is formed on the back surface of the base material 4. When joining from the base material 9 side, the part located in the opening 4b of the base material 9 is removed, and the conductive layer 10 is formed so that the conductive layer 10 faces the opening 4b. Since 10 can be directly connected without bonding via a conductive adhesive, the connection work is facilitated.

  Since other configurations and manufacturing methods are the same as those of the second embodiment, description thereof is omitted.

  Further, in each of the above-described embodiments and modifications, an example in which a thermoplastic adhesive is used as the adhesive layer has been described. However, the present invention is not limited thereto, and UV (ultraviolet) curable adhesive or EB (electron beam) A curable adhesive may be used.

It is a perspective view which shows the outline of the wireless tag made using the antenna and interposer which concern on this invention. It is sectional drawing which shows 1st Embodiment of the non-contact-type IC tag which concerns on this invention. It is a schematic side view which shows the manufacturing apparatus of the non-contact type IC tag which concerns on 1st Embodiment of this invention. It is a schematic perspective view which shows the fixing operation | movement of the interposer which concerns on 1st Embodiment. It is sectional drawing which shows the modification of 1st Embodiment of the non-contact-type IC tag which concerns on this invention. It is a schematic side view which shows the manufacturing apparatus of the non-contact-type IC tag which concerns on the modification of 1st Embodiment of this invention. It is sectional drawing which shows 2nd Embodiment of the non-contact-type IC tag which concerns on this invention. It is a schematic side view which shows the manufacturing apparatus of the non-contact type IC tag which concerns on 2nd Embodiment of this invention. It is sectional drawing which shows the modification of 2nd Embodiment of the non-contact-type IC tag which concerns on this invention. It is sectional drawing which shows 3rd Embodiment of the non-contact-type IC tag which concerns on this invention. It is sectional drawing which shows the conventional non-contact-type IC tag. It is sectional drawing which shows the other conventional non-contact type IC tag.

Explanation of symbols

DESCRIPTION OF SYMBOLS 3 ... Interposer 4 ... Base material 4a ... Continuous body of base material 4b ... Opening part 5 ... Thermoplastic adhesive layer (adhesive layer)
6 ... conductive layer 6a ... continuum of conductive layer 7 ... IC chip 8 ... conductive sheet 9 ... base material (insulating base material)
DESCRIPTION OF SYMBOLS 10 ... Conductive layer 15 ... Guide roller 16 ... Processing cylinder 17 ... Receiving roller 18 ... Punching blade 22 ... Interposer supply apparatus 23 ... Fixing device 24 ... Opening part formation apparatus

Claims (7)

  An adhesive layer is formed on any one of the base material and the conductive layer made of metal foil or alloy foil, and the conductive layer is bonded onto one surface of the base material through the adhesive layer, A non-contact type IC tag, wherein an interposer is joined to a position opposite to the conductive layer on the other surface of the substrate, and the interposer is electrically connected to the conductive layer.   2. The non-contact type IC tag according to claim 1, wherein the interposer has a conductive sheet in which a metal foil is laminated on an insulating base material connected to both sides of the IC chip, and the metal foil side is connected to the other side of the base material. A non-contact type IC tag characterized in that it is bonded to the surface.   The contactless IC tag according to claim 1, wherein an opening is formed at a position where the interposer is bonded to the base material, and the interposer and the conductive layer are electrically connected through the opening. A non-contact type IC tag characterized.   4. The non-contact type IC tag according to claim 3, wherein the interposer has a conductive sheet in which a metal foil is laminated on an insulating base material connected to both sides of the IC chip, and both sides of the insulating base material are the metal foil. The non-contact type IC tag is characterized in that the metal foil faces the opening when the insulating base is bonded to the other surface of the base.   An adhesion step of adhering a conductive layer to one surface of the substrate while an adhesive layer is being run, a punching step of punching out the conductive layer on the substrate, and the conductivity on the other surface of the substrate A non-contact type IC tag manufacturing method comprising: a bonding step of bonding an interposer electrically connected to the conductive layer at a position opposite to the layer.   6. The method of manufacturing a non-contact type IC tag according to claim 5, further comprising an opening forming step of forming an opening at a position where the interposer is bonded to the base material. .   7. The method of manufacturing a non-contact type IC tag according to claim 5, wherein the bonding step is performed after the opening forming step.

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