JP4150312B2 - Manufacturing method of sheet with non-contact IC tag - Google Patents

Manufacturing method of sheet with non-contact IC tag Download PDF

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JP4150312B2
JP4150312B2 JP2003310123A JP2003310123A JP4150312B2 JP 4150312 B2 JP4150312 B2 JP 4150312B2 JP 2003310123 A JP2003310123 A JP 2003310123A JP 2003310123 A JP2003310123 A JP 2003310123A JP 4150312 B2 JP4150312 B2 JP 4150312B2
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sheet
shaped conductor
strip
band
contact
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JP2005078492A (en
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元 功 松
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Dai Nippon Printing Co Ltd
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本発明は、外部のリーダ・ライタと非接触でデータの授受を行うことができる非接触ICタグを有する非接触ICタグ付シートの製造方法に関する。   The present invention relates to a method of manufacturing a sheet with a non-contact IC tag having a non-contact IC tag that can exchange data with an external reader / writer in a non-contact manner.

従来より外部のリーダ・ライタと非接触でデータの授受を行う非接触ICタグは、ICチップとアンテナ回路とを有しており、このような非接触ICタグは基材シートに設けられ、このようにして非接触ICタグ付シートが得られる。   Conventionally, a non-contact IC tag that exchanges data without contact with an external reader / writer has an IC chip and an antenna circuit, and such a non-contact IC tag is provided on a base sheet. Thus, a non-contact IC tag-attached sheet is obtained.

上述のように、非接触ICタグ付シートは、基材シートと、基材シートに設けられたICチップおよびアンテナ回路とを有している。この場合、ICチップはアンテナ回路の所定位置に位置決めされた後、実装される。しかしながらICチップの位置決めは煩雑であり、高精度を必要とするためICチップの実装作業が困難となっているのが実情である。   As described above, the non-contact IC tag-attached sheet includes a base sheet, an IC chip and an antenna circuit provided on the base sheet. In this case, the IC chip is mounted after being positioned at a predetermined position of the antenna circuit. However, the positioning of the IC chip is complicated and requires high accuracy, so that it is difficult to mount the IC chip.

本発明はこのような点を考慮してなされたものであり、アンテナ回路に対するICチップの位置決めおよび実装作業を容易に行なうことができる非接触ICタグ付シートの製造方法を提供することを目的とする。   The present invention has been made in consideration of such points, and an object of the present invention is to provide a method of manufacturing a sheet with a non-contact IC tag that can easily perform positioning and mounting of an IC chip with respect to an antenna circuit. To do.

本発明は、一方の帯状導電体を供給する工程と、この一方の帯状導電体上に、開口を有する非導電体シートを供給して積層する工程と、非導電体シートの開口内に、両面に各々電極を有するICチップを順次実装する工程と、非導電体シート上に他方の帯状導電体を供給して積層し、これら一方の帯状導電体、非導電体シート、ICチップおよび他方の帯状導電体によりシート体を形成する工程と、を備えたことを特徴とする非接触ICタグ付シートの製造方法である。   The present invention includes a step of supplying one band-shaped conductor, a step of supplying and laminating a non-conductive sheet having an opening on the one band-shaped conductor, and a double-sided surface in the opening of the non-conductive sheet. A step of sequentially mounting IC chips each having an electrode, and supplying and laminating the other band-shaped conductor on the non-conductive sheet, one of these band-shaped conductors, non-conductive sheet, IC chip and the other band-shaped And a step of forming a sheet body with a conductor.

本発明は、シート体をICチップ毎に打抜きまたは切断し、一方の帯状導電体および他方の帯状導電体から一方のアンテナ回路および他方のアンテナ回路を形成する工程と、を更に備えたことを特徴とする非接触ICタグ付シートの製造方法である。   The present invention further comprises a step of punching or cutting a sheet body for each IC chip, and forming one antenna circuit and the other antenna circuit from one band-shaped conductor and the other band-shaped conductor. It is a manufacturing method of the sheet | seat with a non-contact IC tag.

本発明は、一方の帯状導電体は、一方の基材シートに保持され、一方の帯状導電体は一方の基材シートとともに供給されることを特徴とする非接触ICタグ付シートの製造方法である。   One aspect of the present invention is a method for producing a sheet with a non-contact IC tag, wherein one band-shaped conductor is held on one base sheet, and one band-shaped conductor is supplied together with one base sheet. is there.

本発明は、他方の帯状導電体は、他方の基材シートに保持され、他方の帯状導電体は他方の基材シートとともにに供給されることを特徴とする非接触ICタグ付シートの製造方法である。   The present invention provides a method for producing a sheet with a non-contact IC tag, wherein the other strip-shaped conductor is held on the other base sheet, and the other strip-shaped conductor is supplied together with the other base sheet. It is.

本発明によれば、アンテナ回路に対するICチップの位置決めおよび実装作業を容易に行なうことができ、これにより非接触ICタグ付シートを容易かつ簡単に製造することができる。   According to the present invention, it is possible to easily position and mount the IC chip with respect to the antenna circuit, and thereby it is possible to easily and easily manufacture the non-contact IC tag-attached sheet.

以下、図面を参照して本発明の実施の形態について説明する。   Embodiments of the present invention will be described below with reference to the drawings.

図1乃至図3は、本発明による非接触ICタグ付シートの製造方法の一実施の形態を示す図である。   1 to 3 are diagrams showing an embodiment of a method for producing a sheet with a non-contact IC tag according to the present invention.

まず図2および図3により、非接触ICタグ付シートについて説明する。非接触ICタグ付シート1は、開口26を有する非導電体シート25と、非導電体シート25の開口26内に収納され両面に各々電極21,22を有するICチップ20とを備えている。非導電体シート25の下面には一方のアンテナ回路34aと一方の基材シート31aが順次設けられ、非導電体シート25の上面には他方のアンテナ回路34bと他方の基材シート31bが順次設けられている。   First, the non-contact IC tag-attached sheet will be described with reference to FIGS. The non-contact IC tag-attached sheet 1 includes a non-conductive sheet 25 having an opening 26 and an IC chip 20 housed in the opening 26 of the non-conductive sheet 25 and having electrodes 21 and 22 on both sides. One antenna circuit 34a and one base sheet 31a are sequentially provided on the lower surface of the non-conductive sheet 25, and the other antenna circuit 34b and the other base sheet 31b are sequentially provided on the upper surface of the non-conductive sheet 25. It has been.

この場合、一方のアンテナ回路34aは非導電体シート25の幅方向において左端からICチップ20を越えて延び、他方のアンテナ回路34bは非導電体シート25の幅方向において右端からICチップ20を越えて延びている(図2参照)。またICチップ20はICチップ本体20aと、ICチップ本体20aの下面に設けられた一方の電極21と、ICチップ本体20aの上面に設けられた他方の電極22とを有している。そして一方の電極21は、一方のアンテナ回路34aに接続され、他方の電極22は他方のアンテナ回路34bに接続されている。   In this case, one antenna circuit 34a extends beyond the IC chip 20 from the left end in the width direction of the non-conductive sheet 25, and the other antenna circuit 34b exceeds the IC chip 20 from the right end in the width direction of the non-conductive sheet 25. (See FIG. 2). The IC chip 20 has an IC chip body 20a, one electrode 21 provided on the lower surface of the IC chip body 20a, and the other electrode 22 provided on the upper surface of the IC chip body 20a. One electrode 21 is connected to one antenna circuit 34a, and the other electrode 22 is connected to the other antenna circuit 34b.

なお、一方のアンテナ回路34aを非導電体シート25の右端からICチップ20を超えて延ばし、他方のアンテナ回路34bを非導電体シート25の左端からICチップ20を超えて延ばしてもよい。   One antenna circuit 34 a may extend from the right end of the non-conductive sheet 25 over the IC chip 20, and the other antenna circuit 34 b may extend from the left end of the non-conductive sheet 25 over the IC chip 20.

このような構成からなる非接触ICタグ付シート1は、通常の非接触ICタグ付シートとして用いることができるが、通常の非接触ICタグ付シートを作製するための非接触ICタグ付シート部材としても用いることができる。   The non-contact IC tag-attached sheet 1 having such a configuration can be used as a normal non-contact IC tag-attached sheet, but a non-contact IC tag-attached sheet member for producing a normal non-contact IC tag-attached sheet Can also be used.

なお、一方のアンテナ回路34aに一方の基材シート31aを設け、他方のアンテナ回路34bに他方の基材シート31bを設けた例を示したが、後述のように一方の基材シート31aおよび他方の基材シート31bは取除くこともできる。   In addition, although the example which provided one base material sheet 31a in one antenna circuit 34a and provided the other base material sheet 31b in the other antenna circuit 34b was shown, one base material sheet 31a and the other were provided as mentioned later. The base sheet 31b can also be removed.

次に図1により非接触ICタグ付シートの製造方法について説明する。   Next, a method for manufacturing a sheet with a non-contact IC tag will be described with reference to FIG.

まず、銅箔またはアルミ箔製の一方の帯状導電体14aと、この帯状導電体14aを接着して保持する紙、PETまたはポリイミド製の一方の基材シート11aとからなる積層体が供給される。同時に一方の基材シート11aおよび一方の帯状導電体14a上に、紙、PETまたはポリイミド製の非導電体シート25が供給されて積層される。この非導電体シート25は、ICチップ20を収納する複数の開口26が予め形成されている。   First, a laminate composed of one strip-shaped conductor 14a made of copper foil or aluminum foil and paper for bonding and holding the strip-shaped conductor 14a, one base sheet 11a made of PET or polyimide is supplied. . At the same time, a non-conductive sheet 25 made of paper, PET, or polyimide is supplied and laminated on one base sheet 11a and one strip-shaped conductor 14a. In this non-conductive sheet 25, a plurality of openings 26 for accommodating the IC chip 20 are formed in advance.

これら一方の基材シート11a、一方の帯状導電体14aおよび非導電体シート25はニップローラ35を経てニップローラ36側へ送られる。   The one base sheet 11a, the one strip conductor 14a, and the non-conductor sheet 25 are fed to the nip roller 36 side through the nip roller 35.

ニップローラ35からニップローラ36へ供給される非導電体シート25の開口26内に両面に電極21,22を有するICチップ20が充填されて実装される。   The IC chip 20 having the electrodes 21 and 22 is filled and mounted in the opening 26 of the non-conductive sheet 25 supplied from the nip roller 35 to the nip roller 36.

次に、非導電体シート25上に銅箔またはアルミ箔製の他方の帯状導電体14bと、この他方の帯状導電体14bを接着して保持する紙、PETまたはポリイミド製の他方の基材シート11bとからなる積層体が供給されて積層される。   Next, the other strip-shaped conductor 14b made of copper foil or aluminum foil on the non-conductive sheet 25, and the other substrate sheet made of paper, PET or polyimide that adheres and holds the other strip-shaped conductor 14b A laminate composed of 11b is supplied and laminated.

上述のように、基材シート11a、11bおよび非導電体シート25は、紙、PETまたはポリイミド製となっているが、その他高絶縁性、耐熱性、機械的強度、薄さ等を設計事項として考慮した材料を用いてもよい。   As described above, the base material sheets 11a and 11b and the non-conductive sheet 25 are made of paper, PET, or polyimide, and other high insulation properties, heat resistance, mechanical strength, thinness, and the like are design matters. Considered materials may be used.

なお、図1の供給方向Lに向って一方の帯状導電体14aは一方の基材シート11aの上面において、幅方向の左端から中央部よりわずか右側まで延びている。また、他方の帯状導電体14bは他方の基材シート11bの下面において、幅方向の右端から中央部よりわずか左側まで延びている。このため、一方の帯状導電体14aと他方の帯状導電体14bは、ICチップ20近傍において、幅方向に関して互いに重なりあっている(図2参照)。   In addition, one strip | belt-shaped conductor 14a is extended from the left end of the width direction to the right side from the center part in the upper surface of one base material sheet 11a toward the supply direction L of FIG. Further, the other strip-shaped conductor 14b extends from the right end in the width direction to the left side slightly from the central portion on the lower surface of the other base sheet 11b. For this reason, one strip-shaped conductor 14a and the other strip-shaped conductor 14b overlap each other in the width direction in the vicinity of the IC chip 20 (see FIG. 2).

このようにして積層された一方の基材シート11aと、一方の帯状導電体14aと、非導電体シート25と、他方の帯状導電体14bと、他方の基材シート11bとからなる積層体は、ニップローラ36により押圧される。この場合、非導電体シート25と一方の帯状導電体14aとの間、および非導電体シート25と他方の帯状導電体14bとの間が、図示しない接着剤を介して接着される。   Thus, the laminated body which consists of one base material sheet 11a laminated | stacked in this way, one strip | belt-shaped conductor 14a, the nonconductor sheet 25, the other strip | belt-shaped conductor 14b, and the other base material sheet 11b is obtained. The nip roller 36 is pressed. In this case, the non-conductive sheet 25 and one strip-shaped conductor 14a and the non-conductive sheet 25 and the other strip-shaped conductor 14b are bonded via an adhesive (not shown).

このようにして一方の基材シート11a、一方の帯状導電体14a、非導電体シート25、他方の帯状導電体14b、他方の基材シート11bとからなるシート体10が得られる。次にシート体10は、シート体10の供給方向Lに直交する方向にカッタ27により個々のICチップ毎に切断される。   In this way, the sheet body 10 including the one base sheet 11a, the one strip conductor 14a, the non-conductor sheet 25, the other strip conductor 14b, and the other base sheet 11b is obtained. Next, the sheet body 10 is cut into individual IC chips by the cutter 27 in a direction orthogonal to the supply direction L of the sheet body 10.

この場合、シート体10が切断されて、一方の帯状導電体14aおよび他方の帯状導電体14bから各々アンテナ回路34a,34bが形成される。   In this case, the sheet body 10 is cut, and the antenna circuits 34a and 34b are formed from the one strip-shaped conductor 14a and the other strip-shaped conductor 14b, respectively.

なお、シート体10をシート体10の供給方向Lに直交する方向に切断する代わりに、シート体10をICチップ毎に打ち抜いてもよい。   Instead of cutting the sheet body 10 in a direction orthogonal to the supply direction L of the sheet body 10, the sheet body 10 may be punched for each IC chip.

このようにして基材シート31aと、アンテナ回路34aと、ICチップ20が実装された非導電体シート25と、アンテナ回路34bと、基材シート31bとを有する非接触ICタグ付シート1が得られる。   In this way, the non-contact IC tag-attached sheet 1 having the base sheet 31a, the antenna circuit 34a, the non-conductive sheet 25 on which the IC chip 20 is mounted, the antenna circuit 34b, and the base sheet 31b is obtained. It is done.

以上のように本実施の形態によれば、一方の基材シート11aに保持された一方の帯状導電体14a上に非導電体シート25を積層し、非導電体シート25の開口26内にICチップ20を実装し、次に非導電体シート25上に他方の基材シート11bに保持された他方の帯状導電体14bを積層することによりシート体10を得ることができる。そしてこのシート体10をICチップ20毎に切断することにより、容易に非接触ICタグ付シート1を得ることができる。   As described above, according to the present embodiment, the non-conductive sheet 25 is laminated on the one strip-shaped conductor 14 a held by the one base sheet 11 a, and the IC is placed in the opening 26 of the non-conductive sheet 25. The sheet body 10 can be obtained by mounting the chip 20 and then laminating the other strip-shaped conductor 14 b held by the other base sheet 11 b on the non-conductive sheet 25. And the sheet | seat 1 with a non-contact IC tag can be easily obtained by cut | disconnecting this sheet | seat body 10 for every IC chip 20. FIG.

この場合、非導電体シート25の開口26にICチップ20を収納するだけでICチップ20を実装することができるので、ICチップ20の位置決めおよび実装作業を容易かつ簡単に行なうことができる。   In this case, since the IC chip 20 can be mounted simply by housing the IC chip 20 in the opening 26 of the non-conductive sheet 25, the positioning and mounting work of the IC chip 20 can be performed easily and easily.

なお、上記実施の形態において、一方の帯状導電体14aが一方の基材シート11aにより保持され、他方の帯状導電体14bが他方の基材シート11bにより保持される例を示したが、これに限らず一方の基材シート11aを取除いて一方の帯状導電体14aのみを供給するとともに、他方の基材シート11bを取除いて他方の帯状導電体シート14bのみを供給してもよい。   In the above embodiment, an example is shown in which one strip conductor 14a is held by one base sheet 11a and the other strip conductor 14b is held by the other base sheet 11b. Not only may one base sheet 11a be removed and only one strip conductor 14a be supplied, but the other base sheet 11b may be removed and only the other strip conductor sheet 14b may be supplied.

本発明による非接触ICタグ付シートの製造方法の一実施の形態を示す図。The figure which shows one Embodiment of the manufacturing method of the sheet | seat with a non-contact IC tag by this invention. 非接触ICタグ付シートを示す側断面図。The sectional side view which shows a sheet | seat with a non-contact IC tag. ICチップを示す側断面図。The side sectional view showing an IC chip.

符号の説明Explanation of symbols

1 非接触ICタグ付シート
11a 一方の基材シート
11b 他方の基材シート
14a 一方の帯状導電体
14b 他方の帯状導電体
20 ICチップ
21 電極
22 電極
25 非導電体シート
26 開口
27 カッタ
31a 一方の基材シート
31b 他方の基材シート
34a 一方のアンテナ回路
34b 他方のアンテナ回路
DESCRIPTION OF SYMBOLS 1 Sheet | seat 11 with a non-contact IC tag One base sheet 11b The other base sheet 14a One strip | belt-shaped conductor 14b The other strip | belt-shaped conductor 20 IC chip 21 Electrode 22 Electrode 25 Non-conductor sheet 26 Opening 27 Cutter 31a Base sheet 31b The other base sheet 34a One antenna circuit 34b The other antenna circuit

Claims (4)

一方の帯状導電体を供給する工程と、
この一方の帯状導電体上に、複数の開口を有する非導電体シートを供給して積層する工程と、
非導電体シートの開口内に、両面に各々電極を有するICチップを順次実装する工程と、
非導電体シート上に他方の帯状導電体を供給して積層し、一方の帯状導電体は非導電体シートの幅方向の一端から開口をわずかに越えた位置まで延び、他方の帯状導電体は非導電体シートの幅方向の他端から開口をわずかに越えた位置まで延びて、一方の帯状導電体と他方の導電体は非導電体シートの幅方向で開口近傍において互いに重なり合い、これら一方の帯状導電体、非導電体シート、複数のICチップおよび他方の帯状導電体によりシート体を形成するとともに、各ICチップの一方の電極を一方の帯状導電体に接続し、他方の電極を他方の帯状導電体に接続する工程と、を備えたことを特徴とする非接触ICタグ付シートの製造方法。
Supplying one strip conductor;
A step of supplying and laminating a non-conductive sheet having a plurality of openings on the one band-shaped conductor;
A step of sequentially mounting IC chips each having electrodes on both sides in each opening of the non-conductive sheet;
The other band-shaped conductor is supplied and laminated on the non-conductive sheet, and one band-shaped conductor extends from one end in the width direction of the non-conductive sheet to a position slightly beyond the opening, and the other band-shaped conductor is It extends from the other end in the width direction of the non-conductive sheet to a position slightly beyond the opening, and one band-shaped conductor and the other conductor overlap each other in the vicinity of the opening in the width direction of the non-conductive sheet . A sheet body is formed by a band-shaped conductor, a non-conductor sheet, a plurality of IC chips and the other band-shaped conductor, and one electrode of each IC chip is connected to one band-shaped conductor, and the other electrode is connected to the other A method of manufacturing a sheet with a non-contact IC tag, comprising: a step of connecting to a strip-shaped conductor .
シート体をICチップ毎に打抜きまたは切断し、一方の帯状導電体および他方の帯状導電体から一方のアンテナ回路および他方のアンテナ回路を形成する工程と、を更に備えたことを特徴とする請求項1記載の非接触ICタグ付シートの製造方法。   The method further comprises a step of punching or cutting the sheet body for each IC chip, and forming one antenna circuit and the other antenna circuit from one band-shaped conductor and the other band-shaped conductor. A method for producing a sheet with a non-contact IC tag according to 1. 一方の帯状導電体は、一方の基材シートに保持され、一方の帯状導電体は一方の基材シートとともに供給されることを特徴とする請求項1記載の非接触ICタグ付シートの製造方法。   2. The method for producing a sheet with a non-contact IC tag according to claim 1, wherein the one strip-shaped conductor is held on one base sheet, and the one strip-shaped conductor is supplied together with the one base sheet. . 他方の帯状導電体は、他方の基材シートに保持され、他方の帯状導電体は他方の基材シートとともにに供給されることを特徴とする請求項1記載の非接触ICタグ付シートの製造方法。   2. The non-contact IC tag-attached sheet according to claim 1, wherein the other strip-shaped conductor is held by the other base sheet, and the other strip-shaped conductor is supplied together with the other base sheet. Method.
JP2003310123A 2003-09-02 2003-09-02 Manufacturing method of sheet with non-contact IC tag Expired - Fee Related JP4150312B2 (en)

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JP2003310123A JP4150312B2 (en) 2003-09-02 2003-09-02 Manufacturing method of sheet with non-contact IC tag

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JP2003310123A JP4150312B2 (en) 2003-09-02 2003-09-02 Manufacturing method of sheet with non-contact IC tag

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JP2005078492A JP2005078492A (en) 2005-03-24
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