JP2023122097A - Dual interface ic card and manufacturing method thereof - Google Patents

Abstract

To provide a dual interface IC card and a manufacturing method thereof which improve reliability of an electric connection between an IC module and an antenna line, widen a selection range of a conductive member for the electric connection, and facilitate machining.SOLUTION: A dual interface IC card 1 comprises: a card substrate 2 comprising a concave part 9; an antenna 80 which is arranged inside the card substrate, and comprises an antenna line and a plate-like end part 100, and with which a tip end of the antenna line and the plate-like end part 100 are electrically connected, respectively; and an IC module 70 having an IC chip. In the concave part 9, the plate-like end part 100 is at least partially exposed from the card substrate 2. The antenna 80 is arranged at an opening side of the concave part 9 with respect to the center of the card substrate 2, in a thickness direction of the card substrate 2. The tip end is electrically connected with the plate-like end part 100, on a surface to be turned to the opening side of the plate-like end part 100.SELECTED DRAWING: Figure 1

Description

The present invention relates to a dual interface IC card capable of contact communication and non-contact communication with an external device.

2. Description of the Related Art Conventionally, as IC cards, there have been used contact IC cards for inputting and outputting electrical signals through external connection terminals on the surface of the card, and non-contact IC cards for inputting and outputting electrical signals by electromagnetic induction or the like via antennas. In addition to these, a contact and non-contact shared IC card, that is, a dual interface IC card, which can realize both the function of a contact IC card and the function of a non-contact IC card with a single IC chip provided in the card, is also used. It is In particular, the dual interface IC card can be used as a contact IC card that is effective in suppressing the external leakage of input/output data during financial settlement, and can be used in close proximity to the ticket gates at stations and when entering/exiting a room. It can be used as a highly convenient non-contact IC card for exchanging information. Therefore, dual interface IC cards are also becoming popular in the market.

By the way, the dual interface IC card is manufactured as follows. First, as described in Patent Literature 1, a card substrate including one or more core sheets is formed, and an embedding area in which an IC module is to be embedded is cut from the surface of the card substrate. Then, the IC module is embedded in the embedding area. wherein conductors are disposed on one of the one or more core sheets, the conductors being in electrical contact with the wound antenna portion for providing contactless communication capability and the terminals of the IC module. The contact terminals are exemplarily arranged in a meandering shape.

Cutting with an end mill is performed to expose the contact terminal portion, in which the conductive wire is formed in a meandering shape, from the card substrate. However, the embedding depth from the surface of the conductor embedded in the card base material varies due to variations in the thickness of the core sheet forming the base material and variations in heat and pressure conditions when the conductor is embedded in the core sheet. Therefore, it is difficult to reliably expose a conductive wire of about 0.2 mm or less from the card substrate without damaging the conductive wire. A decrease in productivity due to

On the other hand, in order to avoid such a problem, a metal plate can be used as the contact terminal portion electrically contacting the terminals of the IC module, as in Patent Document 2. The document describes a card substrate, an antenna wire embedded in the card substrate, an IC module embedded in the card substrate, and a metal embedded in the card substrate and electrically connected to the antenna wire and the IC module. A communication medium including a plate is described. Here, the metal wire is in contact with the first main surface, which is the lower surface of the metal plate, of the first and second main surfaces that define the plate thickness direction of the metal plate, and along the first main surface. I'm stretching. By electrically connecting the IC module and the antenna through such a metal plate, improvement in yield and workability can be expected as compared with direct exposure of the conducting wire.

Patent Document 2 describes that the antenna coil and the metal plate are first connected by welding or the like, and then arranged and attached to the intermediate sheet. Since it is difficult to obtain the desired electrical properties, it is usually manufactured as follows. First, a metal plate is affixed to one surface of the base material of the antenna sheet, and then a loop circuit is drawn while embedding a covered conductor wire in the base material by hot pressing or the like to embed the antenna wire. After that, the antenna sheet is completed by welding both ends of the antenna wire to the metal plate. In order to use this as a communication medium as in Patent Document 2, one surface of the base material of the antenna sheet must be on the lower side, that is, the antenna mounting surface of the base material must be in contact with the IC module in the thickness direction of the communication medium. It is necessary to arrange the antenna sheet so as to face the side opposite to the terminal and to laminate it with another base material.

Therefore, it is difficult to make the depth from the surface of the card base on which the IC module is exposed to the metal plate shallower than a predetermined depth due to the restriction of the thickness of the antenna sheet. The reason for this is that if the antenna sheet is made thinner, the depth from the surface of the card substrate to the metal plate can be made shallower, but the thinner the base material, the more stably the antenna wire can be embedded in the base material. This is because it becomes difficult. Therefore, since the distance between the IC module and the metal plate in the thickness direction cannot be shortened below a predetermined length, the reliability of the electrical connection between the IC module and the antenna largely depends on the physical properties of the conductive adhesive that joins them. Dependent. As a result, there is a problem that it is difficult to improve the reliability of the electrical connection, and the options for the conductive adhesive and the like are limited.

JP 2019-219732 A JP-A-2005-50326

The present disclosure has been made in view of such circumstances, and aims to improve the reliability of electrical connection between an IC module and an antenna wire, expand the range of selection of conductive members for the electrical connection, and improve processing. An object of the present invention is to provide an easy dual interface IC card and a method of manufacturing the same.

According to the present embodiment, the dual interface IC card capable of contact communication and non-contact communication with an external device includes a card base having a recess, an antenna wire and a plate-like end, and a tip of the antenna wire and An antenna and an IC module having an IC chip are provided, the plate-shaped ends of which are electrically connected to each other, and the plate-shaped ends are at least partially from the card base toward the IC module, the antenna is disposed closer to the opening side of the recess than the center of the card base in the thickness direction of the card base; A surface of the end portion facing the opening side is electrically connected to the plate-shaped end portion.

Further, in the dual interface IC card according to another aspect of the present embodiment, the recess includes a first recess having a first depth from the surface of the card base, and a central recess from the first recess. a second recess that is formed on the side and has a second depth that is deeper than the first depth, and in plan view, the plate-shaped end is located in a region outside the second recess. may be placed.

Further, in the dual interface IC card according to another aspect of this embodiment, the recess is adjacent to the first recess, is arranged in a region outside the second recess, and is deeper than the first depth. and a third recess having a third depth shallower than the second depth, wherein the plate-shaped end is at least partially exposed from the card base in the third recess. good too.

Also, in the dual interface IC card according to another aspect of the present embodiment, a through hole may be provided in the plate-shaped end portion.

Further, in the dual interface IC card according to another aspect of the present embodiment, the through holes may be provided to avoid portions of the plate-shaped end portion facing the terminals of the IC chip.

Further, in the dual interface IC card according to another aspect of the present embodiment, the terminals and the plate-shaped end portions facing each other in the IC module may be electrically connected via an anisotropic conductive film. good.

Moreover, in the dual interface IC card according to another embodiment of the present invention, the anisotropic conductive film may contain solder as conductive particles.

In the dual interface IC card according to another aspect of the present invention, the plate-like end portion includes a conductive second member forming a surface facing the opening side, and the opening of the second member. and a first member having an insulating property forming a surface facing away from the side is laminated, and the tip and the terminal are both electrically connected to the second member. good too.

A method of manufacturing a dual interface IC card capable of contact communication and non-contact communication with an external device according to the present embodiment comprises a first base material, a second base material, an IC chip, and an electrical connection between the IC chip and the IC chip. preparing an IC module having terminals connected thereto; forming an antenna composed of an antenna wire and a plate-shaped end on one surface of the first base material; a step of electrically connecting the plate-shaped ends respectively; and laminating the first base material and the second base material so as to sandwich the antenna by thermal fusion bonding or via an adhesive. forming a laminate by punching the laminate into a card size to form a card substrate; and exposing the plate-like end portion of the IC module to the card substrate at least partially. and embedding the IC module in the recess, and electrically connecting the terminal and the plate-shaped end to each other, wherein the antenna comprises: In the thickness direction of the card base, it is arranged on the opening side of the recess rather than the center of the card base, and the tip and the terminal are arranged in the plate-shaped end on the surface facing the opening side of the plate-shaped end. electrically connected to the end of the

According to the present embodiment, the reliability of the electrical connection between the IC module and the antenna wire can be improved, the selection range of the conductive member for the electrical connection can be expanded, and the dual interface IC can be easily processed. A card and method for manufacturing the same can be provided.

1A and 1B are a plan view and a cross-sectional view illustrating the structure of a dual interface IC card according to a first embodiment; FIG. FIG. 4A is a plan view and a cross-sectional view of a recess for embedding an IC module; It is a figure explaining connection of an IC module and an IC module and an antenna. FIG. 8 is a cross-sectional view illustrating the structure of a dual interface IC card according to a second embodiment, and a plan view of a concave portion for embedding an IC module; FIG. 11 is a plan view for explaining the structure of a dual interface IC card according to a third embodiment; FIG. 11 is a plan view for explaining the structure of a dual interface IC card according to a fourth embodiment; FIG. 2 is a cross-sectional view for explaining the layer structure of the card base of the dual interface IC card according to the first embodiment;

An example of the dual interface IC card of the present disclosure will be described below with reference to the drawings and the like. However, the dual interface IC card of the present disclosure is not limited to the embodiments and examples described below.

In addition, each figure shown below is shown typically. Therefore, the size and shape of each part are appropriately exaggerated for easy understanding. In each figure, hatching indicating cross sections of members is omitted as appropriate. Numerical values such as dimensions and material names of each member described in this specification are examples as an embodiment, and are not limited to these, and can be appropriately selected and used. In this specification, terms specifying shapes and geometrical conditions, such as parallel, orthogonal, perpendicular, etc., not only have strict meanings but also include substantially the same states.

1. First Embodiment An example of a first embodiment of the dual interface IC card of the present disclosure will be described. Here, for convenience of explanation, an XYZ coordinate system is set for the dual interface IC card 1 . First, as shown in FIGS. 1 and 2, the normal direction of the main surface of the dual interface IC card 1 is the Z axis. The direction from the main surface of the IC module 70 on which the external connection terminals 71 are not arranged to the main surface on which the external connection terminals 71 are arranged is defined as the +Z direction or the upper direction in the thickness direction. The opposite direction is the -Z direction or downward in the thickness direction.

Also, when the dual interface IC card 1 is viewed from the +Z direction, a straight line perpendicular to both short sides of the dual interface IC card 1 and the Z axis is defined as the X axis. The direction from one short side near the external connection terminal 71 to the other short side is the +X direction or the right direction, and the opposite direction is the -X direction or the left direction. Further, the axis perpendicular to the X-axis and the Z-axis is the Y-axis, the direction from one long side farther from the external connection terminal 71 to the other long side is the +Y direction or upward, and the opposite direction is the -Y direction. or down.

Here, FIG. 1(a) is a plan view of the dual interface IC card 1 viewed from the +Z direction. FIG. 1(b) shows a cross section of the dual interface IC card 1 of FIG. It is a cross-sectional view seen from the -Y direction side. FIG. 2(a) is an enlarged plan view of the concave portion 9 when the IC module 70 is removed from the dual interface IC card 1 of FIG. 1(a). FIG. 2(b) is a cross-sectional view similar to FIG. 1(b) in which the IC module 70 and the conductive adhesive layer 11 are absent. For reference, the IC modules 70 are indicated by dashed lines in order to show the arrangement of the IC modules 70 .

As shown in FIG. 1A, the dual interface IC card 1 has a substantially rectangular thin plate shape with four rounded corners when viewed from the +Z direction side. Also, on the surface of the dual interface IC card on the +Z direction side, an IC module 70 including an external connection terminal 71 is arranged slightly to the upper left of the center, that is, closer to the -X direction than the center and closer to the +Y direction. As shown in FIGS. 1(b), 2(a), and 2(b), the IC module 70 is embedded in the concave portion 9 formed in the card base 2, and is located on the +Z direction side of the external connection terminal 71. are arranged so that the surface of the card substrate 2 and the surface of the card base 2 on the +Z direction side are substantially flush with each other. The form of such a dual interface IC card 1 complies with ISO/IEC7816, which is an international standard for IC cards.

As shown in FIGS. 1(b) and 2(b), the card base 2 constituting the card body of the dual interface IC card 1 comprises an oversheet layer 8, an inner layer 7, an inner layer 7, and an oversheet layer 8 in this order when viewed from the -Z direction. The antenna holding layers 6 and 5, the inner layer 4 and the oversheet layer 3 are laminated and integrated. Typically, but not limited to, the oversheet layers 8 and 3 are transparent substrates and the inner layers 7 and 4 and the antenna holding layers 6 and 5 are white substrates. Further, between the antenna holding layers 6 and 5, the antenna wire 83 constituting the antenna 80 and the first plate 110 and the second plate 120, which are the plate-shaped end portions 100, are arranged so as to be sandwiched between them. there is The plate-shaped edge is also simply called an edge.

The antenna wire 83 forming the antenna 80 is buried inside the card base 2 and is not exposed from the concave portion 9, as indicated by broken lines in FIGS. 1(a) and 2(a). The antenna wire 83 is wound so as to go around slightly inside the outer periphery of a substantially rectangular card, and has a first plate 110 and a second plate 120 having a pair of conductive plate-shaped ends 100 at both ends. electrically connected. As shown in FIG. 2B, the first plate 110 has a structure in which a first member 111 and a second member 112 are laminated, and the surface of the second member 112 is exposed at the bottom surface 91a of the recess 9. are doing. However, this is only an example, and the first plate 110 and the second plate 120 may both be composed of a single member, or both may have a laminated structure of three or more layers of different members.

In this embodiment, the first member 111 and the second member 112 are made of metals different from each other, and the second member 112 is made of a metal that is more difficult to oxidize than the first member 111 . As an example, the first member 111 can be copper and the second member 112 can be silver-plated, but the invention is not limited to this. The configuration of the second plate 120 is also the same.

The surface of the IC module 70 facing the card base 2 is provided with terminals 73a and 73b that are electrically connected to the enclosed IC chip, as will be described later. As shown in FIG. 1B, the terminal 73a is electrically connected to the first plate 110 through the conductive adhesive layer 11, and the IC module 70 connects the card base 2 and the conductive adhesive layer 11 together. It is also mechanically joined through. The conductive adhesive layer 11 is composed of a member containing therein conductive particles 11a such as solder and an adhesive 11b. Here, the first plate 110 and the second plate 120 are attached to the card base 2 so that the second member 112 faces the opening side of the recess 9 and the first member 111 faces the side opposite to the opening side of the recess 9. are placed. The opening side of the concave portion 9 is the +Z direction side in FIG. 2(b).

The tip of the antenna wire 83 is electrically connected to the first plate 110 by abutting on the +Z direction side of the first plate 110 , that is, the second member 112 . The terminals 73 a of the IC module 70 are also electrically connected to the first plate 110 by contacting the second member 112 of the first plate 110 via the conductive adhesive layer 11 . As a result, the first plate 110 only needs to have the necessary conductivity on the surface side of the second member 112, and the selection range of the members of the first plate 110 can be expanded. The contents regarding the first plate 110 and the terminals 73a also apply to the second plate 120 and the terminals 73b.

1(b) and 2(b), the antenna wire 83 and the first plate 110 forming the antenna 80 are arranged in an X direction passing through the center of the card base 2 in the thickness direction of the card base 2. It is arranged on the +Z direction side, which is the opening side of the recess 9, with respect to the straight line c1 parallel to the axis. That is, the antenna 80 is arranged closer to the opening side of the recess 9 than the center of the card base 2 in the thickness direction of the card base 2 .

As a result, compared to the case where the antenna 80 straddles the center of the card base 2 in the thickness direction of the card base 2, the internal stress received by the antenna 80 when the card base 2 receives an external force such as bending is reduced. The reliability of the dual interface IC card 1 can be improved. Furthermore, the first plate 110 can be arranged at a position close to the IC module 70 in the thickness direction of the card base 2 . Therefore, the distance in the thickness direction of the conductive adhesive layer 11 can be shortened, the reliability of the electrical connection between the IC module 70 and the antenna 80 can be improved, and the formation process of the conductive adhesive layer 11 and its quality control process can be simplified. can be easily processed. The same can be said for the second plate 120 as well.

As described above, the dual interface IC card 1 of this embodiment capable of contact communication and non-contact communication with an external device includes the card base 2 having the concave portion 9 and the antenna wire 83 disposed inside the card base 2 . and a plate-like end 100 . The dual interface IC card 1 includes an antenna 80 to which the tip of the antenna wire 83 and the plate-shaped end 100 are electrically connected, respectively, an IC chip 74a, and terminals electrically connected to the IC chip 74a. an IC module 70 having 73a, 73b. The plate-like ends 100 are the first plate 110 and the second plate 120 .

Here, in the dual interface IC card 1 , the plate-like end portion 100 is at least partially exposed from the card base 2 toward the IC module in the concave portion 9 facing the IC module 70 . Further, the IC module 70 is accommodated in the recess 9 so that the terminals 73a, 73b facing each other and the plate-shaped end portion 100 are electrically connected to each other. Further, the antenna 80 is arranged closer to the opening side of the concave portion 9 than the center of the card base 2 in the thickness direction of the card base 2 . Furthermore, the tip of the antenna wire 83 and the terminals 73a and 73b are electrically connected to the plate-shaped end 100 on the surface of the plate-shaped end 100 facing the opening side.

With such a configuration of the dual interface IC card 1, it is possible to improve the reliability of the electrical connection between the IC module and the antenna wire, expand the selection range of the conductive member for the electrical connection, and improve the processing. becomes easier. The configuration of the dual interface IC card 1 of this embodiment and the details of the manufacturing method thereof will be described below.

(a) Card Substrate The card substrate 2 refers to the card body that constitutes the dual interface IC card 1 and excludes the IC module 70 . As described above, the card base 2 typically includes an oversheet layer 8, an inner layer 7, antenna holding layers 6 and 5, an inner layer 4 and an oversheet layer 3 from one end of the -Z direction in the thickness direction. It has the structure laminated|stacked in order. Between the antenna holding layers 6 and 5 is arranged an antenna 80 wound in a loop shape and formed of a coated conductor wire or the like.

The card base 2 may refer to both before the recess 9 is formed and after the recess 9 is formed, and may refer to both without and including the antenna 80 . Both ends of the antenna wire 83 of the antenna 80 are electrically connected to the first plate 110 on the -X direction side and the second plate 120 on the +X direction side, which are arranged along the X-axis direction. .

Here, in the present embodiment, for convenience of explanation, the antenna wire 83 of the antenna 80 is described as a single conductive wire that is not branched and wound in a loop, but the present disclosure is not limited to this. It is assumed that the antenna line 83 is branched as appropriate and includes the one having three or more tips. Also, three or more plate-shaped ends 100 can be arranged according to the number of ends of the antenna wire 83 .

Moreover, the layer structure of the card base 2 is not limited to the one described above, and may be a three-layer structure consisting of an oversheet layer, an antenna holding layer and an oversheet layer, or a two-layer structure consisting of an antenna holding layer and an antenna holding layer. Alternatively, the layer structure of the card substrate 2 is seven or more layers, such as an oversheet layer, an antenna holding layer, a second inner layer, a first inner layer, a first inner layer, a second inner layer, an antenna holding layer and an oversheet layer. may be a multi-layer configuration. In this case, the antenna 80 is placed between the two first inner layers.

In addition, the surface of the oversheet layer 3 or 8 and the inner layer 4 or 7 of the card base 2 may be printed or embedded with a magnetic stripe, and the surface adjacent to the inner layer 4 or 7 and the oversheet layer 3 or 8 may be printed. may be printed on FIG. 7 is a cross-sectional view of the dual interface IC card 1 of FIG. 1(a) having a magnetic stripe and a printed layer. It is a view of the cross section cut along line C and viewed from the -X direction side. Thus, in the dual interface IC card 1, for example, the magnetic stripe 14 is embedded in the surface of the oversheet layer 3 of the card substrate 2 opposite to the inner layer 4, and the surface of the inner layer 4 adjacent to the oversheet layer 3 is embedded. The printed layer 15 may be provided on the substrate. As a result, the design of the card can be enhanced, and the card can be used as a credit card for reading information on the magnetic stripe.

The thickness of the card base 2 is preferably 0.76 mm or more and 0.84 mm or less from the viewpoint of complying with standards such as ISO/IEC7816, but may be outside this range.

(i) Inner layer The inner layer is also called a core layer. As the inner layers 4 and 7, a wide variety of white or colored plastic sheets can be used, and the following single films or composite films thereof can be used. For example, polyethylene terephthalate (PET), PET-G (terephthalic acid-cyclohexanedimethanol-ethylene glycol copolymer), polyvinyl chloride, vinyl chloride-vinyl acetate copolymer, polycarbonate, polyamide, polyimide, cellulose diacetate, cellulose triacetate, polystyrene, ABS, polyacrylate, polypropylene, polyethylene, polyurethane, and the like. The thickness of the inner layers 4 and 7 can be appropriately selected in consideration of the overall thickness of the card.

(ii) Antenna Holding Layer The antenna holding layer is also referred to as a core layer like the inner layer. The antenna holding layers 5 and 6 have the function of sandwiching and holding the antenna 80, and various plastic sheets similar to the inner layers 4 and 7 can be widely used. The antenna holding layers 5 and 6 may be made of the same material as the inner layers 4 and 7, or may be made of different materials. The thickness of the antenna holding layers 5 and 6 can be appropriately selected in consideration of the overall thickness of the card.

(iii) Oversheet layer As the oversheet layers 3 and 8, the same material as the inner layer and the antenna holding layer is usually used, but a transparent material with a thickness of about 0.05 mm or more and 0.10 mm or less is used. It is often done. It is preferable that the oversheet layers 3 and 8 have the same thickness from the viewpoint of preventing curling when the laminate of the inner layer, the antenna holding layer and the oversheet layer is integrated by heat pressing or the like. , are not necessarily the same. This point is also common to the inner layers 4 and 7 and the antenna holding layers 5 and 6 described above.

The material of the oversheet layer may be any material as long as it has adhesiveness when heated. However, even if the oversheet layer itself does not have adhesiveness when heated, a layer of a known adhesive that generates adhesiveness when heated or the like is used. By additionally forming between the inner layer and the oversheet layer, both can be integrated. Further, when the dual interface IC card 1 is used as a magnetic card, one or both of the oversheet layers 3 and 8 have a magnetic stripe on the main surface side opposite to one or both of the inner layers 4 and 7. It may be embedded in advance by thermal transfer or the like.

(iv) Antenna sheet In this embodiment, as described later, the antenna 80 is formed on one surface of the antenna holding layer 5 or 6, and both ends of the antenna wire 83 constituting the antenna 80 are plate-shaped. electrically connected to the first plate 110 and the second plate 120 which are the conductive ends 100 of the . Formation of the antenna 80 on the antenna holding layer 5 or 6 is performed, for example, as follows. First, the first plate 110 and the second plate 120 are adhered and fixed to the surface of the antenna holding layer 6 before lamination, which faces the antenna holding layer 5, by applying heat pressure or the like. At this time, the first plate 110 and the second plate 120 may be arranged after applying an adhesive to the surface of the antenna holding layer 6 . The first plate 110 and the second plate 120 are arranged in the horizontal direction at the planned mounting position of the IC module 70, and are arranged so that a part thereof overlaps the terminals 73a and 73b of the IC module 70 when mounted. be.

After that, the tip of the antenna wire 83 is welded to one of the first plate 110 and the second plate 120 . Using this point as a starting point, the antenna wire 83 is subjected to a predetermined heat pressure, and the antenna wire 83, which is a coated conductor wire covered with an insulating material, is embedded in the surface of the antenna holding layer 6 by a winding forming machine. That is, while applying a predetermined heat pressure to the antenna wire 83, the antenna supply head is drawn in a loop shape as shown in FIG. 6 in sequence. The embedded antenna wire 83 is cut, and the tip of the cut antenna wire 83 is welded to the other of the first plate 110 and the second plate 120 as an end point.

The leading end and the trailing end of the antenna wire 83 are electrically connected to one and the other of the first plate 110 and the second plate 120 by welding, respectively. Thus, the antenna holding layer 6 (antenna sheet 12) having the antenna 80 formed thereon is obtained. An intermediate product in which the antenna 80 is embedded in the antenna holding layer 5 or 6 is sometimes called an antenna sheet 12 . The antenna sheet 12 alone can be marketed as a component for manufacturing the dual interface IC card 1 . Alternatively, there may be a commercial form in which a sheet material such as an antenna holding layer is supplied to a processing company, and the processing company processes this into the antenna sheet 12 and delivers it to the supplier.

(v) Antenna In the antenna 80 formed on the antenna holding layer 5 or 6, a plurality of tips of the antenna wire 83 are connected to the first plate 110 and the second plate 120 which are a pair of ends 100 electrically connected. are electrically connected to terminals 73a and 73b of the IC module 70, respectively. Thereby, the IC chip and the antenna 80 provided in the IC module 70 form a communication circuit for non-contact communication. The communication circuit may perform proximity communication using, for example, the HF frequency band of 13.56 MHz defined by ISO/IEC18092, ISO/IEC144443, or the like. Alternatively, communication may be performed using a UHF frequency band of 920 MHz, an LF frequency band of 125 KHz, or a microwave frequency band of 2.45 GHz, for example.

When the dual interface IC card 1 is held up to an external device such as a reader/writer, electromotive force and current are generated in the communication circuit by the magnetic field and radio waves generated by the reader/writer, and power is supplied to the IC chip. . As a result, the IC chip can be driven, can transmit and receive information without contact with the reader/writer, and can read and rewrite information in the memory.

The antenna wire 83 that constitutes the antenna 80 is typically formed of a coated conductor in which the periphery of a copper wire is coated with an insulating member. In addition to these, copper alloy wires such as Cu-Ni, Cu-Cr, Cu-Zn, Cu-Sn, and Cu-Be, or various metal wires such as iron, stainless steel, and aluminum, and metal alloy wires are selected. You can also The dual interface IC card 1 can be manufactured at a low cost by using coated conductors compared to, for example, a copper foil etching method. However, the dual interface IC card 1 of the present disclosure may use an antenna wire formed by a copper foil etching method, a metal foil punching method, or the like.

The diameter of the antenna wire 83 is not particularly limited as long as the characteristics of the non-contact communication circuit can be ensured. 05 mm or more and 0.15 mm or less. By setting the latter range, it is possible to improve durability against heat pressure due to embedding and external force due to cutting, and to ensure good communication characteristics.

(vi) ends (first plate and second plate)
Next, the details of the configuration of the first plate 110 and the second plate 120, which are the conductive ends 100, will be described. Both the first plate 110 and the second plate 120 are substantially rectangular plate members when viewed from above along the Z-axis direction, which is the normal direction of the main surface of the dual interface IC card 1 . As shown in FIG. 2( a ), the first plate 110 and the second plate 120 have a region overlapping the first recess 91 , that is, a region exposed from the card base 2 and a first plate 120 in plan view. and a region located outside the recess 91 and embedded inside the card base 2 .

In other words, the straight lines overlapping the −X direction side 93a and the +X direction side 93b along the Y axis of the outer periphery 93 of the recess 9 in plan view are straight lines m1 and m2, respectively. At this time, the area of the first plate 110 on the +X direction side of the straight line m1 is exposed from the card base 2 in the first concave portion 91, and the area on the -X direction side of the straight line m1 is covered by the card base 2. ing. Similarly, the second plate 120 has an area on the -X direction side of the straight line m2 exposed from the card base 2 in the first concave portion 91, and an area on the +X direction side of the straight line m2 covered by the card base 2. ing.

Taking the first plate 110 as an example, the width of the first plate exposed from the card base 2 in the first recess 91 along the X-axis direction is W12, which is the same as the width of the first recess 91. 2 is narrower than the width W11 including the covered portion. Further, the vertical width along the Y-axis direction of the first plate exposed from the card base 2 in the first concave portion 91 is W2. Although the sizes and ratios of W12, W11, and W2 are arbitrary, the area of the terminals 73a when the IC module 70 is mounted may be included in the area of the vertical width W2 and the horizontal width W12 of the first plate 110. preferable. This is because a contact area for electrical connection between the terminal 73a and the first plate 110 can be stably obtained. The same applies to the second plate 120 as well.

In addition, since a part of the first plate 110 and the second plate 120 are covered with the card base 2 in this way, the first plate 110 and the second plate 120 are protected against external forces such as cutting resistance of the end mill blade when the recess 9 is formed. The holding effect of the second plate 120 is enhanced. Therefore, it is possible to prevent the plate from being carelessly peeled off from the card base 2 and being out of position.

On the other hand, the positions of the +X direction end of the first plate 110 and the -X direction end of the second plate 120 are the positions of the +X direction side and -X direction side ends of the first concave portion 91 that overlap with these, respectively. is the same as That is, the +X direction end of the first plate 110 and the −X direction end of the second plate 120 before the formation of the recess 9 are arranged to enter the inside of the second recess 92 in a plan view from the +Z direction. are placed. As will be described later, the second recess is a recessed area for accommodating the IC chip body, which is cut deeper than the surrounding first recess 91 . Then, the plate portion in the area of the second recess 92 is removed by cutting during the forming process of the recess 9 . In other words, in plan view, the first plate 110 and the second plate 120 after cutting the recess 9 are arranged in the region outside the second recess 92 .

In other words, the recess 9 has a first recess 91 having a first depth from the surface of the card base 2, and a first recess 91 formed closer to the center than the first recess 91 and having a depth greater than the first depth. and a second recess 92 that is of a greater second depth. In a plan view along the Z-axis direction, the plurality of end portions 100 are arranged in a region outside the second concave portion 92 .

With such arrangement and size of the first plate 110 and the second plate 120, the terminals 73a and 73b of the IC module 70 can be reliably connected even if the plates are displaced along the X-axis direction. contact area can be secured. However, the +X direction end of the first plate 110 may be shifted to the -X direction side from the +X direction end of the first concave portion 91 overlapping with it, and the -X direction side of the second plate 120 may be shifted to the -X direction side. may be offset in the +X direction from the -X direction end of the first recess 91 that overlaps the first recess 91 . However, if the thickness of the IC chip body is sufficiently thin, the second recess 92 may have the same depth as the first recess, and the second recess may not necessarily have a depth different from that of the first recess. good.

Further, as described above, the first plate 110 and the second plate 120 have a laminated structure including at least two layers of the first member 111 and the second member 112 laminated on the +Z direction side of the first member 111. have At this time, it is preferable that the second member 112 is a member that is more difficult to oxidize than the first member 111 . For example, when both the first member 111 and the second member 112 are made of metal, the member that is difficult to oxidize can be rephrased as saying that the second member 112 is made of a metal that has a lower ionization tendency than the first member 111. can. As examples of such metals, first member 111 can be aluminum, iron, nickel, or copper, and second member 112 can be silver, palladium, platinum, or gold.

Moreover, the first member 111 and the second member 112 are not limited to members composed of a single metal, and may be an alloy or a nonmetallic member such as carbon. In such a case, the evaluation of the relative resistance to oxidation between the first member 111 and the second member 112 may be obtained by calculation from the compounding ratio of the metal or the like of each member, or may be obtained experimentally. good.

Also, the first plate 110 and the second plate 120 may have a laminated structure of three or more layers further including layers of different members other than the first member 111 and the second member 112 . For example, it is assumed that the first member, the third member, and the second member are laminated in this order from the -Z direction side toward the +Z direction side. In this case, the second member is preferably a member that is more difficult to oxidize than either one of the first member and the third member. This is because if the second member is a member that is easily oxidized with respect to both the first member and the third member, it will be difficult to achieve the effects of the present disclosure. Suitable examples of such include, for example, the first member being copper, the third member being nickel plated, and the second member being gold plated.

Considering the ease of material procurement, cost, workability, electrical characteristics, etc., it is possible to use highly conductive copper as the first member 111 and silver plating as the second member 112 among the above. preferable. Copper, which can ensure sufficient conductivity, is used as the first member 111, and silver, which is difficult to oxidize and easily exposes the metal interface when cutting the resin layer with an end mill, is used as the plating for the second member 112, thereby suppressing an increase in cost. This is because it is possible to obtain good electrical characteristics and workability at the same time.

On the other hand, the first plate 110 and the second plate 120 may not have the lamination structure of two layers or three layers or more as described above, and may have a structure of only a single member. In this case, the single member is limited to a conductive member, and for example, the above-described members exemplified as the first member 111 and the second member 112, alloys thereof, and the like can be used. Preferably, highly conductive copper, aluminum, stainless steel, or the like can be selected. The use of a single member makes it easier to obtain and process materials, and also leads to cost reduction.

Further, in the above-described two-layer structure of the first member 111 and the second member 112, the second member may be a conductive member such as metal, and the first member may be an insulating member. In other words, the plate-like end portion 100 forms a conductive second member 112 forming a surface facing the opening side of the recess 9 and a surface of the second member 112 facing opposite to the opening side to provide insulation. It may have a configuration in which the first member 111 having properties is laminated. For example, the first member 111 may be made of a heat-resistant flexible member such as glass epoxy or polyimide, and the second member 112 may be made of the metal foil or metal plating described above. Also, the second member 112 may be formed of a conductive non-metallic film such as a graphite film.

By forming the first plate 110 and the second plate 120 into a two-layer structure of the first member 111 which is an insulating member and the second member 112 which is a conductive member, the following effects can be expected. First, the heat capacity can be reduced compared to the case where the first plate 110 and the second plate 120 are entirely composed of members having high electrical and thermal conductivity. Therefore, when the IC module 70 is electrically connected to the antenna 80 by heating the IC module 70 from the external connection terminal 71 side and mechanically connected to the card base 2, thermal deformation of the card base 2 is suppressed. can.

In addition, compared to the case where the first plate 110 and the second plate 120 are entirely made of metal, the range of material selection can be expanded, and it is easy to impart necessary conductivity only to necessary portions. Furthermore, compared to the case where the first plate 110 and the second plate 120 are entirely made of metal, the flexibility when the card base 2 is bent can be enhanced, so that the internal stress against the bending of the card can be dispersed. 2 can be suppressed from being damaged.

In this embodiment, the first plate 110 and the second plate 120 have a laminated structure of a first member 111 and a second member 112 that is more difficult to oxidize than the first member 111 . Furthermore, the tip of the antenna wire 83 and the terminals 73a and 73b are electrically connected to the first plate 110 and the second plate 120 facing the second member 112 . While not wishing to be bound by theory, the following can be considered as an example of the effects of this.

For example, if the second member 112 is a member that is more difficult to oxidize than the first member 111, the amount of oxide film formed on the surface of the second member 112 is less than when the surface of the first member 111 is exposed. few. Therefore, when the second member 112 and the tip of the antenna wire 83 are joined by welding, the amount of impurities interposed between them is small, so that the welding can be performed satisfactorily. Further, if both the first member 111 and the second member 112 are made of copper, when welding the second member 112 and the antenna wire 83, when welding to the copper of the second member 112 having high thermal conductivity, heat escapes, resulting in poor welding or longer welding time. However, by providing the second member 112 with a lower thermal conductivity than the copper of the first member 111 by silver plating or the like, welding efficiency and welding yield can be improved.

On the other hand, it is considered that the first plate 110 and the second plate 120 are sandwiched between resin base materials such as the antenna holding layers 5 and 6 and then hot-pressed. At this time, depending on the type of the resin base material, if the oxide film is sufficiently formed on the surface of the first plate 110 or the second plate 120, hydrogen bonding may occur between the resin base material and the oxide film. are easier to form. As a result, the first plate 110 and the second plate 120 are likely to adhere strongly to the resin base material. Conversely, when almost no oxide film is formed on the surface of the first plate 110 or the second plate 120 and the metal surface is substantially exposed, the resin base material and the first plate 110 or the second plate 120 are Adhesion is believed to be very weak. In addition, regarding the wettability of the surfaces of the first plate 110 and the second plate 120, the wettability tends to be higher when foreign matter such as an oxide film does not adhere to the surfaces.

When solder is applied to the surfaces of the first plate and the second plate, residual solder depends on whether the surface is made of copper, which easily forms a large oxide film, or is silver-plated, which makes it difficult to form an oxide film. A difference arises in a state, ie wettability. In this regard, an anisotropic conductive film containing solder or other metal particles ( ACF) and anisotropic conductive paste (ACP) are also interposed. That is, the smaller the oxide film on the surfaces of the first plate 110 and the second plate 120 and the higher the wettability, the more the IC module 70 is buried in the concave portion 9 of the card base 2 via ACF or ACP. The reliability of electrical connection between the chip and the antenna 80 can be improved.

1(b) and 2(b), the antenna wire 83 and the first plate 110 forming the antenna 80 are arranged in an X direction passing through the center of the card base 2 in the thickness direction of the card base 2. It is arranged on the +Z direction side, which is the opening side of the recess 9, with respect to the straight line c1 parallel to the axis. That is, the antenna 80 is arranged closer to the opening side of the recess 9 than the center of the card base 2 in the thickness direction of the card base 2 .

As a result, compared to the case where the antenna 80 straddles the center of the card base 2 in the thickness direction of the card base 2, the internal stress received by the antenna 80 when the card base 2 receives an external force such as bending is reduced. can be reduced. This can be explained as follows. In FIG. 1(b), it is assumed that the cross section of the dual interface IC card 1 has a substantially uniform density distribution as a whole. Here, it is assumed that the dual interface IC card 1 is bent along an axis parallel to the Y axis so that its left and right ends are bent in the -Z direction.

At this time, the cross section of the dual interface IC card 1 taken along the YZ plane has a rectangular shape with the same area regardless of the X coordinates. For this reason, the bending stress when bending is distributed so that the tensile stress along the X axis increases with distance from the straight line c1 on the +Z direction side of the straight line c1, and the straight line c1 on the −Z direction side of the straight line c1. The distribution is such that the compressive stress along the X-axis increases with increasing distance from .

Therefore, when the antenna wire 83 and the end portion 100 are arranged across the straight line c1 which is the center of the card base 2 in the thickness direction of the card base 2, the portion where the antenna wire 83 and the conductive adhesive layer 11 receive the tensile stress. and a portion that receives compressive stress. In other words, the antenna wire 83 and the conductive adhesive layer 11 are subject to different types of stress inside, and therefore are prone to deformation and cohesive failure. However, in the present embodiment, the antenna wire 83 and the end portion 100 are biased toward the +Z direction side of the straight line c1 that is the center of the card base 2 in the thickness direction of the card base 2 . Therefore, the antenna wire 83 and the conductive adhesive layer 11 receive only the same type of tensile stress, and the difference in stress received by each portion can be reduced. Therefore, the antenna wire 83 and the conductive adhesive layer 11 are less prone to deformation and cohesive failure.

Further, due to the configuration of the present embodiment as described above, the arrangement of the antenna wire 83 in the dual interface IC card 1 is close to the opening side of the concave portion 9 in the thickness direction of the card base 2 . Therefore, when the dual interface IC card 1 performs non-contact communication by proximity (NFC, etc.), the distance between the antenna wire 83 and the reader/writer is shortened, thereby improving communication sensitivity. Further, by moving the antenna wire 83 away, the smoothness of the surface where the external connection terminal 71 of the dual interface IC card 1 is not exposed is improved, and the quality of the thermal transfer printing of portraits, characters, etc. on the surface can be improved. .

By the way, in the prior art, as in the above-mentioned Patent Document 2, among the front and back surfaces of the end portion (metal plate) of the antenna, the antenna wire is disposed on the surface facing away from the opening side of the recess provided in the card base. The tip and the end are electrically connected. In addition, the terminal of the IC module and the end are electrically connected on the surface of the end of the antenna facing the opening side of the recess provided in the card base. In this case, the antenna is generally arranged in the center of the card base in the thickness direction of the card base.

This is because, in the prior art, foreign matter such as the antenna wire and the edge of the card should preferably be placed near the center of the card base in the thickness direction of the card base as much as possible. That is, by arranging the foreign matter in the center of the card base in the thickness direction and laminating the other resin base materials vertically symmetrically, the symmetry of the member in the thickness direction can be secured, and the card can be prevented from warping due to the heating process or the like. This is because it was thought that it could be suppressed.

However, while card warpage can be suppressed to some extent by adjusting the material composition and thickness of the laminated resin base material, the electrical connection between the IC module and the end of the antenna is most important in terms of the manufacturing load and quality assurance of the card. Although it is a strong factor, the former was prioritized in the design. Therefore, as described above, it is difficult to shorten the distance from the surface of the card base to the plate more than a predetermined amount by designing the antenna to be connected to the lower side of the plate.
It has been difficult to control the conditions for forming the conductive adhesive layer that electrically connects the IC module and the end of the antenna and to reduce the load of quality control.

As described above, the method of manufacturing a card in the prior art involves first attaching a metal plate to one surface of the base material of the antenna sheet, and then embedding the coated conductor wire into the base material by hot pressing or the like. Draw a loop circuit and embed the antenna wire. After that, the antenna sheet is completed by welding both ends of the antenna wire to the metal plate. Next, the antenna sheet is formed so that one surface of the base material of the antenna sheet faces downward, that is, the antenna mounting surface of the base material faces the opposite side to the external connection terminals of the IC module in the thickness direction of the communication medium. is placed and laminated with another substrate.

Therefore, it is difficult to make the depth from the surface of the card substrate on which the IC module is exposed to the metal plate shallower than a predetermined depth due to the restriction of the thickness of the antenna sheet. The reason for this is that if the antenna sheet is made thinner, the depth from the surface of the card substrate to the metal plate can be made shallower, but the thinner the base material, the more stably the antenna wire can be embedded in the base material. This is because it becomes difficult.

On the other hand, in the present disclosure, the constraint of arranging the antenna near the center of the card base is intentionally removed, and the antenna is arranged closer to the opening side of the recess than the center of the card base in the thickness direction. Furthermore, both the tip of the antenna wire and the terminal of the IC module are electrically connected to the plate-shaped end of the antenna on the surface of the plate-shaped end of the antenna facing the opening side of the concave portion of the card base. .

As a result, compared with the case where the antenna is arranged across the center of the card base in the thickness direction, the internal stress received by the antenna when the card base receives an external force such as bending can be reduced, and the reliability of the electrical connection can be reduced. can improve sexuality. Furthermore, the end portion can be arranged at a position close to the IC module in the thickness direction of the card base. Therefore, the distance in the thickness direction of the conductive adhesive layer can be shortened, the reliability of the electrical connection between the IC module and the antenna can be improved, the process of forming the conductive adhesive layer, the quality control process thereof, etc. can be simplified, and the processing can be improved. becomes easier.

In this embodiment, the antenna 80 is arranged closer to the opening of the recess 9 than the center of the card base 2 in the thickness direction of the card base 2 . However, for the reason described above, it is preferable that the plate-like end portion 100 and the antenna wire 83 constituting the antenna 80 are arranged closer to the opening side of the recess 9 than the center of the card base 2 as much as possible. For example, when the thickness of the card base 2 is t, the antenna 80 is preferably arranged at a distance of 0.05 t or more and 0.4 t or less from the surface of the card base 2 on the opening side of the concave portion 9 . , 0.1 t or more and 0.3 t or less. By setting the former range, the selection range of the material used for the conductive adhesive layer 11 can be expanded. In addition, since the latter range allows the use of a relatively thin material such as ACF as the conductive adhesive layer 11, both electrical connection and mechanical connection can be achieved with the same adhesive layer, thereby reducing manufacturing load and quality control load. can be reduced.

(b) IC Module Next, each part of the main constituent elements of the IC module 70 will be described mainly based on FIG. 1(b) and FIG. FIG. 3(a) is a diagram of the external connection terminal 71 side of the IC module 70 viewed from the +Z direction side, like FIG. 1(a). FIG. 3(b) is a view of the IC module 70 viewed from the −Z direction side opposite to FIG. 3(a). Here, most of the molded portion 74b of the IC chip body 74 is omitted so that the inside can be seen through. Moreover, FIG.3(c) is sectional drawing which expanded the B section near the terminal 73a of FIG.1(b).

IC module 70 is embedded in recess 9 formed in card base 2, and terminals 73a and 73b of IC module 70 are electrically connected to first plate 110 and second plate 120 of antenna 80, respectively. , can form a communication circuit for contactless communication. At this time, contact communication with a contact reader/writer or the like can be performed through the external connection terminals 71 provided in the IC module 70 .

The substrate 72 is a flexible insulating resin film made of glass epoxy resin, polyimide resin, or the like. , are left to form a predetermined pattern. Specifically, a film on which a photosensitive material is applied and a predetermined pattern is formed so that an external connection terminal 71 is formed on one copper foil surface of the resin film and terminals 73a and 73b are formed on the other copper foil surface. Mounting of the plate, exposure, and etching removal of non-photosensitive portions are performed in sequence. As a result, a substrate 72 is formed in which the copper foil of the predetermined pattern is partially left on the front and back surfaces of the resin film. Also, the substrate 72 is provided in advance with a plurality of bonding holes 76 which are through holes for wire bonding to the external connection terminals 71 .

As shown in FIG. 3A, the external connection terminals 71 are defined with respective sections of the external terminals defined by the ISO/IEC7816-2 standard. These sections and the IC chip 74a are connected by wires 75 such as gold wires through the bonding holes 76 provided in the substrate 72, as shown in FIG. 3(b). Similarly, the terminals 73a and 73b and the IC chip 74a are also connected by wires 75. FIG. These bonding holes 76 and wires 75 are covered and protected by the mold portion 74b.

An IC chip body 74 is arranged on the surface of the substrate 72 opposite to the surface on which the external connection terminals 71 are formed. The IC chip body 74 includes an IC chip 74a adhered and fixed to the substrate 72 via an adhesive, bonding wires 75 for connection, and a mold portion 74b which is a sealing resin for protecting them. consists of The IC chip 74a includes a CPU for controlling operations of both contact communication and non-contact communication, and storage devices such as RAM, ROM, EEPROM, and flash memory. Furthermore, the IC chip 74a includes various circuits such as an interface circuit and a power generation circuit for decoding input signals and generating output signals for contact communication and non-contact communication. Various circuits may be provided as separate elements from the IC chip 74a.

The molded portion 74b is provided as a projecting portion that covers the IC chip 74a and the wire 75 in order to protect them from external force load and environmental load. An ultraviolet curable resin, a thermosetting resin, or the like is used as the mold portion 74b.

(c) Conductive Adhesive Layer After forming a concave portion 9 for embedding the IC module 70 in the card base 2 by cutting with an end mill or the like, the IC module 70 is embedded and fixed in the concave portion 9, and electrically and mechanically bonded. The conductive adhesive layer 11 that is connected to each other will be described. The conductive adhesive layer 11 is disposed between the first plate 110, the substrate 72 of the IC module 70, and the terminals 73a formed on the substrate 72, as shown in FIG. 3(c). It is a tape-shaped member.

The conductive adhesive layer 11 may be applied or attached in advance to the surface of the substrate 72 of the IC module 70 opposite to the external connection terminals 71, and may be applied to the bottom surface 91a of the recess 9 of the card base 2 after cutting. It may be painted or pasted.

Since the typical conductive adhesive layer 11 also serves as a mechanical connection between the IC module 70 and the cut card base 2, it is applied to the entire back surface of the substrate 72 or to a portion of the recess 9 corresponding to the first recess 91. It may be attached or affixed. By doing so, the electrical connection between the IC chip 74a and the antenna 80 and the mechanical connection between the IC module 70 and the card base 2 can be performed with the same type of conductive adhesive layer 11, which contributes to simplification of the process. .

However, the conductive adhesive layer 11 is applied and attached so as to cover only the areas of the terminals 73a and 73b on the back surface of the substrate 72, and another non-conductive adhesive is applied to the other back surface of the substrate 72. may be painted or attached. This is because it is easy to select an adhesive that is advantageous for mechanical connection because the conductivity of the separate adhesive does not have to be taken into consideration.

ACF (Anisotropic Conductive Film), that is, an anisotropic conductive film or ACP (Anisotropic Conductive Paste) can be used as the conductive adhesive layer 11 that can be used for both electrical connection and mechanical connection. In addition, a so-called conductive paste or solder paste in which silver particles are dispersed in an epoxy resin as a filler may be used. Among them, if ACF is used, the entire back surface of the substrate 72 of the IC module 70 is thermally laminated with the ACF, and after embedding the IC module 70 in the recess 9 of the cut card base 2, this is subjected to a predetermined temperature and load. can be heat-pressed. By doing so, the electrical connection between the IC chip 74a and the antenna 80 can be easily achieved. Furthermore, since the IC module 70 can be mechanically connected to the card base 2 at the same time, the process of mounting the IC module 70 to the card base 2 can be simplified.

The electrical connection between the IC chip 74a and the antenna 80 and the mechanical connection between the IC module 70 and the card substrate 2 when ACF is used as the conductive adhesive layer 11 are as follows based on FIG. I can explain. The conductive adhesive layer 11 has a structure in which conductive particles 11a, in which a metal film is formed around a spherical resin or spherical metal, are dispersed in an adhesive 11b, which is a binder containing an adhesive component. The conductive particles may be resin coated with nickel or gold, or may be solder particles. Various types of solder particles such as SnPb-based, SnAgCu-based, SnCu-based, SnZnBi-based, SnAgInBi-based, SnZnAl-based, and alloys of these and other metals can be used. These configurations are the same even when the ACP is used.

Here, the conductive adhesive layer 11 arranged so as to be sandwiched between the first plate 110 electrically connected to the tip of the antenna wire 83, the substrate 72 of the IC module 70, and the terminal 73a formed on the substrate 72 is formed. Thermal pressure is applied to the substrate 72 from the +Z direction to the −Z direction so as to compress it.

As a result, strong heat pressure is applied to a portion of the conductive adhesive layer 11 sandwiched between the first plate 110 and the terminal 73a, where the space is particularly narrow, and the conductive particles 11a of the conductive adhesive layer 11 in this portion become conductive adhesive. It is pressed from the first plate 110 and the terminal 73 a along the thickness direction of the layer 11 . In addition, when the conductive particles 11a are small, the conductive particles 11a overlap from the first plate 110 to the terminals 73a along the thickness direction of the conductive adhesive layer 11 in a daisy chain. That is, the first plate 110 and the terminal 73a are electrically connected through the conductive particles 11a.

On the other hand, between the substrate 72 in the area where the terminals 73a are not present, the conductive particles 11a are pressed along the thickness direction of the conductive adhesive layer 11 by the first plate 110 and the terminals 73a, or overlapped in a daisy chain. is not compressed up to . However, the antenna holding layer 6 and the substrate 72 are mechanically connected by the adhesive strength of the adhesive 11b generated by the heat pressure.

(d) Manufacturing Method of Dual Interface IC Card Next, an example of manufacturing method of the dual interface IC card 1 using the card substrate 2, the IC module 70 and the conductive adhesive layer 11 described above will be described.

First, the first plate 110 and the second plate 120, which are plate-shaped end portions 100, are adhered to the surface of either the antenna holding layer 5 or 6, which is not adjacent to the inner layer 4 or 7. FIG. Both may be adhered and fixed to the surface of the antenna holding layer 5 or 6 via an adhesive. Next, using a covered conductor covered with an insulating member as the antenna wire 83, either one of the first plate 110 and the second plate 120 is attached to the formation surface of the antenna holding layer 5 or 6 on which the end portion 100 is formed. It is embedded by a winding forming machine with the starting point and the other as the ending point. Here, the wire former welds the tip of the antenna wire 83 to the first plate 110 and the second plate 120 at the start and end points of the antenna wire 83 .

Specifically, for example, while applying a predetermined heat pressure to the antenna holding layer 6, the antenna supply head is drawn in a loop shape as shown in FIG. The wires 83 are embedded in the antenna holding layer 6 in sequence. At this time, the antenna holding layer 6 may be referred to as a first base material.

Next, as shown in FIGS. 1(b) and 2(b), the oversheet layer 8, the inner layer 7, the antenna holding layers 6 and 5, the inner layer 4 and the oversheet layer 3 are arranged from the bottom in the thickness direction. Repeat in this order. After that, the card is sandwiched between stainless steel plates from above and below in the thickness direction in units of a stack of large-sized sheets arranged in a multi-faceted manner, and heat pressure is applied to the stack through the stainless steel plates. At this time, for example, an antenna 80 is formed in advance on the surface of the antenna holding layer 6 so as to be sandwiched between the antenna holding layers 5 and 6 . At this time, the antenna holding layer 5 arranged opposite to the antenna holding layer 6 which is the first base material and laminated on the first base material so as to sandwich the antenna 80 may be referred to as a second base material. good.

Through such a hot pressing step, it is possible to obtain a large sheet unit card substrate in which each layer of the laminate including the first base material and the second base material is integrated. If any of the oversheet layer, the inner layer, and the antenna holding layer has heat resistance such that it does not heat-seal at a predetermined temperature, an adhesive sheet that heat-seales at a predetermined temperature is sandwiched between the layers, or an adhesive is applied. to paint. Then, these are subjected to a hot press process to obtain an integrated card base in large-sized sheet units.

The large sheet unit card base in which the cards are arranged vertically and horizontally in multiple faces obtained as described above is punched out as the card base 2 having the card size of ISO/IEC 7816 by a punching machine. Further, a recess 9 for embedding the IC module 70 is formed in the card base 2 by cutting with an end mill. As a result, the cut card base 2 is obtained. The concave portion 9 is deeper than the first concave portion 91 having a first depth for accommodating the flat substrate 72 of the IC module 70 and the first concave portion 91 for accommodating the convex IC chip body 74. As described above, the second concave portion 92 and the second concave portion 92 having the second depth are formed in two stages. Surfaces of the first plate 110 and the second plate 120 are exposed on the bottom surface 91a of the first concave portion 91 of the card base 2 .

On the other hand, apart from the manufacturing of the card base 2 and the cutting for forming the concave portion 9, the conductive adhesive layer 11 is adhered to the IC module 70. As shown in FIG. As the IC module 70, a module tape in which the IC modules 70 are continuously formed on a long tape in one row or two rows is usually used. A tape-shaped ACF is pasted on the surface of the module tape opposite to the surface on which the external connection terminals 71 are formed, while applying constant heat and pressure. After that, the module tape to which the ACF is pasted is punched out by a punching machine to form a substantially rectangular IC module 70 having rounded corners, whereby the IC module 70 to which the conductive adhesive layer 11 is pasted is obtained.

After that, the IC module 70 with the conductive adhesive layer 11 attached is embedded in the card base 2 having the concave portion 9 formed therein, and a predetermined heat block is pressed against the external connection terminals 71 to face the card base 2 side. A predetermined amount of heat and pressure is applied for a predetermined period of time. As a result, by melting the conductive adhesive layer 11 made of ACF, the terminals 73a and 73b of the IC module 70 are electrically connected to the first plate 110 and the second plate 120, and the IC module 70 and the IC module 70 are electrically connected. A mechanical connection with the card substrate 2 is attempted. Depending on the type and composition of ACF, there are differences in the time and heat-pressing conditions, but as an example, the time is 0.5 seconds or more and 10.0 seconds or less, the temperature is 150 ° C. or more and 250 ° C. or less, the pressure is can be 20 MPa or more and 100 MPa or less.

(e) Regarding the dual interface IC card of the first embodiment To summarize the above, in the dual interface IC card 1 of the first embodiment capable of contact communication and non-contact communication with an external device, the plate-shaped end portion 100 is , a first plate 110 and a second plate 120 . The antenna 80 can have a relatively simple structure in which both ends of the antenna wire 83 are electrically connected to the end portions 100 of the layer structure, respectively, and it is relatively easy to manufacture the card base 2 in which this is embedded. .

The dual interface IC card 1 also includes an IC module 70 having an IC chip 74a and terminals 73a and 73b electrically connected to the IC chip 74a. In the concave portion 9 of the card base 2 facing the IC module 70, the plate-like end portion 100 is at least partially exposed from the card base 2 toward the IC module, and the antenna 80 extends in the thickness direction of the card base 2. , it is arranged closer to the opening of the recess 9 than the center of the card base 2 . Further, the tip of the antenna 80 and the terminals 73a and 73b are electrically connected to the plate-shaped end 100 on the surface of the plate-shaped end 100 facing the opening side.

As a result, the internal stress received by the antenna 80 when the card base 2 receives an external force such as bending can be reduced, and the reliability of the dual interface IC card 1 can be improved. Furthermore, since the plate-shaped end portion 100 can be arranged at a position close to the IC module 70 in the thickness direction of the card base 2, the distance of the conductive adhesive layer 11 in the thickness direction can be shortened. As a result, the reliability of the electrical connection between the IC module 70 and the antenna 80 can be improved, the selection range of the conductive member for the electrical connection can be expanded, and the processing can be facilitated.

2. Second Embodiment Next, a dual interface IC card according to a second embodiment of the present disclosure will be described.

FIG. 4(a) is a cross-sectional view corresponding to FIG. 1(b), regarding the dual interface IC card 1a of the second embodiment. 4(b) is a plan view corresponding to FIG. 2(a). In the dual interface IC card 1a of this embodiment, the configuration of the antenna 80 including the configuration of the end portion 100 is the same as that of the first embodiment, but the configuration of the concave portion 9a is different from that of the first embodiment. That is, in a plan view from the +Z direction side, the recessed portion 9a is adjacent to the first recessed portion 91b and is arranged in a region outside the second recessed portion 92, and is deeper than the first depth, which is the depth of the first recessed portion 91b. It further includes a third recess 94 that is deeper than the second depth and that is a third depth that is shallower than the second depth that is the depth of the second recess 92 .

The third recessed portion 94 is separated into a third recessed portion 94a that overlaps with the first plate 110 and a third recessed portion 94b that overlaps with the second plate 120 in plan view. In the third recess 94a facing the IC module 70, the first plate 110a facing the terminals 73a of the IC module 70 when placed is at least partially exposed from the card base 2a toward the IC module 70. . The same applies to the third recess 94b, and the second plate 120 facing the terminals 73b of the IC module 70 when placed is at least partially exposed from the card base 2a.

In this embodiment, the widths of the third recesses 94a and 94b along the Y-axis direction are substantially the same as the widths of the first plate 110 and the second plate 120 along the Y-axis direction, respectively, in plan view. or larger than this. In other words, the first plate 110 and the second plate 120 are exposed throughout the third recesses 94a and 94b. By doing so, even if the positions of the third recesses 94a and 94b and the positions of the first plate 110 and the second plate 120 are deviated from each other, the first plate having substantially the same area is provided throughout the third recesses 94a and 94b. It can be expected that the plate 110 and the second plate 120 will be exposed. As a result, deterioration in reliability of electrical connection between the IC module 70 and the antenna 80 can be suppressed. However, the widths of the third recesses 94a and 94b along the Y-axis direction may be formed to be smaller than the widths of the first plate 110 and the second plate 120 along the Y-axis direction, respectively.

The dual interface IC card 1a of this embodiment having such a configuration provides the following effects. That is, regardless of the distance between the terminals 73a and 73b of the IC module 70 and the first plate 110 and the second plate 120, the distance between the board 72 other than the terminals 73a and 73b and the card base 2a can be determined. Therefore, the distance setting for optimum electrical connection between the terminals 73a and 73b of the IC module 70 and the first plate 110 and the second plate 120, and the optimum mechanical connection between the IC module 70 and the card substrate 2a. The setting of the distance for establishing connection can be individually optimized.

For example, in the present embodiment, the third concave portions 94a and 94b are filled with a conductive paste 11c, which is a solder paste or a conductive paste in which silver particles are dispersed in an epoxy resin as a filler, as the conductive adhesive layer 11. FIG. In addition, in the first concave portion 91b, the adhesive layer 13, which is thermoplastic, thermosetting or other adhesive without conductivity, is used between the card base 2a and the substrate 72 of the IC module 70. . Since the third recesses 94a and 94b are formed deeper than the first recesses 91, even if a liquid conductive adhesive is used for the third recesses 94a and 94b, it is suppressed from protruding into the first recesses 91b. can.

However, the present disclosure is not limited to this, and an anisotropic conductive film (ACF) is used as the common conductive adhesive layer 11 across the first recess 91b and the third recesses 94a and 94b in the same manner as in the first embodiment. may In this case also, the distance setting for optimum electrical connection between the terminals 73a and 73b of the IC module 70 and the first plate 110 and the second plate 120, and the optimum distance between the IC module 70 and the card substrate 2a. It is possible to change the setting of the distance for achieving a good mechanical connection. As a result, the same conductive adhesive layer 11 can achieve both optimum electrical connection and optimum mechanical connection.

3. Third Embodiment Next, a dual interface IC card according to a third embodiment of the present disclosure will be described.

FIG. 5 is a plan view showing the configuration of the vicinity of the concave portion 9 corresponding to FIG. 2(a) regarding the dual interface IC card 1b of the third embodiment. The dual interface IC card 1b of this embodiment differs from the first and second embodiments in the configuration of the first plate 110a and the second plate 120a that constitute the end portion 100a of the antenna 80a. That is, the first plate 110a and the second plate 120a each have a plurality of electrodes along the X-axis direction at the +Y direction end and the −Y direction end in the region exposed in the first recess 91. Through holes 113, 114, 123 and 124 are provided.

However, the first plate 110a and the second plate 120a may have only one through-hole, and the shape of the through-hole is not limited to being circular in plan view, and may be oval, elliptical, square, or star-shaped. etc., can be any shape. The positions of the through-holes formed in the first plate 110a and the second plate 120a are located at the -X direction end and the +X direction end in the region exposed in the first recess 91, respectively. One or more may be arranged along the direction.

Since the dual interface IC card 1b of the present embodiment has such a configuration, the resin base material such as the antenna holding layer 6 below the first plate 110a and the second plate 120a is melted during lamination processing such as hot pressing. to enter the through hole. Therefore, the first plate 110a and the second plate 120a are strongly supported by the antenna holding layers 5 and 6 sandwiching them and by the anchor effect through the through holes. As a result, when the recess 9 is cut, the first plate 110a and the second plate 120a can be prevented from detaching from the antenna holding layer or being displaced.

Through hole 113 at the +Y direction end and through hole 114 at the −Y direction end in the exposed region of the first plate 110a, and through hole 123 at the +Y direction end in the exposed region of the second plate 120a and The through-hole 124 at the end on the -Y direction side is not particularly restricted in its arrangement or size. However, these through-holes are provided to avoid portions of the first plate 110a and the second plate 120a that face the terminals 73a and 73b of the IC module 70 when mounted in plan view from the +Z direction side. is preferred.

As a result, reduction in the electrical contact area between the end portion 100a and the terminals 73a and 73b is suppressed, and the reliability of the electrical connection between the two is improved. Furthermore, it is possible to prevent the resin base material above the through-hole from coming into close contact with the first plate 110a and the second plate 120a during cutting. Therefore, even when the first plate 110a and the second plate 120a are cut slightly shallower than the surfaces, the effect that the surfaces of the first plate 110a and the second plate 120a are well exposed can be expected.

In this embodiment, the conductive paste 11c described above is used as the conductive adhesive layer 11, and the non-conductive adhesive layer 13 is used for bonding between the card base 2b and the substrate 72 of the IC module 70. good too. Also, as the conductive adhesive layer 11, an anisotropic conductive film (ACF) may be used as a whole.

4. Fourth Embodiment Next, a dual interface IC card according to a fourth embodiment of the present disclosure will be described.

FIG. 6 is a plan view showing the configuration of the vicinity of the concave portion 9 corresponding to FIG. 2(a) regarding the dual interface IC card 1c of the fourth embodiment. In the dual interface IC card 1c of this embodiment, the configuration of the antenna 80a including the configuration of the end portion 100a is the same as that of the third embodiment, but the configuration of the concave portion 9b is similar to that of the second embodiment. That is, in a plan view from the +Z direction side, the recess 9b is adjacent to the first recess 91c, is arranged in a region outside the second recess 92, and is deeper than the first depth, which is the depth of the first recess 91c. It further includes a third recess 95 that is deeper than the second depth and that is a third depth that is shallower than the second depth that is the depth of the second recess 92 .

The third recessed portion 95 is separated into a third recessed portion 95a that overlaps with the first plate 110a and a third recessed portion 95b that overlaps with the second plate 120a in plan view. Also, in the third recess 95a facing the IC module 70, the first plate 110a facing the terminals 73a of the IC module 70 when mounted is at least partially exposed from the card base 2c toward the IC module 70. there is However, the +Y direction end and the −Y direction end of the first plate 110a are covered with the card base 2c to form covered areas 84a and 84b, respectively.

In other words, both ends of the first plate 110a facing each other along the Y-axis are embedded in the card base 2c in the first recess 91c, and sandwiched between the ends of the first plate 110a in the third recess 95a. A portion is exposed from the card base 2c. The second plate 120a is similar to the above except that the terminal 73a is replaced with the terminal 73b, the third recess 94a is replaced with the third recess 95a, and the covered areas 84a and 84b are replaced with covered areas 85a and 85b.

In this embodiment, it is assumed that the +Y direction end and the −Y direction end of the first plate 110a are covered with the card base 2c. However, the present disclosure is not limited to this. may be exposed from the card base 2c. Both the opposite ends of the first plate 110a along the X axis and the opposite ends thereof along the Y axis may be embedded in the card base 2c in the first recess 91c. At this time, the portion sandwiched between both ends of the first plate 110a in the third recess 95a may be exposed from the card base 2c.

In any case, the first plate 110a and the second plate 120a in the regions overlapping the terminals 73a and 73b should be exposed at the third concave portions 95a and 95b in plan view from the +Z direction side. . Therefore, even if the first plate 110a and the second plate 120a are covered with the card base body 2c in the first concave portion 91c in any region other than that, the effects of the present embodiment can be similarly obtained.

In the present embodiment, the widths of the third recesses 95a and 95b along the Y-axis direction are formed to be shorter than the widths of the first plate 110a and the second plate 120a along the Y-axis direction in plan view. ing. In other words, both ends of the first plate 110a and the second plate 120a extend further along the Y-axis direction than the regions exposed in the third recesses 95a and 95b of the first plate 110a and the second plate 120a. are placed. These extended portions are embedded in the card base 2c on the -Z direction side of the first recess 91c to form covered regions 84a, 84b, 85a and 85b. Also, inside the embedded region, the first plate 110a and the second plate 120a are provided with a plurality of through holes 113, 114, 123 and 124 similar to those of the third embodiment.

With such a configuration of the dual interface IC card 1c of the present embodiment, in addition to the points described in the third embodiment, the following effects can be obtained. That is, both ends along the Y-axis direction of the first plate 110a and the second plate 120a are buried in the card base 2c. Therefore, both ends of the first plate 110a and the second plate 120a sandwiched between the antenna holding layers 5 and 6 are firmly supported by the resin base material. Therefore, problems such as the first plate 110a and the second plate 120a detaching from the antenna holding layer and causing misalignment can be further suppressed.

In this embodiment, the conductive paste 11c may be used as the conductive adhesive layer 11 for the third recesses 94a and 94b, and the non-conductive adhesive layer 13 may be used for the first recess 91b. Also, an anisotropic conductive film (ACF) may be used as the common conductive adhesive layer 11 across the first recess 91b and the third recesses 94a and 94b.

As described above, each of the embodiments and modifications thereof described in the present disclosure can be implemented in combination with each other in part or in whole as long as there is no contradiction. included.

1, 1a, 1b, 1c dual interface IC cards 2, 2a, 2b, 2c card substrates 3, 8 oversheet layers 4, 7 inner layers 5, 6 antenna holding layers 9, 9a recesses 11 conductive adhesive layer 11a conductive particles 11b adhesion Agent 11c Conductive paste 12 Antenna sheet 13 Adhesive layer 14 Magnetic stripe 15 Printed layer 70 IC module 71 External connection terminal 72 Substrate 73a, 73b Terminal 74 IC chip body 74a IC chip 74b Mold part 74p Pad 75 Wire 76 Bonding hole 80, 80a Antenna 83 antenna wires 84a, 84b, 85a, 85b covering regions 91, 91b, 91c first recess 91a bottom surface 92 second recess 93 outer periphery 93a, 93b sides 94, 94a, 94b third recess 95, 95a, 95b third recess 100, 100a end portions 110, 110a first plate 111 first member 112 second members 113, 114, 123, 124 through holes 120, 120a second plate

Claims (9)

A dual interface IC card capable of contact communication and non-contact communication with an external device,
a card base with a recess;
an antenna wire and a plate-like end;
an antenna in which the tip of the antenna wire and the plate-shaped end are electrically connected to each other;
an IC module having an IC chip,
the plate-like end is at least partially exposed from the card base toward the IC module in the recess facing the IC module;
the antenna is arranged closer to the opening side of the recess than the center of the card base in the thickness direction of the card base;
The dual interface IC card, wherein the front end is electrically connected to the plate-shaped end on a surface of the end facing the opening side. The recesses include a first recess having a first depth from the surface of the card base, and a second recess formed at a center side of the first recess and having a depth deeper than the first depth. a second recess having a depth of
2. The dual interface IC card according to claim 1, wherein said plate-like end portion is arranged in a region outside said second recess when viewed from above. The recess is adjacent to the first recess and arranged in a region outside the second recess, and has a third depth that is deeper than the first depth and shallower than the second depth. It further comprises a third recess that is
3. The dual interface IC card according to claim 2, wherein said plate-like end is at least partially exposed from said card base in said third recess. 4. The dual interface IC card according to any one of claims 1 to 3, wherein said end portion is provided with a through hole. 5. The dual interface IC card according to claim 4, wherein said through-hole is provided to avoid a portion of said plate-shaped end portion facing a terminal of said IC chip. 6. The IC module according to any one of claims 1 to 5, wherein said terminals facing each other and said plate-shaped end are electrically connected via an anisotropic conductive film. Dual interface IC card. 7. The dual interface IC card of claim 6, wherein the anisotropic conductive film contains solder as conductive particles. The plate-like end portion includes a conductive second member forming a surface facing the opening side and an insulating second member forming a surface facing away from the opening side of the second member. 1 member and has a laminated configuration,
8. The dual interface IC card according to claim 1, wherein said tip and said terminal are both electrically connected to said second member. A method for manufacturing a dual interface IC card capable of contact communication and non-contact communication with an external device,
providing a first substrate, a second substrate, and an IC module having an IC chip and a plurality of terminals electrically connected to the IC chip;
forming an antenna composed of an antenna wire and a plate-shaped end on one surface of the first base material, and electrically connecting the tip of the antenna wire and the plate-shaped end, respectively; ,
forming a laminate by laminating the first base material and the second base material so as to sandwich the antenna by heat-sealing or using an adhesive;
punching the laminate into a card size to form a card substrate;
forming a recess for embedding the IC module in the card base so that the plate-shaped end is at least partially exposed;
embedding the IC module in the recess, and electrically connecting the terminal and the plate-like end to face each other;
the antenna is arranged closer to the opening side of the recess than the center of the card base in the thickness direction of the card base;
A method of manufacturing a dual interface IC card, wherein the tip and the terminal are electrically connected to the plate-shaped end on a surface of the plate-shaped end facing the opening side.