JP2023031881A - Dual interface card and manufacturing method thereof - Google Patents

Abstract

To provide a dual interface card configured to efficiently form an antenna at a low cost while securing electrical connection reliability between an IC module and the antenna and adhesiveness of the IC module to the card, and a manufacturing method of the dual interface card.SOLUTION: A dual interface card 1 includes: a card substrate 2; an antenna 8 having a plurality of first ends 81; and an IC module 7 having an IC chip and a plurality of terminals 73a. The IC module 7 is arranged in a recess 9 formed in the card substrate 2 so that the terminal 73a and the first end 81 facing each other may be electrically connected to each other. The first end 81 is configured by repeatedly folding an antenna wire 83 from an outer periphery of the recess 9 toward the center, and partially exposed to the recess 9. The first end 81 in a range from the outer periphery of the recess 9 toward the center is formed along contours of convex shapes that expand along a direction orthogonal to a direction from the outer periphery of the recess 9 toward the center.SELECTED DRAWING: Figure 1

Description

The present invention relates to a dual interface card capable of contact communication and non-contact communication with an external device.

2. Description of the Related Art Conventionally, as IC cards, there have been used contact IC cards for inputting and outputting electrical signals through external connection terminals on the surface of the card, and non-contact IC cards for inputting and outputting electrical signals by electromagnetic induction or the like via antennas. In addition to these, a dual interface card, that is, a contact IC card and a non-contact IC card that can realize both the function of a contact IC card and the function of a contactless IC card with a single IC chip provided in the card, is also used. It is In particular, the dual interface card can be used as a contact IC card that is effective in suppressing the external leakage of input/output data during financial settlement, and can be used in close proximity to the ticket gates at stations and when entering/exiting a room. It can be used as a highly convenient non-contact IC card for exchanges. Therefore, dual interface cards are also becoming popular in the market.

By the way, the dual interface card is manufactured as follows. First, as described in Patent Literature 1, a card substrate including one or more core sheets is formed, and an embedding area in which an IC module is to be embedded is cut from the surface of the card substrate. Then, the IC module is embedded in the embedding area. wherein a conductor is arranged on one of the one or more core sheets, and the conductor is in electrical contact with the winding antenna portion for providing the contactless communication function and the terminal of the IC module; The contact terminals are arranged in a meandering manner, for example.

Moreover, in Patent Document 2, in the manufacture of the above-described dual interface card, both ends of the coated conductor are placed in predetermined areas corresponding to the respective terminals of the IC module mounted in the recess, and the both ends of the coated conductor are meandered in the direction from the outer periphery toward the center of the recess. An electrode portion is provided which is formed by proceeding while bending into a shape and densely arranging. Here, in the electrode portion, the trajectory of the coated conductor between the first turn-around point and the next second turn-around point projects toward the center of the recess at the center relative to the first and second turn-around points. , and exemplarily, the trajectory is arc-shaped or polygonal.

The configuration of the antenna end for electrical connection with the terminals of the IC module typically has a meander shape as shown in FIG. Here, the antenna wire 83 forming the antenna 8 has substantially arcuate bends at its upper and lower ends, and the portions other than the bends are substantially linear in the vertical direction. Here, the outer shape of the IC module to be embedded in the card substrate is typically substantially rectangular. The operating direction of the end mill is the vertical direction parallel to the linear portion of the antenna wire 83 .

JP 2019-219732 A Japanese Patent No. 6442003

At this time, as described in Patent Literature 2, the edge of the end mill bites into a part of the antenna wire 83, so that FIG. As shown in (b), a part of the antenna line 83 is branched into a long and thin shape. Such branched portions of the antenna line 83 are sometimes referred to as whiskers. If a whisker is generated, it may be sandwiched between the terminal of the IC module and the antenna end 81p, thereby interfering with the electrical connection between the IC module and the antenna 8. FIG. Also, by pinching the whiskers, the IC module may protrude from the surface of the card substrate, resulting in an IC card that deviates from the standard.

On the other hand, as exemplified in Patent Document 2, it is conceivable to incline the linear portion of the antenna wire at the end of the antenna with respect to the vertical direction like the antenna end 81q in FIG. 9(c). However, in this case, areas DS1 and DS2 where the antenna line 83 is not arranged are formed on the upper left and lower right of the antenna end 81q. Therefore, the area for electrical connection with the IC module is substantially reduced. Furthermore, when the IC module is adhered to the card base, the areas DS1 and DS2 will have a gap corresponding to the absence of the antenna wire 83, which may hinder the adhesion between the IC module and the card base. In addition, if the straight part of the antenna wire at the end of the antenna is changed to a circular arc or a polygonal line, the trajectory of the antenna wire becomes complicated, leading to an increase in consumption of the antenna wire and processing time. is preferred.

Considering these factors, the antenna end should be placed in the narrowest possible range, in order to ensure good electrical connection with the IC module, and to limit its placement in areas that do not contribute to electrical connection with the IC module. is preferable from the viewpoints of reducing the material cost, improving the efficiency of the work of embedding the antenna wire into the card substrate, and suppressing the above-described whiskers.

The present disclosure has been made in view of such circumstances, and an antenna can be efficiently and inexpensively manufactured while ensuring electrical connection reliability between the IC module and the antenna and adhesion of the IC module to the card. It is an object of the present invention to provide a dual interface card that can be formed and a method for manufacturing the same.

A dual interface card capable of contact communication and non-contact communication with an external device according to the present embodiment includes a card base, an antenna having a plurality of ends disposed inside the card base, an IC chip and a and an IC module having a plurality of terminals electrically connected to the IC chip, wherein the plurality of terminals facing each other and the plurality of ends are electrically connected to each other. is arranged in a recess provided in the card base, and the plurality of end portions are formed by a structure in which the antenna wire that constitutes the antenna is repeatedly folded back from the outer periphery toward the center of the recess, and one of the is exposed in the recess, and the plurality of end portions in the range from the outer periphery toward the center of the recess are convexly spread in a direction orthogonal to the direction from the outer periphery toward the center of the recess. It is formed along the contour.

Further, in the dual interface card according to another aspect of the present embodiment, the recess is formed on the outer peripheral side and has substantially the same depth, and the recess is formed on the center side of the first recess. and a second recess that is deeper than the recess.

Further, in the dual interface card according to another aspect of the present embodiment, the plurality of terminals facing each other and the plurality of ends of the IC module may be electrically connected via an anisotropically conductive film. good.

Further, in the dual interface card according to another aspect of the present invention, the outer periphery is substantially rectangular having sides substantially parallel to the short and long sides of the card base, and the plurality of ends constitute the antenna. The antenna wire may be repeatedly folded back toward the center from the outer circumference, which is a side substantially parallel to the short side of the card base of the recess.

Further, in the dual interface card according to another aspect of the present embodiment, among the plurality of end portions in the range from the outer periphery of the recess toward the center, one region overlapping with the plurality of terminals extends from the outer periphery of the recess toward the center. A width in a direction orthogonal to the direction of movement may be larger than a width in a direction orthogonal to the direction from the outer periphery to the center of the recess in other regions.

Further, in the dual interface card according to another aspect of the present invention, the end portion is composed of a bent portion and a portion other than the bent portion, and the portion of the portion other than the bent portion that overlaps with the terminal is a first and the portion other than the bent portion of the end that does not overlap with the terminal is defined as a second portion, the arrangement pitch of the antenna wires in the first portion is equal to that of the second portion. It may be narrower than the arrangement pitch of the antenna wires.

Moreover, in the dual interface card according to another aspect of the present embodiment, the portion of the end portion other than the bent portion may be inclined with respect to the straight line along the outer periphery.

Further, in the dual interface card according to another aspect of the present embodiment, the angle of inclination of any of the terminals with respect to the straight line along the outer circumference of the portion other than the bent portion is 5 degrees or more, It may be 20 degrees or less.

A method of manufacturing a dual interface card according to another embodiment of the present invention includes embedding an antenna wire in a first base material while applying heat and pressure, and forming an antenna having a plurality of ends on one surface of the first base material. a lamination step of laminating a second base material so as to sandwich the antenna on the first base material on which the antenna is formed; and the first base material and the second base material. A punching step of punching a laminate obtained by laminating the above into a card base body of a card size, a recess forming step of forming a recess for embedding an IC module in the card base, an IC chip and an electrical contact with the IC chip an IC module preparation step of preparing an IC module having a plurality of terminals connected to each other; an IC module adhering step of adhering the IC module to the recess of the card base through an IC module, wherein the plurality of end portions are repeatedly formed from the outer periphery of the recess toward the center by an antenna wire that constitutes the antenna. and part of which is exposed in the recess, and the plurality of ends in the range from the outer periphery of the recess toward the center are perpendicular to the direction from the periphery of the recess toward the center It is formed so as to follow the contours of the shapes that extend convexly along the direction.

According to the present embodiment, a dual interface card and its manufacture in which an antenna can be formed efficiently and at low cost while ensuring the reliability of electrical connection between the IC module and the antenna and the adhesiveness of the IC module to the card. can provide a method.

2 is a plan view for explaining the structure of the dual interface card according to the first embodiment; FIG. 2 is a cross-sectional view illustrating the structure of a dual interface card corresponding to FIG. 1; FIG. It is a figure explaining the detail of the structure of the edge part of an antenna wire. It is a figure explaining connection of an IC module and an IC module and an antenna. 4 is a plan view corresponding to FIG. 3 for explaining the structure of the dual interface card according to the second embodiment; FIG. FIG. 4 is a plan view corresponding to FIG. 3 for explaining the structure of a dual interface card according to a third embodiment; FIG. 10 is a plan view corresponding to FIG. 3 for explaining the structure of a dual interface card according to a fourth embodiment; FIG. 10 is a plan view corresponding to FIG. 3 for explaining the structure of a dual interface card according to a fifth embodiment; It is a figure explaining the antenna edge part which concerns on a prior art.

An example of the dual interface card of the present disclosure will be described below with reference to drawings and the like. However, the dual interface card of the present disclosure is not limited to the embodiments and examples described below.

In addition, each figure shown below is shown typically. Therefore, the size and shape of each part are appropriately exaggerated for easy understanding. In each figure, hatching indicating cross sections of members is omitted as appropriate. Numerical values such as dimensions and material names of each member described in this specification are examples as an embodiment, and are not limited to these, and can be appropriately selected and used. In this specification, terms specifying shapes and geometrical conditions, such as parallel, orthogonal, and perpendicular terms, not only have strict meanings but also include substantially the same states.

1. First Embodiment An example of a first embodiment of the dual interface card of the present disclosure will be described. Here, for convenience of explanation, an XYZ coordinate system is set for the dual interface card 1 . First, as shown in FIGS. 1(a) and 2(b), etc., the Z-axis is taken in the direction normal to the main surface of the dual interface card 1. As shown in FIG. The direction from the main surface of the IC module 7 on which the external connection terminals 71 are not arranged to the main surface on which the external connection terminals 71 are arranged is defined as the +Z direction or the upper direction in the thickness direction. The opposite direction is the -Z direction or downward in the thickness direction.

Also, when the dual interface card 1 is viewed from the +Z direction, a straight line perpendicular to both short sides of the dual interface card 1 and the Z axis is taken as the X axis. The direction toward the side is the +X direction or rightward direction, and the opposite direction is the -X direction or leftward direction. Further, the axis perpendicular to the X-axis and the Z-axis is the Y-axis, the direction from one long side farther from the external connection terminal 71 to the other long side is the +Y direction or upward, and the opposite direction is the -Y direction. or down.

Here, FIG. 1(a) is a plan view of the dual interface card 1 viewed from the +Z direction, and FIG. 1(b) is the vicinity of the external connection terminal 71 of the dual interface card 1 of FIG. is an enlarged view for explaining the arrangement of the antenna 8. FIG. However, in order to make the configuration of the antenna 8 easier to understand, the IC module 7 is omitted, and the antenna wire 83 embedded in the card base 2 is indicated by solid lines instead of dashed lines. That is, the figure is a perspective view of the antenna 8 . Originally, the antenna 8 is not exposed in the area outside the outer circumference 93 of the recess 9 . On the other hand, FIG. 2(a) is a view of the cross-section of the dual interface card 1 of FIG. 1(b) taken along line AA, viewed in the -Y direction. FIG. 2(a) is a diagram with the IC module 7 omitted, and FIG. 2(b) is a diagram with the IC module 7 mounted in FIG. 2(a).

As shown in FIG. 1A, the dual interface card 1 has a substantially rectangular thin plate shape with four rounded corners when viewed from the +Z direction side. Also, on the surface of the dual interface card on the +Z direction side, the IC module 7 including the external connection terminal 71 can be seen slightly to the upper left of the center, that is, closer to the -X direction than the center and closer to the +Y direction. As shown in FIGS. 2A and 2B, the IC module 7 is embedded in a recess 9 formed in the card base 2, and the surface of the external connection terminal 71 on the +Z direction side faces the card base 2. are arranged so as to be substantially flush with the surface on the +Z direction side of the . The form of such a dual interface card 1 complies with ISO/IEC7816, which is an international standard for IC cards.

As shown in FIG. 2(a), the card base 2 constituting the card body of the dual interface card 1 has an oversheet layer 6, a core layer 5, a core layer 4, and an oversheet layer in that order when viewed from the -Z direction side. 3 are laminated and integrated. Typically, but not limited to, the oversheet layers 6 and 3 are transparent substrates and the core layers 5 and 4 are white substrates. An antenna wire 83 constituting the antenna 8 is arranged between the core layers 5 and 4 so as to be sandwiched between them.

The antenna wire 83 that constitutes the antenna 8 is partly exposed in the area of the bottom surface 91a of the first recess 91 formed relatively shallow in the recess 9, and is exposed in the card base body other than this area. 2 completely embedded. In other words, the antenna wire 83 is embedded inside the card base 2, but in the step of cutting the card base 2 to form the recess 9, the antenna wire 83 is cut together to the extent that a part of the antenna wire 83 is not broken. , the cut surface of the antenna wire 83 is exposed to the bottom surface 91 a of the first recess 91 . In the recess 9, in addition to a first recess 91 having approximately the same depth formed on the outer periphery 93 side, a second recess 91 is formed closer to the center than the first recess 91 and deeper than the first recess 91. 92 are further provided.

As shown in FIG. 2(b), the IC module 7 is embedded such that the external connection terminals 71 and the substrate 72 supporting the external connection terminals 71 are placed on the bottom surface 91a of the first recess 91 of the recess 9 described above. 72 and the bottom surface 91 a of the first concave portion 91 of the card base 2 are mechanically bonded via the conductive adhesive layer 11 . Incidentally, in the second concave portion 92, an IC chip body 74, which is a projecting portion of the IC module 7, is accommodated. A terminal 73 a electrically connected to an IC chip provided inside the IC module 7 is provided on the surface of the substrate 72 opposite to the external connection terminal 71 . At this time, the antenna wire 83 exposed on the bottom surface 91a and the terminal 73a are electrically connected through the conductive adhesive layer 11 by the action of heat and pressure when the IC module 7 is embedded in the concave portion 9 of the card base 2. .

Here, both ends of the antenna wire 83 of the antenna 8, which is mostly embedded inside the card base 2 and partly exposed from the first concave portion 91, are located at the second end of FIG. 1(b). It has a configuration as shown at one end 81 and second end 82 . That is, the first end portion 81 and the second end portion 82, which are both end portions of the antenna 8, extend along the X-axis direction so that the first recess portion 91 and a portion thereof overlap in plan view along the Z-axis. placed side by side. Each of the first end portion 81 and the second end portion 82 has a structure in which the antenna wire 83 is repeatedly folded back from the outer periphery 93 of the first recess 91 toward the center of the recess 9 . In other words, the first end portion 81 and the second end portion 82 are formed to have a structure called a so-called zigzag shape, meander shape or bellows shape. By increasing the exposed area of the antenna wire 83 per unit area in the concave portion 9 in this way, the reliability of the electrical connection between the terminal 73a of the IC module 7 and the antenna 8 can be improved.

In addition, in the first end portion 81 and the second end portion 82 of the antenna wire 83, the portions other than the bent portions of the upper end and the lower end of the folded structure are parallel to the sides 93a and 93b along the outer circumference 93 of the first concave portion 91, respectively. They are arranged along straight lines m1 and m2, ie straight lines parallel to the Y-axis. Further, the first end portion 81 and the second end portion 82 are formed so as to follow the contours of the shapes that protrude from each other in the direction orthogonal to the direction from the outer periphery 93 of the recess 9 toward the center. That is, the first end portion 81 and the second end portion 82 each have a substantially circular arc curve that protrudes toward the +Y direction side and the −Y direction side, respectively, and a Y It is formed so as to follow the outline of the shape of the figure enclosed by the substantially straight line segment along the axis. Such a shape is sometimes referred to as a bale shape.

Further, of the first end portion 81 and the second end portion 82, the first exposed portion 84 and the second exposed portion 85, which are the portions where the antenna wire 83 is exposed from the concave portion 9, are also part of the above-described figure. It is formed so as to follow the outline of a figure surrounded by two curved lines and two line segments. Therefore, the first end portion 81 and the second end portion 82, or the first exposed portion 84 and the second exposed portion 85 can be formed relatively compactly while reducing the usage of the antenna wire 83. The work of embedding in the base material while applying heat and pressure can be done efficiently.

In addition, since the first end portion 81 and the second end portion 82 have such a shape, the length along the Y axis of the portion other than the bent portion of the folded structure of the antenna wire 83 constituting them is It is maximum at a predetermined point along the X-axis of one recess 91 . On the other hand, the terminals 73 a and 73 b of the IC module 7 buried above the recess 9 are also arranged so as to be included in a predetermined range along the X-axis of the first recess 91 . Therefore, along the Z-axis direction, the antenna wires 83 of the first end portion 81 and the second end portion 82 overlapping the terminals 73a and 73b of the IC module 7 respectively have lengths along the Y-axis other than the bent portions. Since the length is relatively long, good electrical connection between the IC module 7 and the antenna 8 can be achieved.

On the other hand, the antenna wires 83 of the first end 81 and the second end 82 separated from the terminals 73a and 73b of the IC module 7 along the X-axis have lengths along the Y-axis of the portions other than the bent portions. Since the antenna wire 83 is relatively short, the amount of the antenna wire 83 used can be reduced, and the efficiency of the work of embedding the antenna wire 83 into the card base 2 can be improved. In addition, when cutting a portion along the outer circumference 93 of the first recess 91 and the vicinity of the boundary between the first recess 91 and the second recess 92 with an end mill, the cutting area of the antenna wire 83 is narrow. Unintentional branching can be suppressed.

The configuration of the dual interface card 1 of this embodiment and the details of the manufacturing method thereof will be described below.

(a) Card Substrate The card substrate 2 refers to the card body that constitutes the dual interface card 1 and excludes the IC module 7 . As described above, the card base 2 typically has a structure in which the oversheet layer 6, the core layer 5, the core layer 4 and the oversheet layer 3 are laminated in this order from one end of the -Z direction in the thickness direction. are doing. Between the core layer 5 and the core layer 4, an antenna 8 wound in a loop shape and formed of a coated conductor wire or the like is arranged. The card base 2 may refer to both before the recess 9 is formed and after the recess 9 is formed, and may refer to both without and including the antenna 8 . Moreover, as described above, the antenna wire 83 is processed into a predetermined shape and arranged at the first end portion 81 and the second end portion 82 of the antenna 8 .

However, the layer structure of the card base 2 is not limited to this, and may be a three-layer structure consisting of an oversheet layer, a core layer, and an oversheet layer, a two-layer structure consisting of a core layer and a core layer, or an oversheet layer, a core layer, and an antenna. It may be a five-layer structure including a core layer, a core layer, and an oversheet layer. Further, the surface of the oversheet layer 3 or 6 of the card base 2 opposite to the core layer 4 or 5 may be printed or embedded with a magnetic stripe. may be printed on the surface adjacent to the

The thickness of the card base 2 is preferably 0.76 mm or more and 0.84 mm or less from the viewpoint of complying with standards such as ISO/IEC7816, but may be outside this range.

(i) Core Layer As the core layers 4 and 5, a wide variety of white or colored plastic sheets can be used, and the following single films or composite films thereof can be used. For example, polyethylene terephthalate (PET), PET-G (terephthalic acid-cyclohexanedimethanol-ethylene glycol copolymer), polyvinyl chloride, vinyl chloride-vinyl acetate copolymer, polycarbonate, polyamide, polyimide, cellulose diacetate, cellulose triacetate, polystyrene, ABS, polyacrylate, polypropylene, polyethylene, polyurethane, and the like. The thickness of the core sheet can be appropriately selected in consideration of the overall thickness of the card, and can be, for example, about 0.25 mm or more and 0.38 mm or less. As will be described later, it is necessary to arrange the antenna 8 on the surface of either the core layers 4 or 5 so that the antenna 8 is sandwiched between the two core layers.

(ii) Oversheet layer As the oversheet layers 3 and 6, the same material as the core layer is usually used, but a transparent material having a thickness of about 0.05 mm or more and 0.10 mm or less may be used. many. The oversheet layers 3 and 6 preferably have the same thickness from the viewpoint of preventing curling when the laminate of the core layer and the oversheet layer is integrated by hot pressing or the like, but they are not necessarily the same. It doesn't have to be.

The material of the oversheet layer may be any material as long as it has adhesiveness when heated. However, even if the oversheet layer itself does not have adhesiveness when heated, a layer of a known adhesive that generates adhesiveness when heated or the like is used. By additionally forming between the core layer and the oversheet layer, both can be integrated. Further, when the dual interface card 1 is used as a magnetic card, a magnetic tape is previously embedded by thermal transfer or the like on the principal surface side opposite to the core layers 4 and 5 of either or both of the oversheet layers 3 and 6. You can leave it at

(iii) Antenna sheet In the present embodiment, as described later, the antenna 8 is formed on one surface of the core layer 5, and the first end 81 that is the end of the antenna wire 83 that constitutes the antenna 8 and the The second end portions 82 are processed into predetermined shapes and arranged. The formation of the antenna 8 on the core layer 5 is performed by applying a predetermined heat pressure to the antenna wire 83 and embedding the antenna wire 83 in the core layer 5 while melting the coating of the core layer 5 and the antenna wire 83 . by doing. An intermediate product in which the antennas 8 are embedded in the core layer 5 is sometimes called an antenna sheet 12 . The antenna sheet 12 by itself can be marketed as a component for manufacturing the dual interface card 1. Alternatively, the sheet material such as the core layer 5 is supplied to a processing company, and the processing company manufactures the antenna. There may be a commercial form in which the sheet 12 is processed and delivered to a supplier.

The details of the method for forming the antenna sheet 12 will be described later, but the outline is as follows. First, a coated conductor covered with an insulating member is embedded in the surface of the core layer 5 by a winding forming machine, with one of the first ends 81 and 82 as a starting point and the other as an ending point. That is, while applying a predetermined heat pressure to the core layer 5, the antenna supply head is drawn in a loop shape as shown in FIG. sequentially embedded in the

Here, the first end portion 81 and the second end portion 82, which are either the start point or the end point of the antenna wire 83, are aligned in the left-right direction of the mounting position of the IC module 7 so as to form a predetermined shape described later. , part of which overlaps the terminals 73 a and 73 b of the IC module 7 . Then, the winding machine cuts the antenna wire 83 after forming either the first end portion 81 or the second end portion 82 which is the terminal point of the antenna 8 . Thus, the core layer 5 (antenna sheet 12) with the antenna 8 formed thereon is obtained.

(iv) Antenna The antenna 8 formed on the core layer 5 is electrically connected to the terminals 73a and 73b of the IC module 7 to the first end 81 and the second end 82, respectively, so that the IC module 7 The IC chip and antenna 8 provided in constitute a communication circuit for non-contact communication. The communication circuit may perform proximity communication using, for example, the HF frequency band of 13.56 MHz defined by ISO/IEC18092, ISO/IEC144443, or the like. Alternatively, other communication may be performed using, for example, a UHF frequency band of 920 MHz, an LF frequency band of 125 KHz, or microwaves of 2.45 GHz.

When the dual interface card 1 is held up to an external device such as a reader/writer, current is generated in the communication circuit by a magnetic field formed by the reader/writer or the like, and power is supplied to the IC chip. As a result, the IC chip becomes drivable, transmits/receives information to/from the reader/writer in a non-contact manner, and reads/rewrites information from/to the memory.

The antenna wire 83 that constitutes the antenna 8 is typically formed of a covered conductor in which the periphery of a copper wire is covered with an insulating member. In addition to these, copper alloy wires such as Cu-Ni, Cu-Cr, Cu-Zn, Cu-Sn, and Cu-Be, or various metal wires such as iron, stainless steel, and aluminum, and metal alloy wires are selected. You can also The dual interface card 1 can be manufactured at a low cost by using coated conductors, as compared with, for example, a copper foil etching method.

The diameter of the antenna wire 83 is not particularly limited as long as the characteristics of the non-contact communication circuit can be ensured. 05 mm or more and 0.15 mm or less. By setting the latter range, it is possible to improve durability against heat pressure due to embedding and external force due to cutting, and to ensure good communication characteristics.

Next, the details of the configuration of the first end portion 81 and the second end portion 82 will be described. FIG. 3 is an enlarged view illustrating the configuration of the first end portion 81 of the antenna 8 in FIG. 1(b). One end of the antenna 8 extending from the −X direction side toward the +X direction in FIG. 3 then forms a repeatedly folded structure from the outer circumference 93 of the recess toward the center. In other words, the antenna line 83 extends from the -X direction side toward the +X direction so that the folded structure continues a plurality of times.

The folded structure has substantially arc-shaped bent portions at the ends on the +Y direction side and the −Y direction side, that is, the upper end and the lower end, and the portion other than the bent portion connecting the bent portion at the upper end and the bent portion at the lower end is substantially It is straight or substantially curved. However, it is preferable to form the portions other than the bent portion in a substantially straight shape as much as possible from the viewpoint of work efficiency of embedding the antenna wire 83 into the core layer 5 and saving of material for the antenna wire 83 .

In addition, portions other than the bent portions of the folded structure are arranged along a straight line m1 substantially parallel to the Y-axis along the side 93a of the outer periphery 93 of the recess 9, and adjacent portions other than the bent portions are arranged in a zigzag pattern. The arrangement pitch p1 of the shapes is substantially constant. Further, the first end portion 81 as a whole has a maximum width H1 in the direction along the Y-axis and a width W1 in the direction along the X-axis. It is formed so as to follow the outline of a figure surrounded by line segments. The figure has approximately circular arc curves that are convex toward the +Y direction side and the −Y direction side, and approximately straight line segments along the Y axis on the −X direction side and the +X direction side respectively. have However, the convex shape is not limited to a substantially circular arc curve, and may be a combination of a plurality of substantially circular arc curves, or a shape formed by a stepped polygonal line. Alternatively, it may be formed by combining a plurality of line segments and a plurality of curved lines.

As a result, the length of the antenna wire 83 in the direction along the Y-axis is shorter than H1 at the ends of the first end portion 81 on the -X direction side and the +X direction side. Similarly, the first exposed portion 84, which is a part of the first end portion 81 and where the antenna wire 83 is actually exposed in the first concave portion 91, is also formed so as to follow the contour of the figure of a predetermined shape that is part of the figure. formed in Furthermore, the length of the antenna wire 83 in the direction along the Y-axis is shorter than H1 at the end of the first exposed portion 84 on the -X direction side, that is, at the outer circumference 93 .

In the contour of the figure along which the first end portion 81 extends, when the curved lines that are convex in the +Y direction and the -Y direction are substantially circular arcs, the radius R1 of the circular arc can be determined arbitrarily. R1 is, for example, 1/2 or more times W1, preferably 10 times or less, and more preferably 3/4 or more times W1, and more preferably 5 times or less. When R1 is within the former range, a good electrical connection can be achieved between the IC module 7 and the antenna 8, and the material consumption of the antenna wire 83 can be reduced and the work of embedding the antenna wire 83 into the card base 2 can be made efficient. In addition, since R1 is in the latter range, changes in electrical connection due to relative positional displacement between the IC module 7 and the antenna 8 can be minimized, and further material reduction and embedding work for the antenna wire 83 can be achieved. can be accelerated.

A typical contour shape of the IC module 7 in plan view is a substantially rectangular shape with four rounded corners. In this case, the contour shape of the recess 9 is substantially the same as the contour shape of the IC module 7. In many cases, the contour shape is about 0.1 mm to 0.2 mm larger. In this case, the outer periphery 93 of the recess 9 is substantially rectangular with sides substantially parallel to the short and long sides of the card base 2 , and the first end 81 and the second end 82 are formed by the antenna wire 83 . 9, which is a side substantially parallel to the short side of the card base 2, is repeatedly folded back toward the center.

On the other hand, when the contour shapes of the IC module 7 and the recess 9 are elliptical or the like, the straight line along the side of the outer periphery 93 of the recess 9 is a curved line such as an arc. Point to the tangent. Normally, the outline of the IC module 7 is often configured to be symmetrical in the vertical and horizontal directions. A straight line along the side of the outer circumference 93 is a straight line parallel to the Y-axis.

In addition, the zigzag arrangement pitch p1 of the antenna wires 83 of the first end portion 81 depends on the performance of the winding forming machine, the quality of the antenna sheet 12 after the antenna wires 83 are embedded in the core layer 5, and the like. is preferably 0.50 mm or less, more preferably 0.25 mm or less. When the pitch p1 is within the former range, the exposed area of the antenna wire 83 per unit area at the first end portion 81 can be increased, and the area for electrical connection with the terminals 73a of the IC module 7 can be expanded. As a result, the electrical connection reliability can be improved, and the electrical resistance of the contact portion between the antenna wire 83 and the terminal 73a can be reduced. Further, by setting the pitch p1 within the latter range, the above effects can be further enhanced.

Note that, in the present embodiment, of the region of the first end portion 81 along the X direction, the end on the +X direction side is substantially at the same position as the boundary between the first recess 91 and the second recess 92, and is located at the −X direction. The side edge is on the −X direction side of the edge of the first recess 91 , which is the outer periphery 93 of the recess 9 . Thus, when the end of the first end portion 81 on the +X direction side is at substantially the same position as the boundary between the first concave portion 91 and the second concave portion 92 or is located on the -X direction side from this, the second The antenna wire 83 is not cut when the recess 92 is cut, or the amount of cutting of the antenna wire 83 can be reduced. Therefore, it is possible to suppress the branching of the antenna wire 83, that is, the generation of whiskers, which tends to occur as the cutting depth increases.

In addition, of the region along the X direction of the first end portion 81, the end on the -X direction side is located on the -X direction side of the end of the first recessed portion 91, which is the outer periphery 93 of the recessed portion 9, so that the antenna 8 Even if there is a misalignment with respect to the core layer 5 or a misalignment of the formation position of the recess 9, the dense area of the antenna wires 83 exists continuously. Therefore, reliable electrical connection with the terminals 73a of the IC module 7 can be achieved. However, in the region along the X direction of the first end portion 81, the end on the +X direction side may be on the +X direction side of the boundary between the first recess 91 and the second recess 92, or may be on the -X direction side. may be located on the +X direction side of the edge of the first recess 91 , which is the outer periphery 93 of the recess 9 .

The above description relates to the relationship between the first end 81 of the antenna 8 and the terminal 73a of the IC module 7 electrically connected thereto. It is also established between the terminal 73b that is connected to the terminal 73b. Further, in the above embodiment, the description has been made on the premise that the antenna 8 has two ends, the first end 81 and the second end 82, for electrical connection with the IC module 7. Three or more ends may be provided, and the number of corresponding terminals of the IC module 7 may also be the same.

(b) IC Module Next, each part of the main constituent elements of the IC module 7 will be described mainly based on FIG. 2(b) and FIG. FIG. 4(a) is a view of the external connection terminal 71 side of the IC module 7 viewed from the +Z direction side, like FIG. 1(a). FIG. 4(b) is a view of the IC module 7 viewed from the −Z direction side opposite to FIG. 4(a). Here, most of the molded portion 74b of the IC chip body 74 is omitted so that the inside can be seen through. Moreover, FIG.4(c) is sectional drawing which expanded the B section near the terminal 73a of FIG.2(b).

The IC module 7 is embedded in the recess 9 formed in the card base 2, and the terminals 73a and 73b of the IC module 7 are electrically connected to the first end 81 and the second end 82 of the antenna 8, respectively. Thus, a communication circuit for contactless communication can be formed. At this time, contact communication with a contact reader/writer or the like can be performed through the external connection terminals 71 provided in the IC module 7 .

The substrate 72 is made of a resin film having flexibility such as glass epoxy resin or polyimide resin, and copper foils are attached to the front and back surfaces of the resin film via an adhesive. It is left so as to form a pattern. Specifically, a film on which a photosensitive material is applied and a predetermined pattern is formed so that an external connection terminal 71 is formed on one copper foil surface of the resin film and terminals 73a and 73b are formed on the other copper foil surface. Mounting of the plate, exposure, and etching removal of non-photosensitive portions are performed in sequence. As a result, a substrate 72 is formed in which a predetermined pattern of copper foil is partially left on the front and rear surfaces of the resin film. Further, the substrate 72 is provided in advance with a plurality of bonding holes 76 which are through holes for wire bonding to the external connection terminals 71 .

As shown in FIG. 4A, the external connection terminals 71 are defined with respective sections of the external terminals defined by the ISO/IEC7816-2 standard. These sections and the IC chip 74a are connected by wires 75 such as gold wires through the bonding holes 76 provided in the substrate 72, as shown in FIG. 4(b). Similarly, the terminals 73a and 73b and the IC chip 74a are also connected by wires 75. FIG. These bonding holes 76 and wires 75 are covered and protected by the mold portion 74b.

An IC chip body 74 is arranged on the surface of the substrate 72 opposite to the surface on which the external connection terminals 71 are formed. The IC chip body 74 includes an IC chip 74a adhered and fixed to the substrate 72 via an adhesive, bonding wires 75 for connection, and a mold portion 74b which is a sealing resin for protecting them. consists of The IC chip 74a includes a CPU for controlling operations of both contact communication and non-contact communication, storage devices such as RAM, ROM, EEPROM, and flash memory, and input signal decoding and output signal decoding for contact communication and non-contact communication. and various circuits such as an interface circuit for generation and a power generation circuit. Various circuits may be provided as separate elements from the IC chip 74a.

The molded portion 74b is provided as a projecting portion that covers the IC chip 74a and the wire 75 in order to protect them from external force load and environmental load. An ultraviolet curable resin, a thermosetting resin, or the like is used as the mold portion 74b.

(c) Conductive Adhesive Layer After forming a recess 9 for embedding the IC module 7 in the card base 2 by cutting with an end mill or the like, the IC module 7 is embedded and fixed in the recess 9, and electrically and mechanically bonded. The conductive adhesive layer 11 that is connected to each other will be described. As shown in FIG. 4(c), the conductive adhesive layer 11 is attached to the core layer 5 where the antenna wire 83 is partially cut and exposed on the bottom surface 91a, the substrate 72 of the IC module 7, and the substrate 72. It is a liquid or tape-like member arranged so as to be sandwiched between the formed terminals 73a.

The conductive adhesive layer 11 may be applied or attached in advance to the surface of the substrate 72 of the IC module 7 opposite to the external connection terminals 71, and may be applied to the bottom surface 91a of the recess 9 of the card base 2 after cutting. It may be painted or pasted.

Since the typical conductive adhesive layer 11 also serves as a mechanical connection between the IC module 7 and the cut card base 2, it is applied to the entire back surface of the substrate 72 or to a portion of the recess 9 corresponding to the first recess 91. It may be attached or affixed. By doing so, the electrical connection between the IC chip 74a and the antenna 8 and the mechanical connection between the IC module 7 and the card base 2 can be performed with the same kind of conductive adhesive layer 11, which contributes to the simplification of the process. .

However, the conductive adhesive layer 11 is applied and attached so as to cover only the areas of the terminals 73a and 73b on the back surface of the substrate 72, and another non-conductive adhesive is applied to the other back surface of the substrate 72. may be painted or attached. This is because it is possible to easily select an adhesive that is more advantageous for mechanical connection because the conductivity of the other adhesive does not have to be taken into consideration.

ACF (Anisotropic Conductive Film), ie, an anisotropic conductive film, or ACP (anisotropic conductive paste) can be used as the conductive adhesive layer 11 that can be used for both electrical connection and mechanical connection. In addition, a so-called conductive paste or the like in which silver particles are dispersed in an epoxy resin as a filler can be used. Among them, if ACF is used, the entire back surface of the substrate 72 of the IC module 7 is thermally laminated with the ACF, and after embedding the IC module 7 in the recess 9 of the cut card base 2, this is subjected to a predetermined temperature and load. can be heat-pressed. By doing so, the electrical connection between the IC chip 74a and the antenna 8 can be easily achieved. Furthermore, since the IC module 7 can be mechanically connected to the card base 2 at the same time, the process of mounting the IC module 7 to the card base 2 can be simplified.

The electrical connection between the IC chip 74a and the antenna 8 and the mechanical connection between the IC module 7 and the card substrate 2 when ACF is used as the conductive adhesive layer 11 are as follows based on FIG. I can explain. The conductive adhesive layer 11 has a structure in which conductive particles 11a, in which a metal film is formed around a spherical resin or spherical metal, are dispersed in an adhesive 11b, which is a binder containing an adhesive component. Here, the conductive adhesive layer 11 arranged so as to be sandwiched between the core layer 5 with the antenna wire 83 partially exposed, the substrate 72 of the IC module 7, and the terminals 73a formed on the substrate 72 is compressed. A thermal pressure is applied to the substrate 72 from the +Z direction to the −Z direction so that the substrate 72 is formed.

As a result, a portion of the conductive adhesive layer 11 sandwiched between the core layer 5 and the terminal 73a, where the gap is particularly narrow, is subjected to strong heat pressure, and the conductive particles 11a of the conductive adhesive layer 11 in this portion are removed from the conductive adhesive layer. 11 are pressed from the exposed antenna wire 83 and the terminal 73a of the core layer 5 along the thickness direction. When the conductive particles 11a are small, the conductive particles 11a overlap from the antenna wire 83 to the terminal 73a along the thickness direction of the conductive adhesive layer 11 in a daisy chain. That is, the exposed antenna wire 83 and the terminal 73a are electrically connected through the conductive particles 11a.

On the other hand, between the core layer 5 and the substrate 72 in the region where the terminals 73a do not exist, the conductive particles 11a are pressed along the thickness direction of the conductive adhesive layer 11 from the antenna wire 83 and the terminals 73a, or the rosary is pressed. It does not compress to the extent that it overlaps the tether. However, the core layer 5 and the substrate 72 are mechanically connected by the adhesive strength of the adhesive 11b generated by the heat pressure.

(d) Manufacturing Method of Dual Interface Card 1 Next, an example of manufacturing method of the dual interface card 1 using the card substrate 2, the IC module 7 and the conductive adhesive layer 11 described above will be described.

First, on the surface of either the core layer 5 or 4 on the side not adjacent to the oversheet layer 6 or 3, a coated conductor coated with an insulating material is used as the antenna wire 83, and the first end 81 or the second Using either one of the ends 82 as a starting point and the other as an ending point, the wire is embedded by a winding forming machine. Specifically, for example, while applying a predetermined heat pressure to the core layer 5, an antenna supply head is drawn in a loop shape as shown in FIG. 83 are sequentially embedded in the core layer 5 .

Here, the antenna wire 83 is arranged at predetermined positions on the left and right of the planned mounting position of the IC module 7 so that the first end portion 81 and the second end portion 82 are aligned in the horizontal direction, and the antenna wire 83 is cut at the end point. do. The first end portion 81 and the second end portion 82 of the winding forming machine are configured by the antenna wire 83 that constitutes the antenna 8 so as to be constituted by a repeatedly folded structure from the outer periphery 93 of the recess 9 toward the center. The arrangement position of the antenna wire 83 is adjusted by changing the movement. Here, the antenna 8 is embedded in the core layer 5 so that the portion of the antenna wire 83 other than the bent portion of the folded structure is along the Y-axis, which is a straight line along the outer circumference 93 .

In addition, the antenna 8 is arranged on the core layer such that the first end 81 and the second end 82 follow the contours of the shapes that spread convexly each other along the direction perpendicular to the direction toward the center from the outer periphery 93 of the recess 9 . 5 is embedded. That is, the first end portion 81 and the second end portion 82 are curved in a substantially circular arc that is convex in the +Y direction side and the -Y direction side, respectively, and Y in the -X direction side and the +X direction side, respectively. The antenna 8 is embedded in the core layer 5 so as to follow the outline of the figure surrounded by the substantially straight line segment along the axis.

Next, as shown in FIG. 2, the oversheet layer 6, the core layer 5, the core layer 4 and the oversheet layer 3 are stacked in this order from the bottom in the thickness direction. After that, the card is sandwiched between stainless steel plates from above and below in the thickness direction in units of a stack of large-sized sheets arranged in a multi-faceted manner, and heat pressure is applied to the stack through the stainless steel plates. At this time, the antenna 8 is formed on the core layer 5 in advance.

Through such a hot press process, it is possible to obtain a large-sized sheet unit card base in which each layer of the laminate is integrated. If either the oversheet layer or the core layer has heat resistance such that it is not heat-sealable at a predetermined temperature, an adhesive sheet that is heat-sealable at a predetermined temperature is sandwiched between the layers, or an adhesive is applied. After that, they are subjected to a hot press process to obtain an integrated large-sized sheet unit card base.

The large sheet unit card base in which the cards are arranged vertically and horizontally in multiple faces obtained as described above is punched out as a card base 2 having a card size of ISO/IEC7816 by a punching machine. Further, a recess 9 for embedding the IC module 7 is formed in the card base 2 by cutting with an end mill. As a result, the cut card base 2 is obtained. The concave portion 9 is composed of two steps, a first concave portion 91 for accommodating the flat board 72 of the IC module 7 and a second concave portion 92 for accommodating the convex IC chip body 74 . As mentioned above.

Here, the depth of the first recess 91 corresponds to the embedding depth of the first end 81 and the second end 82 of the antenna 8 . That is, when the first concave portion 91 is formed by cutting, part of the antenna wire 83 of the first end portion 81 and the second end portion 82 is exposed on the bottom surface 91 a of the first concave portion 91 . In other words, the depth from the surface of the card base 2 on the side where the external connection terminals 71 are exposed to the bottom surface 91a of the first recess 91 is d1, and either the first end 81 or the second end 82 is located from the surface. Let d2 be the distance to the upper end of one antenna line 83 . Also, let d3 be the distance from the surface to the lower end of the one antenna wire 83 . At this time, d2<d1<d3 holds for each value of d1, d2 and d3. This is because if this condition is not satisfied, the antenna wire 83 may be broken by cutting or may not be exposed from the bottom surface 91a.

Further, the concave portion 9 is formed so that the surface of the external connection terminal 71 is substantially flush with the surface of the non-cutting area of the card base 2 . Here, the thickness of the substrate 72 of the IC module 7 is about 0.07 mm or more and 0.2 mm or less, and the thickness of the IC chip body 74 is about 0.45 mm or more and 0.75 mm or less. Moreover, the thickness of the conductive adhesive layer 11 is usually about 0.03 mm or more and 0.2 mm or less. In consideration of these, the depth of the first recess 91 is normally about 0.1 mm or more and 0.4 mm or less, and the depth of the second recess 92 is normally about 0.48 mm or more and 0.78 mm or less. Note that the depth of the second recess 92 is deeper than the depth of the first recess 91 .

On the other hand, apart from the manufacturing of the card base 2 and the cutting for forming the concave portion 9, the conductive adhesive layer 11 is adhered to the IC module 7. As shown in FIG. As the IC module 7, a module tape in which the IC modules 7 are continuously formed on a long tape in one row or two rows is usually used. A tape-shaped ACF is pasted on the surface of the module tape opposite to the surface on which the external connection terminals 71 are formed, while applying constant heat and pressure. After that, the module tape to which the ACF is pasted is punched out by a punching machine to form a substantially rectangular IC module 7 having rounded corners, whereby the IC module 7 to which the conductive adhesive layer 11 is pasted is obtained.

After that, the IC module 7 with the conductive adhesive layer 11 attached is embedded in the card base 2 having the concave portion 9 formed therein, and a predetermined heat block is pressed against the external connection terminals 71 to face the card base 2 side. A predetermined amount of heat and pressure is applied for a predetermined period of time. Thereby, by melting the conductive adhesive layer 11 made of ACF, the terminals 73a and 73b of the IC module 7 and the first end 81 and the second end 82 of the antenna 8 are electrically connected, Mechanical connection between the IC module 7 and the card substrate 2 is attempted. Depending on the type and composition of ACF, there are differences in the time and heat-pressing conditions, but as an example, the time is 0.5 seconds or more and 10.0 seconds or less, the temperature is 150 ° C. or more and 250 ° C. or less, the pressure is can be 20 MPa or more and 100 MPa or less.

(e) Regarding the dual interface card of the first embodiment To summarize the above, the dual interface card 1 of the first embodiment comprises a card base 2 and at least a plurality of end portions arranged inside the card base 2. an antenna 8 having a first end 81 and a second end 82 . Further, the dual interface card 1 includes an IC module 7 having an IC chip 74a and a plurality of terminals 73a and 73b electrically connected to the IC chip 74a. The IC module 7 is arranged in the concave portion 9 provided in the card base 2 so that the terminals 73a and 73b and the first end portions 81 and the second end portions 82 facing each other are electrically connected to each other. be done.

A first end portion 81 and a second end portion 82, which are a plurality of ends, are formed by a structure in which the antenna wire 83 forming the antenna 8 is repeatedly folded back from the outer periphery 93 of the recessed portion 9 toward the center. A part of it is exposed in the recess 9 . In addition, the portions other than the bent portion of the folded structure of the antenna 8 are along straight lines along the sides 93a and 93b of the outer periphery 93, and the plurality of first end portions 81 and the second end portions 82 are contoured in a predetermined shape. formed to follow.

The predetermined shape means that the first end portion 81 and the second end portion 82 in the range from the outer periphery 93 of the recess 9 toward the center extend along the direction perpendicular to the direction toward the center from the outer periphery 93 of the recess 9 and extend in the +Y direction. , and -Y-direction, which are convex shapes that spread out toward each other. Further, of the first end portion 81 and the second end portion 82, the first exposed portion 84 and the second exposed portion 85, which are the portions where the antenna wire 83 is exposed from the concave portion 9, are also part of the predetermined shape described above. to form

Therefore, in the dual interface card 1 of the present embodiment, the first end portion 81 and the second end portion 82 can be formed relatively compactly while reducing the usage of the antenna wire 83. Therefore, the antenna wire 83 is subjected to heat pressure. It is possible to efficiently perform the work of embedding in the base material. In addition, the length along the Y-axis of the portion other than the bent portion of the folded structure of the antenna wire 83 that constitutes the first end portion 81 and the second end portion 82 is a region overlapping the terminals 73 a and 73 b of the IC module 7 . It can be arranged relatively long in the vicinity and relatively short in the vicinity of the non-overlapping region.

Furthermore, since the cutting amount of the antenna wire 83 can be reduced when cutting with an end mill, unintended branching of the antenna wire 83 can be suppressed. As a result, in the dual interface card 1 of the present embodiment, the reliability of the electrical connection between the IC module 7 and the antenna 8 and the adhesiveness of the IC module 7 to the card base 2 are ensured, while efficient and low Antenna 8 can be formed at low cost.

2. Second Embodiment Next, a dual interface card according to a second embodiment of the present disclosure will be described.

FIG. 5 is a diagram showing the configuration of the first end 81a of the antenna 8 corresponding to FIG. 3 regarding the dual interface card of the second embodiment. The first end 81a of the dual interface card of this embodiment follows a contour of a figure different from that of the first end 81 of the first embodiment. The entire first end portion 81a has a maximum width H1 in the direction along the Y-axis and a width W1 in the direction along the X-axis. The first end portion 81a has a maximum width H1 in the direction along the Y-axis at the portion overlapping with the terminal 73a of the IC module 7, which is indicated by a dashed line in FIG. The antenna line 83 is arranged so that the width in the direction along the Y-axis is smaller than the maximum width H1 in the portion.

The −X direction side portion of the first end portion 81a that overlaps approximately half of the terminal 73a in the −X direction is defined as a first portion AR11, and overlaps approximately half of the +X direction side of the terminal 73a. A portion of the first end portion 81a on the +X direction side of the first portion AR11 is referred to as a second portion AR12. At this time, in the first portion AR11, the width of the first end portion 81a in the direction along the Y-axis as it proceeds from the −X direction side to the +X direction side becomes linear with respect to each of the +Y direction side and the −Y direction side. It is formed so as to gradually increase in size along the contour. On the other hand, in the second portion AR12, the width of the first end portion 81a in the direction along the Y-axis as it proceeds from the -X direction side to the +X direction side is substantially arc-shaped on each of the +Y direction side and the -Y direction side. It is formed to gradually become smaller along the contour.

The terminal 73a is arranged closer to the +X direction than the approximate center of the first end portion 81a in the direction along the X axis. Therefore, the first portion AR11 has a larger width along the X-axis than the second portion AR12, and the figure along which the first end portion 81a extends is substantially symmetrical when viewed along the Y-axis direction. It is asymmetric when viewed along the axial direction. As described above, the figure along which the first end portion 81a extends includes a portion where a substantially straight line segment and a substantially circular arc curve that are convex toward the +Y direction side and the −Y direction side are connected, and a −X direction side. It is surrounded by substantially straight line segments along the Y-axis on each of the direction side and the +X direction side.

However, the figure along which the first end portion 81a extends is not limited to this. The +Y direction side and the −Y direction side may be formed so as to gradually increase in size along a substantially arcuate contour. In the second portion AR12, the width of the first end portion 81a in the direction along the Y-axis as it proceeds from the -X direction side to the +X direction side is substantially linear on each of the +Y direction side and the -Y direction side. It may be formed to gradually become smaller along the contour.

Furthermore, between the first portion AR11 and the second portion AR12, there is further provided a third portion AR13 that overlaps the substantially central portion of the terminal 73a, and the third portion AR13 advances from the −X direction side to the +X direction side. The width of the first end portion 81a in the Y-axis direction may be formed to maintain substantially the same maximum width H1.

Although the above description is for the first end 81a, the same applies to the second end arranged side by side in the +X direction. At this time, the second end is preferably formed symmetrically with the first end 81a, that is, symmetrical with respect to a straight line along the Y-axis. Instead of being bilaterally symmetrical with the portion 81a, the first end portion 81a may be formed in a shape translated along the XY plane. This point is also common to subsequent embodiments.

In this way, in the portion where the first end portion 81a overlaps the terminal 73a of the IC module 7, the width in the direction along the Y-axis becomes the maximum width H1, and in the portion other than the overlapping portion, the width along the Y-axis The antenna line 83 is arranged so that the width in the direction of the antenna line 83 is smaller than the maximum width H1. This provides the following effects. That is, since the length of the antenna wire 83 along the Y-axis is relatively long at the portion overlapping with the terminal 73a, good electrical connection between the IC module 7 and the antenna 8 can be achieved.

In addition, in the second portion AR12, the figure along which the antenna wire 83 follows can be a substantially trapezoidal shape that does not include a substantially circular arc. can be shortened. Therefore, the amount of the antenna wire 83 used can be further reduced, and the work of embedding the antenna wire 83 can be made more efficient. Furthermore, unintended branching of the antenna wire 83 during cutting can be suppressed.

3. Third Embodiment Next, a dual interface card according to a third embodiment of the present disclosure will be described.

FIG. 6 is a diagram showing the configuration of the first end portion 81b of the antenna 8 corresponding to FIG. 3 regarding the dual interface card of the third embodiment. The first end 81b of the dual interface card of this embodiment follows a contour of a figure different from that of the first ends of the above-described embodiments. The entire first end portion 81b has a maximum width H21 in the direction along the Y-axis and a width W1 in the direction along the X-axis. The first end portion 81b has a maximum width H21 in the direction along the Y-axis at the portion overlapping with the terminal 73a of the IC module 7, which is indicated by a dashed line in FIG. The antenna line 83 is arranged so that the width in the direction along the Y-axis is smaller than the maximum width H21 in the portion.

A portion of the first end portion 81b on the -X direction side that does not overlap with the terminal 73a is defined as a first portion AR21, and a portion of the first end portion 81b on the +X direction side of the first portion AR21 that overlaps with the terminal 73a is defined as a first portion AR21. A second portion AR22. A portion of the first end portion 81b on the +X direction side of the second portion AR22, which does not overlap the terminal 73a, is referred to as a third portion AR23. At this time, in the first portion AR21 and the third portion AR23, the width of the first end portion 81b in the direction along the Y-axis is H22, and the value of H22 is smaller than the value of H21. On the other hand, in the second portion AR22, the width in the direction along the Y-axis of the first end portion 81b is a substantially constant maximum width H21.

Thus, the figure along which the first end portion 81b extends constitutes a first substantially rectangular portion that constitutes the first portion AR21, a second substantially rectangular portion that constitutes the second portion AR22, and a third portion AR23. It becomes a figure combined with the third substantially rectangular portion. Here, since the second substantially rectangular portion has a larger width in the direction along the Y-axis than the first substantially rectangular portion and the third substantially rectangular portion, the figure along which the first end portion 81b extends is a substantially cross. becomes a mold. However, the widths in the Y-axis direction of the first portion AR21 and the third portion AR23 do not have to be the same, and may be shorter than H21 and different from each other.

On the other hand, the figure along which the first end portion 81b extends is not the first substantially rectangular part, but the figure forming the first portion AR21 has a lower base with a width H21 on the side facing the second portion AR22, and −X It may be a substantially trapezoidal portion with an upper base narrower than H21 on the side facing the direction side. Similarly, the figure that constitutes the third portion AR23 is not the third substantially rectangular portion, but the side facing the second portion AR22 has a lower base with a width H21, and the side facing the +X direction side is wider than H21. It may be a substantially trapezoidal portion with a narrow upper base.

That is, the figure along which the first end portion 81b extends may be substantially octagonal. By forming the first end portion 81b into such a shape, even if the position of the terminal 73a in the direction along the X-axis deviates from the range of the second portion AR22, the first end overlapping the terminal 73a Reduction in the area of the portion 81b can be suppressed smoothly. Therefore, good electrical connection between the IC module 7 and the antenna 8 can be achieved while suppressing the influence of the positional displacement of the IC module 7 .

It is preferable that the width of the second portion AR22 along the X-axis is set slightly wider than the width of the terminal 73a along the X-axis in consideration of mounting misalignment of the IC module 7 and the like. When the width of the second portion AR22 along the X axis is Dar22 and the width of the terminal 73a along the X axis is D73a, for example, Dar22 is preferably 101% or more and 300% or less of D73a. % or more and 200% or less is more preferable. In particular, by setting the latter range, the IC module 7 and the antenna 8 can be sufficiently electrically connected even in consideration of the dislocation of the antenna wire 83, the dislocation of the card substrate 2, the misalignment of the mounting position of the IC module 7, and the like. This is because the connection can be achieved, the usage of the antenna wire 83 can be reduced, and the embedding work can be performed efficiently.

In this way, in the portion overlapping with the terminal 73a of the IC module 7, the width in the direction along the Y-axis is substantially constant at the maximum width H1, and in the portion other than the overlapping portion, the width in the direction along the Y-axis is The antenna line 83 is arranged so that the width is substantially constant, which is smaller than the maximum width H1. This provides the following effects. That is, since the length of the antenna wire 83 along the Y-axis at the portion overlapping with the terminal 73a is long with a constant width, the IC module 7 and the antenna 8 can be connected without being affected by the deviation of the mounting position of the IC module 7 or the like. good electrical connection can be achieved. In addition, since the length of the antenna wire 83 along the Y-axis is constant and short in the portion not overlapping the terminal 73a, the amount of the antenna wire 83 used can be further reduced, and the embedding work of the antenna wire 83 can be further reduced. Efficient. Furthermore, unintended branching of the antenna wire 83 during cutting can be suppressed.

4. Fourth Embodiment Next, a dual interface card according to a fourth embodiment of the present disclosure will be described.

FIG. 7 is a diagram showing the configuration of the first end 81c of the antenna 8 corresponding to FIG. 3 regarding the dual interface card of the fourth embodiment. The first end 81c of the dual interface card of this embodiment follows the contour of a figure similar to that of the first end 81 of the first embodiment. That is, the figure has approximately arcuate curves that become convex toward the +Y direction side and the −Y direction side, and approximately straight lines along the Y axis on the −X direction side and the +X direction side. has a line segment. However, in the antenna wire 83 of the first end portion 81c, the arrangement pitch of the portions other than the bent portions of the adjacent folded structures is changed depending on the region of the first end portion 81c. 81 is different.

That is, the portion on the -X direction side of the first end portion 81c that does not overlap with the terminal 73a, which is indicated by a dashed line in FIG. A portion of the first end portion 81c, which is the side, is referred to as a second portion AR32. A portion of the first end portion 81c on the +X direction side of the second portion AR32, which does not overlap the terminal 73a, is referred to as a third portion AR33. At this time, in the first portion AR31, the arrangement pitch of the portions other than the bent portion of the adjacent folded structure of the antenna wire 83 forming the first end portion 81c is substantially constant p31, and in the second portion AR32, the same is p32 with a substantially constant arrangement pitch, and in the third part AR33, a similar arrangement pitch is p33 with a substantially constant arrangement pitch.

Here, the value of p32 is smaller than the values of p31 and p33. Also, typically the values of p31 and p33 may be the same, but they may be different values. In other words, the arrangement pitch of the portion of the first end portion 81c other than the bent portion of the folded structure of the antenna wire 83 that overlaps with the terminal 73a is narrower than the arrangement pitch of other portions that do not overlap with the terminal 73a. It's becoming

Thus, in the portion where the first end portion 81c overlaps the terminal 73a of the IC module 7, the arrangement pitch of the portion other than the bent portion of the folded structure of the antenna wire 83 is arranged narrower than the other portion. Thereby, the contact area for electrical connection between the IC module 7 and the antenna 8 can be increased. Therefore, better electrical connection between the IC module 7 and the antenna 8 can be achieved. In addition, since the arrangement pitch is wide in the portion that does not overlap with the terminal 73a, the amount of the antenna wire 83 used can be further reduced, and the work of embedding the antenna wire 83 can be made more efficient. Furthermore, unintended branching of the antenna wire 83 during cutting can be suppressed.

5. Fifth Embodiment Next, a dual interface card according to a fifth embodiment of the present disclosure will be described.

FIG. 8 is a diagram showing the configuration of the first end 81d of the antenna 8 corresponding to FIG. 3 regarding the dual interface card of the fifth embodiment. The first end 81d of the dual interface card of this embodiment follows the contour of a figure similar to that of the first end 81 of the first embodiment. That is, the figure has approximately arcuate curves that become convex toward the +Y direction side and the −Y direction side, and approximately straight lines along the Y axis on the −X direction side and the +X direction side. has a line segment. However, the portion other than the bent portion of the folded structure of the antenna wire 83 is at a predetermined angle with respect to the straight line along the side 93a of the outer periphery 93 of the recess 9 in FIG. It differs from the first end portion 81 of the first embodiment in that it is inclined clockwise by a certain angle θ.

Here, the entire first end portion 81c is arranged along the outline of a rectangle having a width of H1 in the direction along the Y axis and a width of W1 in the direction along the X axis. That is, the length of the portion of the folded structure other than the bent portion is approximately the same length near the center of the first end portion 81d along the X direction. However, near the end on the −X direction side and near the end on the +X direction side, the length of the portion other than the bent portion of the folded structure is gradually shortened toward the −X direction and +X direction, respectively.

The inclination angle θ is preferably 2 degrees or more and 20 degrees or less, more preferably 5 degrees or more and 15 degrees or less. In addition, the inclination angle θ does not have to be exactly the same in all portions of the folded structure other than the bent portions, and may vary within the range described above. Since the inclination angle θ is within the former range, the antenna wire 83 has an inclination with respect to the direction along the Y-axis, which is the movement direction of the end mill during cutting of the concave portion 9. This is because it can be suppressed.

Further, when the +X direction end of the first end portion 81c is located on the +X direction side of the boundary between the first recess 91 and the second recess 92, the antenna wire 83 is cut when the second recess 92 is cut, This breaks in the middle. However, if the inclination angle .theta.

On the other hand, since the inclination angle .theta. Moreover, even when the +X direction end of the first end portion 81 is located on the +X direction side of the boundary between the first recess 91 and the second recess 92 , the antenna wire 83 is cut off when the second recess 92 is cut. The disconnection area of the wire 83 can be further reduced. As a result, the reliability of electrical connection between the antenna 8 and the terminal 73a of the IC module 7 can be further improved.

In particular, when the end on the +X direction side is located on the +X direction side of the boundary between the first concave portion 91 and the second concave portion 92 , this region includes the bent portion of the folded structure of the antenna wire 83 . It is preferable to arrange so as not to include other parts. By doing so, when cutting the second concave portion 92, the antenna wire 83 is less likely to branch from the bent portion that is greatly deviated from the direction along the Y axis, which is the movement direction of the end mill, and as a result, the quality This is because it contributes to improvement.

In this embodiment, the inclination angle θ is the angle at which the portion other than the bent portion inclines clockwise with respect to the straight line m1. However, θ mentioned above may be replaced with an angle at which the portion other than the bent portion is inclined counterclockwise with respect to the straight line m1. This is because even if the portion other than the bent portion is inclined counterclockwise, the same effects as in the case where the portion is inclined clockwise can be obtained.

As described above, each embodiment and each modification described in the present disclosure can be implemented in combination with each other in part or in whole as long as there is no contradiction. included. For example, in the first end portion 81b of the third embodiment, the contour shapes of the first portion AR21, the second portion AR22, and the third portion AR23 are parallelograms, and like the first end portion 81d of the fifth embodiment, , the portion other than the bent portion of the folded structure of the antenna wire 83 may be inclined at an angle θ with respect to the straight line m1.

Further, the antenna wire 83 overlapping the terminal 73a of the IC module 7 at the first end 81a of the second embodiment, the first end 81b of the third embodiment, or the first end 81d of the fifth embodiment may be configured as follows. That is, like the first end portion 81c of the fourth embodiment, the antenna wires 83 may be arranged with a narrower arrangement pitch in the portions other than the bent portion of the folded structure compared to the other portions. This is because even if each embodiment and each modification are combined in this manner, the effects of each embodiment and each modification can be similarly obtained.

1 dual interface card 2 card base 3, 6 oversheet layers 4, 5 core layer 7 IC module 8 antenna 9 recess 11 conductive adhesive layer 11a conductive particles 11b adhesive 71 external connection terminal 72 substrate 73a, 73b terminal 74 IC chip body 74a IC chip 74b Mold portion 74p Pad 75 Wire 76 Bonding holes 81, 81b, 81c, 81d First ends 81p, 81q Antenna ends 82, 82b Second end 83 Antenna wire 84 First exposed portion 85 Second exposed portion 91 First recess 91a Bottom surface 92 Second recess 93 Periphery 93a, 93b Side

Claims (9)

A dual interface card capable of contact communication and non-contact communication with an external device,
a card base;
an antenna having a plurality of ends disposed inside the card base;
an IC module having an IC chip and a plurality of terminals electrically connected to the IC chip,
said IC module is arranged in a recess provided in said card base so that said plurality of terminals and said plurality of ends facing each other are electrically connected to each other;
The plurality of end portions are formed by a structure in which the antenna wire that constitutes the antenna is repeatedly folded back from the outer periphery of the recess toward the center, and a portion thereof is exposed in the recess,
The plurality of end portions in the range from the outer periphery of the recess toward the center are formed along contours of shapes that protrude from each other in a direction orthogonal to the direction from the outer periphery toward the center of the recess, dual interface card. wherein the recess comprises a first recess having approximately the same depth formed on the outer peripheral side, and a second recess formed closer to the center than the first recess and having a greater depth than the first recess. A dual interface card according to item 1. 3. The dual interface card according to claim 1, wherein the plurality of terminals and the plurality of ends facing each other of the IC module are electrically connected via an anisotropic conductive film. The outer periphery is a substantially rectangular shape having sides substantially parallel to the short and long sides of the card base, and the plurality of ends are formed by the antenna wires forming the antenna. 4. The dual interface card according to any one of claims 1 to 3, wherein the dual interface card is configured by a repeatedly folded structure directed from the outer periphery toward the center, which is a side substantially parallel to the . Among the plurality of end portions in the range from the outer periphery toward the center of the recess, the width of one region overlapping the plurality of terminals in the direction orthogonal to the direction toward the center from the outer periphery of the recess is equal to that of the other regions. 5. The dual interface card according to any one of claims 1 to 4, wherein the width in a direction orthogonal to a direction from the outer periphery to the center of the recess is larger than that of the recess. The end portion is composed of a bent portion and a portion other than the bent portion,
When a portion of the portion other than the bent portion that overlaps with the terminal is defined as a first portion, and a portion of the portion other than the bent portion of the end portion that does not overlap with the terminal is defined as a second portion,
6. The dual interface card according to claim 1, wherein the arrangement pitch of said antenna wires in said first portion is narrower than the arrangement pitch of said antenna wires in said second portion. 7. The dual interface card according to any one of claims 1 to 6, wherein a portion of said end portion other than said bent portion is inclined with respect to a straight line along said outer periphery. 8. The dual interface according to claim 7, wherein the tilt angle of any of the terminals other than the bent portion with respect to the straight line along the outer circumference is 5 degrees or more and 20 degrees or less. card. A method for manufacturing a dual interface card capable of contact communication and contactless communication with an external device,
An antenna forming step of embedding an antenna wire in a first base material while applying heat and pressure to form an antenna having a plurality of ends on one surface of the first base material;
A lamination step of laminating a second base material so as to sandwich the antenna on the first base material on which the antenna is formed;
A punching step of punching a laminate obtained by laminating the first base material and the second base material into a card base body of a card size;
a recess forming step of forming a recess for embedding an IC module in the card base;
an IC module preparation step of preparing an IC module having an IC chip and a plurality of terminals electrically connected to the IC chip;
an IC module adhering step of adhering the IC module to the recess of the card base via a conductive adhesive so that the plurality of terminals and the plurality of ends facing each other are electrically connected to each other; , and
The plurality of end portions are formed by a structure in which the antenna wire that constitutes the antenna is repeatedly folded back from the outer periphery of the recess toward the center, and a portion thereof is exposed in the recess,
The plurality of end portions in the range from the outer periphery of the recess toward the center are formed along contours of shapes that protrude from each other in a direction orthogonal to the direction from the outer periphery toward the center of the recess, A method of manufacturing a dual interface card.

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