JP4428631B2 - UIM with plate-shaped frame and manufacturing method thereof - Google Patents

Description

The present invention relates to a UIM with a plate-like frame and a manufacturing method thereof.
Specifically, the conventional UIM card has been further reduced in size, a mini-size UIM, a normal-size UIM that can be slid into the inner frame structure, and both shapes in a wallet-sized card board. The present invention relates to an integrally formed UIM with a plate frame and a method for manufacturing the same.

Of the various IC cards, what is called a contact IC card is folded into a 53.98 mm x 85.60 mm (ID-1 type) wallet size specified by ISO or JIS, and a size slightly smaller than this. There is a card called a UIM (Universal / User Identity Module) card or a SIM (Subscriber Identity Module) card that can be removed and inserted into a mobile device or other device. .
The UIM card or SIM card has a GSM (Global System for Mobile Communication) standard and a 3GPP (3rd Generation Partnership Project) standard, and is well known for determining the shape, position, electrical characteristics during use, and the like.

By the way, as shown in FIG. 13, a conventional UIM card or SIM card usually has a bridge portion (connecting portion) that can be folded in a card 50 manufactured in the above-mentioned wallet size compliant with the ISO 7816/1 and 2 standards. ) Is provided, and a UIM or SIM card outer shape slit (groove) is provided, and the UIM area 40 conforming to the GSM and 3GPP standards is broken off from the bridge portion and used by attaching it to the device immediately before use. Usage is common.
This is because the UIM card is manufactured by diverting the normal contact IC card manufacturing process, and issuance processing (UIM and device send / receive data before inserting and using it) This also means installation of programs necessary for proper functioning and loading of personal information and initial data.) Using a contact IC card issuance processor reduces manufacturing and equipment costs. This is due to the fact that it can be done.

Therefore, the UIM card has an outer shape with a plate-like frame added to the shape of a normal contact IC card, and the UIM area on the outer periphery of the UIM can be easily folded later. In general, a process that can be easily broken is applied.
In addition to the slits and bridge portions described above, this easy-to-break processing is performed by half-cut processing, perforation processing, punching processing, counterbore processing, and a combination processing method thereof. Regarding the UIM card thus processed, there are many prior arts as described below.

Patent Document 1 describes that a precut contour is provided on a card substrate so that a chip card can be removed from a card body by a groove and a bridge.
Patent Document 2 describes that an opening is provided in a plate-shaped frame, and an IC carrier is held on an oversheet remaining on the bottom surface of the opening via a fusion-inhibiting layer or the like.
There are various other prior arts.

JP-A-6-24188 JP 2000-90218 A

The main use of UIMs is to incorporate them into mobile phones, but as the size of mobile phones has become smaller year by year, the need for smaller size of UIM itself, which is not bound by the standards, has increased. Yes.
Prior arts related to this include Patent Document 3, Patent Document 4, Patent Document 5, and Patent Document 6, which are used when a small IC card area is folded from a card-sized card outer shape. It proposes a UIM break-off shape that allows selection of either a size or a smaller mini-size UIM.

For example, Patent Document 4 shows a UIM as shown in FIG. In this case, the rectangular plug-in (UIM) is separated from the surrounding free punch 30 from the card body 50 or used as a smaller square plug-in (UIM). Is an idea.
Patent Document 7 is a prior application related to the present application, but describes various inner frame structures into which a mini-size UIM is fitted. However, the structure in which the mini-size UIM is slid and fitted from the insertion slot as in the present application is not described.
Patent document 8 describes a structure in which a mini-size UIM is slid and fitted from an insertion port, which is a prior application having an approximate content to the present application. However, it does not describe reducing the overall thickness of the mini-size UIM as in the present application.

Japanese translation of PCT publication No. 2002-535783 Special Table 2002-537609 Japanese translation of PCT publication No. 2002-537610 Japanese Patent Application No. 2003-119216 Japanese Patent Application No. 2003-355215 Japanese Patent Application No. 2003-352284

  However, if the standard-compliant UIM is folded as in Patent Document 3, Patent Document 4, and Patent Document 5, the force at the time of folding is obtained even when the UIM is broken as it is used as a standard-compliant conventional UIM. The mini-size UIM may be broken off due to the condition of the insertion. In addition, there is also a problem that there is no means for returning to the size when it is desired to use it again as a standard-compliant UIM size after the start of use as a mini size UIM.

Furthermore, in order to fold the mini size UIM from the standard compliant UIM size, it is necessary to provide a certain margin on the outer periphery of the mini size UIM. If the margin is small, the outer peripheral area may be damaged when the mini size UIM is folded. As a result, so-called burrs (irregular minute irregularities) are generated, and there is a possibility that the mini-size UIM cannot be folded to a specified size, and there is a problem that the size of the mini-size UIM is limited.
Therefore, the present inventors have completed the present invention by studying a form in which the conventional UIM size and the mini-size UIM conforming to the standard can be smoothly folded and compatible with each other. .

The first of the gist of the present invention for solving the above-mentioned problems is a miniature in which an IC module having a planar outer shape substantially equal to the outer shape of the contact terminal plate of the IC card IC module is mounted in the same wallet size card substrate. size UIM, by the mini UIM two opposite sides a concave slit, have a frame structure fitting slides, and normal size UIM outer shape having no IC module, is formed, the In a UIM with a plate-like frame that is formed so that both shapes can be folded off by a peripheral slit, the thickness of the entire substrate of the mini-size UIM portion on which the IC module is mounted is uniform to a thickness that can slide in the concave slit. It is in UIM with a plate-shaped frame characterized by being cut .

The second of the gist of the present invention is that two normal size UIM shapes are formed to be foldable by a peripheral slit in the same wallet size card substrate, and one of the normal size UIMs is one normal size UIM. Includes a mini-size UIM fitted with an IC module having a planar outer shape substantially the same as the outer shape of the contact terminal plate of the IC module for the IC card, and the other normal size UIM is the mini-size UIM. opposing the two sides concave slit, have a frame structure fitting slides, the sheet-framed UIM Oite are those which do not have an IC module, mini UIM portion equipped with IC modules the overall thickness substrate, said U with the plate-like frame member, characterized in that the inside concave slits are uniformly cut to a thickness that can slide M, in the.

  In the first and second aspects of the present invention, if the thickness of the entire board of the mini-size UIM portion on which the IC module is mounted is 60 to 90% of the thickness of the wallet-size card board, Appropriate.

The third aspect of the present invention is a mini-size UIM in which an IC module having a planar outer shape substantially the same as the outer shape of a contact terminal plate of an IC card IC module is mounted in the same wallet-size card substrate; the UIM two opposite sides a convex or concave slits, have a frame structure fitting slides, and normal size UIM outer shape having no IC module, is formed, the shape of the both in the sheet-framed UIM being folded up can be formed by peripheral slit, overall thickness substrate mini UIM portion equipped with IC modules, uniformly 6 0% to 90% of the thickness of the wallet size card substrate It is in UIM with a plate-shaped frame body characterized by having been cut by.

According to a fourth aspect of the present invention, two normal size UIM shapes are formed by a peripheral slit so as to be foldable in the same wallet size card substrate, and one of the normal size UIMs is one normal size UIM. Includes a mini-size UIM fitted with an IC module having a planar outer shape substantially the same as the outer shape of the contact terminal plate of the IC module for the IC card, and the other normal size UIM is the mini-size UIM. the two opposing sides of the convex or concave slits, have a frame structure fitting slides were mounted sheet-framed UIM Oite are those which do not have the IC module, the IC module mini and wherein the size thickness of the entire substrate of UIM moiety is uniformly cut into 6 0% to 90% of the thickness of the bill insertion size card substrate To the UIM with a plate-like frame.

In the first, second, third, and fourth aspects of the present invention, the two opposing sides of the mini size UIM are two sides along the long side of the IC module attached to the mini size UIM, It can also be inserted from the insertion port provided on the short side of the normal size UIM or the open end, and the two opposite sides of the mini size UIM are on the short side of the IC module mounted on the mini size UIM. It is also possible to insert it from the insertion port or the open end provided on the long side of the normal size UIM. Further, the contact terminal board of the mini-size UIM IC module is preferably at a predetermined position of the wallet size card defined by ISO7816, and the wallet size card substrate is also preferably 0.76 ± 0.08 mm thick. . It is further preferable that the outer shape of the normal size UIM conforms to the GSM standard and 3GPP standard.

According to a fifth aspect of the present invention, a mini-size UIM and an outer shape of a normal-size UIM having an inner frame structure in which the mini-size UIM is slid and fitted are formed on a wallet-size card board. In the method of manufacturing a UIM with a plate-like frame formed by a peripheral slit, the entire mini-size UIM position of the thin card-like card substrate is cut uniformly to 60 to 90% of the thickness of the wallet-size card substrate. A step of mounting an IC module at the position of the mini size UIM, a step of forming the outer shape of the mini size UIM and the normal size UIM by the peripheral slit, and an inner frame structure for fitting the mini size UIM into the normal size UIM And a step of forming a convex or concave slit in the inner frame structure. The method of manufacturing UIM, located in.

Sixth of the gist of the present invention is that a mini-size UIM and an outer shape of a normal-size UIM having an inner frame structure in which the mini-size UIM is slid and fitted are formed on a wallet-size card board. In the method for manufacturing a UIM with a plate-like frame formed by a peripheral slit, the step of mounting the IC module at the mini-size UIM position of the thin card-like card substrate and the side opposite to the contact terminal board at the mini-size UIM position A step of uniformly cutting the entire surface of the card board so as to be 60 to 90% of the thickness of the card substrate, a step of forming the outer shape of the mini size UIM and the normal size UIM by the peripheral slit, and the mini size UIM Including a step of forming an inner frame structure for fitting a normal size UIM, and a step of forming a convex or concave slit in the inner frame structure. The method of producing the sheet-framed UIM, wherein, in.

In the fifth and sixth aspects of the present invention, a process for issuing a mini-size UIM can be added, and the terminal board of the contact IC module of the mini-size UIM is defined in a wallet size defined by ISO7816. It is also preferable to install the card at a predetermined position because a conventional IC card manufacturing apparatus and process can be adopted.
Further, the folding facilitating process can be suitably performed by any one of a half cut process, a perforation process, a groove punching process, a counterbore process, or a combination thereof.

In the UIM with a plate frame of the present invention, the following effects can be obtained.
(1) In the same card, there is a mini-size UIM and a standard-compliant UIM that can be integrated into the inner frame by sliding the mini-size UIM from the insertion slot or open end in a different area. It can be used as a mini-size UIM, and then used as a normal-size UIM, and can be used for various use cycles such as a mini-size UIM. In this case, since the detachable structure is a rigid structure that slides and fits, the mini-size UIM can be prevented from falling off, and a highly reliable UIM can be provided.
(2) If the mini-size UIM is mounted at a position specified by ISO on a wallet-size card board (hereinafter also referred to as “card board”), the issuance processing device is the same as the issuance processing process of a normal IC card. Can be used in the same process.
(3) The method for manufacturing a UIM with a plate-like frame according to the present invention can produce a UIM with a plate-like frame in the same manufacturing / inspection process as that of a normal contact IC card. .
(4) By making the mini-size UIM thin, when a bending external force acts on the entire card, the mini-size UIM part can easily absorb the stress and reduce the load on the slide part. There is an effect that it becomes difficult to drop off.

The present invention relates to a UIM of a standard size (normal size), a UIM with a plate frame that can be used as a mini-size UIM further reduced, and a manufacturing method thereof.
Here, the UIM is a small IC card in which contractor information issued by a mobile phone company is recorded, and is originally incorporated into a mobile phone and used for user identification.
This is a functional extension from a SIM having the same function, and it becomes possible to encrypt and register private information such as a telephone directory and personal identification information for credit settlement in addition to contractor information. ing. Because it is based on SIM, it is sometimes called USIM (Universal SIM).
The SIM is intended to use the GSM mobile phone service, but the UIM can be used, for example, by inserting it into an American cdma2000 mobile phone and receiving an international roaming service. In the future, it is considered that such a mini-size IC card will be used not only for mobile phones but also for various purposes.
The UIM referred to in the present invention is a concept including the above SIM and USIM.

There are four types of embodiments of the UIM with a plate-like frame of the present invention. The first embodiment is in claim 1, the second embodiment is in claim 2, the third embodiment is in claim 3, The fourth embodiment is described in claim 4 respectively.
Each embodiment has a common point that it has a contact type IC module or a mini size UIM equipped with a contact / non-contact type IC module, and a normal size UIM having an inner frame structure and no IC module. However, in the case of the second embodiment and the fourth embodiment, there is a difference that the outer shape of the normal size UIM is further formed on the outer periphery of the mini size UIM.

The “mini-size UIM” has a planar outer shape that is substantially the same as the outer shape of the contact terminal plate of the IC module. “Substantially equivalent” means that the size is substantially the same as the outer shape of the contact terminal plate or a size obtained by adding a slight peripheral portion to this. This is because reducing the size as much as possible contributes to downsizing of the device. The “normal size UIM” generally has a size compliant with the GSM standard or 3GPP standard.
The “normal size UIM” has an insertion slot (or an open end) into which the “mini size UIM” is slid and fitted and an inner frame structure, and can be used as a UIM in the fitted state.
That is, the “normal size UIM” serves as an adapter of the “mini size UIM”. Therefore, hereinafter, the normal size UIM may be expressed as “adapter”.

The UIM with a plate-like frame of the present invention can be folded by making the shape of the “mini-size UIM” and the “normal size UIM” easy to break into the plate-like frame of the wallet size card. ing. This process for facilitating folding includes half cut processing, perforation processing, groove punching processing, counterbore processing, and combinations thereof.
A groove formed by these processes is expressed as a peripheral slit. Although the width | variety of a peripheral slit changes with processing methods, it can be in the range of about 0.1-5.0 mm.
If it is 5.0 mm or more, there is a problem in appearance, and the reason why it is 0.1 mm or less is that the processing step becomes difficult.

Hereinafter, description will be given with reference to the drawings.
FIG. 1 is a diagram showing a first embodiment (invention of claim 1) of a UIM with a plate-like frame.
FIG. 2 is a view showing the second embodiment (the invention of claim 2).
FIG. 3 is a view showing the third embodiment (the invention of claim 3).
FIG. 4 is a view showing the fourth embodiment (the invention of claim 4).
FIG. 5 is a diagram showing a modified embodiment of a UIM with a plate-like frame.
FIG. 6 is a diagram illustrating a usage state of the UIM with a plate-like frame.
FIG. 7 is a diagram illustrating a usage state of a UIM with a plate-like frame in a modified embodiment.

1A and 1B are diagrams showing a first embodiment of a UIM 10 with a plate-like frame, in which FIG. 1A is a plan view, and FIG. 1B is an enlarged cross-sectional view taken along line A1-A2 of FIG. FIG. 1 (C) is an enlarged cross-sectional view taken along line B1-B2 of FIG. 1 (A), and FIG. 1 (D) is an inner frame of a normal size UIM2 of a mini-size UIM1 broken from a UIM 10 with a plate-like frame. FIG. 9 is an enlarged cross-sectional view showing a state in which it is slid to 9 and fitted.
As shown in FIG. 1A, the card substrate 3 is formed with both the mini size UIM1 and the normal size UIM2 by the peripheral slits 1S and 2S. The peripheral slits 1S and 2S are through-hole portions obtained by cutting out the card substrate 3 into a slit shape.
The card substrate 3 is a uniform thin plate-like plastic substrate and generally has a thickness of 0.76 ± 0.08 mm defined by ISO. The size is the ID-1 type.
In the mini-size UIM1, a peripheral slit 1S is formed, but if it is easy to drop off if it is slit all around, two or three places are connected by a bridge 1b. The half cut 1h is usually inserted in the bridge 1b portion for the purpose of enhancing the ease of folding and smoothing the folded surface. However, it is not essential if it does not fall out easily.

The planar appearance of the mini-size UIM 1 is mostly occupied by the IC module contact terminal plate 6 made of a metal foil, but the peripheral portion 1r of the card substrate 3 can be left around.
Since the positions of the eight terminals of the IC module contact terminal board 6 with respect to the card substrate 3 are defined within a certain position range by ISO, the position of the contact terminal board 6 of the mini size UIM1 is also made to satisfy the regulations. Is preferred. This is because the issue processing or the like is performed in the state of the card substrate as described above.

The size of the IC module contact terminal plate 6 itself can be changed as long as the conditions of the ISO are satisfied, but those having a size of about 12 mm × 11 mm are usually used in many cases.
The width of the peripheral portion 1r is preferably left at about 0.2 to 2.0 mm in order to slide the inner peripheral frame of the normal size UIM. Usually, a thickness of about 0.5 to 1.0 mm is sufficient.
In FIG. 1A, the peripheral portion 1r is formed such that the right side portion of the contact terminal plate 6 is narrow and the left side portion is slightly wide. This is because when the mini size UIM is fitted into the inner frame 9 of the normal size UIM, the left side is widened so that each terminal plate of the contact terminal plate 6 is positioned within a predetermined position range defined by the GSM and 3GPP standards. .
The mini-size UIM1 itself needs to be mounted on a mobile phone and can be used. It is equipped with an IC module that integrates a CPU, memory, electrodes, etc., and functions as both a contact type IC card and a contact or non-contact type IC card. The UIM function is provided.

A peripheral slit 2S is also formed around the normal size UIM2, but two to three portions are similarly connected by a bridge 2b.
In FIG. 1, the long side of the normal size UIM2 is arranged so as to be parallel to the short side of the card substrate 3, but the orientation may be parallel to the long side. The normal size UIM2 has dimensions conforming to the GSM and 3GPP standards, and has a width of 15 mm and a length of 25 mm.
A cutout portion 8 is provided at one corner portion of the normal size UIM2 for positioning when mounted on the target device. It is preferable to provide a similar notch 4 in the mini size UIM1. When the notch 4 is provided in the mini size UIM1, the inner frame 9 is also matched with the shape.

When the mini size UIM1 is broken from the half cut line 1h adjacent to the bridge 1b, the inner portion of the peripheral slit 1S can be extracted.
As shown in FIG. 1B, the entire mini size UIM 1 portion is thinner than the wallet size card substrate 3. This thickness is preferably about 60 to 90% of the wallet size card substrate 3, more preferably 70 to 80%. This is because, by setting the thickness to such a level, the embedded concave portion of the IC module can be cut and inserted into the concave slit of the normal size UIM2.
Although not shown, an IC module is mounted on the back surface of the IC module contact terminal plate 6. Since the IC module is a current product and has a thickness of about 550 to 600 μm, the thickness of the mini-size UIM1 portion cannot be made smaller. However, the thickness of the IC module is technically possible to be about 400 μm in the future, and trial manufacture is being performed.
The IC module may be a contact type or a contact / non-contact type. This is because the mini-size UIM 1 normally does not include an antenna, but when attached to a device, a non-contact communication function such as an antenna provided in the device may be used.

As shown in FIG. 1C, concave slits 22h are formed on two opposing sides of the inner frame 9 of the normal size UIM2. The concave slit 22h is obtained by adjusting the thickness of the mini-size UIM1 to the thickness of the slit that can be fitted.
If the thickness of the card substrate 3 is 0.80 mm, the thickness of the convex slit 22h is about 480 to 720 μm (in the case of 60 to 90% of the card substrate thickness), or about 560 to 640 μm (70% of the card substrate thickness). ~ 80%)).
After the normal size UIM2 is broken, the minisize UIM1 can be slid and fitted into the inner frame 9 as shown in FIG.

2A and 2B are views showing the second embodiment, in which FIG. 2A is a plan view, FIG. 2B is an enlarged sectional view taken along line A3-A4 of FIG. 2A, and FIG. ) Is an enlarged cross-sectional view taken along line B3-B4 of FIG. 2A, and FIG. 2D is an enlarged cross-sectional view showing a state where the mini-size UIM1 that has been broken is slid and fitted into the inner frame of the normal size UIM2. .
The second embodiment is configured to be connected to the mini size UIM1 of the first embodiment and further to provide an outer shape 13 of a normal size UIM. Accordingly, a peripheral slit 13S is formed around the outer shape 13 of the normal size UIM.

In the second embodiment, in a state where the mini size UIM1 is connected to the outer shape 13 of the normal size UIM, the half cut line 1h can be folded so as not to be cut and used as the normal size UIM immediately. When the mini-size UIM1 is used alone, it is used after being broken by the peripheral slit 1S and the half-cut line 1h. When the mini-size UIM1 alone is used again as the normal-size UIM, the mini-size UIM1 is used by being fitted into the normal-size UIM2 having the inner frame 9 as an adapter.
Between the mini-size UIM1 and the normal size UIM, the entire periphery may be a half-cut line 1h without forming the peripheral slit 1S as shown in FIG.

In FIG. 2A, the peripheral slit 1S of the mini size UIM1 and the peripheral slit 13S of the normal size UIM2 are joined (joined together) at the mini size UIM1 portion, but the peripheral slit 13S is the peripheral slit 1S. You may make it the shape which encloses. In that case, the structure becomes more complicated than that shown in FIG.
In the case of the shape of FIG. 2A, FIG. 2B, FIG. 2C, and FIG. 2D appear in substantially the same relationship as FIG.
In the case of 1st, 2nd embodiment, there exists an advantage on the process which does not need to form a convex shape or a concave slit in the side of mini size UIM1.

3A and 3B are views showing the third embodiment, in which FIG. 3A is a plan view, FIG. 3B is an enlarged sectional view taken along line A5-A6 of FIG. 3C is an enlarged cross-sectional view taken along line B5-B6 of FIG. 3A, and FIG. 3D is an enlarged view showing a state where the mini-size UIM1 that has been broken is slid and fitted to the inner frame of the normal size UIM2. FIG.
As shown in FIG. 3A, the card substrate 3 has both the mini-size UIM1 and the normal-size UIM2 formed by the peripheral slits 1S and 2S. The arrangement of the mini size UIM1 and the normal size UIM2 is the same as that of the first embodiment, and the formation of the peripheral slits 1S and 2S and the bridges 1b and 2b is also the same.

  The third embodiment is different from the first embodiment in that the two opposite sides (the hatched portion in FIG. 3A) outside the peripheral portion 1r of the mini size UIM1 and the normal size UIM There is a feature that convex or concave slits 12 and 22 for sliding and fitting are provided on two sides of the frame 9. In FIG. 3B, convex slits 12t are provided on two opposing sides of the mini size UIM1, and in FIG. 3C, concave slits 22h are provided on two sides of the inner frame 9 of the normal size UIM2. However, the relationship between the protrusions and recesses may be opposite to that shown in the figure. Moreover, if it can slide mutually, a triangular shape may be sufficient instead of a rectangular slit.

In FIG. 3, the long side of the normal size UIM2 is arranged so as to be parallel to the short side of the card substrate 3, but the orientation may be parallel to the long side.
As shown in FIG. 3B, the mini-size UIM1 portion is made thinner than the wallet-size card substrate 3 as in the first embodiment. Similarly, the thickness is preferably 60 to 90% of the wallet size card substrate 3.
As shown in FIG. 3D, if the folded mini size UIM1 is fitted into the inner frame 9 of the normal size UIM2 as an adapter, it can be used as the normal size UIM.

4A and 4B are views showing the fourth embodiment, in which FIG. 4A is a plan view, FIG. 4B is an enlarged sectional view taken along line A7-A8 of FIG. 4A, and FIG. 4C is an enlarged cross-sectional view taken along line B7-B8 in FIG. 4A, and FIG. 4D is an enlarged view showing a state in which the mini-size UIM1 that has been broken is slid and fitted into the inner frame of the normal size UIM2. FIG.
The fourth embodiment is configured to be connected to the mini size UIM1 of the third embodiment and further to provide an outer shape 13 of a normal size UIM.
In FIG. 4A, the peripheral slit 1S of the mini size UIM1 and the peripheral slit 13S of the normal size UIM2 are joined (joint together) at the mini size UIM1 portion, but as in FIG. The peripheral slit 13S may have a shape including the peripheral slit 1S.

In the fourth embodiment, in a state where the mini size UIM1 is connected to the outer shape 13 of the normal size UIM, the half cut line 1h can be folded so as not to be cut and used as the normal size UIM immediately. When the mini-size UIM1 is used alone, it is used after being broken by the peripheral slit 1S and the half-cut line 1h. When the mini-size UIM1 alone is used again as the normal-size UIM, the mini-size UIM1 is used by being fitted into the normal-size UIM2 having the inner frame 9 as an adapter.
Between the mini-size UIM1 and the normal size UIM, the entire periphery between the mini-size UIM1 and the normal size UIM may be a half-cut line as in the case of FIG. 2, without forming the peripheral slit 1S as shown in FIG.

In FIG. 4B, a concave slit 12h is provided in the mini size UIM1, and in FIG. 4C, a convex slit 22t is provided in the inner frame 9 of the normal size UIM2. May be reversed. The mini-size UIM1 portion is made thinner than the wallet-size card substrate 3 as in the above embodiments. Similarly, the thickness is preferably 60 to 90% of the wallet size card substrate 3.
After folding the normal size UIM2, the mini size UIM1 can be slid and fitted into the slit 22t of the inner frame 9 as shown in FIG.

FIG. 5 shows a modified embodiment of the UIM 10 with a plate-like frame. In this modified embodiment, the convex or concave slit 12 of the mini size UIM1 is formed along the short side of the IC module terminal board 6, and the slit 22 of the normal size UIM2 is also on the side corresponding to the slit. Is provided. The slit 12 may have a convex shape or a concave shape on the mini-size UIM1 side, and the normal size UIM2 side has a shape fitted thereto.
FIG. 5 shows a modification of the third embodiment, but similar modifications of the first, second, and fourth embodiments are possible. However, in the case of the first and second embodiments, the convex or concave slit 12 of the mini size UIM1 is not necessary.

FIG. 6 is a diagram illustrating a usage state of the UIM 10 with a plate-like frame.
When the UIM 10 with a plate-like frame is used, as shown in FIG. 4A, the mini size UIM1 and the normal size UIM2 are folded from the card board, and the mini size UIM1 is removed from the insertion slot 11 of the normal size UIM2. Slide into 9 and fit.
1 to 5, the insertion port 11 is not shown, but is simply an open end, but in FIG. 6, a flat mouth-shaped insertion port 11 through which the mini-size UIM 1 can pass is provided in the normal size UIM 2. It is shown that. The insertion slot 11 is formed by hollowing out the middle layer portion of the card substrate 3 so that the thin mini-size UIM1 can pass therethrough. The normal size UIM2 may be a mere open end where the insertion port 11 is not provided. However, when the insertion port 11 is provided, the normal size UIM2 is stable because the mini-size UIM1 is not easily dropped.
In the present application, such a passage having a passage opening is referred to as an “insertion opening”, and a case where the opening is simply open is referred to as an “open end”.

FIG. 6B is in the middle of fitting, and the convex or concave slit 12 of the mini size UIM1 is slid and fitted into the concave or convex slit 22 of the normal size UIM2. In a state where the mini size UIM1 reaches the deepest position of the inner frame 9, the contact terminal board 6 is positioned at a predetermined position (specified by GSM and 3GPP standards) of the normal size UIM.
FIG. 6C shows a state after being fitted into the adapter 2 and can be used as a normal size UIM in this state.

FIG. 7 is a diagram illustrating a usage state of the UIM 10 with a plate-like frame in a modified embodiment.
The case of FIG. 7 is different in that the insertion port 11 of the adapter 2 is on the long side, but the method of use is the same as in FIG.
The width d of the insertion slot 11 is about 0.5 to 1.5 mm including the case of FIG.

As described above, the mini-size UIM1 can be used immediately as a mini-size UIM in a folded state. However, since the external size of the normal size UIM2 does not include an IC module, it cannot be used immediately in the folded state. . When the normal size UIM2 is used, the minisize UIM1 is slid into the inner frame 9 from the insertion port 11 and used.
It is also one of the advantages of the present invention that the mini-size UIM1 that has been fitted can be removed again and reused by itself.

In the case of the UIM 10 with a plate-like frame according to the second and fourth embodiments, the outer shape 13 of the normal size UIM is formed around the mini size UIM1, so that it is in a state before folding the mini size UIM1. Can be used as a normal size UIM.
Of course, the mini-size UIM1 can be folded and used as the mini-size UIM1 from this state. Similarly, the mini-size UIM 1 is slid from the insertion slot 11 of the adapter 2 and fitted into the inner frame 9 for use.
Since the external size 13 of the normal size UIM after the mini size UIM1 is broken off does not have a fitting structure, it cannot be used as an adapter.

Next, the manufacturing method of UIM with a plate-shaped frame is demonstrated.
FIG. 8 is a flowchart showing a manufacturing process of a UIM with a plate-like frame, FIG. 9 is a diagram showing a method of forming a concave slit, FIG. 10 is a diagram showing a plug-in SIM and its terminal position, and FIG. FIG. 12 is a sectional view showing a mini-size UIM mounting portion on the wallet size card substrate, and FIG. 12 is a cross-sectional view showing a mini-size UIM IC module mounting portion.

  First, a card substrate before mounting an IC module is manufactured in the same manner as a normal contact IC card. This process consists of laminating two layers of printed core sheet layers with multiple imprints and, if necessary, a transparent oversheet layer preliminarily heat-transferred with a magnetic tape, and applying heat pressure to fuse and integrate the substrates. Punch to card size. Transfer sign panels, hologram labels, etc. as necessary.

The subsequent manufacture of the UIM with a plate-like frame is performed in the manufacturing process of FIG. 8 (A) or (B).
Manufacturing process 1 relates to the invention according to claim 11, but is performed according to the process of FIG.
First, a normal card substrate is manufactured (step 101). Next, the entire mini-size UIM position portion of the card board is cut so as to be 60 to 90% of the thickness of the wallet-size card board (step 102). Although it can be processed by cutting either the front or back side of the card substrate 3, it is preferable to cut the side surface opposite to the contact terminal plate uniformly from the viewpoint of module sealing from the surface.

Next, an IC module mounting recess is excavated using a counterbore machine (step 103). An IC module sealing process is performed for loading and crimping the IC module via a thermal adhesive sheet applied to the concave portion for mounting or attached to the IC module (step 104). IC module sealing is performed by applying hot pressure to the surface of the contact terminal plate 6 with a heater block.
After the IC module is mounted, an inspection process (step 105) such as IC chip characteristics is performed.
Then, an issuance processing step for writing data is performed according to the use of the mini-size UIM (step 106). The issuing process is performed in the card state. Each process described above is the same as the normal IC card manufacturing method except for step 102.

Next, finish processing such as formation of a fitting structure by the peripheral slits 1S, 2S, 13S and convex or concave slits, formation of a bridge, etc. is performed (step 107). As described above, these processes include half-cut processing, perforation processing, groove punching processing, counterboring processing, and combinations thereof.
Then, a secondary IC chip characteristic inspection step (step 108) after finishing is performed.
If there is no damage to the IC chip during the finishing process, this step can be omitted. Finally, a packing / shipping process of the UIM with a plate-like frame is performed (step 109).

The second manufacturing step relates to the invention according to the twelfth aspect, but is performed by the step shown in FIG.
First, a normal card substrate is manufactured (step 201). Next, the IC module mounting recess is excavated using a counterbore machine (step 202). An IC module sealing process for loading and crimping the IC module is performed (step 203) by applying an adhesive to the mounting recess or through a thermal adhesive sheet adhered to the IC module. Module sealing is performed by applying hot pressure to the contact terminal plate 6 surface with a heater block.
Next, the entire mini-size UIM position of the card board is cut to a thickness of 60 to 90% of the thickness of the wallet-size card board (step 204). Of course, the side opposite to the contact terminal plate of the IC module is cut.

After the IC module is mounted, an inspection process (step 205) such as IC chip characteristics is performed.
Next, issue processing is performed (step 206). Each process described above is the same as the normal IC card manufacturing method except for step 204. After the IC module is mounted, an inspection process (step 105) such as IC chip characteristics is performed. Next, an issue process step (S206) is performed.
After the issuance process, the finishing process is performed in the same manner as in the manufacturing process 1 (step 207), the second IC chip characteristic inspection process (step 208) is performed, and the packaging / shipping process of the UIM with a plate frame is performed ( Step 209).

In this way, the UIM with a plate-like frame can use conventional IC card manufacturing equipment, so it is difficult to use the mini-size UIM1 alone, and it is difficult to use the conventional device for issuing processing, various inspection processes, and packing / shipping processes. There are advantages that can be made using.
The product may be delivered in a card state, delivered in a mini-size UIM, or delivered by fitting into a normal size UIM.
In addition, in the process of FIG. 8 (B), cutting and finishing of the mini-size UIM portion can be performed in a continuous process.

  The convex slits 12t and 22t can be formed by cutting to a predetermined depth and width from both sides of the card substrate. However, the concave slits 12h and 22 require some contrivance. Specifically, the end mill 28 is used. As shown in FIG. 9, after the peripheral slit is formed in the card substrate 3, the card substrate 3 is curved, and the end mill cutting blade 29 with a small diameter is inserted from the side surface. Used to cut to a predetermined depth and width.

The plug-in SIM defined by 3GPP and its terminal position are as shown in FIG. The size and shape of the SIM, and the maximum and minimum dimension values from the upper end or the left end of each terminal position for the eight terminals C1 to C8 are defined.
When the terminal position of the mini size UIM1 is determined based on the specified value, the center position C of the contact terminal board 6 is 23.89 mm from the upper end of the card board and 15.06 mm from the left end of the card board (see FIG. 11). In addition, the rectangular frame in each terminal board shows the range which adapts to the said specification.
When the mini size UIM1 has a horizontal dimension of 13.0 mm and a vertical dimension of 12.0 mm, the alignment cut-out 4 is about 1.5 mm in length and 1.5 mm in width (approximately 2.1 mm). Is appropriate.
However, in consideration of processing convenience, the size of the mini size UIM1 may be different from the ideal size. For example, when sliding from the short side of the normal size UIM, the short side on the insertion port side is widened.

The section of the mounting portion of the mini-size UIM1 IC module 5 is as shown in FIG.
The IC module mounting recess 20 is excavated in the card substrate 3, and the liquid adhesive 19 is applied to the shallowly cut first recess, or the adhesive tape 19 is attached to the IC module, and the IC module 5 is mounted. The recess 20 is loaded with heat pressure. The mold resin portion 17 of the IC module 5 is fitted into a second recess that is cut deeper than the mounting recess. In the case of FIG. 12, the scale in the thickness direction is shown enlarged, but the actual IC module 5 is much flatter than the appearance shown. FIG. 12 shows a state before the lower surface of the mini size UIM1 is cut into a thin thickness.
After the IC card is formed, the mini size UIM1 is cut by the peripheral slit 1S so that a slight peripheral portion 1r remains around the contact terminal board 6.
Note that the card substrate 3 is often formed in such a manner that the core sheets 31 and 32 are used as a central layer, and oversheets 33 and 34 are laminated thereon.

  The material of the card substrate is vinyl chloride sheet, polyethylene terephthalate (PET), polybutylene terephthalate, cellulose acetate, nylon, ethylene / vinyl acetate copolymer, polypropylene, polyvinyl butyral, acrylonitrile-butadiene-styrene copolymer resin, acrylic Sheets of polycarbonate, PET-G resin, etc. can be used. The PET-G resin is generally a dehydration condensate of an aromatic dicarboxylic acid and a diol, and is composed of a substantially non-crystalline aromatic polyester resin having a particularly low crystallinity among the copolyesters. Say.

Hereinafter, embodiments of the present invention will be described with reference to FIG. 1, FIG. 6, FIG. 8, FIG.
(Preparation of IC module)
As the printed circuit board 7 for the IC module 5, a glass epoxy material having a thickness of 100 μm laminated with a surface-side copper foil having a thickness of 35 μm was used.
A front-side contact terminal board 6 and a back-side circuit were formed on the printed board 7 by a photoetching process, and after etching, nickel plating and gold plating were applied to the surface copper foil.
A contact type IC chip was die-bonded to the printed board 7 and necessary wire bonding was performed between the IC chip and the terminal, and then the IC chip and the wire bonding portion were resin-molded (see FIG. 12).

  The size of the IC module contact terminal plate 6 is 12.0 mm × 11.0 mm, the mold resin portion 17 is the size, 8.0 mm × 8.0 mm, and the height of the mold resin portion 17 not including the substrate thickness is It was 420 μm. Thus, the IC module 5 was completed.

(Manufacture of IC card substrates)
As the core sheets 31 and 32 of the card substrate 3, a biaxially stretched white PET-G sheet (thickness 360 μm) having a surface printed thereon and a white PET-G sheet (thickness 360 μm) similarly having a surface printed thereon are used. Two biaxially stretched transparent PET-G sheets having a thickness of 50 μm were used as the oversheets 33 and 34 on the lower surface, and the card substrate 3 was prepared by heat-pressure fusion using a press machine and press lamination.
The conditions for the pressing step were (150 ° C., 2.0 MPa, molding (heating) time 30 minutes). After lamination, the card had a total thickness of 800 μm due to some shrinkage.

Using the previously prepared IC module 5 and the IC card substrate 3 made of the PET-G base material, the UIM 10 with a plate-like frame of the first embodiment was manufactured.
First, the entire bottom surface (the core sheet 32 and the oversheet 34 side) of the mounting portion (size 12.0 mm × 13.0 mm) of the mini-size UIM1 of the card substrate 3 was uniformly cut to a thickness of 100 μm using an end mill ( FIG. 11). Therefore, the remaining thickness of the card substrate 3 in this portion was 700 μm.

Next, the IC module mounting recess 20 was formed by counterboring by NC cutting. The first recess was cut to a depth of 210 μm, which corresponds to the total thickness of the IC module printed circuit board (thickness 160 μm) 7 and the adhesive tape (thickness 50 μm) 19. The second concave portion was cut so that the total depth was 580 μm by further cutting so as to accommodate the mold resin portion 17 of the IC module in the center portion.
The size of the first recess opening was 12.1 mm × 11.1 mm, and the second recess was 8.0 mm × 8.0 mm.
The previously prepared IC module 5 is mounted in the IC module mounting recess 20 to complete the IC module mounted IC card substrate 3 (see FIG. 12).

The peripheral slit 1S is cut around the terminal substrate 6 of the IC module 5 of the IC card substrate 3 so as to form a peripheral portion 1r having a width of 2.81 mm on the left side and a width of 0.5 mm on the other three periphery. The shape of the mini size UIM1 was formed. As a result, the planar portion of the mini-size UIM1 has a size of 15.31 mm × 12.0 mm. The cutout portion 4 was also formed on a hypotenuse consisting of 1.5 mm in length and breadth so as to form an angle of 45 ° with respect to the side of the mini size UIM1.
The peripheral slit 1S is made to have a width of 1.5 mm around the terminal board 6 by cutting with an end mill, and two bridge portions 1b are provided. The bridge portion 1b has a card along the outer periphery of the mini size UIM1. A half-cut line 1h was punched from the top and bottom surfaces of the substrate 3 with a punching blade at a depth of 0.2 mm from the front and back, so that the center layer remained about 0.4 mm thick.

The normal size UIM2 is arranged with respect to the card substrate 3 as shown in FIG. The size was a prescribed size with a width of 15 mm and a length of 25 mm, and a notch 8 was also provided. The insertion port 11 had a width d of 1.0 mm.
The peripheral slit 2S is made to have a width of 1.5 mm by cutting with an end mill, and two bridge portions 2b are provided. Half cut lines are inserted into the bridge portion from the upper and lower surfaces of the substrate 3 with a punching blade, and the center layer is formed. About 0.4 mm thick was left.
The size of the inner frame 9 including the insertion port 11 (the size not including the width of the concave slit 22h) is 14.31 mm × 12.1 mm, and the inner surfaces of the two opposite sides along the long side are end mills. The concave slit 22h was formed to a thickness of 700 μm and a depth of 500 μm.

  The method of cutting the concave slit 22h is as shown in FIG. 9, with the card substrate 3 being curved, applying an end mill cutting blade having a diameter of 0.7 mm to the center of the exposed side surface of the card substrate, and parallel to the card plane. Cutting by moving to. A flat mouth-shaped opening of the insertion port 11 was formed in the same manner.

  When both the mini size UIM1 and the normal size UIM2 are folded off from the card board 3, and the mini size UIM1 is slid and inserted into the inner frame 9 from the insertion port 11 of the normal size UIM2, it can be inserted well. It was confirmed that it could be used as a UIM for mobile phones (see FIG. 1D and FIG. 6).

It is a figure which shows 1st Embodiment of UIM with a plate-shaped frame. It is a figure which shows the 2nd Embodiment. It is a figure which shows the same 3rd Embodiment. It is a figure which shows the same 4th Embodiment. It is a figure which shows the deformation | transformation embodiment of UIM with a plate-shaped frame. It is a figure which shows the use condition of UIM with a plate-shaped frame. It is a figure which shows the use condition of UIM with a plate-shaped frame in deformation | transformation embodiment. It is a flowchart which shows the manufacturing process of UIM with a plate-shaped frame. It is a figure which shows the method of forming a concave slit. It is a figure which shows plug-in SIM and its terminal position. It is a layout view showing a mini-size UIM mounting portion on the wallet size card substrate. It is sectional drawing which shows the IC module mounting part of mini size UIM. It is a figure which shows the conventional UIM. The UIM illustrated in Patent Document 4 is shown.

Explanation of symbols

1 Mini size UIM
2 Normal size UIM, adapter 3 Wallet size card board, card board 4 Notch part 5 IC module 6 IC module contact terminal board 7 Printed circuit board 8 Notch part 9 Inner frame 10 UIM with plate frame
DESCRIPTION OF SYMBOLS 11 Insertion slot 12 Slit 12t Convex slit 12h Concave slit 13 External form of normal size UIM 17 Mold resin part 19 Adhesive or adhesive tape 20 IC module mounting concave part 22 Slit 22t Convex slit 22h Concave slit

Claims (15)

A mini-size UIM in which an IC module having a planar outer shape substantially the same as the outer shape of a contact terminal board of an IC card IC module is mounted in the same wallet-size card board, and two opposing sides of the mini-size UIM are concave. the slit, have a frame structure fitting slides, and normal size UIM outer shape having no IC module, is formed, a plate shape of the both are formed to be broken off by peripheral slit A UIM with a plate-like frame, wherein the thickness of the entire substrate of the mini-size UIM portion on which the IC module is mounted is cut to a thickness that can slide in the concave slit. In the same wallet size card substrate, two normal size UIM shapes are formed so as to be foldable by a peripheral slit. Among the normal size UIMs, one normal size UIM includes an IC card IC module. A mini-size UIM equipped with an IC module having a planar outer shape substantially the same as the outer shape of the contact terminal plate can be folded, and the other normal size UIM has concave slits on the two opposite sides of the mini-size UIM. Accordingly, have a frame structure fitting slides, Oite UIM with plate-like frame bodies are those which do not have the IC module, the thickness of the entire substrate of the mini UIM portion equipped with IC modules, the concave A UIM with a plate-like frame, which is uniformly cut to a thickness that allows sliding in the slit. A mini-size UIM in which an IC module having a planar outer shape substantially the same as the outer shape of a contact terminal board of an IC card IC module is mounted in the same wallet-size card substrate, and two opposing sides of the mini-size UIM are convex. by Jo or concave slits, have a frame structure fitting slides, and normal size UIM outer shape having no IC module, is formed, the shape of both of which are formed to be broken off by peripheral slit in the sheet-framed UIM to have a feature that the total thickness substrate mini UIM portion equipped with IC modules, are uniformly cut to 6 0% to 90% of the thickness of the wallet size card substrate UIM with a plate-like frame. In the same wallet size card substrate, two normal size UIM shapes are formed so as to be foldable by a peripheral slit. Among the normal size UIMs, one normal size UIM includes an IC card IC module. A mini-size UIM equipped with an IC module having a planar outer shape that is substantially the same as the outer shape of the contact terminal board can be folded, and the other normal size UIM is convex on the two opposite sides of the mini-size UIM. or by a concave slit, have a frame structure fitting slides, Oite UIM with the sheet frame body in which has no IC module, the thickness of the entire substrate of the mini UIM portion fitted with the IC module , the sheet-framed UIM, characterized in that it is uniformly cut into 6 0% to 90% of the thickness of the bill insertion size card substrate . The two opposite sides of the mini-size UIM are two sides along the long side of the IC module mounted on the mini-size UIM so that the mini-size UIM is inserted from the insertion port or the open end on the short side of the normal size UIM. The UIM with a plate-like frame according to any one of claims 1 to 4, wherein the UIM is provided. The two opposite sides of the mini-size UIM are two sides along the short side of the IC module mounted on the mini-size UIM so that the mini-size UIM is inserted from the insertion port or the open end on the long side of the normal size UIM. The UIM with a plate-like frame according to any one of claims 1 to 4, wherein the UIM is provided. 3. The plate frame according to claim 1, wherein the thickness of the entire board of the mini-size UIM portion on which the IC module is mounted is 60 to 90% of the thickness of the wallet-size card board. UIM with body. The plate-like frame according to any one of claims 1 to 4, wherein the contact terminal plate of the mini-size UIM IC module is located at a predetermined position of the wallet size card defined by ISO7816. UIM with. 5. The UIM with a plate-like frame according to claim 1, wherein the wallet-size card substrate has a thickness of 0.76 ± 0.08 mm. The UIM with a plate-like frame according to any one of claims 1 to 4, wherein the outer shape of the normal size UIM is a shape conforming to the GSM standard and the 3GPP standard. A board in which a mini-size UIM and an outer shape of a normal size UIM having an inner frame structure in which the mini-size UIM is slid and fitted are formed on a wallet-size card board, and both shapes are formed by peripheral slits. In a method for manufacturing a UIM with a frame,
A step of uniformly cutting the entire mini-size UIM position of the thin card substrate into a thickness of 60 to 90% of the thickness of the wallet-size card substrate, a step of mounting an IC module at the mini-size UIM position, and a mini-size Forming the outer shape of the UIM and the normal size UIM with a peripheral slit, forming the inner frame structure into which the mini size UIM is fitted into the normal size UIM, and forming a convex or concave slit in the inner frame structure A process for producing a UIM with a plate-like frame. A board in which a mini-size UIM and an outer shape of a normal size UIM having an inner frame structure in which the mini-size UIM is slid and fitted are formed on a wallet-size card board, and both shapes are formed by peripheral slits. In a method for manufacturing a UIM with a frame,
The step of mounting the IC module at the mini-size UIM position of the thin card board and the entire surface opposite to the contact terminal board at the mini-size UIM position are 60 to 90% of the thickness of the card board. A step of uniformly cutting, a step of forming the outer shape of the mini size UIM and the normal size UIM by a peripheral slit, a step of forming an inner frame structure into which the mini size UIM is fitted into the normal size UIM, and the inner frame Forming a convex or concave slit in the structure, and a method for manufacturing a UIM with a plate-like frame. The method for manufacturing a UIM with a plate-shaped frame according to claim 11 or 12, further comprising a step of performing a process of issuing a mini-size UIM. 13. The method of manufacturing a UIM with a plate frame according to claim 11 or 12, wherein a terminal board of a contact IC module of a mini size UIM is mounted at a predetermined position of a wallet size card defined by ISO7816. The plate-like frame body according to claim 11 or 12, wherein the folding facilitating process is performed by any one of a half cut process, a perforation process, a groove punching process, a counterbore process, or a combination thereof. UIM manufacturing method.

Images