JP3361489B2 - IC card manufacturing method - Google Patents

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of manufacturing an IC card, and more particularly, to a terminal of a flat coil formed by winding a conductive wire a plurality of times on substantially the same plane, and an electrode terminal of a semiconductor element. The present invention relates to a method for manufacturing an electrically connected IC card.

[0002]

2. Description of the Related Art As shown in FIG. 19, an IC card has a rectangular planar coil 10 in which a conductive wire 102 is wound a plurality of times.
0 and the semiconductor element 104. The planar coil 100 and the semiconductor element 104 are sandwiched by two resin films 106 made of PVC or the like and having characters or the like printed on the front surface side, and the two resin films 106 are made of polyurethane resin or the like. It is adhered by the agent layer. This adhesive layer is used for the planar coil 100.
The semiconductor element 104 is also sealed. In such an IC card, when passing through the magnetic field provided in the card processing device, electric power is generated in the planar coil 100 by electromagnetic induction to activate the semiconductor element 104, and information about the semiconductor element 104 and the card processing device is obtained. Can be exchanged via the planar coil 100 as an antenna. The planar coil 100 used in such an IC card has conventionally been formed by winding a covered electric wire. However, if the plane coil 100 is formed by winding the covered electric wire, it is difficult to reduce the cost and mass-produce the plane coil 100, and it is difficult to popularize the IC card. . On the other hand, Japanese Unexamined Patent Publication No. 6-310324 proposes forming a plane coil by press working.

[0003]

As proposed in the above publication, by forming a plane coil by pressing, cost reduction and mass production can be achieved as compared with a plane coil formed by winding a conventional covered electric wire. Can be planned. However, it has been found that the handleability of the flat coil formed by pressing is extremely poor. That is, when no external force is applied to the rectangular planar coil 100 formed by press working, as shown in FIG. 21A, a predetermined space is formed between the conductor wires 102 that are adjacent to each other in the inner and outer directions. Has been done. However, as shown in FIG. 21B, when an external force F acts in the lateral direction of the planar coil 100, the conductive material 102 is deformed and adjacent conductive materials come into contact with each other to cause a short circuit. The contact between the conductor wires due to the deformation of the conductor wire 102 is caused by an external force caused by transportation or storage of the plane coil 100 or a resin film 106 having an adhesive layer formed on one surface in the process of manufacturing the IC card. When sandwiching 100, an external force accompanying the flow of the adhesive or the like is easily applied laterally to the conductive wire 102 to be induced. Therefore, an object of the present invention is to provide a method for manufacturing an IC card in which a short circuit due to deformation of a conductive wire due to an external force applied from the lateral direction is unlikely to occur during transportation or storage of a plane coil in the IC card manufacturing process. To do.

[0004]

Means for Solving the Problems The inventors of the present invention have conducted extensive studies to solve the above problems, and as a result, affixing tape material to a plurality of points on the planar coil 100 to form a conductive wire 102 constituting the planar coil 100. By maintaining the state in which each of them is arranged with a predetermined interval between the adjacent conductive wires 102, the conductive wire 1 can be used when the planar coil 100 is transported or stored.
The inventors have found that it is possible to prevent the occurrence of a short circuit due to the deformation of No. 02, and arrived at the present invention. That is, according to the present invention, when manufacturing an IC card in which a terminal of a plane coil formed by winding a conductive wire on a substantially same plane a plurality of times and an electrode terminal of a semiconductor element are electrically connected, After etching or pressing a thin plate to form the plane coil, a semiconductor element is mounted on the plane coil, and a predetermined interval is provided between the conductor wire of each circumference forming the plane coil and an adjacent conductor wire. Adhesive and / or tape material is adhered to a predetermined portion of the planar coil in order to maintain a state in which the semiconductor element is mounted and the adhesive material and / or tape material is adhered. The flat coil is sandwiched between two films having an adhesive layer formed on at least one side of the facing surfaces facing each other, the two films are joined by the adhesive layer, and Element in IC card manufacturing method, characterized in that to seal the planar coils mounted.

In the present invention, the plane coil having the adhesive material and / or the tape material adhered at a predetermined position and the semiconductor element mounted thereon is separated from the IC card frame and then separated from the IC card frame. A plurality of flat coils are individually sandwiched between two strip-shaped films each having an adhesive layer formed on at least one side of the opposing surfaces, and the two films are bonded by the adhesive layer. And each of the planar coils having the semiconductor element mounted thereon is sealed, and then the planar coils having the semiconductor element mounted are individually cut into individual IC cards to form an IC card. The IC card can be obtained by cutting the film at a predetermined position without deforming the conductor wire of the plane coil.

Alternatively, as the IC card frame, the innermost conductor wire and the outermost conductor wire of the plane coil are partially connected to an inner frame and an outer frame formed with a predetermined gap from the inside and the outside of the plane coil. Consisting of I
Using a C card frame, after adhering adhesive and / or tape material to a plurality of points on the plane coil, the inner frame is separated from the innermost conductor of the plane coil, and then the plane coil and the outer frame are separated. Part is sandwiched between two films having an adhesive layer formed on at least one surface side of the facing surfaces facing each other, the two films are joined by the adhesive layer, and the semiconductor element is mounted. After sealing the flat coil, the film joined by the adhesive layer is formed at a predetermined position together with the outer frame in order to separate the outer frame from the outermost conductor of the flat coil on which the semiconductor element is mounted to form an IC card. By cutting, the IC card can be easily obtained without deforming the conductor of the planar coil.

As the IC card frame, a band-shaped IC card frame in which a plurality of plane coils are sequentially formed is used, and as the two films sandwiching the plane coil on which the semiconductor element is mounted, a band-shaped IC card frame is used. A plurality of plane coils, each of which is formed by using a sheet of film and having an adhesive material and / or a tape material attached at a plurality of locations and on which the semiconductor element is mounted, and the strip-shaped IC card frame, A part of each strip-shaped outer frame that is partially connected to each outermost conductor is sandwiched between two strip-shaped films having an adhesive layer formed on one surface side of the opposing surfaces facing each other. An outermost conductor wire of each planar coil on which the semiconductor element is mounted, after bonding the two films by the adhesive layer and sealing each of the planar coils In order to the individual IC cards separately Luo strip of the outer frame, a strip of film which is joined by the adhesive layer by cutting with the outer frame in a predetermined position, it is possible to obtain a plurality of IC cards simultaneously.

Further, according to the present invention, in manufacturing an IC card in which a terminal of a flat coil formed by winding a conductive wire on a substantially same plane a plurality of times and an electrode terminal of a semiconductor element are electrically connected to each other. After forming the plane coil by etching or pressing a thin metal plate, a semiconductor element is mounted on the plane coil, and the conductor wire of each circumference forming the plane coil is provided between adjacent conductor wires in a predetermined manner. A film material was adhered to at least one entire surface including the space portion of the planar coil in order to maintain a state of being wound with an interval, and then the semiconductor element was mounted and the film material was adhered. A protective film having an adhesive layer formed on one surface thereof is attached to each of both surfaces of the planar coil.
It is in the method of manufacturing a C card.

In the present invention, as the film material, a film material in which a heat-resistant film having higher rigidity and heat resistance than that of the film is attached to one surface of the film made of hot-melt resin is used. The handleability of the film material can be improved and the film material can be easily attached to one side of the flat coil. Further, it is possible to reduce the occurrence of burrs and the like when cutting this film material by pressing. An adhesive composed of a hot-melt adhesive having a softening point lower than that of the hot-melt resin forming the film material as an adhesive layer for adhering a protective film to each of both surfaces of the planar coil to which the film material is attached. By using the layer, when the protective film is heat-bonded to the film material, the protective film can be bonded without softening the hot-melt resin forming the film material.

In these inventions, a flat coil formed by etching or pressing a thin metal plate,
By using the IC card frame in which the flat coil and the frame formed at a predetermined interval are partially connected, the flat coil can be integrated with the IC card frame, and the handleability can be improved. It is possible to prevent deformation of the conductive wire forming the planar coil during transportation or the like until the tape material or the like is attached. Further, by forming a bent portion projecting inward and / or outward of the plane coil in each of the conductor wires constituting the plane coil, the conductor wire of the plane coil is further prevented from being deformed during transportation or the like. it can. In addition, a connecting piece is provided for connecting the conductor wires of the respective circumferences adjacent to each other in the inner and outer directions of the flat coil, and after the adhesive material and / or the tape material is attached to a plurality of places of the flat coil, or the space portion of the flat coil. After attaching the film material to the entire surface including, by cutting the connecting piece, when the flat coil is transported until the tape material or the film material is attached, deformation of the conductor of the flat coil is prevented. It can be effectively prevented.

According to the present invention, a flat coil is formed by sticking a tape material or the like on a predetermined portion of the flat coil formed by etching or pressing a thin metal plate or the entire surface including the space of the flat coil. Wire around each
It is possible to maintain a state in which the wire is wound with a predetermined space provided between adjacent conductors. For this reason, even when an external force is applied laterally to the conductors on each circumference during transportation of the flat coil, the conductors are unlikely to be deformed, so that a short circuit due to contact between the conductors on each circumference can be prevented. In order to prevent the conductor wire from being deformed due to transportation or the like until the tape material or the like is attached to a predetermined portion of the flat coil, the flat coil is partially formed on a frame formed with a predetermined gap from the flat coil. It is preferable to form the IC card frame connected to the metal thin plate by etching or pressing a thin metal plate. Furthermore,
By connecting the conductors of the respective circumferences adjacent to each other in the inner and outer directions of the flat coil to each other by the connecting piece, the conductors of the respective circumferences forming the flat coil can be integrated, and the conductors are further prevented from being deformed during transportation. It can be prevented further.

[0012]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An example of an IC card manufacturing method of the present invention will be described with reference to the drawings. FIG. 1 is a process sequence chart showing an example of a manufacturing method according to the present invention. An example of the IC card frame used in this process sequence table is shown in FIG. The IC card frame 10 of FIG. 2 is formed by etching or pressing a thin metal plate, and each of the planar coils 12 and 12 is an inner frame formed with a predetermined gap inside and outside thereof. The planar coil 12 is partially connected to the outer frame 14 and the outer frame 16. That is, each of the support portions 18, 18 ... Extending from a plurality of locations on the inner edge of the outer frame 16 and the planar coil 1
The outermost conducting wire 2a is connected to the two outermost conducting wires 2a, and the supporting portions 20, 2 extending from a plurality of outer edges of the inner frame 14 are connected.
0 ... Each is connected to the innermost conductor 2b of the plane coil 12. In this way, by partially connecting the flat coil 12 and a frame formed via a predetermined interval and supporting the flat coil 12 by the frame, the handling of the flat coil 12 such as transportation and storage can be improved. . As the metal thin plate to be subjected to such etching or pressing, a metal thin plate made of a metal such as copper, iron or aluminum or an alloy thereof can be used. Particularly, by using a metal thin plate made of iron or aluminum, the manufacturing cost of the plane coil can be reduced. Can be reduced. Alternatively, a metal thin plate wound in a coil shape may be pulled out and used.

The plane coil 12 formed in the IC card frame 10 shown in FIG. 2 has a rectangular shape, and bent portions 22, 22 ... Are formed in each of the linear portions thereof.
As shown in FIG. 3A, the bent portion 22 is formed on the conductor wire 2 of each circumference forming the straight portion of the plane coil 12 so that the plane coil 12 can be formed.
The bent portions 24 protruding inward are formed at substantially the same location. The rigidity of the planar coil 12 in which the bent portion 22 is formed can be improved. Therefore, when the flat coil 12 is conveyed or the like, even if an external force acts in the lateral direction of the flat coil 12, deformation of the conductor 2 forming the flat coil 12 can be prevented, and a short circuit due to contact between the conductors can be prevented. It can be prevented. Further, when the flat coil 12 is formed by pressing a thin metal plate, the punch for pulling out the gap between the conductor wires of each circumference forming the flat coil 12 becomes elongated and the rigidity of the punch is lowered. For this reason, the punch may be damaged during the press working, or the formed conductive wire may be twisted. In this regard, by forming the bent portion 24 on each of the conducting wires 2 on each circumference, the bent portion is formed on the punch in accordance with the shape of the conducting wire 2. Therefore, the rigidity of the punch can be improved, and it is possible to prevent the punch from being damaged during the pressing and the conductive wire 2 formed from being twisted.

Further, in the planar coil 12 shown in FIG. 2, as shown in FIG. 3B, connecting pieces 26 for connecting the conductor wires 2 of the respective circumferences adjacent to each other in the inner and outer directions of the planar coil 12 to each other are provided at a plurality of places. Has been formed. By the connecting pieces 26, 26, ..., The conductor wire 2 on each circumference is integrated and the conductor wire 2 can be prevented from separating. Therefore, when a plurality of IC card frames 10 are stacked and transported or stored, it is possible to prevent deformation of the conductive wire 2 due to entanglement with the conductive wire 2 on each circumference of another stacked flat coil 12. . The connecting pieces 26, 26 ...
As shown in (b), the connecting pieces 26, 26, ..
It is possible to facilitate the processing of the cutting punch for cutting the connecting pieces 26, 26, ... When cutting, and to improve the strength of the cutting punch. In other words, cutting the connecting pieces 26, 26 ...
Usually done at the same time. Therefore, the connecting pieces 26, 26 ...
When is formed in a straight line, the cutting punch becomes comb-shaped, which makes it difficult to process the cutting punch and reduces the strength of the cutting punch. In this respect, as shown in FIG. 3B, by forming the connecting pieces 26, 26 ... In a stepwise manner, the positions of the cutting punches are displaced in accordance with the respective forming positions of the connecting pieces 26, 26. The cutting punch can be easily processed and the strength of the cutting punch can be improved. The connecting pieces 26, 26, ... Are cut before the sealing step of sealing the planar coil 12 described later to form a predetermined gap between the conductor wires 2 on each circumference.

A semiconductor element is mounted on the plane coil 12 of the IC card frame 10 shown in FIGS. 2 and 3, as shown in FIG. Planar coil 12 with semiconductor element mounted
Is shown in FIG. As shown in FIG. 5A, the semiconductor element 28 is mounted near the terminals 32 of the planar coil 12. In the vicinity of the terminals 32, 32 of the planar coil 12, as shown in FIG. 4, a gap between the conductor wire 2 on each adjacent circumference is formed to be narrower than the other. As shown in FIG. 5B, the conductor wire 2 on each circumference in which the gap is formed to be narrower than the others.
As shown in, a downward concave portion 35 is formed. The electrode terminals 30, 3 of the semiconductor element 28 are provided on the bottom surface side of the recess 35.
The semiconductor element 28 is mounted so that the formation surface of 0 faces.
As shown in FIG. 5A, the semiconductor element 28 has electrode terminals 30, 30 and terminals 32, 32 of the planar coil 12.
And are connected by wires 34, 34. The terminal 32 of the planar coil 12 connected to the semiconductor element 28 and the wire 34 is crushed to increase the terminal area, and the terminal end face is made lower than the conductor wire 2. Therefore, not only the mounted semiconductor element 28 but also the loop of the wires 34, 34 can be prevented from protruding from the surface of the planar coil 12 by wire bonding by the wedge bonding method.

As shown in FIGS. 4 and 5, the semiconductor element 2 is provided at a predetermined position on the plane coil 12 of the IC card frame 10.
After mounting 8, the adhesive and / or tape material is attached to the planar coil 12 as shown in FIG. FIG. 6 shows a state in which the tape material is attached to the plane coil 12. The flat coil 12 shown in FIG. 6 has a tape material 36 attached to a plurality of locations thereof. The tape material 36 has an adhesive layer formed on one surface side of the tape material. Such tape material 3
At the location where 6 is attached, the adhesive that has entered between the conductor wires of each circumference is solidified and the conductor wires 2 of each circumference are fixed at a predetermined interval. In the rectangular planar coil 12 shown in FIG. 6, the tape material 36 is attached to each linear portion of the planar coil 12, so that the conductor wires 2 of each circumference forming the planar coil 12 can be fixed at predetermined intervals. Therefore, it is possible to cut the connecting pieces 26, 26, ... Connecting the conducting wires on the respective circumferences of the planar coil 12 and to disconnect the planar coil 12 as shown in FIG. The separation of the plane coil 12 means that the plane coil 12 is separated from the inner frame 14 and the outer frame 16 of the IC card frame 10. As shown in FIG. 7, the separated flat coil 12 is fixed to the flat coil 12 when the flat coil 12 is transported because the conductor wire 2 on each circumference is fixed by the tape members 36, 36 ,. Even if an external force is applied from the lateral direction, it is possible to prevent the conductor wire 2 on each circumference from being deformed, and to prevent a short circuit due to the contact between the conductor wires on each circumference. Here, the tape material 36 is
Although it is attached to each straight part of the rectangular planar coil 12,
The flat coil 12 may be attached to each corner portion, or the tape material 36 may be attached to the linear portion and the corner portion of the flat coil 12. An adhesive material may be used instead of the tape material 36, and the tape material 36 and the adhesive material may be used together. The connection parts 26, 26 ... Are cut off by the IC card frame 1
It may be performed after separating the plane coil 12 from 0.

In this manner, the plane coil 12 shown in FIG. 7 is separated from the IC card frame 10, the tape materials 36, 36 ... Are attached and the semiconductor element 28 is mounted.
Is sandwiched between two films as shown in Fig. 1,
The planar coil 12 on which the semiconductor element 28 is mounted is sealed with resin. As shown in FIG. 8, this sealing is performed by two films 38, 3 made of a resin such as an ABS resin having an adhesive layer formed on at least one side of the facing surfaces facing each other.
Between the IC card frame 10 and the tape members 36, 36, ...
By sandwiching the plurality of planar coils 12, 12 on which is mounted, the two films 38, 3 by the adhesive layer.
It is possible to bond 8 together and simultaneously resin-seal a plurality of planar coils 12, 12 on which the semiconductor element 28 is mounted. At the time of such sealing, a lateral force is applied to the conductor wire 2 on each circumference of the plane coil 12 by the flow of the adhesive, but since the conductor wire 2 on each circumference is fixed by the tape material 36, The conductor wire 2 on each circumference is not deformed. The plurality of planar coils 12 and 12 sandwiched between the two strip-shaped films 38 and 38 are made into an IC card as shown in FIG. In this IC card formation, the IC cards 40 shown in FIG. 9 can be obtained by cutting the films 38, 38 joined by an adhesive layer at a predetermined position to individualize them. Since the opposite side of the two films 38, 38 with respect to the respective facing sides is the surface of the finally obtained IC card, various kinds of printing can be performed.

Up to now, the planar coil 12 to which the tape materials 36, 36 ... Are attached and the semiconductor element 28 is mounted
The method of manufacturing an IC card in which the IC card is separated from the IC card frame 10 and sandwiched between two films has been described, but an IC card is manufactured without separating the planar coil 12 from the IC card frame 10 as much as possible.
A card manufacturing method can also be adopted. Thus, by manufacturing the IC card without separating the flat coil 12 from the IC card frame 10 as much as possible, the process of individually handling the flat coils 12 separated from the IC card frame 10 is performed as much as possible. Can be reduced, the plane coil 12
And the IC card can be easily manufactured. In this IC card manufacturing method, as shown in FIG.
After the adhesive and / or tape material is attached to the plane coil of the card frame and the semiconductor element is mounted, the inner frame is separated. Disconnecting this inner frame means that
The inner frame 14 and the outer frame 16 constituting the IC card frame 10 shown in FIG. 1, that is, the inner frame 14 partially attached to the inner and outer sides of the planar coil 12 on which the tape material is attached and the semiconductor element 28 is mounted. And the outer frame 16 and then the inner frame 14 is separated. FIG. 10 shows the IC card frame 10 from which the inner frame 14 is separated. In the IC card frame 10 shown in FIG. 10, the flat coil 12 to which the tape material 36 is attached and the semiconductor element 28 is mounted has the outer frame 16 with the large space portion 42 formed inside.
Are supported by the bearings 18, 18 ... At this time, the connecting pieces 26, 26, ... For connecting the conductors on the respective circumferences of the planar coil 12 are also cut. The cutting of the connecting piece 26 may be performed simultaneously with or before and after the disconnection of the inner coil 12.

By the way, as shown in FIG. 10, when the IC card frame 10 in which a large space 42 is formed inside the plane coil 12 is conveyed for press working, another IC card frame 10 is Since the space for the IC card frame 10 gets into the space 42 or the press die is caught in the space 42, the handling of the IC card frame 10 tends to be slightly reduced. Therefore, as shown in FIG. 1, by sandwiching the planar coil 12 of the IC card frame 10 between two films, the space 42 can be covered with two films. As a result, the handleability of the IC card frame 10 can be improved. FIG. 11 shows a state of the plane coil 12 of the IC card frame 10 sandwiched between two films. Two films 38 and 3 shown in FIG.
8 is a strip-shaped film 3 made of a resin such as ABS resin
8, 38, and the flat coils 12, 12 on which the semiconductor element 28 is mounted and a part of the outer frame 16 are sandwiched. An adhesive layer is formed on at least one surface side of the facing surfaces of the two films 38, 38 facing each other, and the two adhesive films form the two films 38, 38.
38 is joined, and the planar coils 12, 12 on which the semiconductor element 28 is mounted are sealed.

Then, the two films 38 joined together are
9 is cut at a predetermined location, and at the same time, the support portions 18 extending from a plurality of locations on the inner edge of the outer frame 16 are also cut to individualize the planar coils 12, 12 on which the semiconductor element 28 is mounted. The IC card 40 shown in FIG. It is preferable that the widths of the films 38, 38 are such that they fully cover the entire surface of the planar coil 12 and do not close the positioning holes 44, 44 ... Formed in the outer frame 16. This is because the positioning hole 44 is necessary when the outer frame 16 is separated. In addition, the opposite side of the two films 38, 38 with respect to the respective facing surfaces,
Since it will be the surface of the finally obtained IC card, various types of printing can be performed.

In the planar coil 12 shown in FIGS. 6 to 11,
A film material 36 is attached to a predetermined portion of the flat coil 12,
The conducting wires 2 forming the flat coil 12 are fixed at a predetermined interval, but as shown in FIG. 12, the flat coil 12 is formed on the entire surface on one side including the space 42 of the flat coil 12 formed in the IC card frame 10. Conductive wire 2 even if the film material 50 is attached
Can be fixed. On the wide film material 50, a part of the plane coil 12 on which the semiconductor element 28 is mounted and the outer frame 16 are attached. As described above, since the film material 50 is attached to the entire one surface including the space portion 42 of the flat coil 12 formed in the IC card frame 10, as shown in FIG. 13, a film made of hot melt resin is used. It is preferable to use the film material 50 in which the heat resistant film 58 such as paper, which has higher rigidity and heat resistance than the film 58, is attached to one surface of the film material 56.

Film 56 made of hot melt resin
Is usually solid and does not exhibit adhesiveness at room temperature, but when heated above the softening point temperature of the hot-melt resin forming the film 56, the film 56 softens and exhibits adhesiveness. On the other hand, the heat-resistant film 58 such as paper is heated even if the film 56 is softened and exhibits adhesiveness.
It does not soften and does not exhibit adhesiveness. Therefore, when the film material 50 shown in FIG. 13 is attached to the entire surface of one surface of the planar coil 12, the heat-resistant film 58 such as paper is attached to one surface of the film 56 made of hot melt resin. When the film material 50 is heated and pressed, the film material 5 is applied to the contact surface of the pressing body that presses the film material 50.
Since 0 is not adhered, it is easy to handle the IC card frame 10 to which the film material 50 is attached.

As shown in FIG. 14, the cut-out body 48 obtained by separating the flat coil 12 having the film material 50 adhered to the entire one surface from the outer frame 16 as shown in FIG. Film material 50 attached to
Are formed along the edges of the cutouts. The notches 52, 52 ... Are portions where the support portions 18, 18, ... Of the flat coil 12 extending from the inner edge of the outer frame 16 are separated from the flat coil 12. Further, in the film material 50 of the separating portion 48, cutout holes 54, 54 ... Are formed by cutting the connecting pieces 26, 26 .. The cutting of the connecting piece 26 may be performed at the same time as, or before or after the plane coil 12 is separated from the outer frame 16. In this manner, the film material 50 is cut together with the support portion 18 of the IC card frame 10 and the like. When such cutting is performed by pressing using a punch and a die, if only the soft film 56 made of hot melt resin is cut by pressing, burrs are likely to occur from the cut end. In this regard, as shown in FIG.
Since the heat resistant film 58 such as paper having a higher rigidity than that of the IC card frame 10 is adhered, the film material 50 is pressed from the surface side of the IC card frame 10 to which the heat resistant film 58 is adhered. The press workability can be improved, and the occurrence of burrs from the cut edge can be minimized.
It is preferable that the heat-resistant film 58 such as paper of the film material 50 is peeled off from the cut body 48 after the supporting portions 18, 18, ... Of the flat coil 12 are separated from the flat coil 12.

As shown in FIG. 14, since the cutout body 48 has cutouts 52, 52, ...
In order to use the separating body 48 as an IC card, it is necessary to attach protective films capable of printing on both surfaces of the separating body 48. An example in which a polyethylene terephthalate (PET) film is used as the protective film and the PET film is attached to one surface of the cutout 48 will be described with reference to FIG. In FIG. 15, P pulled out from the winding body 60
A drum 64 that rotates the ET film 62 in the direction of arrow A.
One side of PET film 62 (front side) while half-turning
The hot-melt resin 66 which is heated to have adhesiveness is applied. On the other hand, the cut bodies 48, 48, ... Are placed on the conveyor 68 moving in the direction of the arrow B, and when passing below the drum 64, one surface of the cut body 48 is heated and exhibits adhesiveness. The PET film 62 is attached by the hot melt resin 66. Further, the cut body 48 in which the PET film 62 is attached to one surface by a hot melt adhesive 66
Is placed on the conveyor 68 with the other surface on which the PET film 62 is not attached facing up, and the PET film 62
The PET film 62 can be attached to both surfaces of the cut body 48 by sticking to the other surface of the cut body 48 with the hot melt adhesive 66. After that, by cutting at an appropriate position, an IC card can be obtained in which the PET film 62 as a protective film is attached on both sides.

Here, a film 56 made of hot-melt resin is attached to one surface of the separating body 48 including the space 42 of the flat coil 12. Therefore, when the PET film 62 is attached to the separating body 48 and the softening point temperature of the hot melt adhesive 66 is equal to or higher than the softening point temperature of the hot melt resin forming the film 56, the hot melt adhesive The hot melt adhesive 66 is heated to a temperature equal to or higher than the softening point temperature of the hot melt resin forming the film 56 in order to develop adhesiveness in the film 56.
Also softens. Therefore, it is preferable to use, as the hot melt adhesive 66, a hot melt resin having a softening point temperature lower than the softening point temperature of the hot melt resin forming the film 56. In the description of FIGS. 12 to 15, the film material 50 is attached to the entire one surface including the space portion 42 of the flat coil 12, but the film material 50 is attached to the entire both surfaces including the space portion 42 of the flat coil 12. You may wear it.

In the bent portion 22 of the planar coil 12 described above, as shown in FIG. 3 (a), etc., the conductor wire 2 on each circumference is bent at a bent portion 24 protruding substantially in the same place and in the same direction. 16 (a) and 16 (b).
As shown in FIG. 16, the conductor wire 2 of each circumference may be bent so that the bending directions of the bent portions 24, 24 ... Are opposite to each other. As shown in FIG. 24 .... may be formed at different positions. Further, in the planar coil 12 described so far, one bent portion 22 is formed in one straight portion, but a plurality of bent portions 22, that is, one straight portion is formed in one straight portion. A plurality of bent portions 24 may be formed on the peripheral conductor wire 2.

In the semiconductor element 28, as shown in FIG. 17A, the conductor wire 2 around each circumference of the planar coil 12 is provided on the surface of the semiconductor element 28 opposite to the surface on which the electrode terminals 30, 30 are formed. It may be mounted on the planar coil 12 so as to pass therethrough.
In this case, as shown in FIG. 17B, an upward concave portion 35 is formed in the portion of the conductor wire 2 on each circumference where the semiconductor element 28 is mounted, and the semiconductor element 28 is located on the bottom surface side of the concave portion 35. It is installed in. As shown in FIG. 17B, when the recess 35 is formed in the conductor wire 2 on each circumference, the portion of the conductor wire 2 forming the bottom of the recess 35 may be too thin. In such a case, as shown in FIG. 18, a part of the conductive wire 2 may be bent to form the recess 35. The IC card frame 10 described above includes a plurality of planar coils 12, 12
It was a band-shaped IC card frame with
An IC card frame in which only one flat coil 12 is formed can also be used. In this case, as the two films 38, 38, those which are suitable for an IC card frame in which one flat coil 14 is formed are used.
Although the semiconductor element is mounted on the planar coil in the description of FIGS. 1 to 18, as shown in FIG . 19, the semiconductor element 28 and the planar coil 12 located in the space 42 of the planar coil 12 are arranged. May be electrically connected to the conducting wire 2 by the wires 70a and 70b.

[0028]

According to the present invention, in the process of manufacturing an IC card, it is possible to effectively prevent the deformation of the conductor wire of each circumference forming the plane coil, and the conductor wires contact each other due to the deformation of the conductor wire of each circumference. It is possible to prevent the short circuit that occurs. As a result, the reliability of the finally obtained IC card can be improved, and the inspection and the like can be simplified.

[Brief description of drawings]

FIG. 1 is a schematic process drawing outlining one example of a method for manufacturing an IC card according to the present invention.

FIG. 2 is a plan view showing an example of an IC card frame used in the present invention.

FIG. 3 is a partially enlarged plan view illustrating a bent portion of the planar coil shown in FIG.

FIG. 4 is a plan view of an IC card frame showing a state in which a semiconductor element is mounted on the flat coil shown in FIG.

5A and 5B are a partially enlarged plan view and a partially enlarged cross-sectional view illustrating a portion of the planar coil shown in FIG. 4 on which a semiconductor element is mounted.

6 is a plan view of an IC card frame showing a state in which a tape material is attached to the flat coil shown in FIG.

FIG. 7 is a plan view showing a plane coil separated from the IC card frame shown in FIG.

8 is a plan view showing a state in which the plane coil shown in FIG. 7 is sandwiched between two films.

FIG. 9 shows a plan view of the finally obtained IC card.

10 is a plan view showing a state in which the inner frame is separated from the IC card frame shown in FIG.

11 is a plan view showing a state where the IC card frame shown in FIG. 10 is sandwiched between two films.

FIG. 12 is a plan view illustrating a step of another example of the method for manufacturing an IC card according to the present invention.

13 is a partial cross-sectional view illustrating a tape material attached to one surface of the flat coil or the like shown in FIG.

FIG. 14 is a front view of a separation portion obtained by separating the plane coil from the outer frame shown in FIG.

FIG. 15 is an explanatory diagram for explaining an outline of a mounting device for sticking a PET film on one surface of the cutout portion shown in FIG.

FIG. 16 is a partially enlarged plan view illustrating another aspect of the bent portion formed on the planar coil.

17A and 17B are a partially enlarged plan view and a partially enlarged cross-sectional view illustrating another aspect of the portion of the planar coil on which the semiconductor element is mounted.

FIG. 18 is a partially enlarged cross-sectional view illustrating another aspect of the portion of the planar coil on which the semiconductor element is mounted.

FIG. 19 is a plan view illustrating another example of the IC card manufactured according to the present invention.

FIG. 20 is a plan view illustrating a conventional IC card.

FIG. 21 is an explanatory diagram for explaining a state in which an external force is applied laterally to a conductor wire that constitutes a conventional planar coil.

[Explanation of symbols]

2 Conductive wire 2a Outermost conductive wire 2b Innermost conductive wire 10 IC card frame 12 Planar coil 14 Inner frame 16 Outer frames 18, 20 Supporting part 22 Bending part 24 Bending part 26 Connecting piece 28 Semiconductor element 30 Electrode terminal 32 of semiconductor element 28 Plane Terminals 34 of coil 12 Wire 35 Recess 36 Tape material 38 Film 40 IC card 42 Planar coil 12 space 44 Positioning hole 48 Separation 50 Film material 52 Notch 54 Cutout hole 56 Film made of hot melt resin 58 Heat resistant film 62 PET film (protective film) 66 Hot melt adhesive for sticking the PET film 62

─────────────────────────────────────────────────── ─── Continuation of the front page (72) Shigeru Okamura Inventor Shigeru Okamura Nagano City, Nagano City, Kurita character, 711 Rishida, Shinko Electric Industry Co., Ltd. Electric Industry Co., Ltd. (72) Inventor Tomoji Fujii Nagata, Nagano City 711 Address, Rita Kurita, Shinda Electric Industry Co., Ltd. (56) Reference JP 2000-105803 (JP, A) JP 6-310324 (JP, A) JP-A-8-207476 (JP, A) JP-A-10-264564 (JP, A) JP-A-9-232834 (JP, A) JP-A-10-67195 (JP, A) (JP-A) 58) Fields investigated (Int.Cl. ⁷ , DB name) G06K 19/00-19/18 B42D 15/10 H01F 41/04 H01Q 1/38

Claims (13)

(57) [Claims] 1. A thin metal plate for producing an IC card in which terminals of a planar coil formed by winding conductor wires on a substantially same plane a plurality of times are electrically connected to electrode terminals of a semiconductor element. After forming the plane coil by etching or pressing, the semiconductor element is mounted on the plane coil, and the conductor wire of each circumference forming the plane coil is provided with a predetermined interval between the conductor wire and the adjacent conductor wire. An adhesive material and / or a tape material is adhered to a predetermined portion of the planar coil in order to keep the wound state, and then the semiconductor element is mounted and the adhesive material and / or the tape material is adhered. The flat coil is sandwiched between two films having an adhesive layer formed on at least one side of the facing surfaces facing each other, and the two films are joined by the adhesive layer and the semiconductor element is provided. A method for manufacturing an IC card, which comprises encapsulating a planar coil on which is mounted. 2. A frame for an IC card in which a plane coil formed by etching or pressing a thin metal plate and a frame formed at a predetermined interval from the plane coil are partially connected to each other is used. The method of manufacturing an IC card according to claim 1. 3. A flat coil having an adhesive material and / or a tape material attached at a predetermined position and having a semiconductor element mounted thereon is used as an IC.
After disconnecting from the card frame, flat surface coils, separated from the IC card frame
The sandwiched between two sheets of film on which the adhesive layer has been formed on at least one side of opposing surfaces that face each other, wherein the adhesive layer joining the two films and the semiconductor element is mounted plane sealing the coil, then, IC of claim 2, wherein the full Irumu joined by the previous SL adhesive layer is cut at a predetermined position and the IC card
Card manufacturing method. 4. An IC card frame, wherein the innermost conductor wire and the outermost conductor wire of the plane coil are partially connected to an inner frame and an outer frame formed with a predetermined gap from the inside and outside of the plane coil. Using the frame for an IC card, the inner frame is separated from the innermost conducting wire of the plane coil after the adhesive material and / or the tape material is attached to a plurality of points of the plane coil, and then the plane coil and the outer frame are used. A part of the film is sandwiched between two films having an adhesive layer formed on at least one surface side of the facing surfaces facing each other, the two films are bonded by the adhesive layer, and the semiconductor element is After sealing the mounted plane coil, the outer frame is separated from the outermost conductor of the plane coil on which the semiconductor element is mounted to form an IC card. 3. The method for manufacturing an IC card according to claim 2, wherein the film joined by the adhesive layer is cut together with the outer frame at a predetermined position. 5. A strip-shaped IC card frame in which a plurality of planar coils are sequentially formed is used as an IC card frame, and strip-shaped films are used as two films sandwiching the planar coil on which a semiconductor element is mounted. Using two films, a plurality of plane coils in which an adhesive material and / or a tape material is adhered to a plurality of places of the plane coil and the semiconductor element is mounted, and each outermost conducting wire and part of the plane coil A part of the strip-shaped outer frame that is electrically connected is sandwiched between two strip-shaped films each having an adhesive layer formed on one surface side of the opposing surfaces that face each other, and the adhesive layer forms the two After joining the sheets of film and sealing each of the planar coils on which the semiconductor element is mounted, a strip-shaped outer flap is formed from the outermost conducting wire of each planar coil on which the semiconductor element is mounted. The strip-shaped film joined by the adhesive layer is cut at a predetermined position together with the outer frame so as to separate the ram into individual IC cards.
A method for manufacturing the described IC card. 6. The IC card according to claim 1, wherein a bent portion projecting inward and / or outward of the plane coil is formed on a conductor wire of each circumference forming the plane coil. Production method. 7. A connecting piece is provided for connecting the conductor wires of the respective circumferences adjacent to each other in the inner and outer directions of the planar coil to each other, and an adhesive material and / or a tape material is attached to a plurality of points of the planar coil, and then the connecting piece is attached. The method for manufacturing an IC card according to claim 1, wherein the IC card is cut. 8. A thin metal plate for manufacturing an IC card in which a terminal of a planar coil formed by winding a conductive wire on a substantially same plane a plurality of times and an electrode terminal of a semiconductor element are electrically connected to each other. After forming the plane coil by etching or pressing, the semiconductor element is mounted on the plane coil, and the conductor wire of each circumference forming the plane coil is provided with a predetermined interval between the conductor wire and the adjacent conductor wire. In order to keep the wound state, a film material is attached to at least one entire surface including the space of the plane coil, and then both sides of the plane coil on which the semiconductor element is mounted and the film material is attached A method of manufacturing an IC card, characterized in that a protective film having an adhesive layer formed on one surface thereof is attached to each of the above. 9. A frame for an IC card is used, in which a plane coil formed by etching or pressing a thin metal plate and a frame formed at a predetermined interval from the plane coil are partially connected. The method for manufacturing an IC card according to claim 8. 10. A film material comprising a film made of hot-melt resin and a heat-resistant film having higher rigidity and heat resistance than that of the film, which is attached to one surface of the film, as the film material. Item 10. A method for producing an IC card according to item 9. 11. A hot-melt resin having a softening point lower than that of a hot-melt resin forming the film material as an adhesive layer for adhering a protective film on each of both sides of a flat coil in which the film material is attached on one entire surface. I according to any one of claims 8 to 10, wherein an adhesive layer made of a melt adhesive is used.
C-card manufacturing method. 12. The conductor wire of each circumference forming the planar coil,
The method for manufacturing an IC card according to claim 8, wherein a bent portion that protrudes inward and / or outward of the planar coil is formed. 13. A connecting piece is provided for connecting the conductors of the respective circumferences adjacent to each other in the inward and outward directions of the planar coil, the film material is adhered to the entire surface including the space of the planar coil, and then the connecting piece is cut. I according to any one of claims 8 to 12.
C card manufacturing method.