JP3361465B2 - IC card manufacturing method - Google Patents

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing an IC card, and more specifically, a terminal of a flat coil formed by winding a conductive wire on a substantially same plane a plurality of times and an electrode terminal of a semiconductor element are electrically connected. The present invention relates to a method of manufacturing an IC card that is physically connected.

[0002]

2. Description of the Related Art An IC card, as shown in FIG. 15, has a rectangular flat coil 10 formed by winding a conductive wire 102 a plurality of times.
0 and the semiconductor element 102. The planar coil 100 and the semiconductor element 104 are sandwiched by two resin films 106 made of PVC or the like and having characters or the like printed on the front surface side, and the two resin films 106 are made of polyurethane resin or the like. It is adhered by the agent layer. This adhesive layer is used for the planar coil 100.
The semiconductor element 104 is also sealed. In such an IC card, when passing through the magnetic field provided in the card processing device, electric power is generated in the planar coil 100 by electromagnetic induction to activate the semiconductor element 104, and information about the semiconductor element 104 and the card processing device is obtained. Can be exchanged via the planar coil 100 as an antenna. The planar coil 100 used in such an IC card has conventionally been formed by winding a covered electric wire. However, if the plane coil 100 is formed by winding the covered electric wire, it is difficult to reduce the cost and mass-produce the plane coil 100, and it is difficult to popularize the IC card. . On the other hand, Japanese Unexamined Patent Publication No. 6-310324 proposes forming a plane coil by press working.

[0003]

As proposed in the above publication, by forming a plane coil by pressing, cost reduction and mass production can be achieved as compared with a plane coil formed by winding a conventional covered electric wire. Can be planned. However, it has been found that the handleability of the flat coil formed by pressing is extremely poor. That is, when no external force is applied to the rectangular planar coil 100 formed by press working, as shown in FIG. 16A, a predetermined space is provided between the conductor wires 102 adjacent to each other in the inner and outer directions. Spaces are formed. However, as shown in FIG. 16B, when an external force F acts in the lateral direction of the planar coil 100, the conductive material 102 is deformed, and the conductive material on each adjacent circumference comes into contact with each other to cause a short circuit. Such a conductor 102
The contact between the conductive wires on the respective circumferences due to the deformation of the flat coil is caused by an external force associated with transportation or storage of the flat coil 100 in the manufacturing process of the IC card, or by the resin film 106 having an adhesive layer formed on one surface thereof. When sandwiching 100, an external force accompanying the flow of the adhesive or the like is easily applied laterally to the conductive wire 102 to be induced. Therefore, an object of the present invention is to provide a method for manufacturing an IC card in which a short circuit due to deformation of a conductive wire due to an external force applied from the lateral direction is unlikely to occur during transportation or storage of a plane coil in the IC card manufacturing process. To do.

[0004]

Means for Solving the Problems As a result of repeated studies to solve the above-mentioned problems, the present inventors have found that an outer frame formed with a predetermined space between the outermost conductor of the planar coil,
By using an IC card frame in which plane coils are partially connected and carrying and storing the plane coil portion sandwiched between two protective films, the conductor wire is less likely to be deformed. The present invention has been achieved and has reached the present invention. That is, according to the present invention, when an IC card in which a terminal of a flat coil formed by winding a conductive wire on a substantially same plane a plurality of times is electrically connected to an electrode terminal of a semiconductor element is manufactured, An IC card frame, in which the plane coil is partially connected to an outer frame formed at a predetermined distance from the outside of the coil, is formed by etching or pressing, and then the outer frame and the plane coil are formed. A connecting portion that partially connects the outside and a planar coil on which the semiconductor element is mounted are sandwiched between two protective films, and formed on at least one of the opposing facing surfaces of the two protective films. The two protective films are joined by a first adhesive layer, and then the outer surface and outer surface of the plane coil are separated to separate the plane coil from the IC card frame. After cutting the connection part for connecting with a frame together with the two protective films, one of the two protective films is peeled off, and the semiconductor is joined to the first adhesive layer of the other protective film. The flat coil on which the element is mounted is transferred to a second adhesive layer formed on a film forming one surface side of the IC card and having a higher adhesive strength than the first adhesive layer, and then the IC card of the IC card is transferred. An IC characterized in that a flat coil on which the semiconductor element is mounted is resin-sealed between a film forming one surface side and a film forming the other surface side.
It is in the card manufacturing method.

In the present invention, as a frame for an IC card, for an IC card, the plane coil is partially connected to an inner frame and an outer frame formed at a predetermined distance from the inside and the outside of the plane coil. When sandwiching the plane coil on which the semiconductor element is mounted between two protective films by using a frame, the connection portion that partially connects the inner frame and the inner side of the plane coil is cut, and the IC card By separating the inner frame from the inner frame, after sandwiching the flat coil etc. between the two protective films, a large space is formed inside the flat coil by cutting the joint protective film accompanying the separation of the inner frame. It is possible to easily carry the flat coil or the like without performing the above. Further, the rigidity of the conductor wire can be improved by forming bent portions projecting inward and / or outward of the plane coil on the conductor wire of each circumference forming the plane coil. Further, by providing a connecting piece for connecting the conductor wires on the respective circumferences adjacent to each other in the inner and outer directions of the planar coil, the conductor wires on the respective circumferences forming the planar coil can be integrated and the rigidity of the planar coil can be improved. The connecting piece is then sandwiched planar coils between two protective films, it is preferable to cut with protection film. Until the flat coil is sandwiched between two protective films,
Can be integrated each peripheral conductors constituting the planar coil can be improved handling property, the flat coil sandwiched two protective films is because even if cut the connecting piece are integrated by protection film .

In the present invention, the resin sealing of the flat coil or the like is performed such that the flat coil mounted with the semiconductor element is transferred to the second adhesive layer of the film forming one side of the IC card so as to sandwich the flat coil. After inserting a film forming one surface side of the IC card and a film forming the other surface side into a molding die, a sealing resin is injected between both films inserted into the molding die, This can be performed by resin-sealing the flat coil on which the semiconductor element is mounted. Alternatively, the film forming the one side of the IC card and the other side of the IC card are sandwiched between the film and the other side of the IC card so as to sandwich the flat coil having the semiconductor element mounted thereon, which is transferred to the second adhesive layer of the film forming the one side of the IC card. It can also be performed by joining the film to be formed with an adhesive material and resin-sealing the flat coil on which the semiconductor element is mounted.

According to the present invention, the planar coil formed on the IC card frame can be sandwiched between two protective films to perform a predetermined process. Therefore, the joint protection film in which the two protection films are joined and the plane coil can be integrally handled, and the plane coil can be easily transported and stored. Further, after the plane coil sandwiched between the two protective films is separated from the IC card frame, the second adhesive layer having a high adhesive force is formed on the film forming one side of the IC card. After transfer, it is sealed with resin. Therefore, the conductor of the planar coil is not deformed by the flow of the sealing resin, and the resin can be sufficiently sealed.

[0008]

DETAILED DESCRIPTION OF THE INVENTION FIG.
It is a top view which shows an example of the frame for C cards. The IC card frame 10 of FIG. 1 is formed by etching or pressing a thin metal plate. As this metal thin plate, a metal thin plate made of a metal such as copper, iron, or aluminum, or an alloy thereof can be used. Above all,
If a thin metal plate made of iron or aluminum is used, the cost of the final product can be reduced. The IC card frame 10 has a rectangular flat coil 14 formed by winding a conductive wire 12 a plurality of times on substantially the same plane, and a predetermined space is provided from the inside and the outside of the flat coil 14. The inner frame 16 and the outer frame 18 are formed. The plane coil 14 is provided in the inner frame 1.
6 and the outer frame 18 are partially connected. That is, the outer edge of the inner frame 16 and the outer frame 18
The innermost conductor wire 12 and the outermost conductor wire 12 of the planar coil 14 are connected to the tip ends of the connecting portions 20 and 22 that partially extend from the inner edge of the. In this way, the plane coil 1
By partially connecting 4 to the inner frame 16 and the outer frame 18 by the connecting portions 20 and 22, the plane coil 14 can be used as the IC card frame 10 for carrying and storing. The inner frame 16 has
Space portions 30, 30 are formed to reduce the weight of the inner frame 16.

A bent portion 24 is formed on each of the straight portions of the rectangular planar coil 14 shown in FIG. As shown in FIG. 2 (a), the bent portion 24 has the conductor wires 12 of the respective circumferences forming the straight portion of the planar coil 14 at substantially the same location and in the same direction (inward of the planar coil 14). The bent portion 26 is formed by being bent. This bent part 2
The rigidity of the conductor wire 12 on which each winding 6 is formed and on each circumference is improved as compared with the conductor wire on which the bent portion 26 is not formed, and the planar coil 14 in which the bent portion 24 formed of the bent portion 26 is formed.
Also, its rigidity can be improved. Therefore, when the IC card frame 10 is transported or stored, even if an external force acts in the lateral direction of the plane coil 14, the conductor wire 12 forming the plane coil 14 can be prevented from being deformed, and the conductor wire 12 in each circumference can be prevented. It is possible to prevent a short circuit due to the contact of. By the way, when the conventional planar coil 100 shown in FIG. 15 is formed by press working, the punch for pulling out the interval between the conductor wires 102 of each circumference constituting the planar coil 100 becomes elongated, and the rigidity of the punch also decreases.
Therefore, the punch may be damaged during the press working, or the formed conductive wire 102 may be twisted. In this respect, as shown in FIG. 1 and FIG. 2A, the bent portion 26 is formed in the straight portion of the conductor wire 12 in each circumference, so that the conductor wire 12 can be used as a punch for pulling out between the conductor wires 12 in each circumference. The bent portion is formed following the bent portion 26 formed in the above. For this reason,
The rigidity of the punch can be improved, and it is possible to prevent the punch from being broken or the conductive wire 12 formed from being twisted during press working.

Further, as shown in FIG. 2B, the flat coil 14 shown in FIG. 1 is provided with a connecting piece 27 for connecting the conductor wires 12 of each circumference which are adjacent to each other in the inner and outer directions of the flat coil 14. There is. The connecting wires 27, 27 ... Are integrated with the conductive wires 12, 12 ..., and the conductive wires 12 on each circumference can be prevented from being separated. Therefore, when a plurality of IC card frames 10 are stacked and transported or stored, the planar coil 14 formed on another stacked IC card frame 10 is used.
It is possible to prevent the deformation of the conductive wire 12 due to the entanglement with the conductive wire 12 and the like. As shown in FIG. 2 (b), the connecting pieces 27, 27, ... Are formed stepwise between the conducting wires 12 on the respective circumferences, so that the connecting pieces 27, 27 ,. In doing so, the processing of the cutting punch for cutting the connecting piece 27 can be facilitated, and the strength of the cutting punch can be improved. That is, the connection pieces 27, 27 ... Are usually cut at the same time.
Therefore, when the connecting pieces 27, 27 ... Are formed in a straight line, the cutting punch has a comb tooth shape. The cutting punch having such a shape is difficult to process and its strength is lowered. In this respect, as shown in FIG. 2B, the connecting pieces 27, 27
.. by forming stairs so that connecting pieces 27, 2
The cutting punches are also formed in a staircase pattern following the respective forming positions of 7 ... The cutting punch having such a shape can be easily processed and its strength can be improved. The planar coil 14 shown in FIG. 1 is formed with a portion 28 in which the interval width of the conducting wire 12 on each circumference is narrower than other portions. The location 28 is a location where a semiconductor element is mounted, as will be described later.

Next, the inner frame 16 of the IC card frame 10 shown in FIG. 1 is cut off to form a space 32 inside the plane coil 14 as shown in FIG. The inner frame 16 can be cut off by cutting the connecting portions 20, 20 ... With the planar coil 14. In the planar coil 14 shown in FIG. 3, as shown in FIG. 4, the semiconductor element 34 is mounted on the portion 28 where the space between the conductor wires 12 on each circumference is narrow. The mounted semiconductor element 34 is, as shown in FIG.
The conductor wire 12 of each circumference arranged between the terminals 38, 38 of the planar coil 14 passes on the surface side where the electrode terminals 36, 36 are formed and between the electrode terminals 36, 36. In this way, by mounting the semiconductor element 34 on the location 28 of the plane coil 14, the electrode terminals 36, 36 of the semiconductor element 34 and the terminals 38, 38 of the plane coil can be arranged so as to face each other. Can be easily connected by wires 40, 40. As shown in FIG. 5B, in the flat coil portion 28 on which the semiconductor element 34 is mounted, a downward recess 42 is formed in the conductor wire 12 on each circumference. Furthermore, the plane coil 14
The terminals 38, 38 are subjected to a crushing process to increase the terminal area, and the end surface of the terminal 38 is lower than the upper surface of the conductive wire 12. Therefore, not only the semiconductor element 34 disposed on the bottom surface side of the recess 42 with the formation surface of the electrode terminals 36, 36 facing, but also the electrode terminals 36, 36 of the semiconductor element 34 and the terminal 38 of the planar coil 14, The wires 40, 40 connecting 38 can also be prevented from protruding from the plane of the planar coil 14.

In the IC card frame 10 shown in FIGS. 3 and 4, since the large space 32 is formed inside the plane coil 14, the space is formed when the IC card frame 10 is transported or stored. There may be a case where another IC card frame 10 gets into 32, and the IC card frame 10 cannot be transported or stored smoothly. For this reason, as shown in FIG.
A part of the outer frame 16 including the planar coil 14 including 2 and the connection portion 22 with the planar coil 14 is sandwiched between the two protective films. These two protective films are I
This is for protecting the plane coil 14 and the like in the manufacturing process of the C card, and the protective film is finally peeled off from the plane coil 14 and the like. Therefore, by the first adhesive layer (not shown) having an adhesive force which is formed on one surface side of the two protective films and has an adhesive force that allows the conductor wire 12 of the planar coil 14 to be peeled off without being deformed, Bonding protective film 4 by bonding two protective films
Set to 4. The space portion 32 of the flat coil 14 can be covered with the bonding protection film 44, and the space portion 32 of the flat coil 14 does not enter the other space 10 for the IC card. It can be transported and stored smoothly. here,
When the joint protection film 44 is formed by one protection film without joining the two protection films, the first adhesive layer formed on one surface side of the protection film is exposed, so that the IC card frame 10 of the IC card frame 10 is exposed. It cannot be transported smoothly.

In this way, the planar coil 14 protected by the joint protection film 44 is separated from the outer frame 16. This disconnection can be performed by cutting the connection portions 22, 22, ... Connecting the flat coil 14 and the outer frame 16. At this time, the joint protection film 44 is also cut at the same time. By such cutting, the plane coil 14 and the like shown in FIG. 7 can be obtained. The plane coil 14 and the like shown in FIG. 7 are still protected by the joint protection film 44 even when separated from the outer frame 16. Therefore, it is possible to smoothly carry the flat coil 14 and the like. The plane coil 1 shown in FIG.
A connecting piece 27 for connecting between the conductor wires 12 of each circumference forming part 4
Also cut. As described above, this cutting is performed by the connecting piece 27,
The connecting pieces 27, 27, ... Are cut together with the joint protection film 44 at the same time by using a punch for cutting formed in a step shape following the respective forming positions of 27. Connection pieces 27, 27 ...
Even if the flat coil 14 is cut,
Since it is protected by, the conductor wire 12 on each circumference does not vary. The cross-sectional shape of the plane coil 14 and the like shown in FIG. 7 is, as shown in FIG. 8, the protective film 4 constituting the joint protective film 44 joined by the first adhesive layer 47.
The conductor wire 12 of each circumference forming the plane coil 14 is sandwiched between the portions 5 and 45.

In this way, as shown in FIG. 7, the joint protection film 44 for protecting the flat coil 14 and the like has the connecting portions 22, 22 for connecting the flat coil 14 and the outer frame 16 to each other.
.. or cutting traces of the connecting pieces 27, 27 .. The joint protection film 44 is for temporary protection until the connecting portion 22 and the connecting piece 27 are cut. For this reason, it is necessary to peel off the bonding protection film 44 from the plane coil 14 and the like, and seal the plane coil 14 and the like with a resin to form a card. FIG. 9 shows an example of a process of sealing the planar coil 14 and the like with a resin to form a card. In FIG. 9, first, the protective film 4 forming the joint protective film 44 is formed.
One of Nos. 5 and 45 is peeled off [step of FIG. 9 (a)]. As described above, the first adhesive layer that joins the protective films 45, 45 has an adhesive force that allows the conductor wire 12 of the planar coil 14 to be peeled off without deforming the protective film 45. , 45 can be easily peeled off. At the time of this stripping, the conductor wire 12 of the plane coil 14 is not deformed. In addition, protective film 4
Even if one of the strips 5 and 45 is peeled off, the conductor 1
The second grade is glued.

The plane coil 14 on which the semiconductor element 34 is mounted, which is adhered by the first adhesive layer 47 formed on the one surface side of the other protective film 45, is shown in FIG. 9B.
As shown in (c), it is transferred to the second adhesive layer 52 formed on the upper surface of the film 54a made of ABS resin placed on the bottom surface of the cavity recess of the lower die 50a of the sealing die. The second adhesive layer 52 has a higher adhesive strength than the first adhesive layer 47. Such film 54a
The planar coil 14 on which the semiconductor element 34 is mounted, which is transferred to the second adhesive layer 52 formed on the upper surface of FIG.
As shown in (d), the lower mold 50a and the film 54b made of ABS resin are inserted into the cavity formed by the upper mold 50b temporarily adhered to the lower surface, and as shown in FIG. A polyester resin as the sealing resin 56 is injected into the inside. At the time of this resin sealing, the upper mold 50
Since the film 54b temporarily adhered to the lower surface of the sheet is transferred to the surface of the sealing resin 56, the conductor wire 12 of the planar coil 14 having the semiconductor element 34 mounted between the film 54a and the film 54b is inserted. Is sealed with a sealing resin 56 made of polyester resin, as shown in FIG. 9 (e). In such resin sealing, an external force from the lateral direction acts on the conductive wire 12 of the planar coil 14 due to the flow of the sealing resin 56 and the like, but since the conductive wire 12 is bonded to the second adhesive layer 52, the conductive wire is The deformation of 12 can be prevented. Next, by opening the lower mold 50a and the upper mold 50b, as shown in FIG. 9F, the planar coil 14 having the semiconductor element 34 mounted between the films 54a and 54b is mounted.
It is possible to obtain an IC card in which is sealed with a sealing resin 56 made of polyester resin. Further, the obtained IC card may be subjected to a punching process for adjusting its outer shape.

As shown in FIG. 9, the encapsulation method using the encapsulating mold can sufficiently resin-encapsulate the planar coil 14 on which the semiconductor element 34 is mounted. However, since a sealing die is used, the manufacturing facility becomes large. Therefore, FIG. 10 shows a sealing method of resin-sealing the planar coil 14 on which the semiconductor element 34 is mounted without using a sealing die. Even with the sealing method shown in FIG.
One of the protective films 45, 45 forming part 4 is peeled off, and the first protective film 45 is formed on the other surface of the other protective film 45.
The plane coil 14 or the like adhered by the adhesive layer 47 is transferred to the second adhesive layer 52 formed on one surface side of the film 54a made of ABS resin [FIG. 10 (a)].
Step (b)]. As described above, the second adhesive layer 52 has a higher adhesive force than the first adhesive layer 47.

Next, as shown in FIG. 10 (c), ABS resin is used for resin-sealing the planar coil 14 on which the semiconductor element 34 is mounted, which is adhered to the upper surface of the film 54a by the second adhesive layer 52. The film 54b made of the above material and the sealing resin material 58 made of the hot melt material are heated and pressed by the roller 60. As shown in FIG. 10 (d), the planar coil 14 mounted with the semiconductor element 34, which is sandwiched between the films 54a and 54b made of ABS resin, is pressed from the hot melt material by thermocompression bonding of the sealing resin material 58. An IC card sealed with the sealing resin material 58 can be obtained. Further, the obtained IC card may be subjected to a punching process for adjusting its outer shape. Here, when the sealing resin material 58 made of a hot-melt material is thermocompression-bonded, an external force from the lateral direction acts on the conductor 12 of the planar coil 14 due to the flow of the sealing resin material or the like. Since it is adhered to the second adhesive layer 52, it is possible to prevent the conductor wire 12 from being deformed. Note that the film 54b and the sealing resin material 58 shown in FIG. 10C may be laminated in advance in layers, as shown in FIG.
Film 5 of the IC card obtained in (f) or FIG. 10 (d)
Characters and pictures may be printed on 4a and 54b.

As shown in FIG. 2 (a), the bent portion 24 formed on the planar coil 14 described so far has the bent portion 26 protruding the conductor wire 12 on each circumference at substantially the same location and in the same direction. 11 (a) and 11 (b).
As shown in FIG. 11, the conducting wire 12 on each circumference may be bent so that the bending directions of the bent portions 26, 26, ... Are opposite to each other. As shown in FIG. The formation locations of 26 ... May be different. Further, one bent portion 24 is formed in one straight line portion of the planar coil 12, but a plurality of bent portions 24 are formed in one curved line portion, that is, a plurality of bends 24 are formed in the conductor wire 12 of each circumference forming one straight line portion. The individual bent portions 26 may be formed. Even if the plane coil is circular or elliptical, the rigidity of the conductor can be improved by forming a bent portion projecting inward and / or outward of the plane coil in the conductor of each circumference forming the plane coil. Can be improved to counteract external force from the lateral direction.

As shown in FIG. 12A, the semiconductor element 34 has terminals 3 of the planar coil 14 on the surface of the semiconductor element 34 opposite to the surface on which the electrode terminals 36, 36 are formed.
You may mount on the planar coil 14 so that the conductor wire 12 of each circumference arrange | positioned between 8 and 38 may pass. In this case, as shown in FIG. 12B, an upward recess 42 is formed in the portion of the conductor wire 12 on each circumference where the semiconductor device 34 is mounted, and the semiconductor device 34 is formed on the bottom surface side of the recess 42. It is installed. As shown in FIG. 12B, when the recess 42 is formed in the conductor wire 12 on each circumference, the portion of the conductor wire 12 forming the bottom of the recess 42 may be too thin. In such a case, as shown in FIG. 13, the recess 42 may be formed by bending a part of the conductive wire 12.

Further, as the IC card frame used in the present invention, as shown in FIG. 14, an IC card frame 10 having a plurality of plane coils 14, 14 is formed.
Can be used. As described above, by using the IC card frame 10 in which the plurality of plane coils 14 are formed, the plane coil 14 can be compared to the IC card frame 10 in which one plane coil 14 is formed.
Can be efficiently transported and stored. The IC card frame 10 shown in FIG. 14 can be obtained by etching or pressing a strip-shaped thin metal plate. As this strip-shaped thin metal plate, a strip-shaped thin metal plate rolled into a roll may be used.

[0021]

According to the present invention, in the process of manufacturing an IC card, it is possible to effectively prevent the deformation of the conductor wire of each circumference forming the plane coil, and the conductor wires of each circumference contact due to the deformation of the conductor wire. It is possible to prevent the short circuit that occurs. As a result, the reliability of the finally obtained IC card can be improved and the inspection and the like can be simplified.

[Brief description of drawings]

FIG. 1 is a plan view showing an example of an IC card frame used in the present invention.

FIG. 2 is a partial plan view for explaining a state of a bent portion formed on each conductive wire which constitutes the planar coil.

3 is a plan view showing a state in which an inner frame formed inside a plane coil of the IC card frame shown in FIG. 1 is removed.

FIG. 4 is a plan view showing a state in which a semiconductor element is mounted on the plane coil of the IC card frame shown in FIG.

5A and 5B are a partial plan view and a partial cross-sectional view for explaining a state in the vicinity of a semiconductor element mounted on a flat coil of the IC card frame shown in FIG.

FIG. 6 is a plan view showing a state in which a flat coil portion of the IC card frame shown in FIG. 4 is protected by a bonding protection film.

FIG. 7 is a plan view showing a state in which a portion such as a flat coil protected by a joint protection film is separated from the IC card frame.

8 is a cross-sectional view of a portion such as the flat coil shown in FIG.

FIG. 9 is a process diagram showing a manufacturing process for manufacturing an IC card by resin-sealing a flat coil or the like separated from the IC card frame.

FIG. 10 is another process diagram showing a manufacturing process for manufacturing an IC card by resin-sealing a flat coil or the like separated from the IC card frame.

FIG. 11 is a partial plan view for explaining another state of the bent portion formed on each conductive wire forming the planar coil.

FIG. 12 is a partial plan view and a partial cross-sectional view for explaining another state of the semiconductor element mounted on the planar coil.

FIG. 13 is a partial cross-sectional view for explaining another state of the semiconductor element mounted on the planar coil.

FIG. 14 is a plan view showing another example of the IC card frame used in the present invention.

FIG. 15 is a plan view illustrating a conventional IC card.

FIG. 16 is an explanatory diagram for explaining a state when an external force is applied laterally to the conductor wire of each circumference forming the conventional planar coil.

[Explanation of symbols] 10 IC card frame 12 conductors 14 plane coil 16 inner frame 18 outer frame 20,22 connection 24 Bend 26 Bending section 27 connecting piece 28 Places for mounting semiconductor elements 30, 32 Space section 34 Semiconductor element 36 Electrode terminal of semiconductor element 34 38 terminals of the planar coil 14 40 wires 42 recess 44 Bonding protection film 45 Protective film 47 First adhesive layer 50a lower mold 50b Upper mold 52 Second adhesive layer 54a, 54b film 56 sealing resin 58 Sealing resin material 60 roller

─────────────────────────────────────────────────── ─── Continuation of the front page (72) Masatoshi Akagawa Inventor Masatoshi Akakawa 711 Rishida, Kurita character, Nagano City, Nagano Shinko Electric Industry Co., Ltd. (56) Reference JP-A-8-207476 (JP, A) JP-A 6-310324 (JP, A) JP-A-10-236041 (JP, A) JP-A-9-131987 (JP, A) JP-A-9-232834 (JP, A) (58) Fields investigated (Int. Cl. ⁷ , DB name) G06K 19/00-19/18

Claims (6)

(57) [Claims] 1. A flat coil for manufacturing an IC card in which a terminal of a flat coil formed by winding a conductive wire on a substantially same plane a plurality of times and an electrode terminal of a semiconductor element are electrically connected to each other. After forming an IC card frame in which the plane coil is partially connected to an outer frame formed with a predetermined distance from the outer side of the outer frame by etching or pressing, the outer frame and the outer side of the plane coil And a connecting portion for partially connecting and a planar coil on which the semiconductor element is mounted are sandwiched between two protective films, and formed on at least one of opposing facing surfaces of the two protective films. 1 The two protective films are joined by an adhesive layer, and then the outer and outer flakes of the plane coil are separated to separate the plane coil from the IC card frame. After cutting the connecting portion for connecting the dome with the two protective films, one of the two protective films is peeled off, and is bonded to the first adhesive layer of the other protective film, The flat coil on which the semiconductor element is mounted is transferred to a second adhesive layer formed on a film forming one side of the IC card and having a higher adhesive strength than the first adhesive layer, and then the IC card 2. A method of manufacturing an IC card, characterized in that a flat coil on which the semiconductor element is mounted is resin-sealed between a film forming one surface side and a film forming the other surface side. 2. As the IC card frame, an IC card frame in which the plane coil is partially connected to an inner frame and an outer frame which are formed at a predetermined distance from the inside and the outside of the plane coil is used. When sandwiching the flat coil on which the semiconductor element is mounted between two protective films, a connecting portion that partially connects the inner frame and the inner side of the flat coil is cut off, and the IC card frame is removed. The method of manufacturing an IC card according to claim 1, wherein the inner frame is separated. 3. The method of manufacturing an IC card according to claim 1, wherein a bent portion projecting inward and / or outward of the plane coil is formed on the conductor wire of each circumference forming the plane coil. Wherein the connecting piece for connecting the respective circumferential conductor adjacent mediolateral plane coil together provided, IC card of any one of claims 1 to 3, the connecting piece is cut with protection film Manufacturing method. 5. A film forming one side of the IC card so as to sandwich a planar coil having a semiconductor element mounted thereon, which is transferred to a second adhesive layer of a film forming the one side of the IC card, and the like. After inserting into the mold with the film forming the surface side facing each other, a sealing resin is injected between both films inserted into the mold, and the planar coil on which the semiconductor element is mounted is made into resin. The method for manufacturing an IC card according to claim 1, wherein the IC card is sealed. 6. A film forming one surface side of the IC card so as to sandwich a planar coil having a semiconductor element mounted thereon, which is transferred to a second adhesive layer of a film forming the one surface side of the IC card, and the like. The film that forms the surface side,
The method for manufacturing an IC card according to claim 1, wherein the planar coil on which the semiconductor element is mounted is resin-sealed by bonding with an adhesive material.