JP2000222543A - Antenna frame for ic card, and ic card - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an IC card of high reliability by preventing a semiconductor element from being damaged at the time of press-fixing a plane coil and the semiconductor element by sandwiching with resin films. SOLUTION: This antenna frame is so constituted that the plane coil where a conductor 10 may be wound in plural turns on the same plane and plural conductors 10 pass a plane area on which a semiconductor element 14 is mounted may be suspended on an outer frame which is formed with a prescribed gap apart from the outside peripheral conductor of the plane coil. In this case, plural conductors 10 passing the plane area on which the semiconductor element 14 is mounted are bent in this plane area, and bend parts are arranged at approximately uniform intervals.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to an IC card antenna frame and an IC card.

[0002]

2. Description of the Related Art As shown in FIG. 7, an IC card has a semiconductor element 14 mounted on a planar coil 12 formed by winding a conducting wire 10 into a rectangular shape a plurality of times within the same plane area, and two resin films. 16, the planar coil 12 and the semiconductor element 14
Is formed by being pressed from the thickness direction. An adhesive layer made of polyurethane resin or the like is provided on the pressure-bonding surface side of the resin film 16, and this adhesive layer also has a function of sealing the planar coil 12 and the semiconductor element 14. On the outer surface of the resin film 16, characters such as advertisements,
The figure is displayed.

The electrical connection between the planar coil 12 and the semiconductor element 14 is performed by connecting the electrode terminal 18 of the semiconductor element 14 and the conductor 10 of the planar coil 12 so as to cross the planar coil 12.
Are connected by wires 22 to terminals 20 formed at the ends. FIG. 8 shows a semiconductor device 14.
FIG. 4 is an enlarged cross-sectional view showing a connection portion between the electrode terminal 18 and a terminal. At the portion where the semiconductor element 14 is to be disposed, the conductor 10 is crushed to form a recess, and the semiconductor element 14 is housed in the recess. Also, the terminal 20 of the conductor 10 is crushed so that the wire 22 connecting the terminal 20 and the electrode terminal 18 does not protrude from the surface of the conductor 10.

[0004] In this manner, the semiconductor wire 14 of the planar coil 12 is crushed so that the semiconductor element 14 is accommodated in the recess and wire-bonded within the thickness of the wire 10. This is because it needs to be formed. After the semiconductor element 14 is mounted on the plane coil 12, the plane coil 12 and the semiconductor element 14 are sandwiched between the resin films 16a and 16b as shown in FIG. 17 is an adhesive.

[0005]

As described above, when manufacturing an IC card, a concave portion for accommodating the semiconductor element 14 is provided in the conductive wire 10 to reduce the thickness, and when the resin film 16 is crimped. In addition, excessive pressure is not applied to the semiconductor element 14. However, as shown in FIG. 9, when the conductor 10 is arranged so as to cross the center of the plane area of the semiconductor element 14, the resin film 16 is applied to the semiconductor element 14 via the individual conductor 10 when the resin film 16 is pressed. When the pressure is applied intensively, and in the outer region where the conductive wire 10 is arranged in the plane region of the semiconductor element 14, a crack 14 a is generated in the semiconductor element 14 by a reaction force that pushes and bends the semiconductor element 14. Problems may occur.

The semiconductor element 14 shown in FIG.
Are located near the diagonally located edges of the electrode terminal forming surface, and face the electrode terminals 18 to the ends of the outermost outer conductor 10a and the innermost inner conductor 10b of the planar coil 12 for electrical connection. A terminal 20 is provided. If the conductive wire 10 is allowed to pass through the plane area of the semiconductor element 14 in such an arrangement, the conductive wire 10 is allowed to pass through the center of the plane area of the semiconductor element 14 avoiding the side edge side where the electrode terminals 18 are arranged. Become.
There are various types of arrangement of the electrode terminals 18 of the semiconductor element 14. When the conductor 10 of the planar coil 12 is arranged so as to cross the plane area of the semiconductor element 14, the conductor is used when the resin film 16 is crimped. A problem may occur that the pressing force acts on the semiconductor device 14 via the semiconductor device 10 and damages the semiconductor device 14.

[0007] The present invention has been made to solve the problems in manufacturing such an IC card.
An object of the present invention is to provide an IC card antenna frame and an IC card that can be manufactured without damaging a semiconductor element and that can be provided as a highly reliable IC card product.

[0008]

To achieve the above object, the present invention comprises the following arrangement. That is, the conductor is wound a plurality of times in the same plane, and the plane coil formed so that the plurality of conductors pass through the plane area on which the semiconductor element is mounted is spaced apart from the outer conductor of the plane coil by a predetermined distance. In the IC card antenna frame suspended from the outer frame formed by opening, a plurality of conductive wires passing through a plane area on which the semiconductor element is mounted are bent and arranged in the plane area, and a bent portion is formed. Are arranged at substantially equal intervals. Also, the bent part of the conductor is
It is preferable that a plurality of bent portions are formed in one conductive wire in that the bent portions can be evenly arranged in a two-dimensional direction within the plane region of the semiconductor element. In addition, the bent portion of the conductive wire is characterized by having a portion extending substantially diagonally in a plane region of the semiconductor element.

In addition, a plurality of conductive wires are arranged so as to pass through a plane region where a semiconductor device of a planar coil formed by winding a plurality of turns in the same plane is mounted, and the semiconductor element is mounted. In the IC card, a plurality of conductors passing through a plane area on which the semiconductor element is mounted are bent and arranged in the plane area, and the bent portions are arranged at substantially equal intervals. I do. In addition, the formation of the protective resin layer on the surface of the semiconductor element on the side through which the conducting wire passes is preferable in that external force acting on the semiconductor element is effectively dispersed and damage to the semiconductor element is prevented. is there.

[0010]

Preferred embodiments of the present invention will be described below in detail with reference to the accompanying drawings. FIG. 1 is a plan view showing the configuration of an embodiment of an IC card antenna frame according to the present invention. In this antenna frame for an IC card, two planar coils 12 formed by winding a conducting wire 10 in a rectangular shape in a substantially same plane are juxtaposed.
The planar coil 12 is supported on an outer frame 30 formed at a predetermined distance 15a from the outer conductor 10a of the second coil. The plane coil 12 and the outer frame 30 are connected to the conductor 10
Are connected by a support portion 32 having a narrow width. A plurality of support portions 32 are provided at predetermined intervals in the circumferential direction of the outer conductor 10a.

Reference numeral 34 denotes an inner frame formed in the inner space of the planar coil 12 with a predetermined distance 15b from the inner conductor 10b of the planar coil 12. The plane coil 12 is supported by the inner frame 34 via support pieces 36 provided at a plurality of locations in the circumferential direction.
Connect and support. The inner frame 34 is provided so that the planar coil 12 is not deformed when the IC card antenna frame is carried or the like. When manufacturing an IC card, the inner frame 3 is connected to the IC card antenna frame.
4 are separated and removed, and the semiconductor element 14
After mounting, the planar coil 12 and the semiconductor element 14 are sandwiched and pressed by two resin films 16 and finally the planar coil 12 is separated from the outer frame 30 to obtain an IC card.

The semiconductor element 14 is arranged at a predetermined position on the planar coil 12 and is connected to a terminal 20 provided on the conductor 10 by a wire 22. Of course, the electrical connection method may be a method other than wire bonding. I of the present invention
A characteristic feature of the C-card antenna frame is a planar arrangement of the conductor 10 at a position where the semiconductor element 14 is mounted. In other words, in the present invention, when the IC card is manufactured, the planar coil 12 and the semiconductor element 14 are pressed together integrally, especially when the IC card is manufactured, by devising the planar arrangement of the conductive wire 10 at the mounting position of the semiconductor element 14. In this case, the semiconductor element 14 is prevented from being damaged.

Hereinafter, the planar arrangement of the conductor 10 at the position where the semiconductor element 14 which is a feature of the present invention is mounted will be described. FIG. 2 is an enlarged view showing the arrangement of the conducting wires 10 passing over the planar area of the semiconductor element 14 in the antenna frame for an IC card of the above embodiment. The conductor 10 of the present embodiment is arranged such that the conductor 10 is bent and arranged on the plane region of the semiconductor element 14 so that the conductor 10 is arranged substantially evenly on the plane area of the semiconductor element 14. It is. The start and end of the planar coil 12 are the semiconductor element 1
4, and a connection terminal 20 is provided at an end of the conductive wire 10. The terminal 20 is located near the electrode terminal 18, and the terminal 20 and the electrode terminal 18 are electrically connected by a wire 22.

The conductive wire 10 is disposed so as to cross between opposing sides of the rectangular planar region of the semiconductor element 14, and is bent and connected in the middle of the planar region. 40a and 40b are bending points of the conductor 10, and 10c is a bending portion. In the embodiment, the bent portions 10c are arranged in parallel with each other, and the bent portions 10c are gradually displaced at predetermined intervals from one side to the other side in a diagonal direction where the electrode terminals 18 are arranged. By arranging the bent portion 10c so as to be deviated in the diagonal direction, the bent portion 10c can be evenly arranged on the plane region of the semiconductor element 14.

As described above, according to the method of bending and arranging the conductor 10 in the plane area of the semiconductor element 14, the conductor 10 passing on the plane area of the semiconductor element 14 is
8 can be designed to be avoided, and the conducting wires 10 can be arranged substantially uniformly in the plane region of the semiconductor element 14. In this state, the planar coil 12 and the semiconductor element 1
4 and the resin film 16 and pressure-bonded, it is possible to avoid the pressure from being partially concentrated on the semiconductor element 14, and to equalize the pressure at the time of pressure bonding and prevent the semiconductor element 14 from being damaged. be able to.

As shown in FIG. 2, the arrangement in which the conductive wire 10 is bent is such that the conductive wire 10 is uniformly arranged in both the X direction and the Y direction (two-dimensional direction) within the plane area of the semiconductor element 14. Therefore, when the resin film 16 is pressed and pressed by a roller, the roller moves in the X direction or the Y direction.
There is an advantage that the same action can be obtained in any of the directions. That is, the conductor 10 of the present embodiment
With the arrangement method described above, when the roller is moved, the roller and the conductive wire 10 always cross at some point, and it is possible to prevent the pressing force from acting intensively on a part of the semiconductor element 14. .

In the embodiment shown in FIG.
Can be variously changed. In FIG. 2, the conductive wire 10 is bent linearly, but the conductive wire 10 may be formed into a shape that is bent into a smooth curve. FIG.
Although the outermost conductor 10 is arranged so as to intersect with the edge of the semiconductor element 14 so as to partially pass outside the semiconductor element 14, the outermost conductor 10 among the conductors 10 is also The light may pass through the plane area of the semiconductor element 14 without fail. The number of turns of the planar coil 12 is not particularly limited.
The number of the conductors 10 passing over the flat area can be appropriately selected. In addition, the arrangement interval of the conductors 10 can be appropriately designed according to the number of the conductors 10.

In FIG. 2, reference numeral 50 denotes a protective resin that covers the surface of the semiconductor element 14 through which the conducting wire 10 passes in the plane area. When an IC card is produced using the antenna frame for an IC card of the present embodiment, after mounting the semiconductor element 14, the resin 50 is potted in advance on the surface on which the conductor 10 passes at the portion where the semiconductor element 14 is mounted. If cured, the pressing force is dispersed when the planar coil 12 and the semiconductor element 14 are pressed by the resin film 16, so that the pressing force can be prevented from being concentrated on the semiconductor element 14, and the semiconductor element 14 can be hardened. Damage can be more reliably prevented. In the case where a protective resin layer is provided, a resin molding method using a mold can be used instead of potting. When the thickness of the IC card may be slightly increased, both surfaces of the semiconductor element 14 may be covered with resin so that the semiconductor element 14 and the conductor 10 are completely sealed in the resin 50. Good.

FIGS. 3 and 4 show another example in which the conductor 10 is bent and arranged in the plane area of the semiconductor element 14. FIG. FIG. 3 shows a connection terminal 20 provided on the planar coil 12 connected to the semiconductor element 14.
And the electrode terminals 18 of the semiconductor element 14
In this case, the terminal 20 of the conductive wire 10 is arranged to face.
The conducting wire 10 is passed in parallel from one side of the plane area of the semiconductor element 14 to the other side, and the conducting wire 10 is bent halfway so that the conducting wire 10 is evenly arranged in the plane area of the semiconductor element 14. The method of bending the conductive wire 10 is the same as in the above example.

FIG. 4 shows an example in which the conducting wire 10 is arranged so as to provide a plurality of bent portions 10c in the plane area of the semiconductor element 14. In the above example, the bent portion 10c provided on one conductor 10
Although there is only one portion (the portion where the conductor is inclined), in the present embodiment, a plurality of bent portions 10
c is provided to form a zigzag arrangement. As described above, when the conductive wire 10 is arranged, a plurality of bent portions 10c can be provided in the plane region of the semiconductor element 14, and the bent portion 1 can be provided.
0c are evenly arranged so that the semiconductor element 14
Are more evenly arranged in both the X direction and the Y direction in the plane area of FIG.

FIG. 5 shows still another example of the arrangement of the conductive wires 10, the surface (rear surface side) of the semiconductor element 14 opposite to the electrode terminal forming surface.
Through the conducting wire 10. When the conducting wire 10 is passed through the back surface side of the semiconductor element 14,
Is arranged so as to be bent in the plane area of the semiconductor element 10, so that the conductor 1 can be evenly distributed in the plane area of the semiconductor element 10.
0 can be placed. Even when the conducting wire 10 is passed through the back surface side of the semiconductor element 10, the conducting wire 10 is bent and evenly arranged in the plane area of the semiconductor element 14, so that the resin film 16 sandwiches the plane coil 12 and the semiconductor element 14 and press-bonds. In this case, it is possible to prevent the semiconductor element 14 from being damaged. Also in this case, the semiconductor element 14 can be effectively protected by covering the outer surface of the semiconductor element 14 and the surface on which the conductive wires 10 are disposed with the resin 50.

FIG. 6 shows still another arrangement example of the conductor 10. This arrangement example is a case where the electrode terminals 18 are arranged on the same side of the semiconductor element 14. Also in this case, similarly to the above-described example, the conductive wire 10 is arranged to be bent halfway, so that the bent portions are arranged substantially uniformly in the plane region of the semiconductor element 14. Of course, it is not necessary to bend all the conductors 10, and the arrangement of the conductors 10 may be designed according to the interval between the conductors 10 and the like. Note that the intervals between the conductors 10 do not always have to be constant inside and outside the plane region of the semiconductor element 10, and the intervals between the conductors 10 and the like can be appropriately designed.

In manufacturing the above-mentioned antenna frame for an IC card, a thin metal plate can be formed into a predetermined shape by a pressing method or an etching method. Forming the conductive wire 10 in a bent shape does not cause any particular problem in processing whether it is performed by the press working method or the etching method. Further, the antenna frame for an IC card shown in FIG. 1 has two planar coils 12 connected to the outer frame 30, but an antenna frame for an IC card in which a larger number of planar coils 12 are connected is provided. Is also possible.

In an IC card manufactured using this IC card antenna frame, even when external stress acts on the semiconductor element 14 when handling the IC card, stress concentrates on a part of the semiconductor element 14. Therefore, it is possible to reliably prevent the semiconductor element 14 from being easily damaged, and to provide a highly safe and reliable product.

[0025]

The antenna frame for an IC card according to the present invention prevents a semiconductor element from being damaged by being pressed when a flat coil and a semiconductor element are sandwiched between resin films to produce an IC card. And highly reliable IC
Can be provided as a card. Further, the IC card according to the present invention prevents the semiconductor element from being damaged even when external pressure acts on the semiconductor element, and can be provided as a safe and highly reliable product.

[Brief description of the drawings]

FIG. 1 is a plan view of an IC card antenna frame according to the present invention.

FIGS. 2A and 2B are a plan view and a side sectional view showing an arrangement of conductive wires in a plane region of a semiconductor element. FIGS.

FIG. 3 is a plan view showing an arrangement of conductive wires in a plane region of the semiconductor element.

FIG. 4 is a plan view showing an arrangement of conductive wires in a plane region of the semiconductor element.

FIGS. 5A and 5B are a plan view and a side sectional view showing an arrangement of conductive wires in a plane region of the semiconductor element.

FIG. 6 is a plan view showing an arrangement of conductive wires in a plane region of the semiconductor element.

FIG. 7 is a plan view showing a conventional configuration of an IC card.

FIG. 8 is an enlarged sectional view showing a configuration near a semiconductor element mounting portion of the IC card.

9A and 9B are a plan view and a side view showing a conventional arrangement of conductive wires in a plane region of a semiconductor element.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 10 Conductor 10a Outer conductor 10b Inner conductor 10c Bending part 12 Plane coil 14 Semiconductor element 16 Resin film 18 Electrode terminal 20 Terminal 22 Wire 30 Outer frame 32 Bearing 34 Inner frame 40a, 40b Bending point 50 Resin

 ──────────────────────────────────────────────────続 き Continued on the front page F term (reference) 2C005 MA10 NB34 RA07 RA12 RA23 5B035 AA00 AA08 BA03 BA05 BB09 CA01 CA03 CA23 5J046 AA05 AA14 AB11 PA07

Claims (5)

[Claims] 1. A planar coil formed such that a conductor is wound a plurality of times in the same plane and a plurality of conductors pass through a plane area on which a semiconductor element is mounted. In an IC card antenna frame suspended from an outer frame formed at a predetermined interval, a plurality of conductive wires passing through a plane area on which the semiconductor element is mounted are bent and arranged in the plane area, and An antenna frame for an IC card, wherein bent portions are arranged at substantially equal intervals. 2. The antenna frame for an IC card according to claim 1, wherein a plurality of bent portions of the conductor are formed in one conductor. 3. The antenna frame for an IC card according to claim 1, wherein the bent portion of the conductive wire has a portion extending substantially diagonally in a plane area of the semiconductor element. 4. A semiconductor device in which a plurality of conductive wires are arranged so as to pass through a plane region in which a semiconductor device of a planar coil formed by winding a plurality of conductive wires in the same plane is mounted. In the IC card, a plurality of conducting wires passing through a plane area on which the semiconductor element is mounted are bent and arranged in the plane area, and the bent portions are arranged at substantially equal intervals. IC card to do. 5. The IC card according to claim 4, wherein a protective resin layer is formed on a surface of the semiconductor element on a side where the conducting wire passes.