JP2000339433A - Lead frame for ic card, semiconductor device for ic card and its manufacture - Google Patents

Abstract

PROBLEM TO BE SOLVED: To reduce the possibility of generating defective contact because the surface of a contact terminal is oxidized or the plating of the surface is deteriorated by sticking a film for preventing the leakage of resin for sealing onto the contact terminal for transmitting information. SOLUTION: For example, a lead frame material 4 for an IC card consisting of a Cu bar is prepared, this material 4 is formed in a prescribed shape by punching or etching to manufacture a lead frame 5 for the IC card and the surface of this frame 5 is plated with Au or the like 6. Next, a prescribed lead frame 16 for the IC card is manufactured by continuously sticking belt-like resin films such as polyethylene terephthalate, polypropylene as a film 14 for preventing leakage of resin for sealing at the time of sealing resin onto a contact terminal 3 for transmitting information on a surface on a side opposite to a surface on a side to which the semiconductor chip of the frame 5 is mounted. It is desirable that this resin film material is well suited to the resin for sealing 12 to be stuck and to be easily separated.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to a lead frame for an IC card, a semiconductor device for an IC card, an IC card, and a method for manufacturing a semiconductor device for an IC card.

[0002]

2. Description of the Related Art In place of conventional magnetic cards such as telephone cards, cash cards, commuter passes, etc., IC cards have been introduced and rapidly spread due to the demand for an increased amount of information to be handled and for prevention of forgery. It is getting.

[0003] When IC cards are classified according to their information transmission form, there are a contact type, a non-contact type and a composite type thereof, and a contact type IC card having an appearance as shown in FIG. 2 is known. The IC card 1 shown in FIG. 2 includes a main body 2 made of a resin molded body having a thickness of about 0.7 mm, a semiconductor chip (not shown) incorporated inside the main body,
It is electrically connected to the semiconductor chip, and is constituted by information transmitting contact terminals 3 and the like, which are shown enlarged in FIG.

Referring to FIG. 3, a method of manufacturing a conventional IC card 1 will be described. For example, an IC card lead frame member 4 made of Cu strips is prepared (a), and the lead frame member 4 is punched or etched to a predetermined shape. To form an IC card lead frame 5 (b), and the surface of the lead frame 5 is plated 6 with Au or the like (c). On the other hand, a resin film 7 is prepared in another step (d), and this film 7 is punched into a predetermined shape (e). Thereafter, the punched film 8 is accurately aligned and attached to a predetermined position on the surface of the manufactured lead frame 5 on which the semiconductor chip is to be mounted (f). At the time of sealing, the sealing resin 12 is prevented from leaking from the gap of the lead frame. Next, the semiconductor chip 9 is mounted (die-bonded) on the semiconductor chip mounting position of the lead frame 5 (g), and the semiconductor chip 9 and the lead portion 10 of the lead frame 5 are electrically connected by a bonding wire 11 such as a gold wire. (Wire bonding) (h)
A connection portion of the semiconductor chip 9 and the bonding wires 11 is sealed with a sealing resin 12 to manufacture a semiconductor device 13 for an IC card (i). This I
In the C-card semiconductor device 13, a part of the surface of the lead frame 5 opposite to the surface on which the semiconductor chip 9 is mounted is a contact terminal 3 for information transmission. The IC card 1 is manufactured by assembling the information transmitting contact terminals 3 in a state of being exposed to the main body 2 shown in FIG.

[0005]

According to the conventional lead frame for an IC card, a die and a press are required because the film is punched and then pasted.

Further, according to the conventional IC card lead frame, since the above-mentioned film is punched and then pasted, a high degree of positional accuracy is required at the time of pasting. Therefore, it is difficult to employ a continuous process that causes a problem due to accumulation of minute displacements due to thermal expansion or the like, and the working efficiency is low.

[0007] Further, heat is applied to the information transmitting contact terminals on the surface opposite to the surface on which the semiconductor chip is mounted, when the resin is sealed in an exposed state, so that the surface is oxidized or plated on the surface. May be deteriorated to cause poor contact.

Further, there is a problem that the semiconductor device for an IC card and the IC card are surely thickened by the film.

Therefore, an object of the present invention is to omit a die or a press for punching a film, improve the workability of attaching the film, and oxidize the surface of the information transmission contact terminal or oxidize the surface of the contact terminal. The plating deteriorates,
IC that can reduce the possibility of poor contact
Card lead frame, IC card semiconductor device, I
An object of the present invention is to provide a method for manufacturing a C card and a semiconductor device for an IC card.

[0010]

According to the present invention, there is provided a lead frame for an IC card formed into a predetermined shape by punching or etching.
Provided is a lead frame for an IC card in which a film for preventing leakage of a sealing resin at the time of resin sealing is attached to a contact terminal for information transmission on a surface opposite to a surface on which a semiconductor chip is mounted. .

Here, it is preferable that the leakage prevention film is made of a resin film.

The lead frame has an A surface on its surface.
It is preferable to apply plating of u or the like.

According to another aspect of the present invention, there is provided a lead frame for an IC card formed by punching or etching into a predetermined shape, wherein the lead frame has a surface opposite to a surface on which a semiconductor chip is mounted. A semiconductor chip is mounted on the lead frame by using an IC card lead frame in which a film for preventing leakage of the sealing resin at the time of resin sealing is attached to the information transmission contact terminal, and the semiconductor chip and its peripheral portion are mounted. IC that is formed by resin sealing
Provided is a semiconductor device for a card.

In order to achieve the above object, the present invention relates to a lead frame for an IC card formed by punching or etching into a predetermined shape, wherein the lead frame has a surface opposite to a surface on which a semiconductor chip is mounted. A semiconductor chip is mounted on the lead frame by using an IC card lead frame in which a film for preventing leakage of the sealing resin at the time of resin sealing is attached to the information transmission contact terminal, and the semiconductor chip and its peripheral portion are mounted. The present invention provides an IC card configured by incorporating an IC card semiconductor device in which is sealed with a resin.

According to another aspect of the present invention, there is provided an IC card lead frame formed by punching or etching into a predetermined shape, the lead frame having a surface opposite to a surface on which a semiconductor chip is mounted. Using an IC card lead frame with a film for preventing leakage of the sealing resin when sealing the resin on the contact terminals for information transmission,
After mounting the semiconductor chip on the lead frame and sealing the semiconductor chip and its peripheral portion with resin, remove the leakage prevention film of the lead frame.
Provided is a method for manufacturing a semiconductor device for a C card.

[0016]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS One embodiment of the present invention will be described with reference to FIG.

FIG. 1 shows a method of manufacturing a semiconductor device for an IC card according to each process.

According to FIG. 1, first, an IC card lead frame material 4 made of, for example, Cu strips is prepared (a), and the lead frame material 4 is formed into a predetermined shape by punching or etching to form an IC card lead. A frame 5 is manufactured (b), and the surface of the lead frame 5 is Au
Plating 6 is applied (c). Next, as a film 14 for preventing leakage of the sealing resin 12 at the time of resin sealing, on the information transmitting contact terminals 3 on the surface of the lead frame 5 opposite to the surface on which the semiconductor chip is mounted, for example, A belt-like resin film such as polyethylene terephthalate (PET) or polypropylene is continuously adhered (d) to manufacture a predetermined IC card lead frame 16. As the resin film material, a resin film material having good compatibility with the sealing resin 12 and sticking and easily peeling is preferable. Thereafter, the semiconductor chip 9 is mounted (die-bonded) on the semiconductor chip mounting position of the IC card lead frame 16 to which the film 14 manufactured as described above is attached (e), and the semiconductor chip 9 and the lead frame 16 are mounted.
Of the lead portion 10 of the bonding wire 11 such as a gold wire
(F), and is sealed with a sealing resin 12 such as an epoxy resin to protect a connection portion of the semiconductor chip 9 and the bonding wire 11 (g). By removing the film 14, the semiconductor device 15 for IC card thinned is manufactured (h).
In the present embodiment using the long lead frame 5,
Since a large number of the IC card semiconductor devices 15 are manufactured at intervals in the longitudinal direction of the lead frame 5, each semiconductor device 15 is manufactured separately from the lead frame 5. This IC card semiconductor device 1
5 is an IC card, and FIG. 2 shows the appearance of the IC card. A in FIG. 2 is an enlarged view of the information transmitting contact terminal 3 exposed on the surface of the IC card 1.

[0019]

According to the present invention, since the film can be attached without punching, a die and a press for punching the film can be omitted, and a high positional accuracy is not required for attaching the film. The workability of attaching the film is improved, and the attachment of the film prevents the surface of the information transmission contact terminal from being oxidized or the plating on the surface from being deteriorated due to heat generated during resin sealing, thereby preventing poor contact. There is a remarkable effect that the possibility of occurrence can be reduced.

[Brief description of the drawings]

FIG. 1 is a manufacturing process diagram of an IC card semiconductor device according to an embodiment of the present invention.

FIG. 2 is an external view of an IC card according to one embodiment of the present invention.

FIG. 3 is a manufacturing process diagram of a conventional semiconductor device for an IC card.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 IC card 3 Contact terminal for information transmission 5,16 Lead frame for IC card 6 Plating 9 Semiconductor chip 11 Bonding wire 12 Sealing resin 14 Leakage prevention film 15 Semiconductor device for IC card

Claims (6)

[Claims] An IC card lead frame formed into a predetermined shape by punching or etching,
An IC card characterized in that a film for preventing leakage of a sealing resin at the time of resin sealing is attached to a contact terminal for information transmission on a surface opposite to a surface on which a semiconductor chip is mounted. Lead frame. 2. The lead frame for an IC card according to claim 1, wherein said film for preventing leakage comprises a resin film. 3. The lead frame for an IC card according to claim 1, wherein said lead frame has a surface plated with Au or the like.
Lead frame for C card. 4. A lead frame for an IC card formed into a predetermined shape by punching or etching,
A lead frame for an IC card in which a film for preventing leakage of a sealing resin at the time of resin sealing is attached to a contact terminal for information transmission on a surface opposite to a surface on which a semiconductor chip is mounted; A semiconductor device for an IC card, wherein a semiconductor chip is mounted on a frame and the semiconductor chip and its peripheral portion are sealed with a resin. 5. A lead frame for an IC card formed into a predetermined shape by punching or etching,
A lead frame for an IC card in which a film for preventing leakage of a sealing resin at the time of resin sealing is attached to a contact terminal for information transmission on a surface opposite to a surface on which a semiconductor chip is mounted; An IC card comprising: a semiconductor chip mounted on a frame; and a semiconductor device for an IC card in which the semiconductor chip and a peripheral portion thereof are sealed with a resin. 6. A lead frame for an IC card formed into a predetermined shape by punching or etching,
Using a lead frame for an IC card in which a film for preventing leakage of a sealing resin at the time of resin sealing is attached to a contact terminal for information transmission on a surface opposite to a surface on which a semiconductor chip is mounted; A method of manufacturing a semiconductor device for an IC card, comprising: mounting a semiconductor chip on a lead frame; sealing the semiconductor chip and its peripheral portion with a resin; and removing the leakage prevention film of the lead frame.