JP2006218598A - Ic card producing method and ic card - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an IC card producing method and an IC card excellent in card cutting performance, card producing performance, and printer conveyance performance, and capable of reducing a dust mixing rate. <P>SOLUTION: An adhesive layer intervenes between first and second sheet materials, an inlet having an IC chip is sealed in the adhesive layer, format printing is performed for at least one surface of a card base material when the card base material is punched in order to produce an IC card, and at least one of cutting blades starts cutting of the card base material before the other cutting blades when the card base material is cut into a plurality of card forms with the usage of a plurality of the cutting blades. Further, a punching speed of at least one of the cutting blades simultaneously operating is different from the other cutting blades. Furthermore, a member restraining the card base material is divided in accordance with format printing. The cutting blade is in a punch shape, and a corner part of the cutting blade is protruded in the punching direction from the punch surface. The corner part of the cutting blade is curved, and a blade angle of the cutting blade of the curved corner part is equal to or more than 30 degrees and equal to or less than 90 degrees. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to an IC card manufacturing method and an IC card suitable for application to an IC card that stores personal information and the like that require safety (security) such as forgery and alteration prevention.

Conventional IC cards have an IC chip and an inlet having a circuit board mounted with an antenna inserted between two sheets of material, and are attached using a moisture curable adhesive, UV curable adhesive, two-component mixed adhesive, or the like. It is common to manufacture by punching into a card mold after combining and curing, or by hot pressing using a thermocompression-bondable base material and then punching into a card mold (Patent Documents 1 to 4).
Japanese Patent Laid-Open No. 2001-205597 (page 1 to page 8, FIGS. 1 to 6) JP-A-5-214545 (first page to third page, FIG. 1) JP-A-8-207555 (pages 1 to 8, FIGS. 1 to 9) Japanese Patent Laid-Open No. 9-360810

  The produced IC card is generally used after character information and image information are given to the card face and a protective layer is provided. However, since the manufactured IC card has a film thickness distribution and waviness in the sheet material, strictly speaking, the thickness state is individually different from each other. When the thickness of the IC card is different, there are problems that the cutting property is likely to be partially changed by punching, the adhesive protrudes, and burrs are generated at the corners of the IC card.

  Since IC cards are expensive, mechanical adjustment before punching is performed after adjustment with an IC card dedicated for adjustment, but since actual IC cards are not actually punched, during actual punching, IC card loss was inevitable.

  Furthermore, in order to increase productivity, when punching multiple IC cards simultaneously from a large sheet, there is a problem that there are more burrs at the center due to the unevenness of the surface and the mutual tensile stress generated between the cards at the time of punching. It has occurred.

  In order to compensate for the loss, IC cards with burrs and adhesives protruding when punching are being removed by human hands, but there is a serious problem that the production cost increases due to labor costs. A solution was strongly desired. Therefore, there has been a demand for a method of always producing an IC card with a certain cutting property regardless of the shape of the produced sheet.

  The present invention has been made in view of the above points, and an object of the present invention is to provide an IC card manufacturing method and an IC card that are excellent in card cutting performance, card productivity, and printer transportability and have a reduced dust mixing rate.

  In order to solve the above problems and achieve the object, the present invention is configured as follows.

In the first aspect of the present invention, an adhesive layer is interposed between the first sheet material and the second sheet material, and an inlet having an IC chip on an inlet base material is enclosed in the adhesive layer. In an IC card manufacturing method of manufacturing an IC card by punching the card base into a card shape,
Format printing is performed on at least one surface of the card substrate,
When the format-printed card substrate is punched into a plurality of card forms using a plurality of cutting blades, at least one of the operating cutting blades starts cutting the card substrate before the other cutting blades This is an IC card manufacturing method.

According to the second aspect of the present invention, an adhesive layer is interposed between the first sheet material and the second sheet material, and an inlet having an IC chip on an inlet base material is enclosed in the adhesive layer. In an IC card manufacturing method of manufacturing an IC card by punching the card base into a card shape,
Format printing is performed on at least one surface of the card substrate,
When the card substrate printed in the format is simultaneously punched into a plurality of card forms by using a plurality of cutting blades, at least one punching speed of the cutting blades operating simultaneously is different from other cutting blades. This is an IC card manufacturing method.

According to a third aspect of the present invention, an adhesive layer is interposed between the first sheet material and the second sheet material, and an inlet having an IC chip on an inlet base material is enclosed in the adhesive layer. In an IC card manufacturing method of manufacturing an IC card by punching the card base into a card shape,
Format printing is performed on at least one surface of the card substrate,
When the format-printed card base material is simultaneously punched into a plurality of card forms using a plurality of cutting blades, a member for holding the card base material is divided in accordance with the format printing. This is an IC card manufacturing method.

According to a fourth aspect of the present invention, an adhesive layer is interposed between the first sheet material and the second sheet material, and an inlet having an IC chip on an inlet base material is enclosed in the adhesive layer. In an IC card manufacturing method of manufacturing an IC card by punching the card base into a card shape,
Format printing is performed on at least one side of the card base,
When the format-printed card base is punched into a card form using at least one cutting blade, the cutting blade punched into the card form has a punch shape, and the corner of the cutting blade has a punch surface The IC card manufacturing method is characterized in that it protrudes in the punching direction.

According to a fifth aspect of the present invention, an adhesive layer is interposed between the first sheet material and the second sheet material, and an inlet having an IC chip on an inlet base material is enclosed in the adhesive layer. In an IC card manufacturing method of manufacturing an IC card by punching the card base into a card shape,
Format printing is performed on at least one surface of the card substrate,
When the format-printed card base is punched into a card form using at least one cutting blade, the corner part of the cutting blade punched into the card form is curved, and the cutting blade has a curved corner. The IC card manufacturing method is characterized in that the blade angle is 30 ° or more and smaller than 90 °.

  According to a sixth aspect of the present invention, in the IC card manufacturing method according to any one of the first to fifth aspects, the thickness of the bonded card base material is 650 μm or more and 900 μm or less. is there.

The thickness of the sheet | seat material which comprises the said card | curd base material is 100 micrometers or more and 300 micrometers or less, the value of an elasticity modulus is 100 or more and 800 kgf / mm < ² > or less, and the value of breaking elongation is 10%. The IC card manufacturing method according to any one of claims 1 to 5, wherein the IC card is 50% or less.

The invention according to claim 8 is characterized in that the value of the elastic modulus of the adhesive constituting the card substrate is 30 or more and 100 kgf / mm ² or less and the value of the elongation at break is 50% or more and 500% or less. The IC card manufacturing method according to any one of claims 1 to 5.

  The invention according to claim 9 is the IC card according to any one of claims 1 to 8, wherein the bonded product is cut into a single sheet before punching into the card. This is a manufacturing method.

  The invention according to claim 10 is the IC card manufacturing method according to any one of claims 1 to 9, wherein format printing is performed on a non-printed surface before punching into the card shape. is there.

The invention according to claim 11 has an image receiving layer on at least one side of the IC card produced by the IC card production method according to any one of claims 1 to 10,
The image receiving layer is provided with personal identification information including a name and a face image by a thermal transfer method or an inkjet method,
The IC card is characterized in that a writing layer capable of writing is provided on at least a part of the IC card.

In the invention according to claim 12, a transparent protective layer is provided on an upper surface provided with personal identification information including the name and face image,
The IC card according to claim 11, wherein the transparent protective layer is made of an actinic ray curable resin.

  The invention according to claim 13 is the IC card according to claim 11 or 12, wherein the IC chip of the IC card is arranged at a position other than the position overlapping the face image portion.

  The invention described in claim 14 is the IC card according to any one of claims 11 to 13, wherein the IC card is a non-contact type.

  With the above configuration, the present invention has the following effects.

  According to the first aspect of the present invention, when the card substrate that has been formatted and printed is punched into a plurality of card forms using a plurality of cutting blades, at least one of the cutting blades that operates is ahead of the other cutting blades. Start cutting the card base. When punching multiple format printed card bases with multiple cutting blades, simultaneously punching simultaneously applies multiple compressive and tensile stresses to the card base from multiple directions. Prevents the card base from being punched at the same time, preventing the card base from being “cut off” on the cut surface and causing “burrs” to occur. Excellent card productivity and printer transportability. The rate drops.

  According to the second aspect of the present invention, when the card substrate on which format printing has been performed is punched into a plurality of card forms at the same time using a plurality of cutting blades, at least one punching speed of the cutting blade operating simultaneously is different. Different from the cutting blade. When punching multiple format printed card bases with multiple cutting blades, simultaneously punching simultaneously applies multiple compressive and tensile stresses to the card base from multiple directions. Prevents the card base from being punched at the same time, preventing the card base from being “cut off” on the cut surface and causing “burrs” to occur. Excellent card productivity and printer transportability. The rate drops.

According to invention of Claim 3,
When the format-printed card substrate is punched into a plurality of card forms at the same time using a plurality of cutting blades, a member for holding the card substrate is divided in accordance with the format printing. Using a card substrate that has been pre-formatted and printed, the card substrate is pressed by a member that is individually divided based on them, and punching is performed, so that the punching position and pressing position can be made accurate.

  According to the invention of claim 4, when the card substrate that has been formatted and printed is punched into a card form using at least one cutting blade, the cutting blade that punches into the card form has a punch shape, and Since the corner of the cutting blade protrudes in the punching direction from the punch surface, the corner of the card has a round shape, so there is a tendency for burrs to occur easily in this part. The generation of burrs can be eliminated, the card productivity and printer transportability are excellent, and the dust contamination rate is reduced.

  According to the invention of claim 5, when the format-printed card base is punched into the card form using at least one cutting blade, the corner portion of the cutting blade punched into the card form is curved, In addition, when the cutting angle of the cutting edge of the curved corner is 30 ° or more and smaller than 90 °, it is preferable to sharpen the corner, and when the angle becomes smaller than this, the substrate is started when cutting the substrate. In this case, the cutting ability is deteriorated because a crack is generated in another direction.

  According to the invention described in claim 6, the thickness of the bonded card base material is 650 μm or more and 900 μm or less, and by defining the thickness of the card base material, the cutting property when carded is good, and Good handling in the market.

According to the invention described in claim 7, the thickness of the sheet material constituting the card substrate is 100 μm or more and 300 μm or less, the elastic modulus value is 100 or more and 800 kgf / mm ² or less, and the elongation at break is 10 By specifying the thickness and elastic modulus values of the sheet material, the cutting property when carded is good and the marketability is good.

According to invention of Claim 8, the value of the elasticity modulus of the adhesive agent which comprises a card base material is 30-100 kgf / mm < ² > or less, and the value of breaking elongation is 50-500%. When the elastic modulus of the adhesive is high, it is easy to cut with a blade such as scissors, but on the other hand, the adhesive becomes hard and the card durability is lowered. On the other hand, when the elastic modulus of the adhesive is low, the adhesive protrudes from the cross section during cutting, and when the card is formed, the cross-sectional shape deteriorates and the appearance deteriorates. If the breaking elongation of the adhesive is small, it is easy to cut when cutting with a scissors-like cutter, and if the breaking elongation is large, the elongation until the adhesive is cut is large. It is. On the other hand, when an adhesive is used as a part of the card substrate, when the card is bent or folded, a larger value of the breaking elongation is more flexible and preferable. By prescribing the elastic modulus and elongation at break of the adhesive, it is easy to cut, has card durability, does not protrude from the adhesive, and has good appearance when made into a card.

  According to the ninth aspect of the present invention, by cutting the bonded product into a single sheet before punching into a card, the handling is easy and the accuracy of punching into a card is improved.

  According to the invention described in claim 10, by performing format printing on the non-printed surface before punching into a card shape, handling is easy and the accuracy of format printing is improved.

  According to the eleventh aspect of the present invention, the IC card produced by the IC card production method according to any one of the first to tenth aspects has an image receiving layer on at least one surface, and the image receiving layer has a thermal transfer system or an inkjet. Personal identification information including name and face image is provided, and a writing layer that can be written on at least a part of the IC card is provided. Licenses, identification card, passport, alien registration card, library use It can be preferably used for cards, cash cards, credit cards, employee cards, employee cards, membership cards, medical cards, student cards, and the like.

  According to the twelfth aspect of the present invention, a transparent protective layer is provided on the upper surface provided with personal identification information including a name and a face image, the transparent protective layer is made of an actinic ray curable resin, and includes an individual including a name and a face image. Identification information is protected and durability is improved.

  According to the invention of claim 13, the IC chip of the IC card is arranged at a position other than the position overlapping the face image portion, and the IC chip does not exist at the position overlapping the face image portion, so that the surface smoothness is good. Thus, the printability is improved.

  According to the fourteenth aspect of the present invention, since the IC card is non-contact type and excellent in safety, it can be used for applications that require high confidentiality of data and prevention of falsification.

  Hereinafter, an IC card manufacturing method and an IC card according to the present invention will be described in detail with reference to the drawings. However, the present invention is not limited to this embodiment. The embodiment of the present invention shows the most preferable mode of the present invention, and the present invention is not limited to this.

  FIG. 1 is a schematic configuration diagram of an IC card manufacturing process. In this IC card manufacturing process, a long sheet-shaped first sheet material (back sheet) 1 is arranged in the first sheet material supply section A, and a sheet-like second sheet material (front sheet) 2 is formed. The second sheet material supply unit B is provided. An adhesive is supplied to the second sheet material 2 from the adhesive supply unit C <b> 1 and applied to the second sheet material 2. The sheet is conveyed to the inlet supply unit E by the second sheet material conveyance unit D. The second sheet material conveying portion D is composed of a conveying roller d1 and a conveying belt d2, and the conveying belt d2 is supported by the platen roller c1 in the adhesive supply portion C1.

  In the inlet supply portion E, an inlet 3 of components including an IC chip and an IC module having an antenna is supplied and placed at a predetermined position of the second sheet material 2, and the second sheet material 2 is moved to the back roller portion F. Send to. An adhesive is supplied to the first sheet material 1 from the adhesive supply unit C <b> 2, and is applied to the back roller unit F.

  The back roller part F has a temperature-adjustable laminating roller f, and the first sheet material 1 and the second sheet material 2 are bonded together using the laminating roller f. The temperature difference between the laminating roller f and the rollers f1, f2 is 0 ° C. or higher and 100 ° C. or lower. In this embodiment, the second sheet material 2 has an image receiving layer, the first sheet material 1 has a writing layer, and the rollers f1 and f2 have a roller temperature on the image receiving layer side of the writing layer side. The temperature is lower than the temperature of the roller.

  A card base material transport unit G is disposed at the rear stage of the back roller unit F, and the card base material transport unit G includes transport belts g1 and g2 facing each other and transport rollers g3 and g4. A sheet substrate on which the first sheet material 1 and the second sheet material 2 are bonded is sandwiched between the conveying belts g1 and g2 facing each other in the card substrate conveying section G. Send to cutting section H.

  In the cutting part H, the sheet base material of the bonded product is cut into a single sheet by a cutting machine h1. Thereafter, the sheet base material in sheet form is sent to the collection unit K.

  In the collection unit K, the flat plate k1 is disposed between the sheet-like sheet base materials and is sent to the storage unit L. As the flat plate k1, for example, a SUS plate is used.

  In the storage unit L, it is stored at a predetermined temperature for a predetermined time and sent to the format printing unit M.

  In the format printing unit M, format printing is performed on one of the first sheet material 1 and the second sheet material 2, and it is sent to the punching unit N.

  In the punching portion N, punching is performed in a card shape by a punching machine n1. The punched IC card is printed by the printing unit O using the back surface format printing or the ink jet printing card printing machine o1 and sent to the loading unit P.

  In the loading section P, the cartridge is loaded in the magazine p1 and sealed with the cover p2.

  In this embodiment, before punching into a card shape, the sheet base material of the bonded product is cut into a sheet-like sheet shape at the cutting portion H, so that handling is easy and punching accuracy is improved. In addition, by performing format printing in the format printing unit M before punching out into a card shape, handling is easy and the accuracy of format printing is improved.

  Further, an adhesive is interposed between the first sheet material 1 and the second sheet material 2, and an inlet 3 having an IC chip on the inlet base material is enclosed in the adhesive layer, thereby providing a card base material. An IC card is created by punching the card base material into a card shape. The card substrate creation process is performed in the clean room 501, the card substrate storage process is performed in the clean room 502, the format printing, the card substrate punching process, and the punched IC card cartridge loading process are performed in the clean room 503. Are created in an environment of class 100,000 or less. In this way, by creating an IC card in an environment of class 100,000 or less, it is possible to prevent dust and other dust from entering during the manufacture of the IC card, and scratches during punching, printing, card transportation, etc. And the occurrence of dirt can be suppressed, and the yield of non-defective cards is improved.

  The creation of this IC card includes the creation of a card base, storage of the card base, punching out of the card base, and loading of the punched IC card into a cartridge. However, at least one of these may be created in an environment of class 100,000 or less, and dust such as dust can be prevented from being mixed during the manufacture of the IC card. In particular, in order to prevent the attached dust from moving and scratching the card surface when handling IC cards such as punching and loading, the process from storage of the card base material to cartridge loading is class. It is preferable that it is 10,000 or less.

  An IC card manufactured using the IC card manufacturing method or IC card manufacturing apparatus of the present invention is shown in FIG. FIG. 2 is a cross-sectional view of an image forming body of an IC card bonded product.

  A card base material, which is an image forming body of an IC card bonded product, includes an electronic component 3 a having a predetermined thickness between a first sheet material 1 and a second sheet material 2. The electronic component 3a includes an antenna 3a1, an IC chip 3a2, and the like, and an IC module of the electronic component 3a is provided in the inlet 3. This is a laminated structure in which the inlet 3 is disposed between the first sheet material 1 and the second sheet material 2 and laminated with the adhesive layers 6 and 7 interposed therebetween. The IC chip 3a2 is covered with a reinforcing plate 3b, and the reinforcing plate 3b has a larger shape than the IC chip 3a2 and protects the IC chip 3a2.

  The first sheet material 1 or the second sheet material 2 has an image receiving layer 8a on at least one surface, in this embodiment, on one surface of the second sheet material 2, and the name and face by the thermal transfer method or the ink jet method. Personal identification information 8b including an image is provided. Further, a transparent protective layer 8c is provided on the upper surface on which personal identification information 8b including a name and a face image is provided by transfer of a transfer foil, and the transparent protective layer 8c is made of an actinic ray curable resin. By providing the transparent protective layer 8c on the upper surface on which the personal identification information 8b is provided, the personal identification information 8b is protected and durability is improved.

  In this embodiment, a writable writing layer 9 a is provided on one side of the first sheet material 1. Further, the IC chip 3a2 is disposed at a position other than the position overlapping the face image portion, and the IC chip 3a2 does not exist at the position overlapping the face image portion, thereby improving the surface smoothness and improving the printability. An IC card can be obtained.

  As described above, the IC card has an IC module, is a non-contact card, and is excellent in safety. Therefore, the IC card can be used for applications that require high confidentiality of data and anti-counterfeiting.

  The IC card manufactured in this way can suppress the occurrence of scratches and dirt on the IC card. In this embodiment, the number of dust mixed or adhering inside or outside of one card is 100. It is as follows, and it is possible to suppress the occurrence of scratches and dirt on the IC card, and the good card yield is improved.

  Also, by providing personal identification information including name and face image by thermal transfer method or ink jet method on at least one image receiving layer of IC card, and providing a writable writing layer at least in part, licenses and identification It can be preferably used for certificate, passport, alien registration card, library card, cash card, credit card, employee card, employee card, membership card, medical card and student card.

  Next, the configuration of the present invention will be described in detail.

[Punching method]
In the present invention, the punching machine shown in FIGS. 3 and 4 is used. In this embodiment, the punching machine is constituted by a punching die device, FIG. 3 is a plan view of the punching blade, and FIG. 4 is a front end view of the main part of the punching die device.

  This punching die apparatus includes a punching die having an upper blade 110 and a lower blade 120. The upper blade 110 includes a punching punch 111 provided with a relief 141 inside an outer edge. Has a punching die 121. An IC card having the same size as the die hole 122 is punched by lowering the punch 111 for punching into a die hole 122 provided at the center of the punching die 121. For this reason, the size of the punch 111 for punching is slightly smaller than the size of the die hole 122. An upper cutting blade having an angle close to a right angle is generally called a punch die.

  In this invention, in consideration of productivity and maintainability, the punching blade uses a die in which the punch side blade to be punched and the die side blade to be received are paired up and down, and the angle of the blade is 90 °. A method of cutting the sheet before and after was used. The angle of the cutting blade of this method (hereinafter referred to as punch die method) is preferably 80 ° or more and 100 ° or less, and more preferably 85 ° or more and 95 ° or less.

  Since the punch die method has a simple blade structure, the punch die method is suitable for production in which a large amount of sheets are punched. Since it is difficult to punch a sheet having a high elongation at break, it is preferable to use an adhesive having a elongation at break of 500% or less.

  As in this invention, when punching a plurality of format printed substrates with a plurality of punches, if punching is simultaneously performed, compressive stress and tensile stress are simultaneously applied to the sheet from multiple directions. In many cases, “cutting residue” of the base material is generated on the surface, and “burrs” are generated. As a countermeasure against this, in the present invention, as a means for dispersing stress, even if a plurality of punches are operated simultaneously so that the plurality of punches do not punch the card substrate at the same time, the height of the punch as in the embodiment of FIG. By making a difference in, avoid simultaneous punching.

  FIG. 5 is an example showing the height of the punching blade, FIG. 5A is a comparative example in which the height of the punching blade is the same, and FIGS. 5B to 5F show the height of the punching blade. It is a different embodiment. If the difference in punch height between the punching blades is too large, a punching position deviation occurs, so that it is preferably 1000 μm or less, and more preferably 500 μm or less. As a means for making a difference in how to cut a plurality of punches, a means for avoiding punching at the same time by using a plurality of punches using a plurality of motors and changing the punching speed of each of the punches is also preferable.

  If the bonded sheet is punched too quickly, the base material is cracked and burrs are often generated. If it is too slow, the card base material is stretched by cutting, so that burrs are generated. A preferable punching speed is 5 mm / s or more and 1000 mm / s or less, and more preferably 50 mm / s or more and 500 mm / s or less.

[Stripper]
When cutting is performed using a pair of upper and lower molds, the occurrence of burrs can be reduced by sufficiently suppressing the base material with a member (hereinafter referred to as a stripper) that suppresses the card base material punched in advance. However, if a plurality of parts are punched at the same time, it is sufficient that the base material to be punched is flat. However, like an IC card, a plurality of base materials are bonded using an adhesive or the like, and electronic components are mixed inside. Then, it is difficult to produce a bonded base material completely flat. If a card base that is not completely flat is punched almost at the same time, using an integrated stripper as in the past, even if it is pressed with a strong force, if there is an uneven part, the recessed part cannot be pressed. Will be cut, and burr will occur. Therefore, when punching a plurality of parts at the same time, it is preferable that each punched part is pressed individually. Furthermore, in order to make the punching position and the pressing position accurate, as shown in FIG. 6, a card substrate preformatted as shown in FIG. 6 is used, and as shown in FIG. It is a more preferable form that the card substrate is pressed and punching is performed.

[Punching blade shape]
In the punching of the card form, since the corner portion of the IC card has a round shape, burrs tend to occur easily in this portion. The reason that burrs are likely to occur is that this part is difficult to cut, so it is preferable to cut the corner part first. Therefore, as shown in FIG. 8, the corner portion of the card-type punch is made higher than the other remaining long side portions and short side portions, and the corner portion is cut before the remaining portion. It is preferable. The protrusion amount at the corner is preferably 0.1 mm, more preferably 0.5 mm to 10 mm, and still more preferably 1.0 mm to 5 mm.

  As other means, as shown in FIG. 9, the angle of the punch blade may be a sharp corner, preferably the angle of the corner is 30 ° or more and 90 ° or less, more preferably 40 ° or more. 70 ° or less. When the angle becomes smaller than this, when the base material is started to be cut, the base material is cracked in another direction, so that the cutting property is deteriorated.

[Sheet thickness]
In this invention, the cutting property when carded is defined by the standard deviation of the sheet thickness, the thickness range of the sheet before cutting is preferably within ± 10% from the average value of the card thickness, More preferably, it is within ± 6%. IC cards that are normally distributed in the market are mostly about 760 μm to 800 μm, and in the case of 800 μm, they are within ± 80 μm, preferably ± 48 μm or less.

  In addition, when the sheet thickness range is widened, when printing or image formation is performed with a printer or the like, the card surface cannot be pressed with the printer head, and density unevenness and print blurring are caused.

[Tilt in the card surface]
Since the IC card to be manufactured includes an IC chip, an antenna, or a member for protecting the chip, unevenness is likely to occur.

  The inclination in the card surface in the present invention means that when a tangent line is drawn at every point from the top of the raised portion of the IC card to the bottom of the raised portion with respect to the neutral surface inside the card surface, The inclination angle (inclination) between the tangent line and the neutral surface inside the card surface is defined as the in-card surface inclination. When the in-card inclination is larger than 0.004, a blur occurs when printing with a printer.

[Inlet base material]
As the inlet base material used, all of PET (polyethylene terephthalate), PET-G, PEN (polyethylene naphthalate), vinyl chloride, PC (polycarbonate), TAC (triacetylcellulose), acrylic, paper, YUPO, etc. are used. However, in the present invention, PET, PET-G, and PEN are preferable from the viewpoint of mechanical strength, dimensional stability, and solvent resistance, and PET or PET-G is more preferable from the viewpoint of transparency, processability, and cost. .

[Inlet size smaller than card size]
If the inlet size is larger than the card, an inlet appears in the card cross section. Therefore, assuming that the card is generally used as a card, liquid or the like infiltrates from the gap and deteriorates adhesion and durability. As for the size of the inlet sheet, the outer periphery of the inlet sheet is preferably 0.1 mm or more inside from the card cross section, and more preferably 1.0 mm or more inside.

[Break elongation of adhesive]
What is the elongation at break of an adhesive? If the adhesive is continuously pulled at a constant speed, the adhesive tears and breaks at a certain point. It is the elongation rate of the adhesive stretched up to that time. Generally, when the breaking elongation is small, it is easy to cut when cutting with a scissors-like blade, and when the breaking elongation is large, the elongation until the adhesive is cut is large, so it is difficult to cut when cutting with a scissors-like blade. .

  On the other hand, when an adhesive is used as a part of the card substrate, when the card is bent or folded, a larger value of the breaking elongation is more flexible and preferable.

  When card cutting is performed by the punch die method, it is ideal that the breaking elongation is small and the breaking elongation at the completion of curing of the adhesive is large. The preferable range of the breaking elongation at the time of cutting is 5% or more and 500% or less, and more preferably 50% or more and 400% or less. The breaking elongation at the completion of complete curing is preferably 50% or more and 500% or less, more preferably 100% or more and 400% or less.

[Elastic modulus of adhesive]
When the adhesive is deformed by applying an external force, the stress generated by the external force and the strain generated by the deformation are proportional to each other in a range where the deformation is not so large (Hooke's law). The elastic modulus of the adhesive is obtained by using the proportional constant at this time as the elastic modulus. That is, the elastic modulus C is expressed by C = (stress) / (strain). If the elastic modulus is high, cutting with a blade such as scissors is easy to cut, but on the other hand, the adhesive becomes hard and the card durability is lowered. On the other hand, when the elastic modulus is low, the adhesive protrudes from the cross section during cutting, and when the card is formed, the cross sectional shape deteriorates and the appearance deteriorates. A preferred range of the elastic modulus of the adhesive is at 30 kgf / mm ² or more 100 kgf / mm ² or less, more preferably 40 kgf / mm ² or more 80 kgf / mm ² or less.

[Measurement method of elongation at break and 2% elastic modulus]
In this invention, the elongation at break (%) and 2% elastic modulus are 23 ° C. and 55% RH, and after leaving the adhesive to stand for 300 hours or more, Orientec Tensilon Universal Testing Machine RTA- 100 using Tensilon multi-function data processing TYPE MP-100 / 200S Ver. Measurement was carried out using 44. The resin fixing means was fixed by an air chuck method. The crosshead speed can be selected from 5 to 100 mm / min, RANGE from 5 to 100%, and the load from 0.1 to 500 kg. However, in the evaluation of the present invention, the crosshead speed is 30 mm / min, and RANGE is Evaluation was performed under the conditions of 20% and a load of 100 kg.

  When measuring the elongation at break and the 2% elastic modulus of the adhesive, it is particularly difficult to form a single film. Therefore, a 500 μm resin layer was formed on a PP release sheet, and a desired sample was prepared and measured. For the measurement, a sample having a width of 1 cm was fixed to an air chuck and a tensile test was performed.

  The elongation at break was determined from the elongation at break when the actinic ray curable resin was broken or cracked during pulling.

[Back roll temperature control]
In this invention, the laminate first roll for laminating the first sheet material and the second sheet material has a temperature adjusting mechanism, and the temperature of this roll is preferably 40 ° C. or higher and 90 ° C. or lower. Examples of the temperature adjusting mechanism include a method of electrically heating the roll, blowing hot air into the roll, and circulating a temperature-controlled liquid. A method of circulating hot water is simple and preferable. A more preferable temperature range is 60 ° C. or higher and 90 ° C. or lower.

  In addition, in order to prevent a temperature drop of the coated adhesive, it is preferable to attach a heating device for reheating before the coated adhesive is stuck to the counterpart sheet. The temperature of the heating device is preferably 50 ° C. or higher and 120 ° C. or lower, more preferably 60 ° C. or higher and 120 ° C. or lower.

[Environment during lamination]
Normally, when laminating, the adhesive can be applied without adjusting the environmental humidity and temperature, and the curing of the adhesive proceeds.However, when using a moisture-curing adhesive, the temperature and humidity should be adjusted from the time of creation. When the work is performed in such an environment, the curing speed of the adhesive is increased, and the complete curing of the adhesive is accelerated. As an environment at the time of preparation, the temperature is preferably 20 ° C. or more and 50 ° C. or less, and the humidity is preferably 70% or more and 100% or less.

[Sheet storage environment after lamination]
The adhesive is applied and the bonded sheet is stored until the adhesive is cured. The storage environment of the sheet is preferably a temperature of 20 ° C. or more and 50 ° C. or less and a humidity of 40% or more and 100% or less. If the temperature and humidity are below these values, the adhesive will not cure, and if the temperature is above this range, the adhesive will ignite and cause the sheet to swell.

  After about 3 days, the peel strength between the sheets becomes 1500 g / 2.5 cm or more, and even if the sheet is carried or cut, the sheet will not be distorted or bent. Thereafter, the adhesive is completely cured over 1 to 4 weeks.

[Load on the sheet]
Since the sheet immediately after laminating is not completely cured, it is necessary to apply a certain amount of load during storage in order to improve the adhesion between the two bonded sheets. If the applied load is too large, the sheet may be distorted or the IC chip or the like in the bonded sheet may be damaged. It is preferred load applied to the seat is 2 kg / ^{m 2} or more 1500 kg / ^{m 2} or less.

[Judgment of complete curing]
After curing of the sheet using the moisture curable adhesive of the example is when the isocyanate group contained in the moisture curable adhesive has reacted 95% or more, the cured sheet is card-like for confirmation of curing. Whether or not the reaction is completed can be determined based on whether or not blistering due to the generation of carbon dioxide gas occurs when heat treatment at 90 ° C. or higher is performed. In order to know the progress of the reaction, it can be examined by measuring an infrared absorption spectrum and quantifying the amount of isocyanate group (NCO group) from the spectrum intensity.

[Adhesive viscosity]
When the adhesive coating viscosity at the time of making the laminate sheet is smaller than 5000 mPs, many bubbles are generated when the cards are pasted together, the planar unevenness is deteriorated, and when it is larger than 40000 mPs, the adhesive applicability is deteriorated. Therefore, the planar unevenness is deteriorated. In addition to the planar unevenness, a problem that the card surface strength after curing is reduced occurs. Therefore, it is preferably 5000 mPs or more and 30000 mPs or less, more preferably 7000 mPs or more and 20000 mPs or less. The coating temperature is preferably 140 ° C. or lower, more preferably 130 ° C. or lower.

[IC card base material adhesive]
As the bonding material of the present invention, it is preferable to use a hot melt adhesive, a thermoplastic resin, or the like. For example, as the hot melt adhesive, a commonly used one can be used. Examples of the main component of the hot melt adhesive include ethylene / vinyl acetate copolymer (EVA), polyester, polyamide, thermoplastic elastomer, and polyolefin. However, in the present invention, a moisture curable adhesive is specifically preferable among the low temperature adhesives.

  Moisture curable materials as reactive hot melt adhesives are disclosed in JP-A Nos. 2000-036026, 2000-212278, and 2000-219855. Any of these adhesives may be used, and materials that are not particularly limited can be used as long as low-temperature bonding can be performed.

  The film thickness of the adhesive is preferably 100 to 600 μm, more preferably 150 to 500 μm, and still more preferably 150 μ to 450 μm in terms of the thickness including the electronic component.

[Electronic parts]
An electronic component refers to an information recording member, and specifically, an IC chip that electrically stores information of an IC card user and a coiled antenna body connected to the IC chip. The IC chip is only a memory or in addition to a microcomputer. In some cases, a capacitor may be included in the electronic component. The present invention is not limited to this, and is not particularly limited as long as it is an electronic component necessary for the information recording member.

  The IC module has an antenna coil, but when it has an antenna pattern, any method such as conductive paste printing, copper foil etching, or winding welding may be used. As the printed board, a thermoplastic film such as polyester is used, and polyimide is advantageous when heat resistance is required. The IC chip and antenna pattern can be joined using conductive adhesives such as silver paste, copper paste, and carbon paste (EN-4000 series from Hitachi Chemical, XAP series from Toshiba Chemical) and anisotropic conductive films (Hitachi Chemical). There are known methods using industrial anisol, etc.) or soldering methods, but any method may be used.

  In order to fill the resin after placing the parts including the IC chip in a predetermined position in advance, the shearing force due to the flow of the resin causes the joint to come off or the surface smoothness due to the flow or cooling of the resin. In order to eliminate the damage and lack of stability, a resin layer is previously formed on the substrate sheet, and the electronic component is sealed with a porous resin film or porous foam to enclose the component in the resin layer. It is preferably used in the form of a conductive resin film, a flexible resin sheet, a porous resin sheet, or a nonwoven fabric sheet. For example, a method described in Japanese Patent Application No. 11-105476 can be used.

  Further, since the IC chip has a weak point pressure strength, it is also preferable to have a reinforcing plate in the vicinity of the IC chip. The total thickness of the electronic component is preferably 10 to 300 μm, more preferably 30 to 300 μm, still more preferably 30 to 250 μm.

[Sheet material for IC card substrate]
Examples of the base material of the sheet member include polyester resins such as polyethylene terephthalate, polybutylene terephthalate, polyethylene terephthalate / isophthalate copolymer, polyolefin resins such as polyethylene, polypropylene, and polymethylpentene, polyvinyl fluoride, polyvinylidene fluoride, Polyfluorinated ethylene resins such as polytetrafluoroethylene and ethylene-tetrafluoroethylene copolymer, polyamides such as nylon 6 and nylon 6.6, polyvinyl chloride, vinyl chloride / vinyl acetate copolymer, ethylene / Vinyl acetate copolymer, ethylene / vinyl alcohol copolymer, vinyl polymer such as polyvinyl alcohol and vinylon, biodegradable aliphatic polyester, biodegradable polycarbonate, biodegradable polylactic acid, biodegradable polyvinyl alcohol Biodegradable resins such as biodegradable cellulose acetate and biodegradable polycaprolactone, cellulose resins such as cellulose triacetate and cellophane, methyl polymethacrylate, ethyl polymethacrylate, polyethyl acrylate, polyacrylic acid Acrylic resin such as butyl, synthetic resin sheet such as polystyrene, polycarbonate, polyarylate and polyimide, or paper such as fine paper, thin paper, glassine paper and sulfuric acid paper, single layer such as metal foil or two or more layers thereof A laminated body is mentioned. The thickness of the support of the present invention is 30 to 300 μm, desirably 50 to 200 μm.

  In this invention, from the viewpoint of card base material transportability due to heat shrinkage and warping of the support, the thermal contraction rate at 150 ° C./30 min as a sheet member in addition to the low temperature adhesive is 1.2% in the longitudinal (MD) direction. Hereinafter, 0.5% or less is preferable in the lateral (TD). Further, an easy-contact process may be performed on the support for post-processing to improve adhesion, and an antistatic process may be performed for chip protection.

  Specifically, U2 series, U4 series, UL series manufactured by Teijin DuPont Films, Ltd., Chrisper G series manufactured by Toyobo Co., Ltd., E00 series, E20 series, E22 series, X20 series, E40 series manufactured by Toray Industries, Inc. The E60 series QE series can be suitably used.

  The second sheet material may be provided with a cushion layer in addition to the image receiving layer in order to form a face image of the card user. An image element is provided on the surface of the personal authentication card substrate, and at least one selected from an authentication identification image such as a face image, an attribute information image, and format printing may be provided. It may be a card.

[Image receiving layer]
The image receiving layer in the second sheet material can be formed of a binder and various additives.

  The image receiving layer forms a gradation information-containing image by a sublimation type thermal transfer method and also forms a character information-containing image by a sublimation type thermal transfer method or a melt type thermal transfer method. The adhesion of the hot-melt ink should be good as well as the dyeing property of the ink. In order to impart such special properties to the image-receiving layer, it is necessary to appropriately adjust the types of binders and various additives and their blending amounts as described later.

  An information carrier comprising a format print represents an information carrier provided with at least one selected from a plurality of identification information and book information. Specifically, a ruled line, a company name, a card name, and notes Indicates the issuer's phone number.

  For the formation of an information carrier consisting of format printing, use the “lithographic printing technology”, “new printing technology overview”, “offset printing technology”, “plate making / printing slightly understandable picture book” published by Japan Printing Technology Association, etc. It can be formed using the general inks described, and is formed of ink such as carbon in photocurable ink, oil-soluble ink, solvent-type ink, and the like.

  In some cases, watermark printing, holograms, fine patterns, etc. may be employed to prevent visual counterfeiting, and the printed material, hologram, barcode, matte pattern, fine pattern, background pattern, uneven pattern may be used as the forgery / alteration prevention layer. Select timely, visible light absorbing color material, ultraviolet absorber, infrared absorber, fluorescent whitening material, metal deposition layer, glass deposition layer, bead layer, optical change element layer, pearl ink layer, neighboring pigment layer, It is also possible to provide the front sheet by printing or the like from an antistatic layer or the like.

[Writing layer]
The writing layer is a layer that allows writing on the back surface of the ID card. As such a writing layer, for example, inorganic fine powders such as calcium carbonate, talc, diatomaceous earth, titanium oxide, and barium sulfate are included in a film of a thermoplastic resin (polyolefins such as polyethylene and various copolymers). Can be formed. It can be formed with a “writing layer” described in JP-A-1-205155. The writing layer is formed on the first sheet material in the support in which a plurality of layers are not laminated. Addition of a material that improves slipperiness, such as wax, to the writing layer is effective in preventing damage and wear when rubbed. As the additive, polyethylene wax is preferably used.

[IC card manufacturing method]
Here, an example of a method for producing an IC card using a hot melt adhesive will be described. In producing the IC card, first, a hot melt adhesive is applied to a predetermined thickness on the front and back sheets with an applicator. As a coating method, a normal method such as a roller method, a T-die method, or a die method is used. In the case of coating in the form of stripes in the present invention, there is a method of intermittently opening the T-die slit, but it is not limited thereto.

  Further, the first sheet material and the second sheet material may be subjected to format printing or information recording either before or after bonding, offset printing, gravure printing, silk printing, screen printing, intaglio printing, letterpress printing, It can be formed by any method such as an ink jet method, a sublimation transfer method, an electrophotographic method, and a heat melting method.

  The manufacturing method of the IC card of this invention is a method of bonding and coating as in JP 2000-036026, JP 2000-21855, JP 2000-21278, JP 10-316959, JP 11-5964, and the like. It is disclosed. Any bonding method, coating method, etc. can be used, and there is no particular limitation in this invention.

  Moreover, as a method of arranging an adhesive member at a specific position, it can be manufactured by applying an adhesive at a predetermined position by a screen printing method, a gravure printing method or the like. In addition, when a hot melt adhesive is used, it can be applied to each arrangement by applying the adhesive from the nozzle in a bead shape with a hand gun type hot melt applicator.

  Alternatively, the adhesive processed into a film shape can be cut to be placed in a predetermined arrangement, and after being placed in each arrangement, it can be bonded by heating and pressing.

At the time of bonding, it is preferable to perform heating and pressurization in order to increase the surface smoothness of the base material and the adhesion of a predetermined electronic component between the first sheet material and the second sheet material. It is preferable to manufacture by a laminate method or the like. The heating is preferably 10 to 180 ° C, more preferably 30 to 150. The pressurization is preferably 1.0 to 300 kgf / cm ² , more preferably 1.0 to 200 kgf / cm ² . If the pressure is higher than this, the IC chip is damaged. The heating and pressurizing time is preferably 0.001 to 90 seconds, more preferably 0.001 to 60 seconds. If the time is longer than this, the production efficiency is lowered.

  The sheet for an IC card having an IC module having an IC chip and an antenna in the adhesive layer is stored under a predetermined condition. The first sheet material and the second sheet material are bonded together via an adhesive. Thereafter, the IC card sheet is supplied to a punching die, and the IC card is manufactured by punching the IC card from the IC card sheet with the punching die. In this case, an authentication identification image or a bibliographic item may be recorded before punching. Another effective means is a method of making a hole for supplying moisture necessary for reaction around the card size of the laminated sheets to promote curing.

[Method of applying transfer foil onto IC card]
Transfer of the transfer foil to the transfer material is usually performed using a means capable of applying pressure while heating, such as a thermal head, a heat roller, or a hot stamp machine.

[Example 1]
EXAMPLES Hereinafter, although an Example is given and this invention is demonstrated in detail, the aspect of this invention is not limited to this. In the following, “part” means “part by weight”.

[Selection of adhesive]
The adhesive used was Sdyne 2013MK manufactured by Sekisui Chemical Co., Ltd.

<Creation of first sheet material (back sheet)>
U2L98W low heat yield grade 188 μm manufactured by Teijin DuPont Films Ltd. was used as the top sheet and back sheet.

(Create writing layer)
A coating liquid for forming a first writing layer, a coating liquid for forming a second writing layer, and a coating liquid for forming a third writing layer having the following composition are applied and dried in this order on the support backing sheet 188 μm, and the respective thicknesses are obtained. The writing layer was formed by laminating so as to be 5 μm, 15 μm, and 0.2 μm.
<First writing layer forming coating solution>
Polyester resin [Toyobo Co., Ltd .: Byron 200] 8 parts Isocyanate 1 part [Nippon Polyurethane Industry Co., Ltd .: Coronate HX]
Carbon black Trace amount of titanium dioxide particles [Ishihara Sangyo Co., Ltd .: CR80] 1 part Methyl ethyl ketone 80 parts Butyl acetate 10 parts <Second writing layer forming coating solution>
4 parts of polyester resin [Toyobo Co., Ltd .: Bironal MD1200]
Silica 5 parts Titanium dioxide particles [manufactured by Ishihara Sangyo Co., Ltd .: CR80] 1 part 90 parts of water <third writing layer forming coating solution>
Polyamide resin [manufactured by Sanwa Chemical Industry Co., Ltd .: Sanmide 55] 5 parts Methanol 95 parts The center line average roughness of the obtained writing layer was 1.34 μm.

(Form format printing layer on the writing layer)
Format printing (ruled lines, issuer name, issuer telephone number) was performed by the offset printing method. UV ink was used as printing ink. The UV irradiation conditions during printing were equivalent to 200 mj with a high-pressure mercury lamp.

<Creation of second sheet material (front sheet)>
U2L98W low heat yield grade manufactured by Teijin DuPont Films Ltd. was used as a front sheet. The thickness of the PET sheet is 188 μm on both sides.

(Create a table sheet)
A second sheet material (front sheet) formed by sequentially coating and drying a cushion layer and an image receiving layer made of the following composition on a front sheet 188 μm was formed.
(Photo-curing cushion layer) Film thickness 10μm
Urethane acrylate oligomer (made by Shin-Nakamura Chemical Co., Ltd .: NK Oligo UA512)
55 parts polyester acrylate (Toagosei Co., Ltd .: Aronix M6200)
15 parts urethane acrylate oligomer (manufactured by Shin-Nakamura Chemical Co., Ltd .: NK Oligo UA4000)
25 parts hydroxycyclohexyl phenyl ketone (Ciba Specialty Chemicals: Irgacure 184) 5 parts methyl ethyl ketone 100 parts The actinic ray curable compound after application is dried at 90 ° C./30 sec and then with a mercury lamp (300 mj / cm ² ). Photocuring was performed.

(Image receiving layer)
The first image-receiving layer forming coating solution, the second image-receiving layer forming coating solution and the third image-receiving layer forming coating solution having the following composition are applied and dried in this order on the cushion layer, and each thickness is 0. The image receiving layer was formed by laminating to 2 μm, 2.5 μm, and 0.5 μm.
<First image-receiving layer forming coating solution>
9 parts of polyvinyl butyral resin [manufactured by Sekisui Chemical Co., Ltd .: ESREC BL-1]
Isocyanate 1 part [Nippon Polyurethane Industry Co., Ltd .: Coronate HX]
Methyl ethyl ketone 80 parts Butyl acetate 10 parts <Second image-receiving layer forming coating solution>
6 parts of polyvinyl butyral resin [manufactured by Sekisui Chemical Co., Ltd .: ESREC BX-1]
Metal ion-containing compound (Compound MS) 4 parts Methyl ethyl ketone 80 parts Butyl acetate 10 parts <Coating liquid for forming third image-receiving layer>
Polyethylene wax 2 parts [Toho Chemical Industry Co., Ltd .: Hitech E1000]
Urethane-modified ethylene acrylic acid copolymer 8 parts [manufactured by Toho Chemical Co., Ltd .: Hitec S6254]
Methyl cellulose [manufactured by Shin-Etsu Chemical Co., Ltd .: SM15] 0.1 part water 90 parts

(Formation of information carrier consisting of format print layer)
Format printing (employee ID, name) was performed on the image receiving layer by an offset printing method. UV ink was used as printing ink. The UV irradiation conditions during printing were equivalent to 200 mj with a high-pressure mercury lamp.

(Transparent resin layer formation)
The printing ink which consists of the following composition was mixed with the roll mill, and printing ink was created. Printing was performed on the image receiving layer by the offset printing method. The UV irradiation conditions during printing were equivalent to 200 mj with a high-pressure mercury lamp.

(Transparent resin layer composition 1)
Urethane acrylate oligomer 50 parts Aliphatic polyester acrylate oligomer 35 parts Dirocure 1173 (Ciba Specialty Chemicals) 5 parts Trimethylolpropane acrylate 10 parts (Creation of IC concealment layer)
By the resin convex printing method, watermark printing was performed on the outermost surface of the support opposite to the image receiving layer surface. The printing pattern was performed in either FIG. 10 or FIG. Printing ink was printed with UV black ink. The UV irradiation conditions during printing were equivalent to 200 mj with a high-pressure mercury lamp. The film thickness was 1.0 μm.

(Used inlet)
An aluminum foil having a thickness of 10 μm was vapor-deposited on an S series tetron film manufactured by Teijin DuPont Films Co., Ltd., and then etched as in the form of an antenna wire. An IC chip, a reinforcing plate, and the like were placed on the base sheet thus obtained to obtain an IC card inlet.

<Creation of IC card image recording material>
Using the first sheet material (back sheet) of FIG. 12 and the second sheet material (front sheet) of FIG. 13 created as described above, the IC-mounted card substrate and card base with an image receiving layer shown in FIG. A card substrate was prepared using a material preparation device.

  The card base creation as an embodiment will be described. The first sheet material (back sheet) is installed in the first sheet supply unit, and the second sheet material (front sheet) is installed in the second sheet supply unit. An adhesive was charged into the hot melt agent supply section.

  In this way, the first sheet material (back sheet) in the form of a long sheet and the second sheet material (front sheet) of a single sheet are provided, and the second sheet material is under nitrogen at a specific temperature. An adhesive was supplied from a moisture curing type adhesive supply unit by a T-die coating method, and an electronic component composed of FIGS. 14 to 16 having a thickness of 270 μm was arranged. In order to prevent the temperature of the adhesive from decreasing, the heating member was heated and heated.

  FIG. 14 is a schematic diagram of an IC module made of an IC card material, which is an IC module of an electronic component 3a in which an IC chip 3a2 is joined to an antenna 3a1 of an antenna coil wound with a copper wire.

  The inlet structure of FIG. 15 is a nonwoven fabric type, and the nonwoven fabric 3a4 on which the printed pattern is formed and the IC chip 3a2 are joined by bonding or the like, and the reinforcing plate 3b covers the IC chip 3a2 by 50% or more on the IC chip 3a2. It is the schematic diagram which interposes. An IC card sheet “FT series” manufactured by Hitachi Maxell Co., Ltd. can also be used.

  FIG. 16 shows a printed circuit board type. A printed circuit board 3a5 on which a printed pattern is formed and an IC chip 3a2 are joined by bonding or the like, and a reinforcing plate 3b is interposed in the IC chip 3a2 so as to cover 50% or more of the IC chip 3a2. FIG.

  The inlet used was heat-treated for various T series Tetron films manufactured by Teijin DuPont Films Co., Ltd. to adjust the heat shrinkage rate. Thereafter, both surfaces of the support were coated with various resins with a thickness of 1 μm. Further, an aluminum foil having a thickness of 10 μm was vapor-deposited thereon, and then subjected to an etching process like an antenna wire. On the base sheet support thus obtained, an IC chip, a reinforcing plate and the like were installed to form an IC card inlet.

An adhesive is supplied to the first sheet material by a T-die coating method from a moisture curable adhesive supply section under nitrogen at a specific temperature, and the moisture curable adhesive is applied to the first sheet material and the second sheet material. And a IC / fixing member of the IC module, and a card controlled by a heating and pressing roll and a film thickness control roll (pressure 3 kg / cm ² , roll surface temperature 70 ° C.) and controlled to 740 μm A substrate master was created. This card base plate is shown in FIGS. 17 shows an embodiment using the inlet shown in FIG. 15, and FIG. 18 shows an embodiment using the inlet shown in FIG.

  The target thicknesses of the adhesive applied to the first and second sheet materials were 30 to 40 μm and 330 to 350 μm, respectively. In this invention, by controlling the thickness distribution of each coating, the card thickness standard deviation, thickness variation range, and in-plane inclination values were adjusted, and an IC card having the values shown in the examples after punching was obtained.

  The cutting step is preferably performed after the initial curing of the adhesive and the adhesion to the support have been sufficiently performed. In consideration of cutting properties, the adhesive does not necessarily need to be completely cured. The prepared master was able to obtain an image recording body for an IC card having a size of 55 mm × 85 mm by a punching method shown later. When there was no format printing part on the front and back surfaces of the finished card substrate, the logo and OP varnish were printed sequentially by a resin letterpress printing method with a card printer.

[Storage of IC card]
The IC cards obtained above were loaded in the card magazine having the shape shown in FIG. The card magazine is configured to be mountable in the loading section of the card printer shown in FIG. After the card magazines were sealed, these magazines were stored for 10 days in a 23 ° C. and 55% environment.

[IC card creation method]
[Method of describing authentication identification image and attribute information image on IC card]
(Creation of ink sheet for sublimation thermal transfer recording)
A 6 μm-thick polyethylene terephthalate sheet with anti-fusion processing on the back side is coated with a yellow ink layer forming coating liquid, a magenta ink layer forming coating liquid, and a cyan ink layer forming coating liquid each having a thickness of 1 μm. Thus, ink sheets of three colors of yellow, magenta and cyan were obtained.
<Coating liquid for yellow ink layer formation>
Yellow dye (MSY Yellow manufactured by Mitsui Toatsu Dye Co., Ltd.) 3 parts Polyvinyl acetal 5.5 parts [Denka Butyral KY-24, manufactured by Denki Kagaku Kogyo Co., Ltd.]
Polymethylmethacrylate-modified polystyrene 1 part [manufactured by Toa Gosei Chemical Co., Ltd .: Rededa GP-200]
Urethane-modified silicone oil 0.5 part [Dainomer SP-2105, manufactured by Dainichi Seika Kogyo Co., Ltd.]
Methyl ethyl ketone 70 parts Toluene 20 parts <Coating liquid for forming a magenta ink layer>
Magenta dye (MS Magenta manufactured by Mitsui Toatsu Dye Co., Ltd.) 2 parts Polyvinyl acetal 5.5 parts [Denka Butyral KY-24 manufactured by Denki Kagaku Kogyo Co., Ltd.]
Polymethylmethacrylate modified polystyrene 2 parts [Toa Gosei Chemical Co., Ltd .: Rededa GP-200]
Urethane-modified silicone oil 0.5 part [Dainomer SP-2105, manufactured by Dainichi Seika Kogyo Co., Ltd.]
Methyl ethyl ketone 70 parts Toluene 20 parts <Cyan ink layer forming coating solution>
Cyan dye (Nippon Kayaku Co., Ltd. Kayaset Blue 136) 3 parts Polyvinyl acetal 5.6 parts [Electrochemical Industry Co., Ltd .: Denkabutyral KY-24]
Polymethylmethacrylate-modified polystyrene 1 part [manufactured by Toa Gosei Chemical Co., Ltd .: Rededa GP-200]
Urethane-modified silicone oil 0.5 part [Dainomer SP-2105, manufactured by Dainichi Seika Kogyo Co., Ltd.]
20 parts of methyl ethyl ketone (preparation of ink sheet for melt type thermal transfer recording)
An ink sheet was obtained by applying and drying an ink layer forming coating solution having the following composition to a polyethylene terephthalate sheet having a thickness of 6 μm that had been processed to prevent fusing on the back surface to a thickness of 2 μm.
<Ink layer forming coating solution>
Carnauba wax 1 part Ethylene vinyl acetate copolymer 1 part [Mitsui DuPont Chemicals: EV40Y]
Carbon black 3 parts Phenolic resin [Arakawa Chemical Industries, Ltd .: Tamanol 521] 5 parts Methyl ethyl ketone 90 parts (Face image formation)
The image receiving layer or transparent resin portion, the information printing portion and the ink side of the ink sheet for sublimation type thermal transfer recording are overlapped, and the output is 0.23 W / dot and the pulse width is 0.3-4. A human image having gradation in the image was formed on the image receiving layer by heating under conditions of 5 ms and a dot density of 16 dots / mm. In this image, the dye and the nickel of the image receiving layer form a complex.

(Formation of character information)
The transparent resin part and the ink side of the melt type thermal transfer recording ink sheet are overlapped, and the condition of output 0.5 W / dot, pulse width 1.0 ms, dot density 16 dots / mm using the thermal head from the ink sheet side The character information was formed on the IC card image recording body by heating with.

The face image and attribute information are provided as described above.
[Synthesis of IC card surface protective layer-added resin]
[Create IC card surface protection foil]
(Preparation of transfer foil 1)
A transfer foil 1 was prepared by laminating the following composition on a release layer of a polyethylene terephthalate film 2 having a thickness of 25 μm provided with a release layer of a 0.1 μm fluororesin layer.
(Actinic ray curable compound)
Shin-Nakamura Chemical A-9300 / Shin-Nakamura Chemical EA-1020 =
35 / 11.75 parts initiator Irgacure 184 made by Nippon Ciba-Geigy Co., Ltd. 5 parts Additive unsaturated group-containing resin 48 parts Other additives Dainippon Ink Surfactant F-179 0.25 part <intermediate layer forming coating solution > Thickness 1.0μm
Polyvinyl butyral resin [manufactured by Sekisui Chemical Co., Ltd .: ESREC BX-1] 3.5 parts Tuftex M-1913 (Asahi Kasei) 5 parts Curing agent Polyisocyanate [Coronate HX made by Nippon Polyurethane] 1.5 parts Methyl ethyl ketone 90 parts After application Curing of the curing agent was performed at 50 ° C. for 24 hours.
<Adhesive layer forming coating solution> Film thickness 0.5 μm
Urethane-modified ethylene ethyl acrylate copolymer [manufactured by Toho Chemical Industry Co., Ltd .: Hitech S6254B] 8 parts polyacrylic acid ester copolymer [manufactured by Nippon Pure Chemicals Co., Ltd .: Jurimer AT510] 2 parts water 45 parts ethanol 45 parts ( Creation of transfer foil 2)
The following composition was laminated | stacked on the mold release layer of the 25-micrometer-thick polyethylene terephthalate film 2 which provided the mold release layer of the 0.1 micrometer fluororesin layer, and the actinic-light curable transfer foil 2 was produced.
(Actinic ray curable compound)
Shin-Nakamura Chemical A-9300 / Shin-Nakamura Chemical
EA-1020 = 35 / 11.75 parts Reaction initiator Irgacure 184 made by Nippon Ciba Geigy Co., Ltd. 5 parts Additive unsaturated group-containing resin 48 parts Other additives Dainippon Ink Surfactant F-179 0.25 part <intermediate layer Forming coating solution> Film thickness 1.0μm
Polyvinyl butyral resin [Sekisui Chemical Co., Ltd. product: ESREC BX-1]
3.5 parts Tuftex M-1913 (Asahi Kasei) 5 parts curing agent Polyisocyanate [Coronate HX made by Nippon Polyurethane] 1.5 parts Methyl ethyl ketone 90 parts Curing of the curing agent after application was carried out at 50 ° C. for 24 hours.
<Barrier layer forming coating solution> Film thickness 1.0 μm
Polyvinyl butyral resin [manufactured by Sekisui Chemical Co., Ltd .: ESREC BX-1]
1 part Toughtex M-1913 (Asahi Kasei) 8 parts Curing agent Polyisocyanate [Coronate HX made by Nippon Polyurethane] 1 part Methyl ethyl ketone 90 parts <Adhesive layer forming coating solution> Film thickness 0.5 μm
Urethane-modified ethylene ethyl acrylate copolymer [manufactured by Toho Chemical Co., Ltd .: Hitec S6254B] 8 parts polyacrylic acid ester copolymer [manufactured by Nippon Pure Chemicals Co., Ltd .: Jurimer AT510] 2 parts water 45 parts ethanol 45 parts image A pressure of 150 kg / cm ² using a heat roller having a diameter of 5 cm and a rubber hardness of 85, heated to a surface temperature of 200 ° C. using the transfer foil 1 and the transfer foil 2 having the above-described configuration on the image receptor on which characters are recorded. Then, transfer was performed in the order of transfer foil 1 and transfer foil 2 by heating for 1.2 seconds. The transfer was performed using the IC card making apparatus shown in FIG.

  FIG. 19 shows a card printer as an IC card creation device. In the card printer, a card base material supply unit 10 and an information recording unit 20 are arranged at an upper position, and a transparent protective layer and / or an optical change are arranged at a lower position. An element transfer layer application part and / or a resin layer application part 70 are arranged, and then a transparent protective layer and / or an optical change element transfer layer application part and / or a resin layer application part 70 are arranged, and a card as an image recording body Create

  In the card base material supply unit 10, for example, a plurality of card base materials 50 that have been cut into pieces in advance to write the personal information of the card user created in FIG. Stocked up. In this example, the card substrate 50 includes a support and an image receiving layer, and the card substrate 50 is automatically supplied one by one from the card substrate supply unit 10 at a predetermined timing.

  In the information recording unit 20, a yellow ribbon cassette 21, a magenta ribbon cassette 22, a cyan ribbon cassette 23, and a black ribbon cassette 24 are arranged, and recording heads 25 to 28 are arranged correspondingly. While the card substrate 50 is moved by thermal transfer using a thermal transfer sheet such as a yellow ribbon, magenta ribbon, or cyan ribbon, an image area having a gradation such as a photograph of the card user's face is recorded in a predetermined area of the image receiving layer. Is done.

Further, a character ribbon cassette 31 and a recording head 32 are arranged, and authentication identification information such as a name and a card issuance date is recorded by thermal transfer using a thermal transfer sheet such as a character ribbon, and an image recording layer is formed. In this information recording unit 20, a gradation information image is formed on the image receiving layer by heating imagewise, and the recording head condition when forming the image is pressurized in the range of 0.01 to 0.3 kg / cm ² , The head is formed at a temperature of 50 to 500 ° C.

  In the transparent protective layer and / or the optical change element transfer layer applying unit and / or the resin layer applying unit 70, a transfer foil cassette 71 is disposed, and a thermal transfer head 72 is disposed corresponding to the transfer foil cassette 71. The optical change element transfer foil 43 and / or the transparent protective transfer foil 64 and the curable transfer foil 66 are transferred, and an optical change element transfer layer and / or a transparent protective transfer layer and a curable protective layer-containing transfer layer are provided.

  As shown in Table 1, punching blade operation method, punching speed, punching blade height, cutting blade corner angle, stripper split presence, cutting blade corner protrusion, card base breaking elongation, card The card base material was punched by changing the base material elastic modulus, adhesive breaking elongation, and adhesive elastic modulus. Evaluation of this physical property is shown below.

[Card cutting]
A punch die or a hollow blade was placed on the card punching machine shown in FIG. 4 and the card substrate was punched into a card form. Then, the cross section of the IC card was observed and evaluated in five stages. A result of 4 or more is a preferable result.

  5: There is no protrusion of the base material or adhesive on the card cross section, and the card is slippery when touched by hand.

  4: No burrs or adhesive sticking out of the base material on the card cross section.

  3: There is no burr of the base material on the card cross section, but the adhesive protrudes and the cross section is rough.

  2: The burr | flash of a base material generate | occur | produces in the card | curd cross section, the adhesive has protruded, and a cross section becomes rough.

  1: The base material burr | flash generate | occur | produced in the card | curd cross section, and the adhesive has protruded greatly.

[Card productivity]
A punch die was placed on the card punching machine shown in FIG. 4, and the created card base was punched into a card form. 1,500 cards were punched out per day, and the number of cards until the blades had to be changed after the cuts were generated on the cross section of the IC card was recorded. It was set as a condition that it was possible to use in production to punch over 300,000 sheets. Below this, the number of process stops and blade maintainability deteriorate, making them unsuitable for production. Further, if the cutting property is poor, the blade is likely to be worn.

[Printer transportability]
The 10000 cards produced in the example were continuously printed by the printer shown in FIG. 19, and the ratio of the number of transport cards generated at that time was calculated as the transport failure rate. The conveyance failure rate is preferably 1% or less.

[Dust mixing rate]
The 10000 cards produced in the example were continuously printed by the printer shown in FIG. 19, and the ratio of the number of cards in which dust was mixed between the IC card and the protective foil at that time was calculated as the dust mixing rate. did. The dust mixing rate is preferably 0.5% or less.

The results are shown in Table 1.
Table 1

  From the results shown in Table 1, in the present invention, compared to the comparative example, the card cutting property, card productivity, printer transportability, and dust mixing rate are excellent, and the effect of the invention is recognized.

  In this invention, when a plurality of format-printed card base materials are punched with a plurality of cutting blades, if punching is simultaneously performed, compressive stress and tensile stress are simultaneously applied to the card base material from multiple directions. By preventing multiple cutting blades from punching the card base at the same time, it prevents the card base from being “cut off” on the cut surface and causing “burrs” to be produced, improving card productivity and printer transportability. Excellent, debris rate is reduced.

It is a schematic block diagram of the manufacturing process of an IC card. It is sectional drawing of the image forming body of the bonded product of an IC card. It is a top view of a punching blade. It is a front end view of the principal part of a punching die apparatus. It is a figure which shows the height of a punching blade. It is a figure which shows the card | curd base material by which the format printing was carried out. It is a figure which shows the divided | segmented stopper. It is a top view of a cutting blade. It is a figure which shows the angle of a cutting blade. It is a figure which shows the printing pattern of watermark printing on the support body outermost surface opposite to an image receiving layer surface. It is a figure which shows the printing pattern of watermark printing on the support body outermost surface opposite to an image receiving layer surface. It is a figure which shows a 1st sheet material (back sheet). It is a figure which shows a 2nd sheet | seat material (front sheet | seat). It is a schematic diagram of the IC module of the IC card material. It is a schematic diagram of the IC module of the IC card material. It is a schematic diagram of the IC module of the IC card material. It is sectional drawing of a card base original plate. It is sectional drawing of a card base original plate. It is a figure which shows the card printer as an IC card production apparatus.

Explanation of symbols

1 First sheet material (back sheet)
2 Second sheet material (front sheet)
DESCRIPTION OF SYMBOLS 3 Inlet 3a Electronic component 3a1 Antenna 3a2 IC chip 3b Reinforcement plate 6,7 Adhesive layer 8a Image receiving layer 8b Personal identification information 8c Transparent protective layer 9a Writing layer 50 Card base material 501, 502, 503 Clean room A First sheet material supply Part B Second sheet material supply part C1, C2 Adhesive supply part D Second sheet transport part E Inlet supply part F Back roller part G Card base material transport part H Cutting part K Collection part L Storage part M Format printing part N punching part n1 punching machine O printing part o1 card printing machine P loading part

Claims (14)

An adhesive layer is interposed between the first sheet material and the second sheet material, and an inlet having an IC chip on the inlet base material is enclosed in the adhesive layer to produce a card base material. In an IC card manufacturing method for manufacturing an IC card by punching a card substrate into a card shape,
Format printing is performed on at least one surface of the card substrate,
When the format-printed card substrate is punched into a plurality of card forms using a plurality of cutting blades, at least one of the operating cutting blades starts cutting the card substrate before the other cutting blades An IC card manufacturing method characterized by: An adhesive layer is interposed between the first sheet material and the second sheet material, and an inlet having an IC chip on the inlet base material is enclosed in the adhesive layer to produce a card base material. In an IC card manufacturing method for manufacturing an IC card by punching a card substrate into a card shape,
Format printing is performed on at least one surface of the card substrate,
When the format-printed card base is simultaneously punched into a plurality of card forms using a plurality of cutting blades, at least one punching speed of the cutting blades operating simultaneously is different from other cutting blades IC card manufacturing method. An adhesive layer is interposed between the first sheet material and the second sheet material, and an inlet having an IC chip on the inlet base material is enclosed in the adhesive layer to produce a card base material. In an IC card manufacturing method for manufacturing an IC card by punching a card substrate into a card shape,
Format printing is performed on at least one surface of the card substrate,
When the format-printed card base material is simultaneously punched into a plurality of card forms using a plurality of cutting blades, a member for holding the card base material is divided in accordance with the format printing. IC card manufacturing method. An adhesive layer is interposed between the first sheet material and the second sheet material, and an inlet having an IC chip on the inlet base material is enclosed in the adhesive layer to produce a card base material. In an IC card manufacturing method for manufacturing an IC card by punching a card substrate into a card shape,
Format printing is performed on at least one side of the card base,
When the format-printed card base is punched into a card form using at least one cutting blade, the cutting blade punched into the card form has a punch shape, and the corner of the cutting blade has a punch surface An IC card manufacturing method characterized by projecting in a punching direction. An adhesive layer is interposed between the first sheet material and the second sheet material, and an inlet having an IC chip on the inlet base material is enclosed in the adhesive layer to produce a card base material. In an IC card manufacturing method for manufacturing an IC card by punching a card substrate into a card shape,
Format printing is performed on at least one surface of the card substrate,
When the format-printed card base is punched into a card form using at least one cutting blade, the corner part of the cutting blade punched into the card form is curved, and the cutting blade has a curved corner. The IC card manufacturing method characterized in that the blade angle of is 30 ° or more and smaller than 90 °.   6. The IC card manufacturing method according to claim 1, wherein a thickness of the bonded card substrate is 650 μm or more and 900 μm or less. The sheet material constituting the card substrate has a thickness of 100 μm or more and 300 μm or less, an elastic modulus value of 100 or more and 800 kgf / mm ² or less, and a breaking elongation value of 10% or more and 50% or less. The IC card manufacturing method according to any one of claims 1 to 5. The elastic modulus value of the adhesive constituting the card substrate is 30 to 100 kgf / mm ² and the breaking elongation value is 50% to 500%. The IC card manufacturing method of any one of Claims 1.   The IC card manufacturing method according to any one of claims 1 to 8, wherein the bonded product is cut into a single sheet before punching into the card.   10. The IC card manufacturing method according to claim 1, wherein format printing is performed on a non-printed surface before punching into the card shape. 11. An image receiving layer is provided on at least one side of the IC card produced by the IC card production method according to claim 1,
The image receiving layer is provided with personal identification information including a name and a face image by a thermal transfer method or an inkjet method,
An IC card, wherein a writing layer capable of writing is provided on at least a part of the IC card. A transparent protective layer is provided on the top surface provided with personal identification information including the name and face image,
The IC card according to claim 11, wherein the transparent protective layer is made of an actinic ray curable resin.   The IC card according to claim 11 or 12, wherein an IC chip of the IC card is disposed at a position other than a position overlapping the face image portion. The IC card according to claim 11, wherein the IC card is a non-contact type.