JP2007168269A - Card post-processing method and card post-processed by card post-processing method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a card post-processing method which can manufacture an IC card with a satisfactory non-rough side etc. <P>SOLUTION: This method comprises a side modification process to moderate the roughness of the side by irradiating at least one side of the shaped IC card with a laser beam while the IC card and a light path of the laser beam are moved relatively. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to a card post-processing method for irradiating a cut surface of an IC card, a credit card, a prepaid card or the like with a laser beam, and a card post-processed by the card post-processing method.

  In recent years, as IC cards, credit cards, prepaid cards, and the like have been used in many fields, quality requirements for cards, for example, quality requirements for card side surfaces (cut surfaces) have become increasingly severe. .

  In general, the above-mentioned card often has a face photo and characters formed on it, and when the card cut surface is rough, when the face photo image is formed or the character is printed, Adheres to the face photo and characters on the card and causes white spots, resulting in serious quality defects.

  Further, if chips are accumulated in the card reading / writing device, reading and writing errors may occur.

  In order to cope with such a problem, the following techniques for improving the quality of the card cut surface have been proposed.

  (1) In a card punching device composed of a punch and a die, a sharp angle is provided from the crests at the four corners of the punch toward the trough between the crests, and cutting is performed sequentially from the crest to the trough. In order to obtain a good cut surface (see, for example, Patent Document 1).

  (2) In a card punching device composed of a punch and a die, a shear angle is provided from a peak portion at the four corners of the die toward a valley portion between the peak portions, and cutting is performed sequentially from the peak portion to the valley portion. In order to obtain a good cut surface (see, for example, Patent Document 2).

  (3) In a magnetic card reader / writer that reads and writes magnetic information on a magnetic card, a deburring mechanism is provided at the card insertion slot so as to remove burrs protruding from both side edges of the magnetic card (for example, Patent Documents). 3).

In addition, a means for removing burrs from a die joint part of a resin molded product or a gate part using a laser beam is disclosed (for example, see Patent Documents 4 and 5).
JP 7-328999 A JP-A-7-329000 Japanese Utility Model Publication No. 5-4340 JP 2004-126377 A JP 2004-153180 A

  In the technique described in Patent Document 1 or 2, since the card is punched from the four corners, it is possible to suppress to some extent the crepe, burrs, whiskers, etc. that are likely to occur at the four corners of the R shape. The cut surface is likely to be torn, and when a thick material is punched, there is a drawback in that the cutting resistance is increased and the cut surface is likely to be rough.

  Further, in punching a plurality of laminated materials having different mechanical strengths such as an IC card laminated via an adhesive, the adhesive is stretched and cut, and the extended cut piece is an IC card. Therefore, it is difficult to make an effective breakthrough.

  In particular, an IC card or the like uses an adhesive having a certain degree of elasticity even when it is cured so that it does not break even when it is bent. It tends to increase.

  Further, the central part of the four sides corresponding to the apex of the shear angle shape is greatly broken, and the broken part is not on the same straight line as the part cut so far and tends to be a convex shape.

  As mentioned above, images such as facial photographs and characters are often formed on the card, and when the image is formed, cut pieces, crepes, burrs, whiskers, etc. are separated from the cut surface and adhere to the facial photograph or characters. It becomes a serious defect.

  In addition, since reading and writing are repeatedly performed in a card reader or writer, cutting pieces, sacrificial, burrs, whiskers, etc. are accumulated in the apparatus, resulting in reading errors, writing errors, or defective card conveyance. There is a risk of causing.

  The method described in Patent Document 3 is a simple method for removing burrs and the like, but it is difficult to manage the life of the deburring blade, and in the case of an IC card laminated through the adhesive described above. In some cases, due to the viscosity of the adhesive, the adhesive adheres to and accumulates on the periphery of the blade edge, and deburring may not be performed normally.

  In the methods described in Patent Documents 4 and 5, fine burrs, whiskers and the like can be easily removed by irradiating the cut surface of the card with laser light. For example, a resin sheet serving as a card base In addition, if it is attempted to remove a relatively large piece of cutting residue such as an adhesive or the like, a crepe or the like, it becomes necessary to irradiate a laser beam with a high output for a long time.

  If the card is irradiated with a high-power laser beam for a long time, the shape of the cut surface changes or the card size becomes small.

  The present invention has been made in view of such problems, and its purpose is post-processing by a card post-processing method and a card post-processing method capable of producing a card having a good side without roughness. To provide a card.

  Although the present inventors have intensively studied to improve the quality of the card side surface, it is considered that there is a limit even if the cutting device for forming the card is improved, and it is appropriate for the cutting surface that is the card side surface. It was found that the quality of the cut surface can be improved by irradiating a laser beam having an intensity.

  That is, in order to obtain a good cut surface without roughness, it is not necessary to remove even large chips and burrs adhering to the cut surface, but by irradiating with laser light having an appropriate intensity to melt the cut surface. It is considered that it is an effective method to be fixed to the surface and not separated from the cut surface, and the present invention has been achieved.

The object of the present invention can be achieved by the following constitution.
1. And a side surface improving step of irradiating at least one side surface of the card with the laser beam while relatively moving the molded card and the optical path of the laser beam to reduce roughness of the side surface. Card post-processing method.
2. 2. The card post-processing method according to 1 above, wherein the laser beam is irradiated to a predetermined width viewed in the thickness direction of the side surface.
3. 3. The card post-processing method according to claim 1 or 2, wherein a pre-cleaning step for cleaning the side surface of the card is provided before the side surface improving step.
4). The card post-processing method according to any one of claims 1 to 3, wherein a post-cleaning step for cleaning the side surface of the card is provided after the side surface improving step.
5. The card post-processing method according to any one of claims 1 to 4, wherein the card is formed by laminating sheets with an adhesive.
6). A card that is post-processed by the card post-processing method according to any one of 1 to 5 above.

  By irradiating the side surface of the card formed by cutting or resin molding with a laser beam and providing a side surface improving step to alleviate the side surface roughness, the side surface is rough, or the cut residue is attached. Even if the rough surface is melted and smoothed, or the cut residue is melted and fixed to the side surface so that the cut residue is not peeled off from the side surface, thereby reducing the roughness of the side surface. Is possible.

  It should be noted that fine crumbs, burrs, whiskers and the like can be removed by sublimation with a laser beam.

  Hereinafter, an example of an embodiment of a card post-processing method according to the present invention will be described with reference to the drawings.

  In the embodiment described below, the target card is an IC card, but is not limited to this, and may be, for example, a credit card or a prepaid card.

  In the present embodiment, the target card is formed by cutting, but is not limited thereto, and may be formed by resin molding or the like.

  In addition, the assertive description in the following embodiment shows the best mode, and does not limit the meaning or technical scope of the term of the present invention.

  First, an IC card (hereinafter also simply referred to as a card) that is a target of the present embodiment, and an IC card sheet (hereinafter also simply referred to as a sheet) before a plurality of cards are formed and punched into individual cards. The outline will be described with reference to FIG.

  FIG. 1A is an exploded perspective view of a sheet, FIG. 1B is an enlarged perspective view of an IC module, and FIG. 1C is a perspective view showing a state in which a card is punched from the sheet.

  In FIG. 1A, S indicates a card sheet. The sheet S includes a core sheet 302 in which a plurality of IC modules 301 are arranged and pasted, a first sheet 303 bonded to the upper side of the core sheet 302, and a second sheet bonded to the lower side of the core sheet 302. 304 or the like. Reference numeral 303A denotes a card design formed on the first sheet 303 by printing or the like.

  In FIG. 1B, the IC module 301 has an IC chip 301A and a loop antenna 301B.

  In FIG.1 (c), C shows the card | curd pierced by the card | curd punching device from the sheet | seat S according to the pattern 303A.

  A known technique can be used for punching out the card. For example, the techniques described in Japanese Patent Application Laid-Open Nos. 8-244000 and 10-166300 can be used.

Here, the core sheet 302, the first sheet 303, the second sheet 304, and the adhesive that bonds these sheets will be described.
(Core sheet 302)
The core sheet 302 is an insulating sheet, and applicable resins include general-purpose polystyrene resins, impact-resistant polystyrene resins, polyester resins such as polyester, polyethylene terephthalate, and polyethylene naphthalate, polyolefin resins such as polypropylene, Cellulosic resins such as cellulose triacetate and cellulose diacetate, ABS (acrylonitrile-butadiene-styrene copolymer) resin, acrylonitrile-styrene resin, polystyrene resin, polyacrylonitrile resin, polyacrylic acid methyl resin, polymethyl methacrylate resin, poly Well-known resin conventionally used for an inlet sheet, such as an ethyl acrylate resin, a polyethyl methacrylate resin, a vinyl acetate resin, is mentioned.
(Second sheet 304)
The second sheet 304 is made of, for example, polyethylene terephthalate (polyethylene terephthalate) in which white pigment is mixed and bubbles are folded into a honeycomb structure to enhance an image formed by the image receiving layer 304A for recording an image provided thereon. PET) or polypropylene (PP) or the like is preferable. In particular, a biaxially stretched resin, specifically, a biaxially stretched polyester film is preferable because it is thin but has strength. The invention is not limited to this.
(Image receiving layer 304A)
The image receiving layer 304A is a layer capable of receiving an image, and is preferably composed of a material that traps and fixes a dye when a sublimation dye or a diffusion dye is heated and thermally diffused by a thermal head. Polymer materials such as polyvinyl chloride resin, polyester resin, polyvinyl acetal resin, polyvinyl butyral resin, epoxy resin, acrylic resin and the like are known as a material for a good image receiving layer.
(Protective layer 304B)
A protective layer 304B is preferably provided on the image receiving layer 304A (on the lower side in FIG. 1) to protect the recorded image. The protective layer is not particularly limited as long as it is transparent and has a protective effect. Actinic ray curable resins such as acid esters and acrylamides are preferred.
(First sheet 303)
The first sheet 303 may have any originally required function. However, when the IC card is heated under pressure, the upper and lower material configurations are symmetric, so that the warp is smaller and a flat surface can be obtained. It is preferable that the second sheet 304 have the same configuration.
(Writing layer 303B)
The writing layer 303B provided on the first sheet 303 is preferably, for example, a polyester emulsion obtained by diffusing calcium carbonate, silica fine particles, etc., and dissolved in a solvent in the same manner as the image-receiving layer of the surface support. It is preferably formed by applying and then drying and evaporating the solvent.

The thickness of the writing layer 303B is preferably about the same as that of the image receiving layer 304A, and it is more preferable that the surface of the writing layer has a fine uneven surface in order to improve the writing property.
(adhesive)
The adhesive is a moisture-reactive hot melt adhesive, and is a type of adhesive in which the resin is cured by melting the resin and then adsorbing the moisture. Its characteristics are that it has a curing reaction compared to normal hot melt, has a long bonding time, and has a high softening temperature after bonding, so it has high durability and is suitable for processing at low temperatures. Is mentioned. As one example of the moisture reaction type hot melt adhesive, there is one in which an isocyanate group-containing urethane polymer is a main component at a molecular end and this isocyanate group reacts with moisture to form a crosslinked structure.

  Examples of moisture-reactive hot melt adhesives that can be used in the present invention include TE030 and TE100 manufactured by Sumitomo 3M Co., Ltd., Hibon 4820 manufactured by Hitachi Chemical Co., Ltd., Bond Master 170 series manufactured by Kanebo UESC, and Macroplast QR 3460 manufactured by Henkel. .

  Next, an example of an embodiment of a card post-processing method for obtaining the card C as described above will be described with reference to FIG.

  FIG. 2 is a schematic view of each step of the card post-processing method.

  Reference numeral 1 denotes a card punching step before each of the above steps. For example, the card C is punched by using the technique described in Japanese Patent Laid-Open Nos. 8-244000 and 10-166300 described above.

  The punched out cards C are sequentially stocked in the temporary storage box 30 of the card stock process 3 using a known transfer means 2 such as a pick and place having a suction cup at the tip.

  The cards C stored in the temporary storage box 30 are transferred to the pre-cleaning step 5 by the transfer means 4 one by one or a plurality of cards, and are placed on the pre-cleaning table 50.

  After the placement is completed, the pre-cleaning brush 51 starts rotating and rises in contact with the cut surface CS, which is the side surface of the card C, and removes easily-peeled scraps attached to the cut surface CS.

  After the cleaning is completed, the front cleaning table 50 is rotated by 90 ° to clean the remaining three side cut surfaces CS.

  It should be noted that suction means 52 is preferably provided in the vicinity of the front cleaning brush 51 so as to prevent swarf or the like removed by the front cleaning brush 51 from scattering.

  When the cleaning of the four sides of the card C is completed, the card C is transferred to the side surface improvement step 7 by the transfer means 6 and placed on the side surface improvement table 70.

  After the placement is completed, laser light is irradiated from the laser irradiation means 71 to the cut surface CS on one side of the card C.

  Although it does not specifically limit as an oscillator of a laser beam, For example, it is possible to use CO2 laser / short wavelength: 9.3 micrometers (ML-G3900 series by Keyence Corporation) etc.

  The laser light is reciprocated in the side direction of the card C so as to cover the length of each side of the card C by a scanning unit such as a galvanometer (no reference symbol) in the laser irradiation unit 71 and is synchronized with the reciprocal scanning. Thus, the card C rises at a predetermined speed, and laser light is irradiated to the entire cut surface of all the cards C. That is, the scanning period of the laser beam and the rising speed of the card C are set so that the spot diameters of the reciprocating laser beams overlap.

  The raising / lowering means 72 for raising the card C can be constituted by, for example, a cam 73 rotated by a stepping motor, a servo motor or the like (no reference numeral).

  Instead of moving the card C up and down, the laser irradiation means 71 may be moved up and down to move the optical path LP of the laser beam in the vertical direction.

  After the completion of the laser beam irradiation, the side surface improvement table 70 is rotated by 90 °, and the remaining three cut surfaces CS are irradiated with the laser beam.

  When the laser irradiation of the cut surfaces CS on the four sides is completed, the card C is transferred to the post-cleaning step 9 by the transfer means 8 and placed on the post-cleaning table 90.

  After the placement is completed, the post-cleaning roller 91 made of an adhesive roller starts rotating and comes in contact with the cut surface CS of the card C and welds to the carbonized portion by the laser beam or the cut surface CS. Removes scraps that easily peel off.

  After the cleaning is completed, the rear cleaning table 90 is rotated by 90 ° to clean the remaining three side cut surfaces CS.

  The adhesive roller is not particularly limited as long as it has adhesiveness. For example, an adhesive rubber roller made of a synthetic rubber mainly composed of butyl rubber can be used.

  After completion of the cleaning of the cut surface CS, the card C is collected in the collection box 12 of the collection step 11 by the transfer means 10.

  As shown in FIG. 3B, by irradiating the rough cut surface CS of the card C with a laser beam by the card post-processing method having the side surface improvement process described above, as shown in FIG. The roughness of the cut surface CS is alleviated, and the cut residue etc. can be melted and fixed to the cut surface CS.

  As a result, for example, in a face image forming apparatus that forms a face image on a card, the cut residue is peeled off from the cut surface CS, and adheres to the face image forming portion when the face image is formed, or white spots occur. In the reading / writing apparatus, it is possible to prevent the occurrence of a reading / writing error due to accumulation of cut chips and the like in the apparatus.

  Further, as in the present embodiment, the pre-cleaning step 5 is provided before the side surface improving step 7 and the cut surface CS is cleaned in advance to remove swarf, crumbs, burrs, whiskers and the like that are easily peeled off. Therefore, it is possible to reduce the risk of melting scum, crumbs, burrs, whiskers, etc. in an unstable state when irradiated with laser light.

  Further, a post-cleaning step 9 is provided after the side surface improving step 7 to clean the cut surface CS irradiated with the laser beam, thereby removing the unstablely adhering or carbonized cutting residue. I can do it.

  It should be noted that fine scraps and the like are removed in the pre-cleaning step 5 or sublimated with a laser beam and removed.

  In the present embodiment, the laser beam is irradiated to the entire width viewed in the thickness direction of the cut surface CS, but the laser beam is irradiated to a predetermined width viewed in the thickness direction of the cut surface CS without being restricted by this. May be.

  For example, as shown in FIG. 4, which is a cross-sectional view of the card C, the laser beam is irradiated only on the adhesive layer AD that is likely to be cut when cut and the width of the core sheet 302 sandwiched between the adhesive layers AD. As a result, the cut residue can be efficiently melted and fixed. In addition, since the first sheet 303 and the second sheet 304, which are members related to the dimensions and the like of the card C, are not irradiated with laser light, the initial dimensional accuracy is maintained without causing a change in dimensions and the like. I can do it.

  In the present embodiment, laser light is irradiated on the four side surfaces of the card C. However, the present invention is not limited to this, and laser light may be irradiated on at least one side surface. For example, the face image forming apparatus, the card reading / writing apparatus, and the like may be irradiated with laser light only on the side where cut chips are likely to be generated, which has the advantage of improving the card production efficiency. .

FIG. 3 is a schematic diagram of an IC card sheet and an IC card. Schematic of each process of a card post-processing method. The schematic enlarged view which looked at the cut surface CS of the card | curd C from the front. Sectional drawing of the card | curd C. FIG.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Card punching process 2, 4, 6, 8, 10 Transfer means 3 Card stock process 5 Pre-cleaning process 7 Side surface improvement process 9 Post-cleaning process 11 Collection process 12 Collection box 30 Temporary storage box 50 Pre-cleaning table 51 Pre-cleaning brush 52 Suction means 70 Side improvement table 71 Laser irradiation means 72 Lifting means 73 Cam 90 Rear cleaning table 91 Rear cleaning roller 301 IC module 301A IC chip 301B Loop antenna 302 Core sheet 303 First sheet 303A Pattern 303B Writing layer 304 Second layer Sheet 304A Image-receiving layer 304B Protective layer AD Adhesive layer C IC card CS Cut surface LP Optical path S IC card sheet

Claims (6)

And a side surface improving step of irradiating at least one side surface of the card with the laser beam while relatively moving the molded card and the optical path of the laser beam to reduce roughness of the side surface. Card post-processing method. 2. The card post-processing method according to claim 1, wherein the laser beam is irradiated to a predetermined width as viewed in a thickness direction of the side surface. The card post-processing method according to claim 1, wherein a pre-cleaning step of cleaning the side surface of the card is provided before the side surface improving step. The card post-processing method according to any one of claims 1 to 3, wherein a post-cleaning step for cleaning the side surface of the card is provided after the side surface improving step. The card post-processing method according to any one of claims 1 to 4, wherein the card is formed by laminating sheets via an adhesive. A card that is post-processed by the card post-processing method according to claim 1.

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