TWI727934B - Manufacturing method of ceramic composite sheet - Google Patents

Manufacturing method of ceramic composite sheet Download PDF

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TWI727934B
TWI727934B TW104135750A TW104135750A TWI727934B TW I727934 B TWI727934 B TW I727934B TW 104135750 A TW104135750 A TW 104135750A TW 104135750 A TW104135750 A TW 104135750A TW I727934 B TWI727934 B TW I727934B
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ceramic
layer
composite sheet
ceramic composite
fired
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TW201620715A (en
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定井真
中井克實
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日商戶田工業股份有限公司
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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B18/00Layered products essentially comprising ceramics, e.g. refractory products
    • CCHEMISTRY; METALLURGY
    • C04CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04BLIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B41/00After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone
    • C04B41/80After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone of only ceramics
    • C04B41/81Coating or impregnation
    • C04B41/82Coating or impregnation with organic materials
    • C04B41/83Macromolecular compounds
    • CCHEMISTRY; METALLURGY
    • C04CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04BLIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B41/00After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone
    • C04B41/80After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone of only ceramics
    • C04B41/91After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone of only ceramics involving the removal of part of the materials of the treated articles, e.g. etching
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01FMAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F1/00Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties
    • H01F1/01Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials
    • H01F1/03Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity
    • H01F1/12Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials
    • H01F1/34Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials non-metallic substances, e.g. ferrites
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00Screening of apparatus or components against electric or magnetic fields

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Ceramic Engineering (AREA)
  • Materials Engineering (AREA)
  • Structural Engineering (AREA)
  • Organic Chemistry (AREA)
  • Dispersion Chemistry (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Devices For Post-Treatments, Processing, Supply, Discharge, And Other Processes (AREA)
  • Laminated Bodies (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)

Abstract

本發明係提供一種陶瓷複合薄片的製造方法。對規定形狀的陶瓷胚片進行燒成而形成燒成陶瓷層以後,隔著黏合層將樹脂層貼著在燒成陶瓷層的至少一個面上來形成陶瓷複合薄片。將燒成陶瓷層和樹脂層同時切成所希望的形狀。將具有黏合性剝離面的黏合性剝離部件按壓在切割步驟中露出的切割面上,將存在於該切割面上的陶瓷碎片除去。 The invention provides a method for manufacturing a ceramic composite sheet. After firing a ceramic green sheet of a predetermined shape to form a fired ceramic layer, a resin layer is attached to at least one surface of the fired ceramic layer via an adhesive layer to form a ceramic composite sheet. The fired ceramic layer and the resin layer are simultaneously cut into the desired shape. The adhesive peeling member having the adhesive peeling surface is pressed against the cut surface exposed in the cutting step, and the ceramic fragments present on the cut surface are removed.

Description

陶瓷複合薄片的製造方法 Manufacturing method of ceramic composite sheet

本發明係關於陶瓷複合薄片的製造方法。更詳細而言,在能夠貼著於電子設備的平面、曲面或者具有凸凹的表面,且能夠被從電子設備的平面、曲面或者具有凸凹的表面剝離下來的陶瓷複合薄片中,除去在被切開的切割面上的陶瓷碎片等,來製造陶瓷複合薄片。 The present invention relates to a manufacturing method of a ceramic composite sheet. In more detail, in the ceramic composite sheet that can be attached to the flat, curved, or convex-concave surface of the electronic device, and can be peeled off from the flat, curved, or convex-concave surface of the electronic device, the cut is removed Ceramic fragments on the cut surface are used to make ceramic composite sheets.

為吸收從電子設備放射出的電磁波、為吸收侵入電子設備等的電磁波,一般情形係在該電子設備等上安裝有陶瓷複合薄片。該陶瓷複合薄片係藉由將薄膜(樹脂層)貼合在非晶磁性體、燒成鐵氧體磁性體、由鐵氧體等磁性粉體與黏合樹脂形成的複合磁性體、燒成鐵氧體等磁性體上而構成。特別是,就使用天線線圈利用電磁波進行通信的無線射頻辨識(RFID:Radio Frequency Identification)標籤而言,在天線線圈附近例如後側,存在金屬一樣的導電性部件之情形下,信號收發困難。為提高通信靈敏度,而將高透磁率的陶瓷複合薄片佈置於RFID標籤的天線線圈與導電性部件之間。 In order to absorb electromagnetic waves radiated from electronic equipment and to absorb electromagnetic waves entering electronic equipment and the like, it is generally the case that ceramic composite sheets are mounted on the electronic equipment and the like. The ceramic composite sheet is made by bonding a thin film (resin layer) to an amorphous magnetic body, a fired ferrite magnetic body, a composite magnetic body formed of a magnetic powder such as ferrite and a binder resin, and a fired ferrite It is constructed on a magnetic body such as a body. Particularly, in the case of a radio frequency identification (RFID: Radio Frequency Identification) tag that uses an antenna coil to communicate with electromagnetic waves, it is difficult to transmit and receive signals when there is a conductive member like a metal near the antenna coil, for example on the back side. In order to improve communication sensitivity, a ceramic composite sheet with high permeability is arranged between the antenna coil and the conductive member of the RFID tag.

如上所述,將FPC等具有可撓性的電子材料製成平面形狀以製成天線,再將陶瓷複合薄片安裝在該天線基板上,以減少金屬在電子設備內的影響,獲得良好的通信特 性。於該情形下,為按照貼附部分的凹凸而進行貼附,一般採取以下做法。即,先將燒成陶瓷層分割成小片,再以其作柔軟的薄片使用。而且,為防止分割出的小片分離,且防止從被分割成小片的部分落粉(這裡,“落粉”指的是陶瓷碎片等微粉脫離而落下來),而將具有黏合層的樹脂薄膜(樹脂層)貼合在燒成陶瓷層的兩個表面上以後,再將燒成陶瓷層分割成小片。這樣一來,便能夠防止從小片的切割面落粉(參照例如專利文獻1)。 As mentioned above, the FPC and other flexible electronic materials are made into a planar shape to make an antenna, and then a ceramic composite sheet is mounted on the antenna substrate to reduce the influence of metal in the electronic device and obtain good communication characteristics. Sex. In this case, in order to attach according to the unevenness of the attaching part, the following methods are generally adopted. That is, the fired ceramic layer is divided into small pieces, and then used as a soft sheet. In addition, in order to prevent the divided pieces from separating and prevent powder falling from the divided parts (here, "fluttering" refers to the separation of fine powder such as ceramic fragments and falling), a resin film with an adhesive layer ( After the resin layer is attached to the two surfaces of the fired ceramic layer, the fired ceramic layer is divided into small pieces. In this way, powder falling from the cut surface of the small piece can be prevented (see, for example, Patent Document 1).

另一方面,陶瓷複合薄片出於裝入設備內之際對尺寸的限制,而需要將它的形狀加工成與天線基板的外周形狀相同,在某些情形下,還需要進行在該陶瓷複合薄片的內部打上通孔等切割步驟。在該情況下,因為要將具備黏合層的樹脂薄膜貼合於燒成陶瓷層的兩表面上,所以樹脂層和燒成陶瓷層的斷面(切割面)會伴隨著切割等露出來。其結果是該已露出的切割面上會出現以下現象。被切割的陶瓷粒子的碎片(以下,將此稱為“陶瓷碎片”)即將脫離而殘留在切割面的陶瓷層上,或者已脫離的陶瓷碎片附著於黏合層上。這些陶瓷碎片會在被裝入的電子設備內部脫落(以下稱此為“落粉”)現象,此乃問題所在。 On the other hand, due to the size limitation of the ceramic composite sheet when it is installed in the equipment, its shape needs to be processed to be the same as the outer peripheral shape of the antenna substrate. In some cases, the ceramic composite sheet needs to be processed. Punch through holes and other cutting steps on the inside. In this case, since the resin film provided with the adhesive layer is bonded to both surfaces of the fired ceramic layer, the cross section (cut surface) of the resin layer and the fired ceramic layer will be exposed with cutting or the like. As a result, the following phenomena appear on the exposed cut surface. Fragments of the cut ceramic particles (hereinafter referred to as "ceramic fragments") are about to detach and remain on the ceramic layer of the cut surface, or the detached ceramic fragments adhere to the adhesive layer. These ceramic fragments will fall off inside the loaded electronic device (hereinafter referred to as "powder falling") phenomenon, which is the problem.

因此,作為防止來自切割面之落粉的方法,能夠想到讓樹脂薄膜等的保護材附著於該切割面上。但是,如果是一個複雜的切割面,則讓保護材附著的步驟將變得複雜,工時數大幅度增加,而缺乏實用性。而且,如果保護材的附著粗粗糙糙的話,則會從尚未附著有保護材的部分 發生陶瓷碎片的落粉。 Therefore, as a method of preventing powder falling from the cut surface, it is conceivable to attach a protective material such as a resin film to the cut surface. However, if it is a complicated cutting surface, the steps for attaching the protective material will become complicated, and the number of working hours will be greatly increased, which lacks practicality. Moreover, if the adhesion of the protective material is rough and rough, it will be removed from the part where the protective material has not yet been attached. Powder falling of ceramic fragments occurred.

[先前技術文獻] [Prior Technical Literature]

[專利文獻1]日本特開2005-15293號公報。 [Patent Document 1] Japanese Patent Application Laid-Open No. 2005-15293.

在上述習知專利文獻1所公開的技術內容中,在燒成陶瓷層的形成有引誘槽的面上、或者與其相反一側的面上設置有由樹脂層和黏合層構成的積層層例如雙面膠帶。而且,在與形成有積層層的面相反一側的表面上設置有用於防止落粉的保護層。結果是,因為保護層存在於沿著引誘槽分割的分割面上,所以能夠防止陶瓷碎片的落粉。但是,在用沖床、切割刀等將該陶瓷複合薄片切成所希望的形狀的情形下、用沖頭在陶瓷複合薄片的一部分上沖出孔的情形下、用湯姆遜模進行切割的情形下或者用雷射光進行切割的情形下等,因為燒成陶瓷層會露出來,所以在該切割面上發生陶瓷碎片的落粉的可能性高。 In the technical content disclosed in the above-mentioned conventional patent document 1, a laminated layer composed of a resin layer and an adhesive layer, such as a double layer, is provided on the surface of the fired ceramic layer on which the attracting groove is formed, or on the opposite side thereof. Face tape. Furthermore, a protective layer for preventing powder falling is provided on the surface opposite to the surface on which the build-up layer is formed. As a result, since the protective layer exists on the dividing surface divided along the attracting groove, it is possible to prevent the ceramic fragments from falling off. However, in the case of cutting the ceramic composite sheet into the desired shape with a punch, cutting knife, etc., in the case of punching a hole in a part of the ceramic composite sheet with a punch, or in the case of cutting with a Thomson die Or in the case of cutting with laser light, since the fired ceramic layer will be exposed, there is a high possibility that ceramic fragments will fall on the cut surface.

亦即,因為是在燒成陶瓷層的至少一個面上隔著黏合層貼著有樹脂層的陶瓷複合薄片,所以會發生以下情況,即將脫離燒成陶瓷層的切割面的陶瓷碎片在將該陶瓷複合薄片安裝到攜帶終端等產品的作業中會掉在該產品內,或者脫離了燒成陶瓷層的切割面的陶瓷碎片暫時附著於黏合層而殘留下來,在產品的使用過程中該陶瓷碎片會掉在該產品內。上述落粉是一個大問題。 That is, because it is a ceramic composite sheet with a resin layer pasted on at least one surface of the fired ceramic layer via an adhesive layer, the following situation may occur. The ceramic fragments that are about to leave the cut surface of the fired ceramic layer The ceramic composite sheet will fall into the product when it is installed in a portable terminal or other products, or the ceramic fragments that have separated from the cut surface of the fired ceramic layer will temporarily adhere to the adhesive layer and remain. The ceramic fragments will remain during the use of the product. Will fall into the product. The above powder falling is a big problem.

本發明正是鑑於上述各點而完成的。其目的在於,可 靠地防止在陶瓷複合薄片的已露出的切割面上發生落粉。 The present invention has been completed in view of the above points. The purpose is to It reliably prevents powder falling on the exposed cutting surface of the ceramic composite sheet.

為達成上述目的,本發明中,做到了將黏合性剝離部件按壓在陶瓷複合薄片的露出來的切割面上,事先強制性地除去殘留在陶瓷複合薄片的切割面上的陶瓷碎片。 To achieve the above object, in the present invention, the adhesive release member is pressed against the exposed cut surface of the ceramic composite sheet, and the ceramic fragments remaining on the cut surface of the ceramic composite sheet are forcibly removed in advance.

具體而言,本發明的陶瓷複合薄片的製造方法具備燒成步驟、貼附步驟、切割步驟以及除去步驟。在該燒成步驟中,對規定形狀的陶瓷胚片進行燒成而形成燒成陶瓷層。在該貼附步驟中,隔著黏合層將樹脂層貼著在該燒成陶瓷層的至少一個面上來形成陶瓷複合薄片。在該切割步驟中,將該燒成陶瓷層和該樹脂層同時切成所希望的形狀。在該除去步驟中,將具有黏合性剝離面的黏合性剝離部件按壓在該切割步驟中露出的切割面上,將存在於該切割面上的陶瓷碎片除去。 Specifically, the manufacturing method of the ceramic composite sheet of the present invention includes a firing step, an attaching step, a cutting step, and a removing step. In this firing step, a ceramic green sheet of a predetermined shape is fired to form a fired ceramic layer. In this attaching step, a resin layer is attached to at least one surface of the fired ceramic layer via an adhesive layer to form a ceramic composite sheet. In this cutting step, the fired ceramic layer and the resin layer are simultaneously cut into a desired shape. In this removing step, the adhesive peeling member having an adhesive peeling surface is pressed against the cut surface exposed in the cutting step, and the ceramic fragments present on the cut surface are removed.

根據該構成,藉由除去步驟能夠去掉脫離燒成陶瓷層或者即將脫離燒成陶瓷層的陶瓷碎片,故在將它裝入產品內之際,能夠大幅度地減少陶瓷碎片等脫離陶瓷複合薄片而掉在產品內所引起的不良現象的發生。 According to this configuration, the ceramic fragments that have separated from the fired ceramic layer or are about to be separated from the fired ceramic layer can be removed by the removing step. Therefore, when it is put into the product, it is possible to greatly reduce the separation of ceramic fragments from the ceramic composite sheet. The occurrence of undesirable phenomena caused by falling into the product.

可以如此,本發明的陶瓷複合薄片的製造方法中,該黏合性剝離面的黏合力比該黏合層的黏合力強。在該除去步驟中,將該黏合性剝離面按壓在該燒成陶瓷層、該樹脂層以及該黏合層上。 In this way, in the method of manufacturing the ceramic composite sheet of the present invention, the adhesive force of the adhesive release surface is stronger than the adhesive force of the adhesive layer. In the removing step, the adhesive release surface is pressed against the fired ceramic layer, the resin layer, and the adhesive layer.

根據該構成,黏合性剝離部件的黏合性剝離面的黏合力強於黏合層的黏合力,故即使在陶瓷碎片等脫離燒成陶 瓷層而附著於黏合層的情形下,也能夠將陶瓷碎片去掉。 According to this structure, the adhesive force of the adhesive peeling surface of the adhesive peeling member is stronger than the adhesive force of the adhesive layer, so even if the ceramic fragments are separated from the fired ceramic When the ceramic layer is attached to the adhesive layer, the ceramic fragments can also be removed.

可以如此,本發明的陶瓷複合薄片的製造方法中,在該除去步驟中,用吸引手段從該切割面上吸引該陶瓷碎片。 In this way, in the method of manufacturing a ceramic composite sheet of the present invention, in the removing step, the ceramic fragments are attracted from the cut surface by a suction means.

根據該構成,能夠可靠地將陶瓷碎片除去。 According to this structure, the ceramic fragments can be reliably removed.

可以如此,本發明的陶瓷複合薄片的製造方法中,在該除去步驟中,將該切割面對齊地將複數張陶瓷複合薄片重疊起來,將黏合性剝離部件同時按壓在該複數張陶瓷複合薄片的各個該切割面上。 In this way, in the method of manufacturing a ceramic composite sheet of the present invention, in the removing step, a plurality of ceramic composite sheets are stacked so that the cut surface is aligned, and the adhesive release member is simultaneously pressed against the plurality of ceramic composite sheets. Each of the cutting surface.

根據該構成,能夠針對複數張陶瓷複合薄片同時進行除去步驟,故能夠使生產性提高。特別是,在將較薄的陶瓷複合薄片重疊起來的情形下,也容易處理。而且,複數張陶瓷複合薄片積層,切割面的厚度增厚,切割面難以變形,故能夠將黏合性剝離部件可靠地按壓在切割面上。 According to this structure, it is possible to simultaneously perform the removal step for a plurality of ceramic composite sheets, so that productivity can be improved. In particular, it is easy to handle when stacking thin ceramic composite sheets. In addition, when a plurality of ceramic composite sheets are laminated, the thickness of the cut surface is increased, and the cut surface is difficult to deform, so the adhesive peeling member can be reliably pressed on the cut surface.

可以如此,本發明的陶瓷複合薄片的製造方法中,在該除去步驟以前進一步具備對該切割面進行刷擦後再除去該陶瓷碎片的刷擦步驟。 In this way, the method for manufacturing a ceramic composite sheet of the present invention may further include a brushing step of brushing the cut surface and then removing the ceramic fragments before the removing step.

根據該構成,因為能夠先將容易脫離的陶瓷碎片等除去,所以能夠使要在除去步驟中除去的陶瓷碎片等減少,故易於可靠地除去陶瓷碎片等。特別是,一次按壓附著於黏合性剝離部件的黏合性剝離面上的陶瓷碎片等減少,故能夠增加黏合性剝離部件的使用次數,無需頻繁地更換。結果是作業性提高。 According to this configuration, since the easily detached ceramic fragments and the like can be removed first, the ceramic fragments and the like to be removed in the removal step can be reduced, and the ceramic fragments and the like can be easily and reliably removed. In particular, since ceramic fragments and the like attached to the adhesive peeling surface of the adhesive peeling member are reduced by one pressing, the number of uses of the adhesive peeling member can be increased without frequent replacement. As a result, workability is improved.

可以如此,本發明的陶瓷複合薄片的製造方法中, 該刷擦步驟中的刷擦,係針對複數張陶瓷複合薄片重疊起來的方向及與該方向成直角的方向,朝著與該兩方向不同的方向相對移動而進行者。 It can be so, in the method of manufacturing the ceramic composite sheet of the present invention, The brushing in the brushing step is performed by relative movement in directions different from the two directions in the direction in which the plurality of ceramic composite sheets are stacked and the direction at right angles to the direction.

根據該構成,易於除去陶瓷碎片等,陶瓷碎片等不會被夾在陶瓷複合薄片之間即能夠將陶瓷碎片除去。 According to this structure, the ceramic fragments and the like can be easily removed, and the ceramic fragments and the like can be removed without being sandwiched between the ceramic composite sheets.

可以如此,本發明的陶瓷複合薄片的製造方法中,在該除去步驟中,包括檢查陶瓷碎片在被按壓在該切割面上的該黏合性剝離部件上的附著狀態,且根據該檢查結果判斷是否進一步按壓該黏合性剝離部件的步驟。 This may be the case. In the method for manufacturing a ceramic composite sheet of the present invention, the removing step includes inspecting the adhesion state of the ceramic fragments on the adhesive peeling member pressed on the cut surface, and judging whether or not according to the inspection result The step of further pressing the adhesive peeling member.

根據該構成,能夠根據陶瓷碎片等的產生狀況除去陶瓷碎片,不會做無用功。 According to this structure, the ceramic fragments can be removed in accordance with the generation situation of the ceramic fragments and the like, and wasteful work is not performed.

根據本發明,因為能夠去掉陶瓷碎片,所以在裝入產品上之際,能夠大幅度地降低因陶瓷碎片等脫離陶瓷複合薄片而掉到產品內所引起的不良現象的發生。 According to the present invention, since the ceramic fragments can be removed, it is possible to greatly reduce the occurrence of defects caused by the ceramic fragments and the like being separated from the ceramic composite sheet and falling into the product when the ceramic fragments are put into the product.

1:樹脂薄膜 1: Resin film

2:陶瓷胚片 2: ceramic blank

2a、2b:引誘槽、分割線 2a, 2b: lure slot, dividing line

2c:小片 2c: small piece

3:燒成陶瓷層 3: Firing the ceramic layer

3a:切割面 3a: cutting surface

3b:端面 3b: end face

4:樹脂層 4: Resin layer

4a:切割面 4a: cutting surface

5:黏合層 5: Adhesive layer

5a:切割面 5a: cutting surface

6:積層層 6: Layered layers

7:保護層 7: protective layer

8:剝離薄片 8: Peel off the sheet

10:陶瓷複合薄片 10: Ceramic composite sheet

11:切割面 11: Cutting surface

S:陶瓷碎片 S: ceramic fragments

21:黏合性剝離部件 21: Adhesive peeling parts

21a:黏合性剝離面 21a: Adhesive peeling surface

22:吸引手段 22: Attraction

25:檢查手段 25: Inspection means

26:判斷手段 26: Judgment

60:分割裝置 60: Dividing device

61:第一輥 61: The first roll

62:第二輥 62: second roll

70:分割裝置 70: Dividing device

71:上模 71: upper die

72:下模 72: Lower die

73:壓緊模 73: Compression die

A:箭頭 A: Arrow

S1~S8、S8a:步驟 S1~S8, S8a: steps

圖1係顯示本發明第一實施方式之陶瓷複合薄片的一部分的剖視圖。 Fig. 1 is a cross-sectional view showing a part of a ceramic composite sheet according to the first embodiment of the present invention.

圖2係顯示本發明第一實施方式之陶瓷複合薄片的燒成陶瓷層的分割狀態的俯視圖。 2 is a plan view showing the divided state of the fired ceramic layer of the ceramic composite sheet according to the first embodiment of the present invention.

圖3係顯示本發明第一實施方式之陶瓷複合薄片的製造方法的流程圖。 Fig. 3 is a flowchart showing the method for manufacturing a ceramic composite sheet according to the first embodiment of the present invention.

圖4係一概念圖,示出將本發明的第一實施方式的陶瓷複合薄片的燒成陶瓷層分割為小片的分割步驟。 Fig. 4 is a conceptual diagram showing a dividing step of dividing the fired ceramic layer of the ceramic composite sheet of the first embodiment of the present invention into small pieces.

圖5係一概念圖,顯示將本發明的第一實施方式的陶瓷複合薄片切成所希望的形狀的切割步驟。 Fig. 5 is a conceptual diagram showing a cutting step of cutting the ceramic composite sheet of the first embodiment of the present invention into a desired shape.

圖6係一概念圖,顯示將黏合材按壓在本發明的第一實施方式的陶瓷複合薄片的切割面上的步驟。 Fig. 6 is a conceptual diagram showing the steps of pressing the adhesive material on the cut surface of the ceramic composite sheet according to the first embodiment of the present invention.

圖7係顯示本發明的第一實施方式的陶瓷複合薄片的製造方法的圖。 Fig. 7 is a diagram showing a method of manufacturing a ceramic composite sheet according to the first embodiment of the present invention.

圖8係顯示本發明的第一實施方式的陶瓷複合薄片的製造方法的圖。 Fig. 8 is a diagram showing a method of manufacturing a ceramic composite sheet according to the first embodiment of the present invention.

圖9係顯示本發明的第一實施方式的陶瓷複合薄片的製造方法的圖。 Fig. 9 is a diagram showing a method of manufacturing a ceramic composite sheet according to the first embodiment of the present invention.

圖10係顯示本發明的第一實施方式的陶瓷複合薄片的製造方法的圖。 Fig. 10 is a diagram showing a method of manufacturing a ceramic composite sheet according to the first embodiment of the present invention.

圖11係顯示本發明的第二實施方式的陶瓷複合薄片的製造方法的流程圖。 Fig. 11 is a flowchart showing a method of manufacturing a ceramic composite sheet according to the second embodiment of the present invention.

圖12係顯示本發明的第三實施方式的陶瓷複合薄片的製造方法的流程圖。 Fig. 12 is a flowchart showing a method of manufacturing a ceramic composite sheet according to a third embodiment of the present invention.

圖13係顯示本發明的第三實施方式的陶瓷複合薄片的端面的刷擦(brushing)步驟的簡圖。 Fig. 13 is a schematic diagram showing a brushing step of the end face of the ceramic composite sheet according to the third embodiment of the present invention.

以下,參照圖式詳細說明本發明的實施方式。以下對較佳實施方式之說明僅為對本質性示例之說明而已,並無限制本發明、其適用物或其用途的意圖。 Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. The following descriptions of the preferred embodiments are merely illustrative of essential examples, and are not intended to limit the present invention, its applicable objects, or its uses.

〔第一實施方式〕 [First Embodiment]

圖1係顯示與本發明第一實施方式相關的陶瓷複合 薄片的一部分的剖視圖。參照圖1說明第一實施方式的陶瓷複合薄片。 Figure 1 shows the ceramic composite related to the first embodiment of the present invention A cross-sectional view of a part of the sheet. The ceramic composite sheet of the first embodiment will be described with reference to FIG. 1.

陶瓷複合薄片10呈積層構造。具體而言,在具有規定形狀(例如矩形)的燒成陶瓷層3的一側(圖1中,下側)的表面上積層有黏合層5,在黏合層5的表面一側積層有樹脂層4,在樹脂層4的表面一側積層有另一黏合層5,由此而構成積層層6。而且,在該積層層6的表面一側積層有剝離薄片8,在該燒成陶瓷層3的另一側(圖1中,上側)的表面上,隔著黏合層5積層有樹脂層4,由此而構成保護層7。此外,為便於說明,於圖1之剖視圖中,與實際厚度相比,對各層的厚度進行了誇張顯示。 The ceramic composite sheet 10 has a laminated structure. Specifically, an adhesive layer 5 is laminated on one side (lower side in FIG. 1) of the fired ceramic layer 3 having a predetermined shape (for example, rectangular), and a resin layer is laminated on the surface side of the adhesive layer 5 4. Another adhesive layer 5 is laminated on the surface side of the resin layer 4, thereby constituting the laminated layer 6. Furthermore, a release sheet 8 is laminated on one side of the laminated layer 6, and a resin layer 4 is laminated on the other side (upper side in FIG. 1) of the fired ceramic layer 3 via an adhesive layer 5. Thus, the protective layer 7 is formed. In addition, for ease of description, in the cross-sectional view of FIG. 1, the thickness of each layer is exaggeratedly displayed compared with the actual thickness.

作為形成燒成陶瓷層3的陶瓷材料,可以使用鐵氧體等公知材料。作為鐵氧體,只要是軟鐵氧體即可,並無特別限制。可以使用公知的軟鐵氧體。例如能夠列舉出的公知的軟鐵氧體如下:Mn-Zn鐵氧體、Ni-Zn鐵氧體、Ni-Zn-Cu鐵氧體、Mn-Mg鐵氧體、Li鐵氧體等。而且,還能夠使用根據所使用的電磁波的頻率改變了組成的軟鐵氧體。 As the ceramic material forming the fired ceramic layer 3, a known material such as ferrite can be used. The ferrite is not particularly limited as long as it is a soft ferrite. A well-known soft ferrite can be used. For example, the following known soft ferrites can be cited: Mn-Zn ferrite, Ni-Zn ferrite, Ni-Zn-Cu ferrite, Mn-Mg ferrite, Li ferrite, and the like. Furthermore, it is also possible to use soft ferrite whose composition is changed according to the frequency of the electromagnetic wave used.

燒成陶瓷層3的厚度為0.01~5mm,較佳為0.02~3mm,更佳為0.03~1mm。於厚度小於0.01mm之情形,難以作為薄片進行處理,從而會導致陶瓷複合薄片10的製造作業下之成品率不良。於超過5mm之情形,燒成陶瓷層3的重量增大,係非較佳的。 The thickness of the fired ceramic layer 3 is 0.01 to 5 mm, preferably 0.02 to 3 mm, and more preferably 0.03 to 1 mm. When the thickness is less than 0.01 mm, it is difficult to handle as a sheet, which may lead to poor yield in the manufacturing operation of the ceramic composite sheet 10. When it exceeds 5 mm, the weight of the fired ceramic layer 3 increases, which is not preferable.

樹脂層4與黏合層5設置為一體的積層層6之例,例如 為雙面膠帶。對雙面膠帶無特別限制,可以使用公知的雙面膠帶。作為積層層6,可以是在燒成陶瓷層3的一個面上,依次積層黏合層5、既具有折彎性又具有伸縮性的樹脂層(樹脂薄膜或薄片)4、黏合層5以及剝離薄片8而成。 An example of the build-up layer 6 in which the resin layer 4 and the adhesive layer 5 are integrated, for example It is a double-sided tape. The double-sided tape is not particularly limited, and a known double-sided tape can be used. As the build-up layer 6, one surface of the fired ceramic layer 3 may be laminated in this order with an adhesive layer 5, a bendable and stretchable resin layer (resin film or sheet) 4, an adhesive layer 5, and a release sheet 8 becomes.

作為設置在燒成陶瓷層3的、與形成有積層層6的面相反一側的面上的保護層7,只要由在燒成陶瓷層3被以分割線2a、分割線2b分割成小片2c(都參照圖2)之情形下能夠延伸且不斷裂的樹脂形成即可,無特別限制。可以使用公知的單面膠帶。例如聚酯薄膜膠帶等。保護層7的厚度為0.001~0.2mm,較佳為0.005~0.15mm,更佳為0.01~0.1mm。於保護層7的厚度小於0.001mm之情形,易斷裂而難以防止落粉。於超過0.2mm之情形,因防止落粉的效果已飽和,故無需讓厚度超過0.2mm。 As the protective layer 7 provided on the surface of the fired ceramic layer 3 opposite to the surface on which the build-up layer 6 is formed, the fired ceramic layer 3 is divided into small pieces 2c by dividing lines 2a and 2b. (All refer to FIG. 2) In the case of the resin, it is only necessary to form a resin that can be stretched without breaking, and there is no particular limitation. A well-known single-sided tape can be used. For example, polyester film tape, etc. The thickness of the protective layer 7 is 0.001 to 0.2 mm, preferably 0.005 to 0.15 mm, and more preferably 0.01 to 0.1 mm. When the thickness of the protective layer 7 is less than 0.001 mm, it is easy to break and it is difficult to prevent powder falling. In the case of more than 0.2mm, since the effect of preventing powder falling is saturated, there is no need to make the thickness more than 0.2mm.

設置在燒成陶瓷層3之兩側的面上的積層層6和保護層7的結合方式無特別限制。既可以將積層層6設置在燒成陶瓷層3的兩側,又可以將保護層7設置在燒成陶瓷層3的兩側。 The bonding method of the build-up layer 6 and the protective layer 7 provided on both sides of the fired ceramic layer 3 is not particularly limited. The build-up layer 6 may be provided on both sides of the fired ceramic layer 3, and the protective layer 7 may be provided on both sides of the fired ceramic layer 3.

如圖2所示,有時候,在陶瓷胚片2的一個面上,燒成前事先形成引誘槽2a、引誘槽2b。於此情形下,因為該引誘槽2a、引誘槽2b會變成分割線2a、分割線2b,所以引誘槽2a、引誘槽2b只要是沿著分割線2a、分割線2b誘導裂縫的槽即可,對其形狀、大小(深度)無特別限制。而且,引誘槽2a、引誘槽2b既可以是連續的槽,也可以是斷續的槽,其分布形狀既可以是棋盤格子形狀,也可以是其它形 狀。例如,可以使用日本特開2005-15293號公報等中所公開的引誘槽2a、引誘槽2b。因此,這裡不再對引誘槽做詳細的說明。引誘槽2a、引誘槽2b的剖面形狀,只要是燒成陶瓷層3能夠被以引誘槽2a、引誘槽2b進行分割即可,無特別限制。 As shown in Fig. 2, there are cases in which an attracting groove 2a and an attracting groove 2b are formed in advance on one surface of the ceramic green sheet 2 before firing. In this case, since the attracting groove 2a and the attracting groove 2b become the dividing line 2a and the dividing line 2b, the attracting groove 2a and the attracting groove 2b may be grooves that induce cracks along the dividing line 2a and the dividing line 2b. There are no particular restrictions on its shape and size (depth). Moreover, the attracting groove 2a and the attracting groove 2b may be continuous grooves or discontinuous grooves, and their distribution shape may be a checkerboard lattice shape or other shapes. shape. For example, the attracting groove 2a and the attracting groove 2b disclosed in Japanese Patent Application Laid-Open No. 2005-15293 etc. can be used. Therefore, the lure slot will not be described in detail here. The cross-sectional shape of the attraction groove 2a and the attraction groove 2b is not particularly limited as long as the fired ceramic layer 3 can be divided by the attraction groove 2a and the attraction groove 2b.

較佳為保護層7具有以下功能。即,燒成陶瓷層3能夠以引誘槽(分割線)2a、引誘槽(分割線)2b進行分割,讓燒成陶瓷層3具有折彎性,而且燒成陶瓷層3裂開之際透磁率降低得也少。特別是,保護層7,只要由即使燒成陶瓷層3被以引誘槽2a、引誘槽2b朝向外側地折過來且以分割線2a、分割線2b進行分割,也不會破裂而會延伸的樹脂形成即可,無特別限制。藉由在設置有引誘槽2a、引誘槽2b的燒成陶瓷層3的表面上形成保護層7,而能夠防止燒成陶瓷層3被引誘槽(分割線)2a、引誘槽(分割線)2b分割後之情形下的落粉,結果是能夠進一步提高可靠性與耐久性。 Preferably, the protective layer 7 has the following functions. That is, the fired ceramic layer 3 can be divided by the attracting groove (parting line) 2a and the attracting groove (parting line) 2b, so that the fired ceramic layer 3 has bendability, and the magnetic permeability when the fired ceramic layer 3 is cracked Reduced too much. In particular, as long as the protective layer 7 is made of resin that will not break and extend even if the fired ceramic layer 3 is folded outward with the attracting groove 2a and the attracting groove 2b and divided by the dividing line 2a and the dividing line 2b It is not particularly limited as long as it is formed. By forming the protective layer 7 on the surface of the fired ceramic layer 3 provided with the attracting groove 2a and the attracting groove 2b, it is possible to prevent the fired ceramic layer 3 from being caught by the attracting groove (partition line) 2a and the attracting groove (partition line) 2b. The powder falling in the case after division results in a further improvement in reliability and durability.

接下來,參照圖3、圖7到圖10說明本發明之陶瓷複合薄片10的製造方法。 Next, a method of manufacturing the ceramic composite sheet 10 of the present invention will be described with reference to FIGS. 3 and 7 to 10.

如圖7到圖10所示,於本發明之陶瓷複合薄片10的製造方法下,首先,將在PET等的樹脂薄膜1上獲得的陶瓷胚片2切成規定的形狀,然後將樹脂薄膜1剝離下來而獲得陶瓷胚片2。接下來,如圖10所示,對陶瓷胚片2進行燒成並以其作為燒成陶瓷層3,將上述積層層6和保護層7積層於該燒成陶瓷層3的兩面上,而獲得陶瓷複合薄片10。之後,將積層層6和保護層7貼合後所獲得的陶瓷複合薄片10 的燒成陶瓷層3分割成小片,再根據使用目的、所使用的產品等,利用沖壓機等機械設備或雷射光等將陶瓷複合薄片10切成所希望的形狀。然後,將黏合性剝離部件21按壓在由於切割而露出來的各切割面上,將能夠分離的陶瓷碎片S等去掉。 As shown in FIGS. 7 to 10, in the method of manufacturing the ceramic composite sheet 10 of the present invention, first, the ceramic green sheet 2 obtained on a resin film 1 such as PET is cut into a predetermined shape, and then the resin film 1 The ceramic green sheet 2 is obtained by peeling off. Next, as shown in FIG. 10, the ceramic green sheet 2 is fired and used as the fired ceramic layer 3, and the above-mentioned build-up layer 6 and the protective layer 7 are laminated on both sides of the fired ceramic layer 3 to obtain Ceramic composite sheet 10. After that, the ceramic composite sheet 10 obtained by bonding the build-up layer 6 and the protective layer 7 The fired ceramic layer 3 is divided into small pieces, and the ceramic composite sheet 10 is cut into a desired shape by mechanical equipment such as a press or laser light according to the purpose of use, the product used, and the like. Then, the adhesive peeling member 21 is pressed against each cut surface exposed by the cutting, and the separable ceramic fragments S and the like are removed.

更具體而言,首先,如圖7所示,在樹脂薄膜1上形成陶瓷胚片2(步驟S1)。 More specifically, first, as shown in FIG. 7, a ceramic green sheet 2 is formed on the resin film 1 (step S1).

此外,陶瓷胚片2能夠用公知方法製造出來。例如,將陶瓷粉末、黏合樹脂以及溶媒混合好以後,再用刮刀(doctor blade)等將混合物塗布在樹脂薄膜(或者樹脂薄片)1上,而獲得陶瓷胚片2。 In addition, the ceramic green sheet 2 can be manufactured by a known method. For example, after mixing the ceramic powder, the binder resin, and the solvent, the mixture is coated on the resin film (or resin sheet) 1 with a doctor blade or the like to obtain a ceramic green sheet 2.

陶瓷胚片2可以事先成形為規定的大小與形狀,於此情形,不需要在燒成前切斷。還可以作為一張連續的陶瓷胚片2成形後,再切成規定的大小與形狀來作為陶瓷胚片2。於此情形下,只要在進行燒成處理以前,將陶瓷胚片2切成規定的大小與形狀即可。無論在步驟S1之後、還是在後述的步驟S2之後都可以進行切割,而且還可以在步驟S1和步驟S2兩步驟中進行切割。 The ceramic green sheet 2 can be formed into a predetermined size and shape in advance. In this case, it is not necessary to cut it before firing. It can also be used as a continuous ceramic green sheet 2 after being formed, and then cut into a predetermined size and shape to be used as the ceramic green sheet 2. In this case, it is only necessary to cut the ceramic green sheet 2 into a predetermined size and shape before performing the firing treatment. Cutting can be carried out no matter after step S1 or after step S2 described later, and cutting can also be carried out in two steps of step S1 and step S2.

還可以在將陶瓷粉末、黏合樹脂以及溶媒混合好以後,再利用粉末壓縮成形法、注射成形法、壓延法、擠壓法等來獲得陶瓷胚片2。此外,還可以根據需要對陶瓷胚片2進行脫脂處理。 After mixing the ceramic powder, the binder resin, and the solvent, the ceramic green sheet 2 can be obtained by powder compression molding, injection molding, calendering, and extrusion. In addition, the ceramic green sheet 2 can also be degreased as needed.

接下來,如圖8所示,在陶瓷胚片2的一個面上形成引誘槽2a、引誘槽2b(步驟S2),該引誘槽2a、引誘槽2b會 變成裂縫(分割線)。如圖2所示,引誘槽2a、引誘槽2b形成為縱橫交錯的網格狀。引誘槽2a、引誘槽2b係藉由推壓與引誘槽2a、引誘槽2b相對應的成形刀等而形成。 Next, as shown in FIG. 8, an attracting groove 2a and an attracting groove 2b are formed on one surface of the ceramic green sheet 2 (step S2). It becomes a crack (parting line). As shown in Fig. 2, the attracting grooves 2a and 2b are formed in a crisscrossed grid shape. The attracting groove 2a and the attracting groove 2b are formed by pushing a shaped knife or the like corresponding to the attracting groove 2a and the attracting groove 2b.

如後所述,對陶瓷胚片2進行燒成而形成燒成陶瓷層3以後,燒成陶瓷層3被沿著該引誘槽2a、引誘槽2b進行分割,引誘槽2a變成分割線2a、分割線2b,燒成陶瓷層3被分割為很多個小片2c。 As described later, after the ceramic green sheet 2 is fired to form the fired ceramic layer 3, the fired ceramic layer 3 is divided along the attracting groove 2a and the attracting groove 2b, and the attracting groove 2a becomes the dividing line 2a. In line 2b, the fired ceramic layer 3 is divided into a large number of small pieces 2c.

引誘槽2a、引誘槽2b能夠在陶瓷胚片2之成形過程中、成形後或者燒成處理後形成。例如,於利用粉末壓縮成形法或者注射成形法形成引誘槽2a、引誘槽2b的情形,較佳為在陶瓷胚片2的成形過程中形成槽。於利用壓延法、擠壓法或者用刮刀等進行塗布而成形在樹脂薄膜1上的陶瓷胚片2上形成引誘槽2a、引誘槽2b之情形,較佳為在成形陶瓷胚片2以後且對陶瓷胚片2進行燒成以前,形成槽。 The attracting groove 2a and the attracting groove 2b can be formed during the forming process of the ceramic green sheet 2, after forming, or after firing treatment. For example, in the case of forming the attracting groove 2a and the attracting groove 2b by a powder compression molding method or an injection molding method, it is preferable to form the grooves during the molding process of the ceramic green sheet 2. In the case of forming the attracting grooves 2a and 2b on the ceramic green sheet 2 formed on the resin film 1 by calendering, extrusion, or coating with a doctor blade, it is preferable to form the ceramic green sheet 2 and to Before the ceramic green sheet 2 is fired, a groove is formed.

此外,本實施方式中,形成引誘槽2a、引誘槽2b,但是該步驟可以省略。特別是,於陶瓷胚片2很薄的情形,省略引誘槽2a、引誘槽2b,能夠分割為小片2c。 In addition, in this embodiment, the attracting groove 2a and the attracting groove 2b are formed, but this step can be omitted. In particular, when the ceramic green sheet 2 is very thin, the attracting groove 2a and the attracting groove 2b are omitted and can be divided into small pieces 2c.

接下來,如圖9所示,將樹脂薄膜1從在步驟S2中獲得的陶瓷胚片2上剝離下來,使其為僅具有陶瓷胚片2的薄片(步驟S3)。在後述的燒成步驟中,樹脂薄膜1是沒有用的,故在該步驟中就將樹脂薄膜1除去。 Next, as shown in FIG. 9, the resin film 1 is peeled off from the ceramic green sheet 2 obtained in step S2 to be a sheet having only the ceramic green sheet 2 (step S3). In the firing step described later, the resin film 1 is useless, so the resin film 1 is removed in this step.

接下來,將在步驟S3中獲得的陶瓷胚片2放入加熱爐中進行燒成處理,由此製造出燒成陶瓷層3(步驟S4)。該 步驟S4屬於公知的步驟,是日本特開2005-15293號公報等公開的方法,故詳細說明省略不提。此外,這裡,不是將陶瓷胚片2重疊起來,而是僅將一張陶瓷胚片2連續地送入加熱爐並進行熱處理的,但是將複數張陶瓷胚片重疊起來進行處理也是可以的。 Next, the ceramic green sheet 2 obtained in step S3 is put into a heating furnace for firing treatment, thereby manufacturing a fired ceramic layer 3 (step S4). The Step S4 is a well-known step and is a method disclosed in Japanese Patent Application Laid-Open No. 2005-15293 etc., so the detailed description is omitted. In addition, here, instead of stacking the ceramic green sheets 2, only one ceramic green sheet 2 is continuously fed into the heating furnace and heat-treated. However, it is also possible to stack a plurality of ceramic green sheets for processing.

接下來,如圖10所示,將樹脂層4與黏合層5成為一體的積層層6(例如雙面膠帶)設置在與在步驟S4中獲得的燒成陶瓷層3的形成有引誘槽2a、引誘槽2b的面相反一側的面上,並且在與形成有積層層6的面相反一側的表面上形成用於防止落粉的保護層7(步驟S5)。 Next, as shown in FIG. 10, a build-up layer 6 (for example, a double-sided tape) in which the resin layer 4 and the adhesive layer 5 are integrated is placed on the fired ceramic layer 3 obtained in step S4 where the attracting groove 2a, A protective layer 7 for preventing powder falling is formed on the surface opposite to the surface of the attracting groove 2b, and on the surface opposite to the surface on which the build-up layer 6 is formed (step S5).

經由黏合材將形成保護層7的PET樹脂等的薄膜或者薄片黏合在燒成陶瓷層3的表面上,由此形成保護層7。或者將含有形成保護層7的樹脂的塗料塗布在燒成陶瓷層3的表面上,由此形成保護層7。 A film or sheet of PET resin or the like forming the protective layer 7 is adhered to the surface of the fired ceramic layer 3 via an adhesive material, thereby forming the protective layer 7. Alternatively, a paint containing a resin that forms the protective layer 7 is coated on the surface of the fired ceramic layer 3 to form the protective layer 7.

具體而言,進行貼附(laminate)處理,將樹脂薄膜(黏合層5設置在樹脂層4上而形成的積層層6)貼附在燒成陶瓷層3的一個面上。此外,如圖1所示,剝離薄片8以能被剝離的狀態隔著黏合層5貼合於積層層6的表面一側。而且,保護層7被貼合於夾著燒成陶瓷層3的另一個面上。 Specifically, a laminating process is performed, and a resin film (laminated layer 6 formed by providing the adhesive layer 5 on the resin layer 4) is attached to one surface of the fired ceramic layer 3. In addition, as shown in FIG. 1, the release sheet 8 is bonded to the surface side of the build-up layer 6 with the adhesive layer 5 interposed therebetween in a peelable state. Furthermore, the protective layer 7 is bonded to the other surface sandwiching the fired ceramic layer 3.

在本步驟S5中可以這樣做。即,從防止燒成陶瓷層3的端面3b(參照圖10)露出的觀點出發,由大於燒成陶瓷層3的薄膜片構成積層層6和保護層7,且如圖10所示,讓積層層6的內表面和保護層7的內表面接觸並使其重疊,來進行接合,燒成陶瓷層3被積層層6和保護層7包起來。此外, 於能夠防止燒成陶瓷層3的落粉之情形,未必一定需要接合積層層6和保護層7。 This can be done in this step S5. That is, from the viewpoint of preventing the end surface 3b (see FIG. 10) of the fired ceramic layer 3 from being exposed, the laminated layer 6 and the protective layer 7 are composed of thin film sheets larger than the fired ceramic layer 3, and as shown in FIG. The inner surface of the layer 6 and the inner surface of the protective layer 7 are in contact with each other and overlapped to perform bonding, and the fired ceramic layer 3 is surrounded by the build-up layer 6 and the protective layer 7. In addition, In the case where powder falling of the fired ceramic layer 3 can be prevented, it is not necessarily necessary to join the build-up layer 6 and the protective layer 7.

這樣一來,形成了這樣的陶瓷複合薄片10,即樹脂層隔著黏合層5貼著於燒成陶瓷層3的兩個面上。 In this way, the ceramic composite sheet 10 is formed in which the resin layer is attached to both surfaces of the fired ceramic layer 3 with the adhesive layer 5 interposed therebetween.

此外,以上是一種將積層層6和保護層7設置在燒成陶瓷層3的表面上這樣的構成。但是除此以外,還可以使其為一種將積層層6或者保護層7僅設置在燒成陶瓷層3的一個面上這樣的構成,或者將積層層6(或保護層7)設置在燒成陶瓷層3的兩面上這樣的構成。 In addition, the above is a configuration in which the build-up layer 6 and the protective layer 7 are provided on the surface of the fired ceramic layer 3. However, in addition to this, it can also be a structure in which the build-up layer 6 or the protective layer 7 is provided on only one surface of the fired ceramic layer 3, or the build-up layer 6 (or the protective layer 7) may be provided in the fired ceramic layer 3. The ceramic layer 3 has such a structure on both sides.

接下來,以分割線2a、分割線2b為基準將在步驟S5中獲得的陶瓷複合薄片10的燒成陶瓷層3分割成小片2c(步驟S6)。此外,此時,形成在燒成陶瓷層3的一個面和另一個面上的積層層6和保護層7未被分割而是原樣留下來,僅有燒成陶瓷層3被分割成小片2c。藉由該構成,便能夠讓陶瓷複合薄片10根據要貼合的對象部件表面的凸凹狀態折彎而改變形狀,並且能夠防止燒成陶瓷層3的小片2c分離為單獨的一片片。 Next, the fired ceramic layer 3 of the ceramic composite sheet 10 obtained in step S5 is divided into small pieces 2c based on the dividing line 2a and the dividing line 2b (step S6). In addition, at this time, the build-up layer 6 and the protective layer 7 formed on one surface and the other surface of the fired ceramic layer 3 are not divided but remain as they are, and only the fired ceramic layer 3 is divided into small pieces 2c. With this configuration, the ceramic composite sheet 10 can be bent to change its shape in accordance with the unevenness of the surface of the target member to be bonded, and it is possible to prevent the small pieces 2c of the fired ceramic layer 3 from being separated into individual pieces.

例如,如圖4所示,利用分割裝置60將燒成陶瓷層3分割為小片2c。更具體而言,讓陶瓷複合薄片10通過小直徑的金屬輥(第一輥61)和大直徑的樹脂輥(第二輥62)之間,而將陶瓷複合薄片10的燒成陶瓷層3分割為小片2c。 For example, as shown in FIG. 4, the fired ceramic layer 3 is divided into small pieces 2c by the dividing device 60. More specifically, the ceramic composite sheet 10 is passed between a small-diameter metal roller (first roller 61) and a large-diameter resin roller (second roller 62), and the fired ceramic layer of the ceramic composite sheet 10 is divided into 3 For the small piece 2c.

此外,本實施方式中,將陶瓷複合薄片10的燒成陶瓷層3分割為小片2c,而易於折彎,但是存在不需要分割為小片2c的情形,於此情形,步驟S6可以省略。 In addition, in this embodiment, the fired ceramic layer 3 of the ceramic composite sheet 10 is divided into small pieces 2c for easy bending, but there are cases where it is not necessary to divide into small pieces 2c. In this case, step S6 can be omitted.

接下來,利用切割手段(沖模、切割刀、沖孔刀、雷射光等)將在步驟S6中獲得的陶瓷複合薄片10切成與貼附對象物的貼附部分相對應的形狀(步驟S7)。即,將燒成陶瓷層3和樹脂層4同時切成所希望的形狀。特別是,在利用機械切割手段(沖模、切割刀、沖孔刀等)進行切割之情形,會出現很多已脫離露出來的切割面的陶瓷碎片或者即將脫離露出來的切割面的陶瓷碎片,故使用本發明效果大。例如,如圖5所示,切割裝置70包括上模71、壓緊模73以及下模72。在由上模71和壓緊模73、下模72和壓緊模73夾住陶瓷複合薄片10的狀態下,讓一方相對移動而進行切割。還可以使用日本特開平11-42629號公報中所公開的剪切手段。 Next, the ceramic composite sheet 10 obtained in step S6 is cut into a shape corresponding to the attachment portion of the attachment object by a cutting means (a die, a cutting knife, a punching knife, a laser beam, etc.) (step S7) . That is, the fired ceramic layer 3 and the resin layer 4 are simultaneously cut into a desired shape. In particular, in the case of cutting by mechanical cutting means (punching dies, cutting knives, punching knives, etc.), there will be many ceramic fragments that have been separated from the exposed cutting surface or are about to be separated from the exposed cutting surface, so The effect of using the present invention is great. For example, as shown in FIG. 5, the cutting device 70 includes an upper mold 71, a compression mold 73 and a lower mold 72. In a state where the ceramic composite sheet 10 is sandwiched by the upper mold 71 and the pressing mold 73, and the lower mold 72 and the pressing mold 73, one of them is relatively moved to perform cutting. The cutting means disclosed in Japanese Patent Application Laid-Open No. 11-42629 can also be used.

此外,與機械切割相比,用雷射光進行切割能夠獲得很光滑的切割面,但是,也會產生脫離的陶瓷碎片、即將脫離的陶瓷碎片,儘管其量比較少。 In addition, compared with mechanical cutting, cutting with laser light can obtain a very smooth cutting surface, but it will also produce detached ceramic fragments, and ceramic fragments that are about to detach, although the amount is relatively small.

接下來,如圖1、圖6所示,將黏合性剝離部件21按壓在陶瓷複合薄片10的在步驟S7中獲得的燒成陶瓷層3的切割面3a與樹脂層4的切割面4a、黏合層5的切割面5a以及保護層7的切割面上,讓附著在黏合層5等上或者即將脫離的(或者可分離的)陶瓷碎片S等附著於黏合性剝離部件21的黏合性剝離面21a上而去掉(步驟S8)。 Next, as shown in FIGS. 1 and 6, the adhesive peeling member 21 is pressed on the cut surface 3a of the fired ceramic layer 3 obtained in step S7 of the ceramic composite sheet 10 and the cut surface 4a of the resin layer 4, and the bonding The cut surface 5a of the layer 5 and the cut surface of the protective layer 7, so that the ceramic fragments S, etc. attached to the adhesive layer 5 or about to be released (or detachable) are attached to the adhesive peeling surface 21a of the adhesive peeling member 21 Top and remove (step S8).

此外,如果不僅將黏合性剝離面21a按壓在燒成陶瓷層3的切割面3a上,還將黏合性剝離面21a按壓在樹脂層4的切割面4a、黏合層5的切割面5a以及保護層7的切割面 上,那麼也能夠將脫離燒成陶瓷層3而附著於黏合層5的陶瓷碎片S等除去。特別是,藉由使用具有強於黏合層5的黏合力的黏合性剝離部件21,則能夠藉由附著而將附著於黏合層5的陶瓷碎片S等去掉,故除去陶瓷碎片S等的除去效果提高。 In addition, if not only the adhesive release surface 21a is pressed on the cut surface 3a of the fired ceramic layer 3, but also the adhesive release surface 21a is pressed on the cut surface 4a of the resin layer 4, the cut surface 5a of the adhesive layer 5, and the protective layer 7 cut surface Above, the ceramic fragments S and the like attached to the adhesive layer 5 after being separated from the fired ceramic layer 3 can also be removed. In particular, by using the adhesive peeling member 21 having a stronger adhesive force than the adhesive layer 5, the ceramic fragments S etc. attached to the adhesive layer 5 can be removed by adhesion, so the removal effect of the ceramic fragments S etc. improve.

可以如此,在步驟S8中,將切割面對齊地將複數張陶瓷複合薄片10重疊起來,再將黏合性剝離部件21同時按壓在複數張陶瓷複合薄片10的各切割面上。 In step S8, a plurality of ceramic composite sheets 10 are overlapped with the cut surfaces aligned, and then the adhesive peeling member 21 is pressed on each cut surface of the plurality of ceramic composite sheets 10 at the same time.

與機械切割相比,雷射光切割能夠獲得較光滑的切割面,但是與機械切割一樣,存在脫離的陶瓷碎片S等,而且還存在少量的陶瓷碎片S等殘留在某些切割面的切口處這樣的情形。於此情形,藉由將黏合性剝離面21a按壓在將樹脂層4的切割面4a、黏合層5的切割面5a以及保護層7的切割面上,也能夠將陶瓷碎片S去掉。 Compared with mechanical cutting, laser cutting can obtain a smoother cutting surface, but like mechanical cutting, there are separated ceramic fragments S, etc., and there are also a small amount of ceramic fragments S remaining in the cuts of some cutting surfaces. Situation. In this case, by pressing the adhesive peeling surface 21a on the cut surface 4a of the resin layer 4, the cut surface 5a of the adhesive layer 5, and the cut surface of the protective layer 7, the ceramic fragments S can also be removed.

於用雷射光進行切割之情形,有時候,由於雷射光的加熱照射而昇華的鐵氧體(ferrite)、樹脂會變成碳素微粒而殘留於切割面上。因此,將黏合性剝離面21a按壓在雷射光切割面上,不僅強制性地除去陶瓷碎片S,還強制性地除去附著於上述切割面上的碳素微粒,故可以說是有效果的。本發明中,將這些碳素微粒一起統稱為陶瓷碎片等。 In the case of cutting with laser light, sometimes the ferrite and resin sublimed by the heating and irradiation of the laser light may become carbon particles and remain on the cutting surface. Therefore, pressing the adhesive peeling surface 21a against the laser cut surface not only forcibly removes the ceramic fragments S but also forcibly removes the carbon particles adhering to the cut surface, so it can be said to be effective. In the present invention, these carbon fine particles are collectively referred to as ceramic chips and the like.

較佳為在步驟S8中,讓真空空氣等吸引手段22靠近切割面3a、切割面4a、切割面5a來除去陶瓷碎片S等。此外,較佳為此情形下的吸引空氣係已不帶靜電。 Preferably, in step S8, the suction means 22 such as vacuum air is brought close to the cutting surface 3a, the cutting surface 4a, and the cutting surface 5a to remove the ceramic fragments S and the like. In addition, it is preferable that the suction air system in this case is no longer static.

如圖6所示,在步驟S8中可以如此,用檢查手段25 對陶瓷碎片S等在按壓在露出來的切割面11上的黏合性剝離部件21上的附著狀態進行檢查,由判斷手段26根據該檢查結果判斷是否進一步按壓黏合性剝離部件21。檢查手段25,例如只要是能夠檢測出陶瓷碎片S等附著在黏合性剝離部件21的黏合性剝離面21a上而變髒的狀態、黏合力已變弱的狀態即可。而且,判斷手段26,例如只要是能夠根據檢查手段25的檢查結果做出是繼續使用黏合性剝離部件21,還是更換黏合性剝離部件21這樣的判斷即可,並無特別限制。藉由該構成,能夠根據陶瓷碎片S等的產生狀況,效率良好地除去陶瓷碎片S等,且陶瓷複合薄片10的品質穩定。 As shown in Fig. 6, this can be done in step S8, using inspection means 25 The adhesion state of the ceramic shards S and the like on the adhesive peeling member 21 pressed on the exposed cut surface 11 is inspected, and the judging means 26 determines whether or not to further press the adhesive peeling member 21 based on the inspection result. For example, the inspection means 25 may detect a state in which ceramic fragments S and the like adhere to the adhesive peeling surface 21a of the adhesive peeling member 21 and become dirty, or a state where the adhesive force is weakened. In addition, the judgment means 26 is not particularly limited, as long as it can make a judgment based on the inspection result of the inspection means 25 as to whether to continue using the adhesive peeling member 21 or to replace the adhesive peeling member 21. With this configuration, the ceramic fragments S and the like can be efficiently removed according to the generation conditions of the ceramic fragments S and the like, and the quality of the ceramic composite sheet 10 is stable.

從減低成本的觀點出發,可以在一定期間過後對黏合性剝離部件21進行更換。於作業者靠手工作業按壓黏合性剝離部件21之情形,能夠靠作業者的目視來對更換黏合性剝離部件21的時刻做出判斷。 From the viewpoint of cost reduction, the adhesive peeling member 21 can be replaced after a certain period of time. In the case where the operator manually presses the adhesive peeling member 21, the operator can visually judge the timing of replacing the adhesive peeling member 21.

在沿著被附著物,例如電子設備、電子部件等的表面的曲面部或者凸凹面部貼附了燒成陶瓷層3之情形,藉由燒成陶瓷層3以分割線2a、分割線2b為起點折彎或者折過來,在分割線2a、分割線2b以外的位置則不會裂成各種各樣的形狀。而且,於此情形,不會發生落粉現象。平面就不用說了,就是圓柱狀的側曲面以及多少存在一些凹凸的面,也能夠使該陶瓷複合薄片密著或者實質密著於其上。本發明中,在貼附於被附著物以前的階段,就能夠將脫離陶瓷複合薄片10的切割面11那樣的或者已附著於黏 合層上的陶瓷碎片S等去掉,故不會發生陶瓷碎片S的落粉現象,能夠防止陶瓷碎片S等的落粉。 In the case where the fired ceramic layer 3 is attached along the curved surface or convex and concave surface of the surface of the attached object, such as electronic equipment, electronic components, etc., the firing ceramic layer 3 takes the dividing line 2a and the dividing line 2b as the starting point When it is bent or folded, it will not split into various shapes at positions other than the dividing line 2a and the dividing line 2b. Moreover, in this case, powder falling will not occur. Needless to say, the plane is the cylindrical side curved surface and the somewhat uneven surface, which can also make the ceramic composite sheet adhere to or substantially adhere to it. In the present invention, at the stage before being attached to the adherend, it is possible to detach the ceramic composite sheet 10 from the cut surface 11 or already attached to the adhesive. The ceramic fragments S and the like on the laminated layer are removed, so the phenomenon of powder falling of the ceramic fragments S will not occur, and the powder falling of the ceramic fragments S etc. can be prevented.

〔第二實施方式〕 [Second Embodiment]

接下來,參照圖11說明本發明的第二實施方式。此外,僅說明與第一實施方式不同的部分。第二實施方式是一種省略了第一實施方式中的步驟S2的製造方法。特別是,於陶瓷複合薄片10很薄之情形,為一種有效的製造方法。 Next, a second embodiment of the present invention will be described with reference to FIG. 11. In addition, only the differences from the first embodiment will be described. The second embodiment is a manufacturing method in which step S2 in the first embodiment is omitted. In particular, when the ceramic composite sheet 10 is very thin, it is an effective manufacturing method.

〔第三實施方式〕 [Third Embodiment]

接下來,參照圖12和圖13,說明本發明的第三實施方式。此外,僅說明與第二實施方式不同的部分。與第二實施方式相比,第三實施方式中是一種追加了步驟S8a作為步驟S8的前步驟的製造方法。步驟S8a屬於一種在將黏合性剝離部件21按壓在陶瓷複合薄片10的切割面11上以前,對切割面11進行刷擦的步驟。如圖13所示,於本步驟中,針對陶瓷複合薄片10重疊起來的方向(圖13中上下方向)及與該方向成直角的方向(圖13中左右方向)這兩個方向,朝著與兩方向不同的方向(箭頭A)進行刷擦。根據該構成,易於除去陶瓷碎片S等,陶瓷碎片S等不會被夾在燒成陶瓷層3間,即能夠將陶瓷複合薄片10除去,故屬於較佳。 Next, referring to FIG. 12 and FIG. 13, a third embodiment of the present invention will be described. In addition, only the differences from the second embodiment will be described. Compared with the second embodiment, the third embodiment is a manufacturing method in which step S8a is added as a step before step S8. Step S8a belongs to a step of brushing the cut surface 11 of the ceramic composite sheet 10 before pressing the adhesive release member 21 on the cut surface 11 of the ceramic composite sheet 10. As shown in FIG. 13, in this step, for the two directions in which the ceramic composite sheets 10 are overlapped (up and down direction in FIG. 13) and a direction at right angles to the direction (left and right direction in FIG. 13), the two directions are toward and Brush in two different directions (arrow A). According to this configuration, the ceramic fragments S and the like can be easily removed, and the ceramic fragments S and the like are not sandwiched between the fired ceramic layers 3, that is, the ceramic composite sheet 10 can be removed, which is preferable.

進行該刷擦時,既可以對陶瓷複合薄片一張一張地刷擦其切割面11,還可以將幾張陶瓷複合薄片重疊起來以後一起進行刷擦。而且,既可以靠手工作業來刷擦,還可以 用設備來刷擦。若進行刷擦,一次按壓附著於黏合性剝離部件21的黏合性剝離面21a上的陶瓷碎片S等就會減少,故黏合性剝離部件21的使用次數增加,不用頻繁地對黏合性剝離部件21進行更換。結果是,作業性提高。 When the brushing is performed, the cut surface 11 of the ceramic composite sheet can be brushed one by one, or several ceramic composite sheets can be overlapped and then rubbed together. Moreover, it can be brushed manually, or Use equipment to scrub. If brushing is performed, the ceramic fragments S and the like attached to the adhesive peeling surface 21a of the adhesive peeling member 21 will be reduced by one pressing, so the number of times the adhesive peeling member 21 is used increases, and the adhesive peeling member 21 does not need to be frequently applied. Replace it. As a result, workability is improved.

此外,於為落粉極少的切割面11或者落粉不成問題的情形,該刷擦可以省略。 In addition, in the case where the cutting surface 11 has very little powder falling or the powder falling is not a problem, the brushing can be omitted.

上述刷擦,也可以在第一實施方式中進行。 The above-mentioned brushing can also be performed in the first embodiment.

(產業利用性) (Industrial Utilization)

本發明對於陶瓷複合薄片的製造方法很有用。該陶瓷複合薄片能夠貼著於電子設備的平面、曲面或者具有凸凹的表面,且能夠被從電子設備的平面、曲面或者具有凸凹的表面剝離下來。 The invention is very useful for the manufacturing method of the ceramic composite sheet. The ceramic composite sheet can be attached to the flat surface, curved surface, or surface of the electronic device, and can be peeled off from the flat surface, curved surface, or surface of the electronic device.

S1~S8‧‧‧步驟 S1~S8‧‧‧Step

Claims (4)

一種陶瓷複合薄片的製造方法,該陶瓷複合薄片的製造方法具備燒成步驟、貼附步驟、切割步驟以及除去步驟;在該燒成步驟中,對規定形狀的陶瓷胚片進行燒成而形成燒成陶瓷層;在該貼附步驟中,隔著黏合層將樹脂層貼著在該燒成陶瓷層的至少一個面上來形成陶瓷複合薄片;在該切割步驟中,將該燒成陶瓷層和該樹脂層同時切成所希望的形狀;以及在該除去步驟中,將具有黏合性剝離面的黏合性剝離部件按壓在該切割步驟中露出的切割面上,將存在於該切割面上的陶瓷碎片除去;在該除去步驟以前進一步具備對該切割面進行刷擦並除去該陶瓷碎片的刷擦步驟;該刷擦步驟中的刷擦係針對該複數張陶瓷複合薄片重疊起來的方向及與該方向成直角的方向朝著與該兩方向不同的方向相對移動而進行。 A method for manufacturing a ceramic composite sheet includes a firing step, an attaching step, a cutting step, and a removing step; in the firing step, a ceramic green sheet of a predetermined shape is fired to form a fired Into a ceramic layer; in the attaching step, a resin layer is attached to at least one surface of the fired ceramic layer via an adhesive layer to form a ceramic composite sheet; in the cutting step, the fired ceramic layer and the The resin layer is cut into the desired shape at the same time; and in the removal step, the adhesive peeling member with the adhesive peeling surface is pressed against the cut surface exposed in the cutting step, and the ceramic fragments present on the cut surface are pressed Removal; before the removal step, it is further provided with a brushing step of brushing the cut surface and removing the ceramic fragments; the brushing in the brushing step is directed to the direction in which the plurality of ceramic composite sheets are overlapped and the direction The direction at a right angle moves relative to the direction different from the two directions. 如請求項1所記載之陶瓷複合薄片的製造方法,其中在該除去步驟中,用吸引手段從該切割面上吸引該陶瓷碎片。 The method for manufacturing a ceramic composite sheet according to claim 1, wherein in the removing step, the ceramic fragments are attracted from the cut surface by a suction means. 如請求項1所記載之陶瓷複合薄片的製造方法,其中在該除去步驟中,將該切割面對齊地將複數張陶瓷複合薄片重疊起來,將該黏合性剝離部件同時按壓在該複 數張陶瓷複合薄片的各個該切割面上。 The method for manufacturing a ceramic composite sheet according to claim 1, wherein in the removing step, a plurality of ceramic composite sheets are stacked with the cut surface aligned, and the adhesive peeling member is simultaneously pressed against the composite Each of the cut surfaces of several ceramic composite sheets. 如請求項1所記載之陶瓷複合薄片的製造方法,其中在該除去步驟中,包括檢查陶瓷碎片在被按壓在該切割面上的該黏合性剝離部件上的附著狀態,且根據檢查結果判斷是否進一步按壓該黏合性剝離部件的步驟。 The method for manufacturing a ceramic composite sheet according to claim 1, wherein the removing step includes inspecting the adhesion state of the ceramic fragments on the adhesive peeling member pressed on the cut surface, and judging whether or not according to the inspection result The step of further pressing the adhesive peeling member.
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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007168269A (en) * 2005-12-22 2007-07-05 Konica Minolta Medical & Graphic Inc Card post-processing method and card post-processed by card post-processing method
JP2010022897A (en) * 2008-07-15 2010-02-04 Sharp Corp Apparatus and method for cleaning sheet-like member, method of manufacturing sheet-like member and method of manufacturing backlight unit
JP2010045120A (en) * 2008-08-11 2010-02-25 Sony Chemical & Information Device Corp Magnetic sheet raw material

Family Cites Families (3)

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JP4002645B2 (en) * 1997-11-25 2007-11-07 アピックヤマダ株式会社 Semiconductor device cutting and storing device
JP4092472B2 (en) * 2002-10-25 2008-05-28 小堀▲鉄▼工株式会社 Deburring and polishing / peeling equipment
JP4608474B2 (en) * 2006-11-10 2011-01-12 北川工業株式会社 Composite magnetic member

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007168269A (en) * 2005-12-22 2007-07-05 Konica Minolta Medical & Graphic Inc Card post-processing method and card post-processed by card post-processing method
JP2010022897A (en) * 2008-07-15 2010-02-04 Sharp Corp Apparatus and method for cleaning sheet-like member, method of manufacturing sheet-like member and method of manufacturing backlight unit
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