KR20180048816A - A method for producing a printed wiring board and a printed wiring board protective film and a sheet- - Google Patents

Abstract

The present invention provides a method for producing a printed wiring board with a high production efficiency. A method for producing a printed wiring board according to an embodiment of the present invention is a method for manufacturing a printed wiring board according to the embodiment of the present invention in which a sheet-like laminate having an adhesive layer (A) and a peelable film provided on one side of the adhesive layer (A) ; Mounting a printed wiring board protective film having an adhesive layer (B1) on the surface of a peelable film through an adhesive layer (B1) to produce an intermediate laminate; Pressing the intermediate laminate; Bonding the adhesive layer (A) of the sheet-like laminate to the printed wiring board; And bonding the printed wiring board protective film and the peelable film through the adhesive layer (B1).

Description

A method for producing a printed wiring board and a printed wiring board protective film and a sheet-

The present invention relates to a method for producing a printed wiring board and a printed wiring board protective film and a sheet-like laminate used in the method.

As a method for attaching a sheet-like laminate to a printed wiring board, there has been known a method of sandwiching a printed wiring board and a sheet-like laminate with a press board through a cushioning printed wiring board protective film and hot pressing (for example, Patent Document 1 or 2). Examples of the sheet-like laminate include an electromagnetic wave shielding film and a conductive (conductive) adhesive film. The sheet-like laminate typically has an insulating protective layer for protecting the sheet-like laminate from mechanical or electrical damage on the first main surface side, and an adhesive layer for adhering to the printed wiring board on the second main surface side. A peelable film is adhered to the outer surface of the insulating protective layer for the purpose of preventing foreign substances from adhering to the insulating protective layer and scratches at the time of shipment of the product and / or work to be attached to the printed wiring board. As the peelable film, a resin film such as a polyester film subjected to a peeling treatment on the surface is generally used. The peelable film is manually peeled off after the sheet-like laminate is attached to the printed wiring board by the hot press.

Recently, electronic devices are required to be small and lightweight, and a printed wiring board used for electronic equipment and a sheet-like laminate attached to the printed wiring board are required to be adapted to a small size. However, if the size of the sheet-like laminate is reduced, the number of pieces of the sheet-like laminate supplied to one batch of the hot pressing step increases, so that the peelable film is peeled off from the sheet- There is a problem that the load of the work becomes large.

Japanese Unexamined Patent Publication No. 10-272700 International Publication No. 2005/002850

SUMMARY OF THE INVENTION The present invention has been made in order to solve the above-mentioned problems of the prior art, and it is an object of the present invention to provide a method of manufacturing a printed wiring board with excellent manufacturing efficiency, And to provide a laminate.

A method for producing a printed wiring board according to one embodiment of the present invention is a method for producing a printed wiring board comprising a sheet-like laminate having an adhesive layer (A) and a peelable film provided on one side of the adhesive layer (A) Mounting the printed circuit board on the printed circuit board; Mounting a printed wiring board protective film having an adhesive layer (B1) on the surface of the peelable film through the adhesive layer (B1) to manufacture an intermediate laminate; Pressing the intermediate laminate; Bonding the adhesive layer (A) of the sheet-like laminate to the printed wiring board; And adhering the printed wiring board protective film and the peelable film through the adhesive layer (B1).

A method for producing a printed wiring board according to another embodiment of the present invention is a method for producing a printed wiring board according to another embodiment of the present invention, which comprises the step of forming a sheet-like laminate having an adhesive layer (A) and a peelable film provided on one side of the adhesive layer (A) Mounting on a printed wiring board; Mounting a printed wiring board protective film having a tack property in a predetermined temperature region on the surface of the peelable film to manufacture an intermediate laminate; Pressing the intermediate laminate; Bonding the adhesive layer (A) of the sheet-like laminate to the printed wiring board; And adhering the printed wiring board protective film and the releasable film to each other by the preference of the printed wiring board protective film.

A method for producing a printed wiring board according to still another embodiment of the present invention is a method for manufacturing a printed wiring board by printing a sheet-like laminate having an adhesive layer (A), a releasable film and an adhesive layer (B2) Mounting on a wiring board; Mounting a printed wiring board protective film on the surface of the adhesive layer (B2) to manufacture an intermediate laminate; Pressing the intermediate laminate; Bonding the adhesive layer (A) of the sheet-like laminate to the printed wiring board; And bonding the printed wiring board protective film and the peelable film through the adhesive layer (B2).

A method for manufacturing a printed wiring board according to still another embodiment of the present invention is a method for manufacturing a printed wiring board comprising a step of forming a sheet-like laminate having an adhesive layer (A) and a peelable film provided on one side of the adhesive layer (A) Mounting the printed circuit board on the printed circuit board; Mounting an adhesive film on a surface of the peelable film; Mounting a printed wiring board protective film on the surface of the adhesive film to manufacture an intermediate laminate; Pressing the intermediate laminate; Bonding the adhesive layer (A) of the sheet-like laminate to the printed wiring board; And bonding the peelable film to the printed wiring board protective film through the adhesive film.

In one embodiment, the manufacturing method further includes peeling off the peelable film from the sheet-like laminate by removing the printed wiring board protective film.

In one embodiment, the press is a hot press.

In one embodiment, the sheet-like laminate further includes a functional portion adjacent to the adhesive layer (A).

According to another aspect of the present invention, a printed wiring board protective film is provided. The printed wiring board protective film is used in the method for producing the printed wiring board and has an adhesive layer (B1) capable of bonding the peelable film of the sheet-like laminate to the printed wiring board protective film on the surface of the peelable film side .

According to still another aspect of the present invention, there is provided a sheet-like laminate. The sheet-like laminate has an adhesive layer (A), a releasable film and an adhesive layer (B2) in this order, and the adhesive layer (A) is a conductive adhesive layer.

Another sheet-like laminate of the present invention has an adhesive layer (A), a functional portion, a peelable film and an adhesive layer (B2) in this order.

In one embodiment, the functional section has an electromagnetic wave shielding layer and a protective layer in this order from the side of the adhesive layer (A).

In one embodiment, the adhesive layer (A) is a conductive adhesive layer, and the functional portion is a protective layer.

According to an embodiment of the present invention, there is provided a manufacturing method comprising adhering a sheet-like laminate to a printed wiring board with a press (typically, a thermal press), wherein the releasable film of the sheet- By transferring the film to the film, the operation of peeling and removing the peelable film manually from the sheet-like laminate after pressing can be omitted. As a result, it is possible to realize a method for manufacturing a printed wiring board with an excellent manufacturing efficiency. Particularly, when the number of pieces of the printed wiring board and the sheet-like laminate to be supplied to one batch of the pressing step is large, the effect is remarkable.

1 (a) to 1 (d) are schematic cross-sectional views for explaining respective steps in a method for manufacturing a printed wiring board according to one embodiment of the present invention.
2 (a) to 2 (d) are schematic cross-sectional views for explaining respective steps in a method for manufacturing a printed wiring board according to another embodiment of the present invention.
3 (a) to 3 (d) are schematic cross-sectional views for explaining respective steps in a method for manufacturing a printed wiring board according to still another embodiment of the present invention.
4 (a) to 4 (e) are schematic cross-sectional views for explaining respective steps in a method for producing a printed wiring board according to still another embodiment of the present invention.

Hereinafter, specific embodiments of the present invention will be described with reference to the drawings, but the present invention is not limited to these embodiments. In all the examples shown in the drawings, the functional portions are formed in the sheet-like laminate, but the functional portions are optional components and may be omitted according to the purpose. For example, when the sheet-like laminate is a circuit connecting member, the functional portion can be omitted.

≪ First Embodiment >

1 (a) to 1 (d) are schematic cross-sectional views for explaining respective steps in a method for manufacturing a printed wiring board according to one embodiment of the present invention. First, as shown in Fig. 1 (a), a printed wiring board 10 is mounted on a release sheet 40. Preferably, a plurality of printed wiring boards 10 are mounted on the release sheet 40 as shown in the illustrated example. The release sheet 40 may be omitted. In this case, the printed wiring board 10 is directly mounted on the lower press plate 52 described later with reference to Fig. 1 (c).

Further, the sheet-like laminate 20 is mounted on the printed wiring board 10. The sheet-like laminate typically has a releasable film 22 provided on one side of the functional part 21 and the functional part 21 and an adhesive layer A provided on the other side of the functional part 21. The sheet-like laminate 20 is typically mounted on a coverlay (not shown) of the printed wiring board 10 via an adhesive layer (A). The sheet-like laminate may be, for example, an electromagnetic wave shielding film or a circuit connecting member. When the sheet-like laminate is an electromagnetic wave shielding film, the functional portion 21 has an electromagnetic wave shielding layer and a protective layer in this order from the side of the adhesive layer (A). In this case, the adhesive layer (A) may be a conductive adhesive layer, or may be an anisotropic conductive adhesive layer or an isotropic conductive adhesive layer. When the adhesive layer (A) is an isotropic conductive adhesive layer, the electromagnetic shielding layer may be omitted from the functional portion, and the conductive adhesive layer may serve also as the electromagnetic wave shielding layer. When the sheet-like laminate is a circuit connecting member, the adhesive layer (A) is typically constituted as a conductive adhesive, and the functional part can be omitted as described above Consisting of a cast film]. As a typical example of the circuit connecting member, a thermosetting resin or a conductive adhesive film having a photocurable resin and a conductive filler can be mentioned. Practically, a separate peelable film is temporarily adhered to the surface of the adhesive layer (A) of the sheet-like laminate until it is used for the purpose of preventing adherence of foreign matter to the adhesive layer and / or scratching of the adhesive layer have.

Next, as shown in Fig. 1 (b), the printed wiring board protective film 30 is mounted on the sheet-like laminate 20. The printed wiring board protective film 30 has a main body portion 31 and an adhesive layer B1. The printed wiring board protective film 30 is mounted on the sheet-like laminate 20 through the adhesive layer B1. Preferably, the printed wiring board protective film 30 is mounted so as to cover all of the plurality of sheet-like laminated bodies with one wide printed wiring board protective film as shown in the illustrated example. With such a constitution, the releasable films 22 are collectively transferred to all of the plurality of sheet-like laminated bodies 20 at the time of pressing to be described later on the printed circuit board protective film, and the peelable films are collectively peeled from all the sheet- Can be removed. Hereinafter, the laminate of the release sheet 40 (if present), the printed wiring board 10, the sheet-like laminate 20, and the printed wiring board protective film 30 is occasionally referred to as an intermediate laminate for convenience.

Next, the intermediate laminate obtained in the process of Fig. 1 (b) is pressed. The intermediate laminate is pressed to bond the printed wiring board protective film 30 and the peelable film 22 through the adhesive layer B1. The timing (hereinafter referred to as timing (1)) at which the sheet-like laminate 20 adheres to the printed wiring board 10 is the timing at which the printed wiring board protective film 30 and the peelable film 22 adhere , And timing (2)), or may be timing (2) after timing (1), but it is preferable that timing (1) and timing (2) are simultaneous. In the case of the timing (2) after the timing (1), from the state shown in Fig. 1 (a), in the known method (heat-pressing through the printed circuit board protective film having no adhesiveness, , The intermediate laminate is produced by bonding the sheet-like laminate and the printed wiring board to the printed wiring board through the adhesive layer (A) of the sheet-like laminate, and by pressing the intermediate laminate, the printed wiring board protective film The peelable film 22 is adhered through the adhesive layer B1. When the timing (1) and the timing (2) are simultaneous, the printed circuit board protective film 30 and the peelable film 22 are bonded to each other through the adhesive layer B1, (If present) and the printed wiring board 10 can be bonded together through the adhesive layer (A). The step of attaching the sheet-like laminate to the printed wiring board and the step of bonding the protective film of the printed wiring board to the releasable film can be carried out at the same time, so that the functions (for example, electromagnetic wave shielding property, Conductive adhesive property) can be efficiently produced.

The case where the timing (1) and the timing (2) are simultaneously described will be described in more detail. The laminate of the sheet-like laminate 20 and the printed wiring board 10 and the printed circuit board protective film 30 and the peelable film 22 are bonded together by pressing the intermediate laminate in the manner as shown in Fig. Can be simultaneously performed. The press is typically a hot press. Specifically, the hot press is carried out by sandwiching the intermediate laminate with the upper press plate 51 and the lower press plate 52 heated to a predetermined temperature and adding a predetermined pressure for a predetermined time. The temperature, the pressure and the time of the hot press (substantially, the temperatures of the upper press plate 51 and the lower press plate 52) are set so as to satisfy the kinds, materials and properties of the adhesive layer (A) and the adhesive layer (B1) The material and surface characteristics of the main body portion of the printed wiring board protective film, the functional portion (if present) and the peelable film of the sheet-like laminate, the adhesive strength between the adhesive layer (A) and the printed wiring board, The adhesive force of the adhesive film, and / or the adhesive strength of the releasable film and the functional part of the sheet-like laminate or the adhesive layer (A). The temperature of the hot press is, for example, 150 deg. C to 200 deg. The pressure of the hot press is, for example, 2 MPa to 5 MPa. The heat press time is, for example, 1 minute to 5 minutes.

The functional part 21 of the sheet-like laminate 20 and the printed wiring board 10 are adhered to each other through the adhesive layer A by hot pressing of the intermediate laminate. When the functional section 21 is omitted, the adhesive layer (A) of the sheet-like laminate 20 is bonded to the printed wiring board 10 by hot pressing of the intermediate laminate. This makes it possible to obtain a printed wiring board to which a function (for example, electromagnetic wave shielding property, conductive adhesiveness) depending on the kind of the sheet-like laminate is imparted. At the same time, the printed wiring board protective film 30 and the peelable film 22 are adhered to each other through the adhesive layer B1 by a hot press. As a result, when the pressure of the hot press is released, the peelable film 22 is transferred from the sheet-like laminate 20 to the printed wiring board protective film 30 as shown in Fig. 1 (d). Such transfer is carried out by using the kind, material and characteristics of the adhesive layer (A) and the adhesive layer (B1), the material and surface characteristics of the main body part of the printed wiring board protective film, the functional part of the sheet- The adhesive strength between the adhesive layer (A) and the printed wiring board, the adhesive strength between the adhesive layer (B1) and the peelable film, the adhesive strength between the peelable film and the function portion of the sheet-like laminate or the adhesive layer (A), and / , The condition of the hot press, and the like. For example, the adhesive force between the surface of the peelable film 22 on the side of the protective film 30 on the printed wiring board side and the adhesive layer B1 is determined by the adhesive strength between the peelable film 22 on the opposite side (substantially the peeled surface) The above-described transfer can be realized by increasing the adhesive force of the functional portion 21 (or the adhesive layer (A) if omitted).

Hereinafter, a printed wiring board, a film, a sheet, an adhesive, and the like used in the present embodiment will be briefly described. Since these configurations are well known in the art, a detailed description thereof will be omitted. For the parts omitted in this specification, well-known structures in the art can be employed.

The printed wiring board 10 may be a flexible printed wiring board, a rigid printed wiring board, or a rigid flexible printed wiring board.

As the adhesive (adhesive composition) constituting the adhesive layer (A) of the sheet-like laminate, any appropriate adhesive can be used as long as the sheet-like laminate and the printed wiring board are adhered well and the above-mentioned transfer is realized. Specifically, the adhesive may be a hot-melt adhesive, a thermosetting resin-based adhesive, a thermoplastic resin-based adhesive, an active energy ray-curable adhesive, or a pressure-sensitive adhesive. Examples of the base resin of the hot-melt adhesive include urethane resin, polyamide resin, polyester resin, polyolefin resin, styrene resin, ethylene-vinyl acetate resin and thermoplastic elastomer. Examples of the base resin of the thermosetting resin adhesive include epoxy resin, phenol resin, (meth) acrylic resin, urethane resin, polyolefin resin and isocyanate resin. Examples of the base resin of the thermoplastic resin adhesive include (meth) acrylic resin, polyvinyl acetal resin, styrene resin, polyimide resin, polyamide resin and polyamideimide resin. Examples of the base resin of the active energy ray-curable adhesive include (meth) acrylic resin and epoxy resin. The adhesive layer (A) having desired properties can be formed by suitably adjusting the composition ratio of the monomer component of the base resin and the kind, number, blend amount and combination of additives. The adhesive constituting the adhesive layer (A) is preferably a thermosetting resin adhesive or an active energy ray-curable adhesive, more preferably a thermosetting resin adhesive. Such an adhesive can realize a desired adhesive force between the sheet-like laminate and the printed wiring board, so that the sheet-like laminate and the printed wiring board can be favorably adhered, and the releasable film can be favorably transferred to the printed wiring board protective film. The thickness of the adhesive layer (A) is preferably 0.5 mu m to 20 mu m. When the thickness of the adhesive layer (A) is 0.5 mu m or more, it is easy to follow the step difference of the printed wiring board. When the thickness is 20 mu m or less, the entire thickness of the sheet-

When the sheet-like laminate 20 is an electromagnetic wave shielding film, the electromagnetic wave shielding layer is typically a layer comprising a thin film of metal or a layer having a conductive filler. When the electromagnetic wave shielding layer is a layer made of a metal thin film, for example, aluminum, silver, copper, gold, nickel, tin, palladium, chromium, titanium and zinc, And the like. The metal material can be appropriately selected depending on the desired shielding properties. When the electromagnetic wave shielding layer is a layer having a conductive filler, a conductive filler used in a conductive adhesive film described later can be used. The thickness of the electromagnetic wave shielding layer is preferably 0.1 mu m to 10 mu m, more preferably 0.3 mu m to 7 mu m, and further preferably 1 mu m to 6 mu m. The protective layer is typically composed of any suitable resin film having electrical insulation and / or scratch resistance. The resin constituting the resin film may be a thermosetting resin, a thermoplastic resin, or an electron beam (e.g., visible light, ultraviolet ray) curable resin. Specific examples of the resin include an epoxy resin, a phenol resin, an amino resin, an alkyd resin, a urethane resin, a (meth) acrylic resin, a polyimide resin and a polyamideimide resin. The thickness of the protective layer is, for example, 1 m to 10 m.

When the sheet-like laminate 20 is an electromagnetic wave shielding film, the adhesive layer (A) can be made into an anisotropic conductive adhesive layer or an isotropic conductive adhesive layer by adding a conductive filler to the above-mentioned adhesive. In the case of the anisotropic conductive adhesive layer, an anisotropically conductive adhesive layer can be obtained by adding 10 to 150 parts by mass of the conductive filler to 100 parts by mass of the base resin of the adhesive. In the case of an isotropic conductive adhesive layer, an isotropic conductive adhesive layer can be obtained by adding 150 to 500 parts by mass of the conductive filler to the base resin of the adhesive. As such a conductive filler, a conductive filler used in a conductive adhesive film described later can be used.

When the sheet-like laminate 20 is a conductive adhesive film, the conductive adhesive is typically formed by blending an optional adhesive composition (for example, an adhesive composition constituting the above-mentioned adhesive layer (A)) with a conductive filler . As the conductive filler, any suitable conductive filler can be used. Specific examples of the conductive filler include silver-coated copper filler obtained by silver plating on carbon, silver, copper, nickel, solder, aluminum or copper powder, and filler obtained by metal plating on resin balls or glass beads. Preferably, it is a silver coated copper filler or nickel. It is relatively inexpensive, has excellent conductivity, and is highly reliable. The conductive filler may be used alone, or two or more conductive fillers may be used in combination. As the shape of the conductive filler, any appropriate shape may be employed depending on the purpose. Specific examples include complete spheres, flakes, scales, plates, dendrites, ellipsoids, rods, needles, and amorphous forms. The amount of the conductive filler in the conductive adhesive is preferably 10 parts by weight to 150 parts by weight based on 100 parts by weight of the base resin.

The peelable film 22 is typically a film obtained by subjecting the surface to peeling treatment. Examples of the film include a polyester film (for example, a polyethylene terephthalate film), a polyolefin film (for example, a polyethylene film, a polypropylene film, and a polymethylpentene film), a polyvinyl chloride film, For example, acetyl cellulose butyrate film, triacetyl cellulose film), polystyrene film, polycarbonate film and polysulfone film; Papers such as glas, paper, kraft paper, coated paper, and synthetic paper; Various nonwoven fabrics; Metal foil; And composite films obtained by combining these materials. Among them, a polyethylene terephthalate (PET) film is preferable from the viewpoints of availability and cost. Examples of the mold releasing treatment include application of a releasing agent to one side or both sides of a film, and formation of a concave-convex shape on the film surface. Examples of the release agent include hydrocarbon resins such as polyethylene and polypropylene, higher fatty acids and metal salts thereof, higher fatty acid soaps, waxes, animal or vegetable oils, mica, talc, silicone surfactants, silicone oils, silicone resins, melamine resins, An activator, a fluororesin, and a fluorine-containing silicone resin. Examples of the application method of the releasing agent include gravure coating, kiss coating, die coating, lip coating, comma coating, blade coating, roll coating, knife coating, spray coating, bar coating, spin coating and dip coating. Examples of the method for forming the concave-convex shape include embossing, kneading of fine particles into a film, roughening by spraying dry-ice or the like on the surface of the film, Of the thermosetting resin.

The main body portion 31 of the printed wiring board protective film 30 may have a property of protecting the printed wiring board from breakage due to contact with the press plate. As the main body 31 having such a property, a cushion film composed of any suitable resin film can be exemplified. Representative examples of the resin constituting the resin film include polyolefin resin (for example, polyethylene, polypropylene, polymethylpentene), polyester resin (for example, polyethylene terephthalate, polybutylene terephthalate) ) Acrylic resin (for example, ethylene-ethyl acrylate copolymer resin (EEA), ethylene-methyl acrylate copolymer resin (EMA), ethylene-methyl methacrylate copolymer resin (EMMA) have. The thickness of the body portion is, for example, 10 to 250 mu m.

As the adhesive (adhesive composition) constituting the adhesive layer (B1), any suitable adhesive can be used as long as the transfer from the sheet-like laminate of the releasable film to the printed wiring board protective film is realized. Specifically, the adhesive may be a hot-melt adhesive, a thermosetting resin-based adhesive, a thermoplastic resin-based adhesive, or an active energy ray-curable adhesive. Examples of the base resin of the hot-melt adhesive include urethane resin, polyamide resin, polyester resin, polyolefin resin, styrene resin, ethylene-vinyl acetate resin and thermoplastic elastomer. Examples of the base resin of the thermosetting resin adhesive include epoxy resin, phenol resin, (meth) acrylic resin, urethane resin, polyolefin resin and isocyanate resin. Examples of the base resin of the thermoplastic resin adhesive include (meth) acrylic resin, polyvinyl acetal resin, styrene resin, polyimide resin, polyamide resin and polyamideimide resin. Examples of the base resin of the active energy ray-curable adhesive include (meth) acrylic resin and epoxy resin. By appropriately adjusting the composition ratio of the monomer component of the base resin and the kind, number, blending amount and combination of additives, an adhesive layer having desired characteristics can be formed. The adhesive constituting the adhesive layer (B1) is preferably a hot-melt adhesive, more preferably a hot-melt adhesive using a styrene-based resin as a base resin. Such an adhesive can realize a desired adhesive force between the sheet-like laminate and the printed wiring board, so that the sheet-like laminate and the printed wiring board can be favorably adhered, and the releasable film can be favorably transferred to the printed wiring board protective film. The thickness of the adhesive layer (B1) is preferably 1 m to 15 m, and more preferably 3 m to 10 m. If the thickness is 1 mu m or more, the peelable film can be favorably transferred to the printed wiring board protective film. When the thickness is 15 mu m or less, the adhesive layer (B1) can be prevented from leaking out when the intermediate laminate is hot-pressed.

≪ Second Embodiment >

2 (a) to 2 (d) are schematic cross-sectional views for explaining respective steps in a method for manufacturing a printed wiring board according to another embodiment of the present invention. Only the characteristic parts of the present embodiment will be described below. The same printed wiring board, film, sheet, adhesive, and the like as those used in the first embodiment are denoted by the same reference numerals, and a description thereof will be omitted. In the case where there is no detailed description on the operating conditions and the like, the description of the first embodiment can be applied.

In this embodiment, instead of the printed circuit board protective film 30 having the main body portion 31 and the adhesive layer B1, as shown in Fig. 2 (b), a predetermined temperature region Temperature region) of the printed wiring board protective film is used. The printed wiring board protective film 32 and the peelable film 22 are formed by using the tentative property of the printed wiring board protective film 32 in the hot pressing of the intermediate laminate shown in Fig. . As a result, when the pressure of the hot press is released, the peelable film 22 is transferred from the sheet-like laminate 20 to the printed wiring board protective film 32, as shown in Fig. 2 (d). As a constituent material of the printed wiring board protective film 32 having a tentative property in the temperature range of the hot press, for example, a polyester resin, an acrylic resin, a urethane resin and an epoxy resin can be given. The printed wiring board protective film is described, for example, in Japanese Patent Application Laid-Open No. 2009-191099, and the description of the above publication is incorporated herein by reference. In addition, the printed wiring board protective film in the present embodiment may be formed of a single material having a tentative nature in the main body portion 32, or may be formed of a plurality of layers having at least a part of the surface of the tentative material.

≪ Third Embodiment >

3 (a) to 3 (d) are schematic cross-sectional views for explaining respective steps in a method for manufacturing a printed wiring board according to still another embodiment of the present invention. Similar to the second embodiment, only the characteristic parts of this embodiment will be described.

In the present embodiment, as shown in FIG. 3A, a sheet-like laminate 20 'having an adhesive layer (B2) on the surface (on the printed wiring board protective film side) of the releasable film 22 is used do. In this regard, in this embodiment, instead of the printed wiring board protective film 30 having the main body portion 31 and the adhesive layer B1 in the first embodiment, as shown in Fig. 3 (b) (31) is used as the protective film. That is, the printed wiring board protective film in the present embodiment does not need to have an adhesive layer on the surface facing the adhesive layer (B2). According to the present embodiment, in the hot pressing of the intermediate laminate shown in Fig. 3 (c), the printed wiring board protective film 31 and the peelable film 22 are bonded to each other through the adhesive layer B2. As a result, when the pressure of the hot press is released, the adhesive layer B2 and the peelable film 22 are peeled from the sheet-like laminate 20 'to the printed wiring board protective film 31 as shown in Fig. 3 (d) Lt; / RTI > The adhesive layer (B2) may be composed of the same adhesive as the adhesive layer (B1).

≪ Fourth Embodiment &

4 (a) to 4 (e) are schematic cross-sectional views for explaining respective steps in a method for producing a printed wiring board according to still another embodiment of the present invention. Similar to the second and third embodiments, only the characteristic parts of this embodiment will be described.

4 (b), the adhesive film 60 is used to mount the adhesive film 60 on the surface of the peelable film 22, and then, as shown in Fig. 4 A printed circuit board protective film comprising the main body 31 is mounted on the surface of the adhesive film as shown in (c) of FIG. According to the present embodiment, in the hot pressing of the intermediate laminate shown in Fig. 4 (d), the printed wiring board protective film 31 and the peelable film 22 are bonded to each other through the adhesive film 60. As a result, when the pressure of the hot press is released, the peelable film 22 is transferred from the sheet-like laminate 20 to the printed wiring board protective film 31 as shown in Fig. 4 (e). Examples of the adhesive film 60 include a film composed of a hot-melt adhesive, a thermosetting resin-based adhesive, a thermoplastic resin-based adhesive, and an active energy ray-curable adhesive.

<Examples>

Hereinafter, the present invention will be described in detail with reference to Examples, but the present invention is not limited to these Examples.

&Lt; Example 1 >

As a sheet-like laminate, a commercially available electromagnetic wave shielding film (SF-PC5600, manufactured by Tatsuta Electric Wire & Cable Co., Ltd.) was used. The electromagnetic wave shielding film had an electromagnetic wave shielding layer (having a thickness of 0.1 占 퐉) formed of a peelable PET film (thickness 60 占 퐉) having a melamine releasing layer on one surface / a protective layer (thickness 5 占 퐉) / thermosetting epoxy resin- ) / Anisotropically conductive adhesive layer (containing 13 parts by mass of silver-coated copper powder in the resin, relative to 100 parts by mass of the thermosetting epoxy resin: thickness of 5 占 퐉). A styrene thermoplastic resin (Aaronmelt PPET-2000S, trade name, manufactured by Toagosei Company, Limited) was dissolved in methyl ethyl ketone (manufactured by Toagosei Co., Ltd.) on the surface opposite to the protective layer of the peelable film of the electromagnetic wave- (Concentration: 30% by weight) dissolved in a mixed solvent of methyl ethyl ketone (MEK) / toluene (50/50 by volume) was applied and dried at 80 ° C for 3 minutes to form a hot- 5 mu m). Next, the electromagnetic wave shielding film having the hot-melt adhesive layer formed thereon was cut into a size of 10 cm long by 5 cm wide to obtain a film piece. Eight film pieces were mounted on a polyimide film (25 cm in length x 25 cm in width) at intervals of 1 cm. At that time, the conductive adhesive layer was mounted on the polyimide film side. Next, a polyimide film on which a film piece was mounted was mounted on a lower press plate of a hot press apparatus (manufactured by Top Range Machinery Co., Ltd., model number AHC007-014). Further, a printed wiring board protective film (polyolefin film, trade name "OFRAN CR1012MT4", thickness 0.15 mm, length 28 cm × width 30 cm, manufactured by Mitsui Chemicals, Incorporated) Layer. The upper press plate (silicone rubber) was lowered from the upper side of the printed wiring board protective film and hot pressed at 170 DEG C and 3 MPa for 3 minutes to bond the electromagnetic wave shielding film and the polyimide film through the conductive adhesive layer, The peelable film and the printed wiring board protective film were bonded. After the completion of the thermal press, the film pieces were cooled to 25 占 폚, and then the printed circuit board protective film was peeled off. The peelable films were transferred to the printed wiring board protective film against all the eight film pieces. Thus, it was confirmed that the peelable film can be well removed from the film piece (electromagnetic wave shielding film) by separation of the printed wiring board protective film.

&Lt; Industrial applicability >

The manufacturing method according to the embodiment of the present invention can be preferably used for manufacturing a printed wiring board.

10: Printed circuit board
20: sheet-like laminate
22: peelable film
30: Printed circuit board protective film
31:
51: press plate
52: press plate
60: Adhesive film
(A): adhesive layer
(B1): adhesive layer
(B2): adhesive layer

Claims (12)

Mounting a sheet-like laminate having an adhesive layer (A) and a releasable film provided on one side of the adhesive layer (A) to the printed wiring board through the adhesive layer (A);
Mounting a printed wiring board protective film having an adhesive layer (B1) on the surface of the peelable film through the adhesive layer (B1) to manufacture an intermediate laminate;
Pressing the intermediate laminate;
Bonding the adhesive layer (A) of the sheet-like laminate to the printed wiring board; And
Bonding the printed wiring board protective film and the peelable film through the adhesive layer (B1)
And a step of forming the printed wiring board. Mounting a sheet-like laminate having an adhesive layer (A) and a releasable film provided on one side of the adhesive layer (A) to the printed wiring board through the adhesive layer (A);
Mounting a printed wiring board protective film having a tack property in a predetermined temperature region on the surface of the peelable film to manufacture an intermediate laminate;
Pressing the intermediate laminate;
Bonding the adhesive layer (A) of the sheet-like laminate to the printed wiring board; And
Adhering the above-mentioned printed wiring board protective film and the releasable film by preference of the above-mentioned printed wiring board protective film
And a step of forming the printed wiring board. Mounting a sheet-like laminate having an adhesive layer (A), a releasable film and an adhesive layer (B2) in this order on a printed wiring board through the adhesive layer (A);
Mounting a printed wiring board protective film on the surface of the adhesive layer (B2) to manufacture an intermediate laminate;
Pressing the intermediate laminate;
Bonding the adhesive layer (A) of the sheet-like laminate to the printed wiring board; And
Bonding the printed circuit board protective film and the peelable film through the adhesive layer (B2)
And a step of forming the printed wiring board. Mounting a sheet-like laminate having an adhesive layer (A) and a releasable film provided on one side of the adhesive layer (A) to the printed wiring board through the adhesive layer (A);
Mounting an adhesive film on a surface of the peelable film;
Mounting a printed wiring board protective film on the surface of the adhesive film to manufacture an intermediate laminate;
Pressing the intermediate laminate;
Bonding the adhesive layer (A) of the sheet-like laminate to the printed wiring board; And
And adhering the peelable film to the printed wiring board protective film through the adhesive film
And a step of forming the printed wiring board. 5. The method according to any one of claims 1 to 4,
And peeling off the peelable film from the sheet-like laminate by peeling off the protective film for printed wiring board. 6. The method according to any one of claims 1 to 5,
Wherein the press is a hot press. 7. The method according to any one of claims 1 to 6,
Wherein the sheet-like laminate further comprises a functional portion adjacent to the adhesive layer (A). A printed wiring board protective film for use in the method for producing a printed wiring board according to claim 1,
(B1) capable of bonding the peelable film of the sheet-like laminate to the printed wiring board protective film on the surface of the peelable film side,
Printed circuit board protective film. In which the adhesive layer (A), the releasable film and the adhesive layer (B2) are in this order, and the adhesive layer (A) is a conductive adhesive layer. (A), a functional portion, a peelable film and an adhesive layer (B2) in this order. 11. The method of claim 10,
Wherein the functional section has an electromagnetic wave shielding layer and a protective layer in this order from the side of the adhesive layer (A). 11. The method of claim 10,
Wherein the adhesive layer (A) is a conductive adhesive layer, and the functional part is a protective layer.

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