CN115416393A - Release film removing method and flexible circuit board - Google Patents
Release film removing method and flexible circuit board Download PDFInfo
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- CN115416393A CN115416393A CN202211172504.2A CN202211172504A CN115416393A CN 115416393 A CN115416393 A CN 115416393A CN 202211172504 A CN202211172504 A CN 202211172504A CN 115416393 A CN115416393 A CN 115416393A
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- transfer
- circuit board
- flexible circuit
- release film
- adhesive
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- 238000000034 method Methods 0.000 title claims abstract description 30
- 238000012546 transfer Methods 0.000 claims abstract description 149
- 239000000853 adhesive Substances 0.000 claims abstract description 79
- 230000001070 adhesive effect Effects 0.000 claims abstract description 79
- 239000000758 substrate Substances 0.000 claims abstract description 19
- 238000003825 pressing Methods 0.000 claims description 13
- 239000004820 Pressure-sensitive adhesive Substances 0.000 claims description 4
- 230000006835 compression Effects 0.000 claims 1
- 238000007906 compression Methods 0.000 claims 1
- 239000003292 glue Substances 0.000 abstract description 8
- 238000004519 manufacturing process Methods 0.000 abstract description 2
- 238000006748 scratching Methods 0.000 abstract 1
- 230000002393 scratching effect Effects 0.000 abstract 1
- 239000012528 membrane Substances 0.000 description 26
- 230000009286 beneficial effect Effects 0.000 description 3
- 238000007731 hot pressing Methods 0.000 description 3
- 229920002799 BoPET Polymers 0.000 description 2
- 229920000139 polyethylene terephthalate Polymers 0.000 description 2
- 239000005020 polyethylene terephthalate Substances 0.000 description 2
- 241000251468 Actinopterygii Species 0.000 description 1
- 238000004026 adhesive bonding Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- -1 polyethylene terephthalate Polymers 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 238000001179 sorption measurement Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
Images
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B43/00—Operations specially adapted for layered products and not otherwise provided for, e.g. repairing; Apparatus therefor
- B32B43/006—Delaminating
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2457/00—Electrical equipment
- B32B2457/08—PCBs, i.e. printed circuit boards
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Structure Of Printed Boards (AREA)
Abstract
The application relates to the technical field of flexible circuit board manufacturing, and provides a release film removing method and a flexible circuit board, wherein the release film removing method comprises the following steps: providing a flexible circuit board, wherein the flexible circuit board is provided with a substrate surface, a plurality of electromagnetic films are attached to the substrate surface, and a release film is attached to each electromagnetic film; the flexible circuit board is pressed with a transfer piece, the transfer piece is provided with a binding surface, the binding surface is provided with a viscous area, one or more transfer glues are arranged in the viscous area, the binding force between the transfer glues and the transfer piece is larger than the binding force between the electromagnetic film and the release film, the release films are respectively bound with the transfer glues, and the binding force between the transfer glues and the release film is larger than the binding force between the electromagnetic film and the release film; and removing the transfer piece from the flexible circuit board, and sticking the release film from the electromagnetic film by the transfer adhesive. The method for removing the release film can improve the removal efficiency of the release film, save labor and reduce the risk of scratching the flexible circuit board product.
Description
Technical Field
The application relates to the technical field of flexible circuit board manufacturing, in particular to a release film removing method and a flexible circuit board.
Background
When pasting an electromagnetic film (EMI) on a flexible circuit board with a small product area and a plurality of jointed boards, the electromagnetic film is required to be relatively dispersed and cannot be made into a connected piece, so that the electromagnetic film is required to be made into a single piece to be pasted on the flexible circuit board product, and the release film on each electromagnetic film is torn off after pressing and curing.
Because the electromagnetic film position is little and the composing is denser, traditional mode of getting rid of from the type membrane is that artifical use the sculpture pen knife to jack earlier from the edge of electromagnetic film from the type membrane, tears again on every piece of electromagnetic film from the type membrane, and this kind of mode not only needs a large amount of manual works, and is inefficient, still fish tail flexible circuit board product more easily moreover when using the sculpture pen knife, causes the quality risk.
Disclosure of Invention
The application provides a release film removing method and a flexible circuit board, so that the release film removing efficiency is improved, labor is saved, and the risk that the flexible circuit board product is scratched is reduced.
An embodiment of the first aspect of the present application provides a method for removing a release film, including:
providing a flexible circuit board, wherein the flexible circuit board is provided with a substrate surface, a plurality of electromagnetic films are attached to the substrate surface, and a release film is attached to each electromagnetic film;
pressing the flexible circuit board and a transfer piece, wherein the transfer piece is provided with a binding surface, the binding surface is provided with a sticky area, one or more transfer glues are arranged in the sticky area, the binding force between the transfer glues and the transfer piece is larger than the binding force between the electromagnetic film and the release film, the release films are respectively bound with the transfer glues, and the binding force between the transfer glues and the release films is larger than the binding force between the electromagnetic film and the release films;
and removing the transfer piece from the flexible circuit board, and sticking the release film from the electromagnetic film by the transfer adhesive.
In some embodiments, the attaching surface has a non-adhesive area and a plurality of adhesive areas, the plurality of adhesive areas are arranged in one-to-one correspondence with the plurality of electromagnetic films, and the non-adhesive area corresponds to an area of the substrate surface other than the electromagnetic films.
In some embodiments, the transfer adhesive is located inside a projection of the release film on the attaching surface.
In some embodiments, the distance between the edge of the transfer adhesive and the edge of the projection of the release film on the attaching surface is greater than or equal to 0.5mm.
In some of these embodiments, the transfer adhesive is provided as a heat-pressure adhesive or a pressure-sensitive adhesive.
In some of these embodiments, the transfer member is a transfer plate or a transfer film.
In some embodiments, pressing the flexible circuit board and a transfer member together comprises:
the flexible circuit board and the transfer piece are stacked together, and the transfer adhesive is attached to the release film;
and pressing the flexible circuit board and the transfer piece to enable the transfer adhesive to be bonded with the release film.
In some embodiments, the transfer piece is provided with a first positioning hole, and the flexible circuit board is provided with a second positioning hole; when the flexible circuit board and a transfer piece are stacked together, the flexible circuit board and the transfer piece are aligned through the first positioning hole and the second positioning hole.
In some embodiments, the stacking the flexible circuit board and a transfer piece together specifically includes:
fixing the flexible circuit board on a first jig, and fixing the transfer piece on a second jig;
and moving the second jig, and stacking the rotary pasting piece on the flexible circuit board through the second jig.
An embodiment of the second aspect of the present application provides a flexible circuit board, which is processed by the release film removing method according to the first aspect.
The release film removing method provided by the embodiment of the application has the beneficial effects that: because it has the binding face to change the piece, it is provided with one or more commentaries on classics rubberizing to have viscidity area and viscidity area on the binding face, change the rubberizing and change the cohesion between the piece be greater than the electromagnetic film and from the adhesion stress between the type membrane, a plurality ofly from the type membrane respectively with change the rubberizing and adhere mutually, change the rubberizing and be greater than the electromagnetic film and from the adhesion stress between the type membrane, so only need to change the piece and remove from flexible circuit board, alright will a plurality ofly from the disposable follow the adhesion stress of electromagnetic film of type membrane through changing the piece, thereby not only can improve the efficiency of getting rid of type membrane, save the manual work, and also reduced the risk that flexible circuit board product was scratched.
Compared with the beneficial effects of the prior art, the flexible circuit board provided by the application has the beneficial effects of being compared with the prior art from the type film removing method provided by the application, and the description is omitted here.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings needed to be used in the embodiments or the prior art descriptions will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present application, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without inventive exercise.
FIG. 1 is a flow chart of a release film removal method according to one embodiment of the present application;
fig. 2 (a) is a schematic diagram of a flexible circuit board and a transfer member structure in one embodiment of the present application;
fig. 2 (b) is a schematic view of the flexible circuit board and the transfer member shown in fig. 2 (a) being pressed together;
fig. 2 (c) is a schematic view of peeling the transfer member shown in fig. 2 (b) from the flexible circuit board;
fig. 3 is a partially enlarged view of a portion a of the flexible circuit board and the transfer member shown in fig. 2 (b);
fig. 4 is a bottom view of the transfer member shown in (a) of fig. 2.
The designations in the figures mean:
10. a flexible circuit board; 11. a substrate surface; 20. an electromagnetic film; 30. a release film; 40. transferring a piece; 41. a binding face; 42. a first positioning hole; 50. and (6) transferring adhesive.
Detailed Description
In order to make the objects, technical solutions and advantages of the present application more apparent, the present application is described in further detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the present application and are not intended to limit the present application.
It will be understood that when an element is referred to as being "secured to" or "disposed on" another element, it can be directly on the other element or be indirectly on the other element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or be indirectly connected to the other element.
Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the present application, "a plurality" means two or more unless specifically limited otherwise.
Reference throughout this specification to "one embodiment," "some embodiments," or "an embodiment" means that a particular feature, structure, or characteristic described in connection with the embodiment is included in one or more embodiments of the present application. Thus, appearances of the phrases "in one embodiment," "in some embodiments," "in other embodiments," or the like, in various places throughout this specification are not necessarily all referring to the same embodiment, but rather mean "one or more but not all embodiments" unless specifically stated otherwise. Furthermore, the particular features, structures, or characteristics may be combined in any suitable manner in one or more embodiments.
To explain the technical solution of the present application, the following description is made with reference to the specific drawings and examples.
Referring to fig. 1, an embodiment of a first aspect of the present application provides a method for removing a release film, including:
s100: the flexible circuit board is provided with a substrate surface, a plurality of electromagnetic films are attached to the substrate surface, and a release film is attached to each electromagnetic film.
Referring to fig. 2 (a), 2 (b) and 3, the flexible printed circuit board 10 has a substrate surface 11, a plurality of electromagnetic films 20 are attached to the substrate surface 11, and a release film 30 is attached to each electromagnetic film 20.
Specifically, the flexible circuit board 10 is designed and processed to the process of sticking the electromagnetic film 20 (EMI) according to the conventional flow, the electromagnetic film 20 is firstly subjected to film cutting according to the design pattern and waste materials are removed, then the automatic adsorption and sticking equipment is used for sticking the flexible circuit board 10 to the corresponding position of the flexible circuit board 10 in a single piece, and finally the flexible circuit board 10 product stuck with the electromagnetic film 20 is pressed and cured.
It will be appreciated that a plurality of electromagnetic membranes 20 are spaced apart.
S200: with flexible circuit board 10 with a commentaries on classics subsides piece 40 pressfitting mutually, it has binding face 41 to change the piece 40, has on the binding face 41 viscidity area and be provided with one or more in the viscidity area and change the rubberizing 50, change the rubberizing 50 and change the cohesion between the piece 40 and be greater than electromagnetic film 20 and from the cohesive force between the type membrane 30, a plurality ofly from the type membrane 30 respectively with change the rubberizing 50 and adhere mutually, change the rubberizing 50 and be greater than electromagnetic film 20 and from the cohesive force between the type membrane 30.
Specifically, after the flexible circuit board 10 and a transfer piece 40 are pressed together, the release films 30 are respectively adhered to the transfer adhesive 50, the attaching surface 41 may have one or more adhesive regions thereon, the transfer adhesive 50 may be fixed to the transfer piece 40 by adhesion, screw connection or other methods, and when the transfer adhesive 50 is fixed to the transfer piece 40 by adhesion, the adhesion force between the transfer adhesive 50 and the transfer piece 40 is the adhesion force between the transfer adhesive 50 and the transfer piece 40.
In an embodiment, there is only one adhesive area on the attaching surface 41, and the transfer adhesive 50 in the adhesive area is simultaneously adhered to the release films 30, and since the electromagnetic film 20 and the release film 30 have a certain thickness, the transfer adhesive 50 will not adhere to and adhere to the area of the substrate surface 11 except the electromagnetic film 20.
In another embodiment, the attaching surface 41 has a plurality of adhesive areas, each of the adhesive areas has a transfer adhesive 50 disposed therein, and the transfer adhesive 50 in each of the areas is adhered to one of the release films 30.
In another embodiment, the attaching surface 41 has a plurality of adhesive areas, each of which has a transfer adhesive 50, and the transfer adhesive 50 in one area can be simultaneously adhered to a plurality of release films 30.
Alternatively, the transfer member 40 may be provided as a transfer plate, such as a thin plate of any shape, or may be provided as a transfer film, such as a PET (polyethylene terephthalate) film, etc.
In this embodiment, the transfer piece 40 is a PET film, and because the PET film has a certain flexibility, the release film 30 on part of the electromagnetic films 20 can be prevented from being tightly adhered to the transfer adhesive 50 due to the height error of the plurality of electromagnetic films 20.
Alternatively, the transfer adhesive 50 may be a thermal pressure adhesive, a pressure sensitive adhesive, or the like.
S300: referring to fig. 2 (c), the transfer member 40 is removed from the flexible circuit board 10, and the transfer adhesive 50 adheres the release film 30 to the electromagnetic film 20.
Specifically, since the bonding force between the transfer adhesive 50 and the transfer element 40 is greater than the bonding force between the electromagnetic film 20 and the release film 30, and the bonding force between the transfer adhesive 50 and the release film 30 is greater than the bonding force between the electromagnetic film 20 and the release film 30, when the transfer element 40 is removed from the flexible circuit board 10, the transfer adhesive 50 can separate the release film 30 from the electromagnetic film 20, and since the transfer adhesive 50 is bonded to a plurality of release films 30, the plurality of release films 30 can be bonded from the electromagnetic film 20 at a time by the transfer element 40, and the electromagnetic film 20 remains on the substrate surface 11 of the flexible circuit board 10.
The embodiment of the application provides a leave type membrane removal method, because it has binding face 41 to change a piece 40, it changes the rubberizing 50 to have sticky region and be provided with one or more in the sticky region on the binding face 41, it is greater than electromagnetic film 20 and the cohesive force from type membrane 30 to change the rubberizing 50 and change the cohesion between a piece 40, it bonds from type membrane 30 with a plurality of, it is greater than electromagnetic film 20 and the cohesive force from type membrane 30 to change rubberizing 50 and the cohesive force from type membrane 30 between a piece 40, so only need to change a piece 40 and remove from flexible circuit board 10, alright will be once only from electromagnetic film 20 with a plurality of from type membrane 30 through changing a piece 40 and gluing from electromagnetic film 20, thereby not only can improve the efficiency of getting rid of type membrane 30, save artifically, and the risk that flexible circuit board 10 product was scratched has also been reduced.
In the conventional method for removing the release film, it takes more than 300 seconds to tear off all the release films 30 on one flexible circuit board 10, and the method for removing the release film provided by the embodiment of the application can remove all the release films 30 on one flexible circuit board 10 within only 5 seconds, so that the processing efficiency can be greatly improved, and the productivity requirement can be met.
Alternatively, after the transfer tape 40 is removed from the flexible circuit board 10 and the transfer tape 50 is pasted from the release film 30 to the electromagnetic film 20, it is checked whether the release film 30 on the flexible circuit board 10 is completely removed.
Referring to fig. 2 (b), fig. 3 and fig. 4, in some embodiments, the attaching surface 41 has a non-adhesive area and a plurality of adhesive areas, the plurality of adhesive areas are disposed in one-to-one correspondence with the plurality of electromagnetic films 20, and the non-adhesive area corresponds to an area on the substrate surface 11 except for the electromagnetic films 20.
By adopting the above scheme, not only can each electromagnetic film 20 be ensured to be closely attached to the transfer adhesive 50 in the sticky area, but also the adhesion of the area on the substrate surface 11 except the electromagnetic film 20 and the transfer adhesive 50 in the sticky area due to the alignment error of the flexible printed circuit board and the transfer piece 40 can be avoided.
It is understood that the non-adhesive region is not adhesive and does not adhere to the region other than the electromagnetic film 20 on the substrate surface 11.
Optionally, the transfer adhesive 50 is located inside the projection of the release film 30 on the attaching surface 41. Thus, the alignment error between the flexible circuit board and the transfer tape 40 can be reduced, and the transfer tape 50 can be prevented from adhering to the substrate surface 11 except the electromagnetic film 20.
In this embodiment, a distance between an edge of the transfer adhesive 50 and an edge of a projection of the release film 30 on the attaching surface 41 is greater than or equal to 0.5mm, such as 0.5mm, 0.6mm, or 0.7 mm. In this way, the positional accuracy of the transfer tape 50 can be better controlled.
Referring to fig. 2 (a), fig. 2 (b) and fig. 3, in some embodiments, the pressing the flexible circuit board 10 and a transfer member 40 together includes:
first, the flexible circuit board 10 and a transfer member 40 are stacked together, and the transfer adhesive 50 is attached to the release film 30.
Specifically, after the transfer adhesive 50 is attached to the release film 30, a certain adhesive force is provided between the transfer adhesive 50 and the release film 30.
Secondly, the flexible circuit board 10 and the transfer piece 40 are pressed, so that the transfer adhesive 50 is adhered to the release film 30.
Specifically, after the flexible circuit board 10 and the transfer member 40 are pressed, the adhesive force between the transfer adhesive 50 and the release film 30 can be further improved.
It can be understood that when the transfer adhesive 50 is a hot-pressing adhesive, the flexible circuit board 10 and the transfer element 40 are subjected to hot-pressing, specific pressing parameters need to be determined according to the type of the hot-pressing adhesive, when the transfer adhesive 50 is a pressure-sensitive adhesive, the flexible circuit board 10 and the transfer element 40 are subjected to cold pressing, and the specific pressing parameters need to be determined according to the type of the cold-pressing adhesive.
By adopting the scheme, the flexible circuit board 10 and the transfer piece 40 can be quickly and conveniently pressed together.
Referring to fig. 2 (b), fig. 3 and fig. 4, in some embodiments, the transfer member 40 is provided with a first positioning hole 42, and the flexible circuit board 10 is provided with a second positioning hole (not shown).
When the flexible circuit board 10 and the transfer piece 40 are stacked together, the flexible circuit board 10 and the transfer piece 40 are aligned through the first positioning hole 42 and the second positioning hole. It can be understood that the flexible circuit board 10 and the transfer device 40 can be aligned directly by observing the relative position relationship between the first positioning hole 42 and the second positioning hole, or the flexible circuit board 10 and the transfer device 40 can be aligned by inserting a first alignment pin into the first positioning hole 42 and the second positioning hole.
By adopting the scheme, the alignment precision of the flexible circuit board 10 and the transfer piece 40 can be improved.
It can be understood that the first positioning holes 42 and the second positioning holes can be arranged in a plurality at intervals, and the plurality of first positioning holes 42 and the plurality of second positioning holes are arranged in a one-to-one correspondence manner.
Referring to fig. 2 (b) and fig. 3, in some embodiments, the stacking the flexible circuit board 10 and a transfer member 40 includes:
first, the flexible circuit board 10 is fixed on the first fixture, and the transfer piece 40 is fixed on the second fixture.
Specifically, a limiting groove may be formed in the first jig, the flexible circuit board 10 is placed in the limiting groove, the transfer member 40 may be fixed to the second jig by a screw or a bolt, and when the transfer member 40 is a transfer film, the transfer member 40 may also be directly bonded to the second jig.
Next, the second jig is moved, and the transfer member 40 is stacked on the flexible circuit board 10 by the second jig.
Specifically, the second jig can be held by hand, the second jig and the transfer element 40 are moved to the flexible circuit board 10 and placed, the attaching surface 41 of the transfer element 40 faces the flexible circuit board 10, and then the transfer element 40 is stacked on the flexible circuit board 10.
By adopting the scheme, the flexible circuit board 10 and the transfer piece 40 can be stacked together through the second jig when the transfer piece 40 is inconvenient to directly move, such as when the transfer piece 40 is a transfer film.
Optionally, the first jig is provided with a third positioning hole, and the second jig is provided with a fourth positioning hole; when the second jig is moved and the transfer piece 40 is stacked on the flexible circuit board 10 through the second jig, the first jig and the second jig are aligned through the third positioning hole and the fourth positioning hole, that is, the flexible circuit board 10 and the transfer piece 40 are aligned through the third positioning hole and the fourth positioning hole. It can be understood that the flexible circuit board 10 and the transfer element 40 can be aligned directly by observing the relative position relationship between the third positioning hole and the fourth positioning hole, or a second alignment pin can be inserted into the third positioning hole and the fourth positioning hole to align the flexible circuit board 10 and the transfer element 40.
Optionally, after the second fixture is moved and the transfer element 40 is stacked on the flexible circuit board 10 by the second fixture, the flexible circuit board 10 and the transfer element 40 are laminated by the laminating second fixture, and the transfer element 40 is removed from the flexible circuit board 10 by moving the second fixture. In this way, the pressing process of the transfer element 40 and the flexible circuit board 10 and the process of removing the transfer element 40 from the flexible circuit board 10 can be more convenient to operate.
Embodiments of the second aspect of the present application provide a flexible circuit board 10 processed by the release film removing method as in the first aspect.
The embodiment of the application provides a flexible circuit board 10, because it has binding face 41 to change piece 40, it changes rubberizing 50 to have one or more in viscous zone and the viscous zone on binding face 41, it is greater than electromagnetic film 20 and the adhesive force of leaving between type membrane 30 to change the adhesive force between rubberizing 50 and the piece 40 of commentaries on classics, a plurality ofly leave type membrane 30 and bond with changeing rubberizing 50 mutually, it is greater than electromagnetic film 20 and the adhesive force of leaving between type membrane 30 to change rubberizing 50 and the adhesive force of leaving between type membrane 30, so when getting rid of from type membrane 30, only need to change piece 40 and remove from flexible circuit board 10, alright once only follow electromagnetic film 20 with a plurality of types membrane 30 through changeing piece 40 and leave, thereby not only can improve the efficiency of getting rid of type membrane 30, it is artifical to save, and also reduced the risk that flexible circuit board 10 product was scratched, the quality of flexible circuit board 10 has been improved.
The above embodiments are only used to illustrate the technical solutions of the present application, and not to limit the same; although the present application has been described in detail with reference to the foregoing embodiments, it should be understood by those of ordinary skill in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; such modifications and substitutions do not depart from the spirit and scope of the embodiments of the present application, and they should be construed as being included in the present application.
Claims (10)
1. A method for removing a release film is characterized by comprising the following steps:
providing a flexible circuit board, wherein the flexible circuit board is provided with a substrate surface, a plurality of electromagnetic films are attached to the substrate surface, and a release film is attached to each electromagnetic film;
pressing the flexible circuit board and a transfer piece, wherein the transfer piece is provided with a binding surface, the binding surface is provided with a viscous area, one or more transfer adhesives are arranged in the viscous area, the binding force between the transfer adhesives and the transfer piece is greater than the binding force between the electromagnetic film and the release film, the release films are respectively bound with the transfer adhesives, and the binding force between the transfer adhesives and the release films is greater than the binding force between the electromagnetic film and the release films;
and removing the transfer piece from the flexible circuit board, and sticking the release film from the electromagnetic film by the transfer adhesive.
2. The release film removing method according to claim 1, wherein the attachment surface has a plurality of the adhesive regions and a non-adhesive region, the plurality of the adhesive regions are disposed in one-to-one correspondence with the plurality of the electromagnetic films, and the non-adhesive region corresponds to a region of the substrate surface other than the electromagnetic films.
3. The release film removing method according to claim 2, wherein the transfer adhesive is located inside a projection of the release film on the attaching surface.
4. The method for removing the release film according to claim 3, wherein the distance between the edge of the transfer adhesive and the edge of the projection of the release film on the attaching surface is greater than or equal to 0.5mm.
5. The method for removing the release film according to claim 1, wherein the transfer adhesive is a thermal compression adhesive or a pressure sensitive adhesive.
6. The method for removing release film according to claim 1, wherein the transfer member is a transfer plate or a transfer film.
7. The release film removing method according to any one of claims 1 to 6, wherein the pressing the flexible circuit board and a transfer member together comprises:
the flexible circuit board and the transfer piece are stacked together, and the transfer adhesive is attached to the release film;
and pressing the flexible circuit board and the transfer piece to enable the transfer adhesive to be bonded with the release film.
8. The release film removing method according to claim 7, wherein the transfer piece is provided with a first positioning hole, and the flexible circuit board is provided with a second positioning hole; when the flexible circuit board and a transfer piece are stacked together, the flexible circuit board and the transfer piece are aligned through the first positioning hole and the second positioning hole.
9. The method for removing the release film according to claim 7, wherein the stacking the flexible circuit board and a transfer member together comprises:
fixing the flexible circuit board on a first jig, and fixing the transfer piece on a second jig;
and moving the second jig, and stacking the transfer piece on the flexible circuit board through the second jig.
10. A flexible circuit board processed by the release film removing method according to any one of claims 1 to 9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211172504.2A CN115416393A (en) | 2022-09-26 | 2022-09-26 | Release film removing method and flexible circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211172504.2A CN115416393A (en) | 2022-09-26 | 2022-09-26 | Release film removing method and flexible circuit board |
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| CN115416393A true CN115416393A (en) | 2022-12-02 |
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| CN202211172504.2A Pending CN115416393A (en) | 2022-09-26 | 2022-09-26 | Release film removing method and flexible circuit board |
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2022
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| WO2009109436A1 (en) * | 2008-02-29 | 2009-09-11 | Foliotec Gmbh | Method and device for removing a film from a plate-like support or a film |
| KR20150067447A (en) * | 2013-12-10 | 2015-06-18 | 우영관 | Method and apparatus for removing transfer film from surface of flexible printed circuit board |
| CN107852817A (en) * | 2015-09-04 | 2018-03-27 | 拓自达电线株式会社 | The manufacture method of printed circuit board and printed circuit board diaphragm and sheet layered product for methods described |
| CN208369958U (en) * | 2018-06-14 | 2019-01-11 | 昆山意力电路世界有限公司 | A kind of release film device of efficiently removal for flexible circuit board |
| KR102334426B1 (en) * | 2020-08-24 | 2021-12-14 | (주)아이엠 | Method for removing emi release film |
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