CN113002121B - Positioning laminated structure - Google Patents

Positioning laminated structure Download PDF

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Publication number
CN113002121B
CN113002121B CN202110308416.XA CN202110308416A CN113002121B CN 113002121 B CN113002121 B CN 113002121B CN 202110308416 A CN202110308416 A CN 202110308416A CN 113002121 B CN113002121 B CN 113002121B
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China
Prior art keywords
rigid
rigid element
compression
compression deformation
positioning
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CN202110308416.XA
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Chinese (zh)
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CN113002121A (en
Inventor
刘小瑄
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AU Optronics Corp
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AU Optronics Corp
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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/12Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/48Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00General aspects of processes or apparatus for joining preformed parts
    • B29C66/90Measuring or controlling the joining process
    • B29C66/92Measuring or controlling the joining process by measuring or controlling the pressure, the force, the mechanical power or the displacement of the joining tools
    • B29C66/922Measuring or controlling the joining process by measuring or controlling the pressure, the force, the mechanical power or the displacement of the joining tools by measuring the pressure, the force, the mechanical power or the displacement of the joining tools
    • B29C66/9221Measuring or controlling the joining process by measuring or controlling the pressure, the force, the mechanical power or the displacement of the joining tools by measuring the pressure, the force, the mechanical power or the displacement of the joining tools by measuring the pressure, the force or the mechanical power
    • CCHEMISTRY; METALLURGY
    • C03GLASS; MINERAL OR SLAG WOOL
    • C03CCHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C27/00Joining pieces of glass to pieces of other inorganic material; Joining glass to glass other than by fusing
    • C03C27/06Joining glass to glass by processes other than fusing
    • C03C27/10Joining glass to glass by processes other than fusing with the aid of adhesive specially adapted for that purpose

Abstract

The invention discloses a positioning laminated structure which comprises a first rigid element, a second rigid element, an elastic element and a compression deformation element. The elastic element is positioned between the first rigid element and the second rigid element and combines the first rigid element and the second rigid element. The compression deformation element is positioned between the first rigid element and the elastic element or between the second rigid element and the elastic element, and when the first rigid element or the second rigid element is compressed, the compressed first rigid element or the compressed second rigid element compresses the compression deformation element to enable the compression deformation element to deform and generate a resistance change value. The positioning laminated structure of the invention can ensure that the first rigid element and the second rigid element have a firm combination relationship.

Description

Positioning laminated structure
Technical Field
The present disclosure relates to positioning structures, and particularly to a positioning laminated structure.
Background
In the assembly process of the display module, the frame and the cover (cover lens) are adhered by glue (glue) or double-sided tape (tape) and pressure is applied to make the two closely combined. If the bonding strength between the cover plate and the frame is not sufficient, the cover plate may be detached (peeling) when the temperature changes or vibrations occur.
Furthermore, because each cover plate and the frame body have tolerance in forming, that is, the flatness of each cover plate is not consistent, the bonding strength between the cover plate and the frame body is affected, and the assembly quality of the display module is difficult to control.
Disclosure of Invention
In view of the above problems, the present invention provides a positioning laminated structure, comprising a first rigid element, a second rigid element, an elastic element and a compression deformation element. The elastic element is positioned between the first rigid element and the second rigid element and is combined with the first rigid element and the second rigid element. When the first rigid element or the second rigid element is pressed, the pressed first rigid element or the second rigid element presses the pressed deformation element to deform the pressed deformation element and generate a resistance change value.
In some embodiments, the compression deformation element is disposed to extend along a surface of the first rigid element, a surface of the resilient element, or a surface of the second rigid element.
In some embodiments, the elastic member has a plurality of bonding surfaces, one of which is bonded to the first rigid member and the other of which is bonded to the second rigid member.
In some embodiments, the bonding surface has a width, and the compression deformable element is linear and has a linear diameter, the width being in an equal ratio to the linear diameter.
In some embodiments, the diameter of the compression deformable element is D and the width of the bonding surface is W, the diameter and the width satisfying the following condition: 0.11 ≦ D/W ≦ 0.13.
In some embodiments, the compression-deformable element is formed by molding or insert molding on a first bonding surface of the first rigid element or a second bonding surface of the second rigid element, the first bonding surface faces the elastic element, and the second bonding surface faces the elastic element.
In some embodiments, the compression deformation element is located on the film, and the film is attached to the first bonding surface of the first rigid element such that the compression deformation element is located on the first bonding surface, or the film is attached to the second bonding surface of the second rigid element such that the compression deformation element is located on the second bonding surface.
In some embodiments, the first rigid element includes a first curved surface, the second rigid element includes a second curved surface, and the compression deformation element detects that the first curved surface and the second curved surface are compressed at different measurement positions to generate different resistance change values.
In some embodiments, the resistance change values at the respective measurement positions are within a predetermined range.
In some embodiments, the apparatus further comprises a face piece covering the compression set element, wherein the face piece extends from the first rigid element or the second rigid element.
In summary, in the assembly process, pressure is required to be applied to tightly bond the elastic element to the first rigid element and the second rigid element, and the shape of the pressed deformable element is changed by the applied pressure, so that the resistance value is changed accordingly. Therefore, by measuring the resistance of the compression deformation element, whether the applied pressure is enough can be known, and when the applied pressure is not enough, the pressure can be adjusted and applied to ensure that the first rigid element and the second rigid element have a firm combination relationship.
The detailed features and advantages of the present invention are described in detail in the following embodiments, which are sufficient for anyone skilled in the art to understand the technical contents of the present invention and to implement the present invention, and the objectives and advantages related to the present invention can be easily understood by anyone skilled in the art according to the disclosure, claims and drawings of the present specification.
Drawings
Fig. 1 is a partial cross-sectional view of a use state of a positioning layer structure according to some embodiments.
Fig. 2 is a partial cross-sectional view of a use state of the positioning layer structure according to some embodiments (ii).
Fig. 3A is a schematic partial cross-sectional view (iii) of a use state of the positioning layer structure of some embodiments.
Fig. 3B is a schematic top view of a use state of the alignment layer structure according to some embodiments.
Fig. 4A is a schematic partial cross-sectional view (iv) of the use state of the positioning layer structure of some embodiments.
Fig. 4B is a schematic top view of a using state of the alignment layer structure according to some embodiments.
FIG. 5 is a partial cross-sectional view of a positioning layer structure according to some embodiments.
Fig. 6 is a partial cross-sectional schematic view of the positioning layer structure of some embodiments (two).
Fig. 7 is a partial cross-sectional schematic view of the positioning layer structure of some embodiments (iii).
Fig. 8 is a partial cross-sectional schematic view of the positioning layer structure of some embodiments (iv).
Fig. 9 is a partial cross-sectional schematic view of the positioning layer structure of some embodiments (v).
Fig. 10 is a partial cross-sectional schematic view of the positioning layer structure of some embodiments (vi).
The reference numerals are explained below:
1: positioning layer structure
11 first rigid element
11a first bonding surface
11b first curved surface
12 second rigid element
12a second bonding surface
12b second curved surface
13 elastic element
13a,13b bonding surface
14 compression deformation element
15 film of
16 appearance piece
17 detection unit
21 optical cement
22 display panel
W is the width
D, wire diameter
Detailed Description
Various embodiments are described in detail below, however, the embodiments are only used as examples and do not limit the scope of the invention. Well-known elements and steps have not been described in detail in order to avoid unnecessarily obscuring the present disclosure. In addition, the drawings in the embodiments are schematic diagrams, which do not represent actual proportions or actual dimensions of the elements of the present invention, and some elements or cross-sectional lines are omitted in the drawings in the embodiments to clearly show the technical features of the present invention. The same reference numbers will be used throughout the drawings to refer to the same or like elements.
As used herein, the terms "a" and "an" can refer broadly to a single or a plurality of items, unless the context specifically states otherwise. It will be further understood that the terms "comprises," "comprising," "includes" and/or "including," when used herein, specify the presence of stated features, regions, integers, steps, operations, elements, and/or components, but do not preclude the presence or addition of one or more other features, regions, integers, steps, operations, elements, components, and/or groups thereof.
Referring to fig. 1, fig. 1 is a partial cross-sectional view illustrating a use state of a positioning layer structure according to some embodiments. The invention provides a positioning layer structure 1 applied to a display module, which comprises a first rigid element 11, a second rigid element 12, an elastic element 13 and a compression deformation element 14.
Referring to fig. 1, in some embodiments, the first rigid element 11 is, for example, a middle frame (middle frame) of the display module, and the second rigid element 12 is, for example, a cover lens (cover lens) of the display module. The first rigid element 11 may be made of plastic or metal, and the second rigid element 12 may be made of plastic or glass. However, the present invention is not limited thereto, and the materials for manufacturing the first rigid element 11 and the second rigid element 12 can be adjusted according to actual requirements.
The elastic element 13 is located between the first rigid element 11 and the second rigid element 12, joining the first rigid element 11 and the second rigid element 12. Here, the elastic element 13 has a plurality of bonding surfaces 13a,13b, for example, two, three or more bonding surfaces 13a,13 b. One of the bonding surfaces 13a is bonded to the first rigid member 11, and the other of the bonding surfaces 13b is bonded to the second rigid member 12. Here, the elastic element 13 may be a glue (glue) formed between the first rigid element 11 and the second rigid element 12 in a coating manner, however, the invention is not limited thereto, and the elastic element 13 may be a double-sided tape (tape), for example.
Referring to fig. 1, in the present invention, the compression deformation element 14 is preferably made of a metal material and is located between the first rigid element 11 and the elastic element 13, and the compression deformation element 14 has a predetermined resistance value, and when it is compressed and deformed, a resistance variation value is generated. During the assembly process, pressure is required to be applied to tightly bond the elastic element 13 to the first rigid element 11 and the second rigid element 12. At this time, the first rigid element 11 and the second rigid element 12 which are pressed press the compression deformation element 14 to deform the compression deformation element 14 and generate the resistance change value.
However, the compression deformation element 14 is not limited to be disposed between the first rigid element 11 and the elastic element 13, please refer to fig. 2, fig. 2 is a partial sectional view (ii) of a use state of the positioning layer structure according to some embodiments, and the compression deformation element 14 may also be disposed between the second rigid element 12 and the elastic element 13.
Referring to fig. 3A, fig. 3A is a schematic partial cross-sectional view (iii) illustrating a use state of a positioning layer structure according to some embodiments. Further, the compression deformation element 14 is externally connected with a detection unit 17 capable of measuring the resistance value, and the pressure applied to the positioning layer structure 1 is known by measuring the resistance change value of the compression deformation element 14, so as to obtain the bonding strength of the first rigid element 11 and the second rigid element 12 (i.e. the strength of the first rigid element 11 and the second rigid element 12 which are bonded without being separated (peeled)).
Referring to fig. 3B, fig. 3B is a schematic top view (a) of a using state of the positioning layer structure according to some embodiments, and fig. 3B illustrates the positioning layer structure shown in fig. 3A and omits the second rigid element 12 and the elastic element 13. As can be seen from fig. 3B, the compression-deformable element 14 extends along the surface of the first rigid element 11, so that the resistance change of the compression-deformable element 14 extending between the sides of the first rigid element 11 (middle frame) and the second rigid element 12 (cover plate) can be measured, i.e. the bonding strength of the first rigid element 11 (middle frame) to the second rigid element 12 (cover plate) at different measurement positions can be measured.
It should be noted that the first rigid element 11 is a middle frame, and the second rigid element 12 is a cover plate, which are only examples, but the present invention is not limited thereto, please refer to fig. 4A and 4B, in which fig. 4A is a schematic partial cross-sectional view (four) of a use state of a positioning layer structure according to some embodiments, fig. 4B is a schematic top view (two) of a use state of a positioning layer structure according to some embodiments, and fig. 4B is a schematic top view illustrating a positioning layer structure shown in fig. 4A and omits the second rigid element 12. Referring to fig. 4A, the first rigid element 11 is a frame of the display module (here, an inner backlight module), and the second rigid element 12 is a cover plate of the display module.
Here, the elastic element 13 in fig. 4B extends along the surface of the first rigid element 11, and the compression deformation element 14 extends along the surface of the elastic element 13, in other words, the compression deformation element 14 is disposed along the surface of the second rigid element 12 (omitted in fig. 4B). Furthermore, the compression deformation element 14 is externally connected to a detection unit 17 capable of measuring a resistance value, so that the bonding strength between the middle frame and the cover plate can be further detected by measuring the resistance variation value of the compression deformation element 14 extending between each side of the first rigid element 11 (middle frame) and the second rigid element 12 (cover plate).
When the first rigid element 11 and the second rigid element 12 are firmly combined, the second rigid element 12 is not easily influenced by external force or external environment and is displaced relative to the first rigid element 11, so that the display panel 22 adhered to the first rigid element 11 (cover plate) through the optical adhesive 21 can be firmly attached to the first rigid element 11, thereby increasing the stability of the whole structure of the display module.
It should be noted that fig. 3B and fig. 4B illustrate a single compressive deformation element 14, but the present invention is not limited thereto, and a plurality of compressive deformation elements 14 may be disposed between the first rigid element 11 and the elastic element 13 or between the second rigid element 12 and the elastic element 13.
Referring to fig. 5, fig. 5 is a partial cross-sectional view of a positioning layer structure according to some embodiments. In some embodiments, the compression deformation element 14 is linear and has a linear diameter D (hereinafter referred to as linear diameter D) and the bonding surfaces 13a,13b have a width W (hereinafter referred to as width W). When the bonding surfaces 13a and 13b are larger, the range of the corresponding resistance change value is larger; further, as the wire diameter D of the pressure-sensitive deformable element 14 increases, the corresponding resistance change value also increases. The table one below shows the widths W of the different bonding surfaces, for which the compression deformation element 14 is suitable. In table one, the wire diameter D of the copper wire and the AWG (Arrayed Waveguide Grating) corresponding to the wire diameter D are taken as examples for explanation.
Watch 1
Width W (mm) of adhesive surface Wire diameter D (mm) Wire diameter D/width W
2 0.255(AWG30) 0.1275
2.5 0.321(AWG28) 0.1284
3 0.361(AWG27) 0.1203
4 0.511(AWG24) 0.1277
5 0.644(AWG22) 0.1288
As can be seen from the above table, when the width W of the bonding surfaces 13a and 13b is increased, the line diameter D of the compression deformation element 14 is preferably increased in an equal proportion manner, so as to maintain a good detection effect, i.e., the width W is approximately equal to the line diameter D. And the line diameter D and the width W preferably satisfy the following conditions: 0.11 ≦ D/W ≦ 0.13.
Referring to fig. 6 and 7, fig. 6 and 7 are schematic partial cross-sectional views (two) and (three) of a positioning layer structure according to some embodiments. In some embodiments, as shown in fig. 6, the compression-deformable element 14 is formed on the first combining surface 11a of the first rigid element 11 by a mold forming or embedding forming method, and a portion of the compression-deformable element 14 is embedded in the first rigid element 11, and another portion of the compression-deformable element 14 protrudes from the first combining surface 11a to detect the pressure applied to the first rigid element 11 and the second rigid element 12.
In some embodiments, as shown in fig. 7, the compression-deformable member 14 is formed by molding or insert molding or is embedded in the second bonding surface 12a of the second rigid element 12, and the form of the compression-deformable member 14 embedded in the second rigid element 12 is similar to that described above, so that the description thereof is omitted.
Referring to fig. 8, fig. 8 is a partial cross-sectional view of a positioning layer structure according to some embodiments (iv). In some embodiments, the positioning layer structure 1 may further include a film 15, where the film 15 has an adhesive property such that the compression deformation element 14 is adhered to the film 15, so that the compression deformation element 14 can be positioned on the second bonding surface 12a by attaching the compression deformation element 14 to the second bonding surface 12a of the second rigid element 12 through the film 15; or the compression deformation element 14 is attached to the first bonding surface 11a (not shown) of the first rigid element 11 (not shown) through the film 15, so that the compression deformation element 14 is positioned on the first bonding surface 11a (not shown).
Referring to fig. 9, fig. 9 is a partial cross-sectional view of a positioning layer structure according to some embodiments. In some embodiments, the first rigid element 11 has a first curved surface 11b, and the second rigid element 12 has a second curved surface 12b, that is, in this embodiment, the combination surface of the frame and the cover of the display module is a curved surface. Here, the elastic element 13 is located between the first curved surface 11b and the second curved surface 12b, and the compression deformation element 14 is compressed at different measurement positions to generate different resistance change values.
Therefore, the bonding strength at each measurement position where the first curved surface 11b and the second curved surface 12b are correspondingly bonded can be detected through the resistance change values at different measurement positions, so as to accurately know whether the pressure applied to each position of the first curved surface 11b and the second curved surface 12b is enough or not, and further adjust the applied pressure at the corresponding position. In some embodiments, the resistance change values at the respective measuring positions preferably differ within a predetermined range, so as to avoid a gap between the first rigid element 11 and the second rigid element 12 caused by a drop in bonding strength, or a relative displacement caused by vibration or collision. Here, the preset range depends on the tolerance of the pressing jig such as a pneumatic cylinder and a resistance measuring instrument.
In some embodiments, the positioning layer structure 1 further comprises an appearance piece 16 covering the compression set element 14 and the elastic element 13. The appearance piece 16 may extend from the second rigid element 12 (as shown in fig. 6), that is, a portion of the second rigid element 12 (cover plate) covering the compression deformation element 14 and the elastic element 13 may be used as the appearance piece 16.
However, the invention is not limited thereto, please refer to fig. 10, fig. 10 is a partial sectional view (six) of the positioning layer structure according to some embodiments, and the appearance piece 16 may also extend from the first rigid element 11, as shown in fig. 8, the top of the first rigid element 11 extends toward the center of the display module until contacting the second rigid element 12. In this way, part of the first rigid element 11 and part of the second rigid element 12 together cover the compression-deformable element 14 and the elastic element 13, that is, part of the first rigid element 11 and part of the second rigid element 12 can be used as the appearance piece 16.
Although the exterior piece 16 is described as a part of the first rigid element 11 or the second rigid element 12, the invention is not limited thereto, and the exterior piece 16 may be a separate element, and is bonded to the first rigid element 11 or the second rigid element 12 by gluing, magnetic attraction, adhesion, or the like.
In summary, the design of the positioning layer structure 1 of the present invention can detect whether the pressure applied to the positioning layer structure 1 is sufficient to make the elastic element 13 adhere tightly to the first rigid element 11 and the second rigid element 12, so that when the applied pressure is insufficient, the applied pressure can be adjusted in time to ensure that the first rigid element 11 and the second rigid element 12 have a stable combination relationship.
Although the present invention has been described with reference to the preferred embodiments, it should be understood that various changes and modifications can be made without departing from the spirit and scope of the invention as defined by the appended claims.

Claims (8)

1. A positioning stack-up structure comprising:
a first rigid member;
a second rigid member;
an elastic element, located between the first rigid element and the second rigid element, for combining the first rigid element and the second rigid element; and
a compression deformation element located between the first rigid element and the elastic element or between the second rigid element and the elastic element, wherein when the first rigid element or the second rigid element is compressed, the compressed first rigid element or the second rigid element presses the compression deformation element to deform the compression deformation element and generate a resistance change value;
wherein the elastic element is provided with a plurality of bonding surfaces, each bonding surface is provided with a width, the compression deformation element is linear and is provided with a linear diameter, and the width and the linear diameter are in equal ratio relation;
wherein the wire diameter is D and the width is W, and the wire diameter and the width satisfy the following conditions:
0.11≦D/W≦0.13。
2. the positioning stack as claimed in claim 1, wherein the compression set member is disposed to extend along a surface of the first rigid member, a surface of the resilient member, or a surface of the second rigid member.
3. The positioning stack as recited in claim 1, wherein one of said bonding surfaces is bonded to said first rigid member and the other of said bonding surfaces is bonded to said second rigid member.
4. The positioning laminate structure as claimed in claim 1, wherein the compression deformable element is formed by molding or insert molding on a first bonding surface of the first rigid element or a second bonding surface of the second rigid element, the first bonding surface faces the elastic element, and the second bonding surface faces the elastic element.
5. The positioning laminated structure as claimed in claim 1, wherein the compression deformable element is disposed on a film, the film is attached to a first bonding surface of the first rigid element to position the compression deformable element on the first bonding surface, or the film is attached to a second bonding surface of the second rigid element to position the compression deformable element on the second bonding surface.
6. The positioning stack-up structure of claim 1, wherein the first rigid element comprises a first curved surface and the second rigid element comprises a second curved surface, the compression deformation element between the first curved surface and the second curved surface being compressed at different measurement locations to produce different values of the change in resistance.
7. The positioning stack-up structure of claim 6, wherein the resistance change value at each measurement location is within a predetermined range.
8. The positioning stack-up structure of claim 1 further comprising a surface member overlying the crush member, wherein the surface member extends from the first rigid member or the second rigid member.
CN202110308416.XA 2020-08-24 2021-03-23 Positioning laminated structure Active CN113002121B (en)

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JP5493739B2 (en) * 2009-03-19 2014-05-14 ソニー株式会社 Sensor device and information processing device
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TWI732662B (en) 2021-07-01
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