JPH04183767A - Tape for fixing tab film to be used in assembling liquid crystal display - Google Patents

Tape for fixing tab film to be used in assembling liquid crystal display

Info

Publication number
JPH04183767A
JPH04183767A JP2314992A JP31499290A JPH04183767A JP H04183767 A JPH04183767 A JP H04183767A JP 2314992 A JP2314992 A JP 2314992A JP 31499290 A JP31499290 A JP 31499290A JP H04183767 A JPH04183767 A JP H04183767A
Authority
JP
Japan
Prior art keywords
tape
adhesive
liquid crystal
printed circuit
tab film
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2314992A
Other languages
Japanese (ja)
Other versions
JPH0696696B2 (en
Inventor
Akimochi Katou
皓以 加藤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
KATOO SEIKO KK
Original Assignee
KATOO SEIKO KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by KATOO SEIKO KK filed Critical KATOO SEIKO KK
Priority to JP2314992A priority Critical patent/JPH0696696B2/en
Publication of JPH04183767A publication Critical patent/JPH04183767A/en
Publication of JPH0696696B2 publication Critical patent/JPH0696696B2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/30Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/303Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/36Assembling printed circuits with other printed circuits
    • H05K3/361Assembling flexible printed circuits with other printed circuits

Abstract

PURPOSE:To obtain the subject tape useful for the assembly of table-top electronic calculator, electronic video apparatus, etc., capable of sufficiently coping with conveyor system and enabling sure temporary bonding by coating a surface of a thin mounting paper with a double-face bonding adhesive in the form of a film at regular spacings. CONSTITUTION:The objective tape is produced by coating a surface of a relatively hard thin mounting paper or releasing paper with a double-face bonding adhesive (synthetic resin adhesive) in the form of a thin film at regular spacings corresponding to the wiring pattern of a printed circuit board.

Description

【発明の詳細な説明】 〈産業上の利用分野〉 本発明は、卓上電子計算機、電子映像機器などの液晶デ
イスプレィ組立工程において使用される仮止めテープに
関するものである。
DETAILED DESCRIPTION OF THE INVENTION <Industrial Application Field> The present invention relates to a temporary fixing tape used in the assembly process of liquid crystal displays of desktop electronic computers, electronic video equipment, etc.

〈従来技術〉 液晶デイスプレィの組立工程においでは、第4図に示す
ように、LSI(大規模集積回路)やICなどからなる
ドライバー回路を取付けTAB(tape  auto
mated  bonding:タブ)フィルム5(以
下、タブフィルムと略称する)と、該タブフィルムによ
って接続される液晶パネル6とプリント基板7との接続
は、該タブフィルム5のll1l縁5aを異方性導電接
着剤層を介して液晶パネル6の端縁部6aに熱圧着し、
他側縁5bをプリント基板7にクリーム半田により#に
続するのであるが、通常タブフィルムはロール巻きした
ものを順次伸ばして使用するため、その巻ぐせ(反り変
形)がタブフィルムの他側に残って影響しタブフィルム
が浮き上がったり、反り返ったりして完全、良好なりリ
ーム半田付けができないので、手作業によってプリント
基板7の配線パターン8を避けて数箇所に予め接着剤1
°を置いてタブフィルムの他側縁5b寄りと該プリント
基板7とを仮接着しておき、次工程で、タブフィルムの
他側縁5bとプリント基板上に載せたクリーム半田4と
を加熱して半田接続するようにしていた。
<Prior art> In the assembly process of a liquid crystal display, as shown in Figure 4, a driver circuit consisting of an LSI (Large Scale Integrated Circuit) or an IC is mounted and a TAB (tape auto
The connection between the mated bonding (tab) film 5 (hereinafter abbreviated as tab film) and the liquid crystal panel 6 and printed circuit board 7 that are connected by the tab film is achieved by anisotropically conducting the 111 edges 5a of the tab film 5. Bonded by thermocompression to the edge 6a of the liquid crystal panel 6 via an adhesive layer,
The other side edge 5b is connected to the printed circuit board 7 with cream solder, but since the tab film is normally used after being rolled up and rolled out one after another, the curling (warping deformation) will cause the other side of the tab film to As a result, the tab film may lift up or warp, making it impossible to perform complete and good ream soldering.
The other side edge 5b of the tab film and the printed circuit board 7 are temporarily bonded at a certain angle, and in the next step, the other side edge 5b of the tab film and the cream solder 4 placed on the printed circuit board are heated. I was trying to connect it by soldering.

〈発明が解決しようとする課題〉 上記従来技術の接着剤による仮接着では、接着剤の量が
均一にならず多少を生じたり、プリント基板上への配置
が悪かったりして接着箇所からはみ出て該プリント基板
の配線パターンに接着剤が付着して不良品にしてしまう
事故が少なからず発生していた。しかも、接着剤の配置
は手作業である為に熟練と要するが、それ許ってなく人
手と時間を要し、効率が悪かった。
<Problems to be Solved by the Invention> In temporary bonding using the adhesive of the above-mentioned prior art, the amount of adhesive may not be uniform and may be uneven, or may be improperly placed on the printed circuit board and may protrude from the bonded area. There have been quite a few accidents in which the adhesive adheres to the wiring patterns of the printed circuit boards, resulting in defective products. Moreover, the placement of the adhesive is done by hand and requires skill, which is not allowed and requires manpower and time, resulting in poor efficiency.

そこで本発明は、上記従来力欠点や問題点を一挙に解決
する手段として組立工程を簡単にし、流れ作業に十分対
応でき、しかもプリント基板とタブフィルムの仮接着が
確実な仮止めテープを開発したのである。
Therefore, the present invention has developed a temporary adhesive tape that simplifies the assembly process, is fully compatible with assembly line work, and is capable of reliably temporarily adhering printed circuit boards and tab films as a means of solving the above-mentioned conventional shortcomings and problems at once. It is.

く課題を解決する為の手段〉 本発明の仮止めテープは、所定細幅の薄い台紙の1面に
、プリント基板の配線パターン間隔に対応して接着可能
な所定箇所毎に膜状の両面接着可能な接着剤を貼設して
なるもので、露出面を剥離紙で覆っている。
Means for Solving the Problems> The temporary adhesive tape of the present invention has a film-like double-sided adhesive bonded to one side of a thin mount having a predetermined narrow width at predetermined locations that can be bonded in accordance with the wiring pattern spacing of a printed circuit board. The exposed surface is covered with release paper.

く作用〉 液晶デイスプレィ組立工程において、液晶パネルとタブ
フィルムの1側縁を熱圧着し、プリント基板のクリーム
半田付は位置寄りに、剥離紙から剥離した仮止めテープ
の接着剤貼設面を接着し、該仮止めテープの台紙を剥離
して接着剤を露出させた後、プリント基板上の該接着剤
にタブフィルムの他側縁を重ねて接着し、該タブフィル
ムにより液晶パネルと仮止め連結したプリント基板の前
記クリーム半田付は部分にクリーム半田を施して、加熱
して該タブフィルムの端縁とプリント基板に一体的にク
リーム半田付けする。
In the liquid crystal display assembly process, one side edge of the liquid crystal panel and the tab film are bonded together by thermocompression, and the adhesive side of the temporary tape that has been peeled off from the release paper is glued to the position of the cream soldering of the printed circuit board. Then, after peeling off the backing paper of the temporary fixing tape to expose the adhesive, the other side edge of the tab film is overlapped and adhered to the adhesive on the printed circuit board, and the tab film is used to temporarily connect the liquid crystal panel. For the cream soldering of the printed circuit board, cream solder is applied to the portion, heated, and cream soldered integrally to the edge of the tab film and the printed circuit board.

・〈実施例〉 実施例を図面により説明すると、第1図は、仮止めテー
プAの平面図で、細幅の薄い台紙2の1面に薄い膜状の
接着剤1を所定間隔毎に塗布してなり、該接着剤1は両
面接着剤で、材質に制限はないが通常、従来公知の市販
の合成樹脂接着剤てあり、精密度を要求される液晶デイ
スプレィ組立のための仮止め用であるからその接着がタ
ブフィルムやプリント基板に悪影響を及ぼさないように
極めて薄い膜状であるが台紙、剥離紙からは剥れやすく
、プリント基板との接着は確実なものである。台紙の長
さ、幅は、液晶パネルの大小により決定され、通常は約
2鰭〜10+++s位であり、紙質。
・〈Example〉 To explain the example using drawings, Fig. 1 is a plan view of temporary adhesive tape A, in which a thin film-like adhesive 1 is applied at predetermined intervals on one side of a narrow and thin mount 2. The adhesive 1 is a double-sided adhesive, and although the material is not limited, it is usually a conventionally known commercially available synthetic resin adhesive, and is used for temporary fixing for assembling a liquid crystal display that requires precision. Because of this, it is in the form of an extremely thin film so that its adhesion does not adversely affect the tab film or printed circuit board, but it easily peels off from the mount and release paper, and the adhesion to the printed circuit board is reliable. The length and width of the mount are determined by the size of the liquid crystal panel, and are usually about 2 fins to 10+++s, and the paper quality.

薄さに特に限定はないが比較的硬質であって、組立工程
中にプリント基板への載置に好都合なものであれば足り
る。柔軟1紙では作業がし難い。
There is no particular limitation on the thickness, but it is sufficient as long as it is relatively hard and convenient for mounting on a printed circuit board during the assembly process. It is difficult to work with a single piece of flexible paper.

第2図は1本発明仮止めテープA3取り扱い易い商品と
して製造した状態の正面図で、1枚の剥離紙3の表面に
多数の仮止めテープAを並列してなるが、該仮止めテー
プも剥離紙も予めそれぞれ所定面積の大きい1枚ものと
して製造し、該仮止めテープの接着剤によって貼り合わ
せ、該テープだけに所定幅に切り目を入れて作成する6
なお、該テープ上に塗布した接着剤1.1、・・・の間
隔は、プリント基板7の配置パターン8により、それを
選けた位置として設定されている。
FIG. 2 is a front view of the temporary fixing tape A3 of the present invention manufactured as an easy-to-handle product, in which a large number of temporary fixing tapes A are arranged in parallel on the surface of one release paper 3. The release paper is also manufactured in advance as a single piece with a large predetermined area, and is pasted together using the adhesive of the temporary fixing tape, and a cut is made to a predetermined width only on the tape.6
Incidentally, the intervals between the adhesives 1.1, .

第3図は、液晶パネル6とプリント基板7をタブフィル
ム5、クリーム半田4によって結合した状態の縦断面を
示すものであり、その工程は、液晶パネル6とタブフィ
ルム5を夫々1側縁6a。
FIG. 3 shows a longitudinal section of a state in which the liquid crystal panel 6 and the printed circuit board 7 are bonded together using the tab film 5 and the cream solder 4. In this process, the liquid crystal panel 6 and the tab film 5 are bonded to one side edge 6a. .

5a同士で熱圧着し、剥離紙3から外した仮止めテープ
Aを台紙ごとその接着剤面によりプリント基板7の所定
位置に接着したのち、該台紙2を剥がしで露出した接着
剤1でタブフィルム5のm!、側MSb寄りを接着し、
タブフィルム5の端縁に対応するプリント基板7上にク
リーム半田4を配置し、クリーム半田4を加熱熔融させ
てタブフィルムの配線パターンとプリント基板上の配線
パターンとを一体的に結合して液晶ディスプレーを組立
てる。なお1図面のように接着剤1が残っても製品には
なんら悪影響はないものである。図中、9はLSIやI
Cなどからなるドライバー回路を示す。
5a are heat-pressed together, and the temporary adhesive tape A removed from the release paper 3 is adhered to a predetermined position on the printed circuit board 7 with the adhesive surface of the mount, and then the tab film is attached using the adhesive 1 exposed by peeling off the mount 2. 5 m! , glue the side MSb side,
A cream solder 4 is placed on the printed circuit board 7 corresponding to the edge of the tab film 5, and the cream solder 4 is heated and melted to integrally bond the wiring pattern on the tab film and the wiring pattern on the printed circuit board to form a liquid crystal display. Assemble the display. Note that even if the adhesive 1 remains as shown in Figure 1, there will be no adverse effect on the product. In the figure, 9 is an LSI or I
This shows a driver circuit made of C and the like.

〈発明の効果〉 上記の構成、作用を有する本発明の仮止めテープは、台
紙上に所定間隔ごとに膜状の接着剤を塗布してなる極め
て簡単な構成であるが呟その組立は容易、簡単であり、
液晶デイスプレィの組立に際して薄いタブフィルムとプ
リント基板とを仮止めする作業も、単に仮止めテープを
プリント基板の所定位置に前工程で予めセ・ントシてお
くだけで良く、次ぎの工程において剥離紙を剥がしてり
プフイルムを載せて手指で軽く押さえることに上りでプ
リント基板とタブフィルムが確実に仮止め接着できてそ
の接着剤が不本意にはみだしてプリント配線などを汚損
したり故11E3せるようなおそれが全くなくなり、従
来の手作業による接着剤の配置のような人手、時間を要
さず、製造効率が著しく向上し、商品の信頼性も増し、
コストダウンも可能となった。
<Effects of the Invention> The temporary fixing tape of the present invention having the above-described structure and function has an extremely simple structure in which a film of adhesive is applied at predetermined intervals on a mount, but it is easy to assemble. It's easy and
When assembling a liquid crystal display, the work of temporarily fixing the thin tab film and the printed circuit board can be done simply by setting the temporary fixing tape in a predetermined position on the printed circuit board in the previous process, and then attaching the release paper in the next process. Peeling off the film and pressing it lightly with your fingers will ensure that the printed circuit board and tab film are temporarily bonded, and the adhesive may inadvertently spill out, staining printed wiring, etc., or causing 11E3 damage. This eliminates the need for manpower and time required for traditional manual adhesive placement, significantly improving manufacturing efficiency and increasing product reliability.
It has also become possible to reduce costs.

【図面の簡単な説明】[Brief explanation of the drawing]

図面は、本発明の仮止めテープの実施例を示し、第1図
は、平面図、 第2図は、商品とした状態の正面図、 第3図は、本発明の仮止めテープを使用し、クリーム半
田でタブフィルム、液晶パネル、プリント基板を結合し
た状態の縦断面図、 第4図は、従来例を示す要部平面図である。
The drawings show examples of the temporary fixing tape of the present invention, FIG. 1 is a plan view, FIG. 2 is a front view of the product, and FIG. 3 is an example of the temporary fixing tape of the present invention. , a vertical cross-sectional view of a tab film, a liquid crystal panel, and a printed circuit board bonded together with cream solder; FIG. 4 is a plan view of essential parts showing a conventional example.

Claims (1)

【特許請求の範囲】[Claims] 1、薄い台紙の1面に、プリント基板の配線パターン間
に対応する間隔をおいて両面接着可能な接着剤を膜状に
塗布してなる液晶ディスプレー組立時使用のタブフィル
ム固定用テープ。
1. A tab film fixing tape for use when assembling a liquid crystal display, which is made by applying a double-sided adhesive in the form of a film on one side of a thin mount at intervals corresponding to the wiring patterns of the printed circuit board.
JP2314992A 1990-11-19 1990-11-19 Tape for temporary fixing of TAB film Expired - Lifetime JPH0696696B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2314992A JPH0696696B2 (en) 1990-11-19 1990-11-19 Tape for temporary fixing of TAB film

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2314992A JPH0696696B2 (en) 1990-11-19 1990-11-19 Tape for temporary fixing of TAB film

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP6098928A Division JP2642061B2 (en) 1994-05-12 1994-05-12 Liquid crystal display device and assembling method thereof

Publications (2)

Publication Number Publication Date
JPH04183767A true JPH04183767A (en) 1992-06-30
JPH0696696B2 JPH0696696B2 (en) 1994-11-30

Family

ID=18060108

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2314992A Expired - Lifetime JPH0696696B2 (en) 1990-11-19 1990-11-19 Tape for temporary fixing of TAB film

Country Status (1)

Country Link
JP (1) JPH0696696B2 (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0772493A (en) * 1993-09-06 1995-03-17 Katoo Seiko:Kk Method for assembling liquid crystal display
US5724056A (en) * 1994-09-02 1998-03-03 Kabushiki Kaisha Kato Seiko Method for constructing a liquid crystal display
US6475314B1 (en) 1995-11-17 2002-11-05 Sharp Kabushiki Kaisha Adhesive lamination useful in making circuit board structures

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5277147A (en) * 1975-12-24 1977-06-29 Atsumi Kashiwagi Doubleeadhesive tape

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5277147A (en) * 1975-12-24 1977-06-29 Atsumi Kashiwagi Doubleeadhesive tape

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0772493A (en) * 1993-09-06 1995-03-17 Katoo Seiko:Kk Method for assembling liquid crystal display
US5724056A (en) * 1994-09-02 1998-03-03 Kabushiki Kaisha Kato Seiko Method for constructing a liquid crystal display
US6475314B1 (en) 1995-11-17 2002-11-05 Sharp Kabushiki Kaisha Adhesive lamination useful in making circuit board structures

Also Published As

Publication number Publication date
JPH0696696B2 (en) 1994-11-30

Similar Documents

Publication Publication Date Title
CN101013236A (en) Adhesive structure and method for making same
JPH04183767A (en) Tape for fixing tab film to be used in assembling liquid crystal display
JP3360445B2 (en) Flexible wiring board connection structure
JP2642061B2 (en) Liquid crystal display device and assembling method thereof
JPH09197427A (en) Production of adhesive layer laminated body and circuit board, liquid crystal display device and its production
JP3429135B2 (en) Adhesive layer laminate, display device using the same, and method of manufacturing the same
JP2541764B2 (en) Liquid crystal display assembly method
JP2003198070A (en) Flexible printed wiring board
JP2006225574A (en) Method for laminating surfaces
JP3488218B2 (en) Manufacturing method of liquid crystal display device
JP2586971B2 (en) Electronic components with flexible substrates
JP3787043B2 (en) Electrical connection method between film having electrode and circuit board
JPH0243856Y2 (en)
US7744996B2 (en) Adhesive structure and method for manufacturing the same
JP3249358B2 (en) Display device and method of assembling the same
CN108848626B (en) Method for improving attaching alignment precision of circuit board adhesive tape
JPH051640B2 (en)
JPS60213087A (en) Coverlay film for flexible printed circuit board and method of forming coverlay of flexible printed circuit board using same
JP3701351B2 (en) Adhesive layer laminate and display device assembly method using the same
JPS6011680Y2 (en) Chip-shaped electronic components
JPH07161771A (en) Film carrier, electronic part and mold releasing paper peeling method
JPH05243703A (en) Flexible board
JP2992872B2 (en) Material holding mount
JP3402130B2 (en) Adhesive sheet with carrier film
JP2847858B2 (en) Masking method of printed wiring board